TDA7056BN1 - NXP SEMICONDUCTORS

DATA SH EET

Product specification

Supersedes data of 1996 May 28 1997 Aug 15

INTEGRATED CIRCUITS

TDA7056B

5 W mono BTL audio amplifier with

DC volume control

1997 Aug 15 2

NXP Semiconductors Product specification

5 W mono BTL audio amplifier with DC

volume control TDA7056B

FEATURES

DC volume control

Few external components

Mute mode

Thermal protectio n

Short-circuit proof

No switch-on and switch-off clic ks

Good overall stab ility

Low power cons umption

Low HF radiation

ESD protected on all pins.

GENERAL DESCRIPTION

The TDA7056B is a mono Bridge-Tied Load (BTL) output

amplifier with DC volume control.

It is designed for use in TV an d monitors, but is also

suitable for battery-fed portable recorders and radios.

The device is contained in a 9-pin medium power package.

A Missing Current Limiter (MCL) is built in. The MCL circuit

is activated when the difference in current between the

output terminal of each amplifier exceeds 100 mA

(300 mA typ.). This level of 100 mA allows for headphone

applications (single-ended).

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VPsupply vo ltage 4.5 18 V

POoutput power VP=12V

RL=1633.5W

RL=855.5W

Gv(max) maximum total voltage gain 39.5 40.5 41.5 dB

gain control 68 73.5 dB

Iq(tot) total quiescent current VP=12V; R

L= 9.2 13 mA

THD tot al ha rmo n i c distortion PO=0.5W 0.3 1 %

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA7056B SIL9MPF plastic single in-line medium power package wit h fi n; 9 leads SOT110-1

1997 Aug 15 3

NXP Semiconductors Product specification

5 W mono BTL audio amplifier with DC

volume control TDA7056B

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

input

7MSA708 - 1

TDA7056B

6I + i

I – i

TEMPERATURE

PROTECTION

signal

ground

DC volume control

n.c.

positive output

negative output

power

ground

Vref STABILIZER

n.c.

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected

VP2 positive supply voltage

VI3 voltage input

GND1 4 signal ground

VC 5 DC volume control

OUT+ 6 positive output

GND2 7 p ower ground

OUT8 negative output

n.c. 9 not connected

Fig.2 Pin configuration.

handbook, halfpage

MSA707

TDA7056B

n.c.

OUT

GND2

OUT

GND1

n.c.

1997 Aug 15 4

NXP Semiconductors Product specification

5 W mono BTL audio amplifier with DC

volume control TDA7056B

FUNCTIONAL DESCRIPTION

The TDA7056B is a mono BTL output amplifie r with DC

volume control, designed for use in TV and monitor but is

also suitable for battery-fed portable recorders and radios.

In conventional DC volume circuits the contr ol or in put

stage is AC coupled to the output stage via external

capacitors to keep the offset voltage low. In the TDA7056B

the DC volume control stage is integrated into the input

stage so that no coupling capacitors are required. With this

configuration, a low offset voltage is still maintained and

the minimum supply voltage remains low.

The BTL principle offer s the follo wing advantages:

Lower peak value of the supply current

The frequency of the ripple on the supply voltage is twice

the signal frequency.

Consequently, a re duced power supp ly with smaller

capacitors can be used which results in co st re ductions.

For portable appl ications there is a trend to decrease the

supply voltage , r es ulting in a reduction of ou tp ut power at

conventional output stages. Using the BTL principle

increases the output power.

The maximum gain of the amplifier is fixed at 40.5 dB.

The DC volume control stage has a logarithmic control

characteristic. Therefore, the total gain can be controlled

from 40.5 dB to 33 dB. If the DC volume control voltage

falls below 0.4 V, the device will switch to the mute mode.

The amplifier is short-circuit proof to ground, VP and

across the load. Also a thermal protection circuit is

implemented. If the crystal temper ature rises above

+150 C the gain will be reduced, thereby reducing the

output power. Special attention is give n to s witch -on and

switch-off clicks, low HF radiation and a good overall

stability.

Power dissipation

Assume VP=12V; R

L=16.

The maximum sine wave dissipation is = 1.8 W.

The Rth vj-a of the package is 55 K/W.

Therefore Tamb (max) =15055 1.8 = 51 C.

LIMITING VALUES

In accordance with the A bsolute Maxi m u m Rating System (IEC 134).

THERMAL CHARACTE RISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VPsupply voltage 18 V

V3, 5 input voltage pins 3 and 5 5V

IORM repetitive peak output current 1.25 A

IOSM non-repetitive peak output current 1.5 A

Ptot total power dissipation Tcase 60 C9W

Tamb operating ambient temperature 40 +85 C

Tstg storage temperature 55 +150 C

Tvj virtual junction temperature +150 C

Tsc short-circuit time 1h

SYMBOL PARAMETER VALUE UNIT

Rth j-a thermal resistance from junction to ambient in free air 55 K/W

Rth j-c thermal resistance from junction to case 10 K/W

1997 Aug 15 5

NXP Semiconductors Product specification

5 W mono BTL audio amplifier with DC

volume control TDA7056B

CHARACTERISTICS

VP=12V; V

DC = 1.4 V; f = 1 kHz; RL=16; Tamb =25C; unless otherwise spec ified (see Fig.13).

Notes

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being

equal to the DC output offset voltage divided by RL.

2. The noise output volta ge (RMS value) at f = 500 kH z is measured with RS=0 and B = 5 kHz.

3. The ripple rejection is measured with RS=0 and f = 10 0 Hz to 10 kHz. The r ipple voltage VR of 200 mV

(RMS value) is applied to th e positive supply rail.

4. The noise output voltage (RMS value) is measured with RS=5k unweighted.

5. The DC volume contr ol c an be configured in severa l way s. Two possible circuits are sho wn in Figs 1 4 an d 15.

The circuits at the volume control pin will influence the switch-on and switch-off behaviour and the maximum voltage

gain.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

VPpositive supply voltage 4.5 18 V

Iq(tot) total quiescent current note 1; RL=9.2 13 mA

Maximum gain (V5=1.4V)

POoutput power THD = 10%; RL=1633.5 W

THD = 10%; RL=855.5 W

THD total harmonic distortion PO=0.5W 0.3 1 %

Gv(max) maximum total voltage gain 39.5 40.5 41.5 dB

VIinput signal handling (RMS value) Gv(max) =0dB; THD1% 1.0 V

Vno noise output voltage (RMS value) note 2; f = 500 kHz 210 V

B bandwidth at 1dB 0.02 to 300 kHz

SVRR supply voltage ripple rejection note 3 34 38 dB

VODC output offset voltage V8v60200mV

ZIinput impedance (pin 3) 15 20 25 k

Mute position

VOoutput voltage in mute position note 4; V50.4 V;

VI=1.0V 35 45 V

DC volume control; note 5

gain control 68 73.5 dB

I5control current V5=0V 20 25 30 A

1997 Aug 15 6

NXP Semiconductors Product specification

5 W mono BTL audio amplifier with DC

volume control TDA7056B

Fig.3 Gain control as a function of DC volume

control.

handbook, halfpage

0 2.0

−80

−120

MBH372

0.4 0.8 1.2 1.6

−40

(dB)

V (V)

Fig.4 Noise output voltage as a fun ction of DC

volume control.

Measured with RS=5k unweighted.

Frequency range is 22 Hz to 22 kHz.

handbook, halfpage

Vno

(mV)

MBH365

−1

−2

0.4 0.8 1.2 1.6

VDC (V)

Fig.5 Control current as a function of DC volume

control.

handbook, halfpage

0 2.0

−15

−25

MBH376

0.4 0.8 1.2 1.6

−5

VDC (V)

IDC

(μA)

Fig.6 Quiescent curr ent versus supply v oltage.

Measured with RL=.

handbook, halfpage

020

MBH367

(mA)

81216

VP (V)

1997 Aug 15 7

NXP Semiconductors Product specification

5 W mono BTL audio amplifier with DC

volume control TDA7056B

Fig.7 Total harmonic distortion versus output

power.

(1) RL16 .

(2) RL=8.

handbook, halfpage

MBH361

-1

1PO (W)

THD

(%)

(1) (2)

Fig.8 Total harmonic distortion versus frequ ency.

PO=0.1W.

(1) Gv(max) =40dB.

(2) Gv(max) =30dB.

handbook, halfpage

MBH362

−2

−1

110

f (kHz)

THD

(%)

(1)

(2)

Fig.9 Output power versus sup ply voltage.

Measured at a THD of 10%. The maximum output power is limited by

the maximum power dissipation an d the maximum available output

current.

(1) RL=8.

(2) RL=16.

handbook, halfpage

020

MBH363

(W)

81216

VP (V)

(1) (2)

Fig.10 Total worst case power dissipation versus

supply voltage.

(1) RL=8.

(2) RL=16.

handbook, halfpage

020

MBH364

(W)

81216

VP (V)

(1) (2)

1997 Aug 15 8

NXP Semiconductors Product specification

5 W mono BTL audio amplifier with DC

volume control TDA7056B

Fig.11 Supply voltage ripple rejection versus

frequency.

handbook, halfpage

−70

−60

−50

−40

−30

−20

MBH374

−2

−1

11010

f (kHz)

SVRR

(dB)

(1)

(2)

Measured with VR=0.2V.

(1) VDC =1.4V.

(2) VDC =0.4V.

Fig.12 Input signal handling.

handbook, halfpage

020

2.0

0.4

MBH375

0.8

1.2

1.6

(V)

81216

VP (V)

Measured at a THD of 1% and a voltage gain of 0 dB.

1997 Aug 15 9

NXP Semiconductors Product specification

5 W mono BTL audio amplifier with DC

volume control TDA7056B

TEST AN D APPLICATION INFORMATION

For single-end application the output peak current may not exceed 100 mA; at higher ou tput currents the short circuit

protection (MLC) will be activated.

Fig.13 Test and applicatio n diagram.

To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as

possibl e to the IC.

(1) This capaci tor can be omitted if the 220 F electrolytic capacito r is connected close to pin 2.

handbook, full pagewidth

input 0.47 μF

MSA709 - 2

100 nF 220 μF

TDA7056B

VP = 12 V

(1)

I − i

5 kΩ

STABILIZER TEMPERATURE

PROTECTION

ground

volume

control

RL = 8 Ω

n.c. 9

n.c. I + i

−

1997 Aug 15 10

NXP Semiconductors Product specification

5 W mono BTL audio amplifier with DC

volume control TDA7056B

Fig.14 Applicatio n with potentiometer as volume

control; maximum gain = 34 dB.

handbook, halfpage

MSA710

volume

control

1 MΩ1 μF

Fig.15 Applicatio n with potentiometer as volume

control; maximum gain = 40 dB.

handbook, halfpage

MBH366

volume

control

VP = 12 V

22 kΩ

100 kΩ

1 μF

1997 Aug 15 11

NXP Semiconductors Product specification

5 W mono BTL audio amplifier with DC

volume control TDA7056B

PACKAGE OUTLINE

UNIT AA

max.

2A3b1D1

bcD

(1) E(1) Z

max.

(1)

eLPP

1q1q2

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 18.5

17.8 3.7 8.7

8.0

15.8

15.4 1.40

1.14 0.67

0.50 1.40

1.14 0.48

0.38 21.8

21.4 21.4

20.7 6.48

6.20 3.4

3.2

2.54 1

5.9

5.7

4.4

4.2

3.9

3.4 15.1

14.9

1.75

1.55

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2.75

2.50

SOT110-1 95-02-25

03-03-12

0 5 10 mm

scale

0.25

q1q2

seating plane

pin 1 index

SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1

1997 Aug 15 12

NXP Semiconductors Product specification

5 W mono BTL audio amplifier with DC

volume control TDA7056B

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth acco un t of sold er ing ICs can be found in

our “IC Package Databook” (order cod e 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperatur e of the s old er is

260 C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg max). If the

printed-circuit board has been pre-heated, forced cooling

may be necess ary immediately aft er soldering to ke ep the

temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 C, contact may be up to 5 seconds.

1997 Aug 15 13

NXP Semiconductors Product specification

5 W mono BTL audio amplifier with DC

volume control TDA7056B

DATA SHEET STATUS

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this do cument was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This document contains data from the objective s pe cification for product

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet Production This doc ument contains the product specification.

DEFINITIONS

Product specification  The information and data

provided in a Product data sheet shall define the

specification of the product as agreed between NXP

Semiconductors and its custo m er, unless NXP

Semiconductors and cus to m er have explicitly agreed

otherwise in writing. In no even t however, shall an

agreement be valid in which th e NXP Semiconductors

product is deemed to offer functions and qualities beyond

those described in the Product data sheet.

DISCLAIMERS

Limited warranty and liability  Information in this

document is believed to be accurate and reliab le .

However, NXP Semiconduc tors does not give any

representations or warranties, expressed or implied, as to

the accuracy or completeness of such information and

shall have no liability for the consequences of use of such

information.

In no event shall NXP Semiconductors be liable for any

indirect, incidental, punitive, special or consequential

damages (including - without limitation - lost profits, lost

savings, busin es s interru ption, costs related to the

removal or replacement of any products or rework

charges) whether or not such damages are based on tort

(including negligence), warranty, breach of contract or any

other legal theory.

Notwithstanding any damages that customer might incur

for any reason whatsoever, NXP Semiconductors’

aggregate and cu mulative liability towards customer for

the products described herein shall be limited in

accordance with the Terms and conditions of commercial

sale of NXP Semiconductors.

Right to make changes  NXP Semiconductors

reserves the right to make changes to information

published in this document, including without limitation

specifications and prod uct descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

Suitability for use  NXP Semiconductors products are

not designed, authorized or warranted to be suitable for

use in life support, life-critical or safety-critical sys tems or

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reasonably be

expected to res ult in pe rsonal injur y, de ath or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductor s pr oducts in such equi pme nt or

application s and therefor e such inclusion and/or use is at

the customer’s own risk.

Applications  Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of

their applications and products using NXP

Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or

customer product design. It is customer’s sole

responsibility to determine whether the NXP

Semiconductors pro du ct is su itable and fit for the

customer’s applications and products planned, as well as

for the planned a pplication and use of custom er’s third

party customer(s). Customers should provide appropriate

design and opera t ing saf eg ua rd s to minimize the risks

associated with their applications and products.

1997 Aug 15 14

NXP Semiconductors Product specification

5 W mono BTL audio amplifier with DC

volume control TDA7056B

NXP Semiconductors does not accept any liability related

to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications

or products, or the applic ation or use by customer’s third

party customer(s). Customer is responsible for doing all

necessary testing for the customer’s ap plications and

products using NXP Semiconductors pr od ucts in order to

avoid a default of the applications and th e products or of

the application or use by customer’s third party

customer(s). NXP does not accept any liability in this

respect.

Limiting values  Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) will cause permanent damage to

the device. Limiting values are stress ratin gs only and

(proper) operation of the device at these or any other

conditions abo ve those given in the Recommended

operating conditions section (if present) or the

Characteristics sections of this document is not warranted.

Constant or repeated exposure to limiting values will

permanently and irreversibly affect the quality and

reliability of the device.

Terms and conditions of commercial sale  NXP

Semiconductors products are sold subject to the general

terms and conditio ns of commercial sale, as published at

http://www.nxp.com/profile/terms, unless other wis e

agreed in a valid written ind i vidual agreement. In case an

individual agreeme nt is co nc luded only the terms and

conditions of the resp ective agreement shall apply. NXP

Semiconductors hereby expressly objects to apply i ng the

customer’s general terms and conditions with regard to the

purchase of NXP Semicon ductors products by customer.

No offer to sell or license  Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for acceptance or the grant, conveyan ce or

implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control  This document as well a s the item(s)

described herein may be subject to export control

regulations. Export might require a prior authorization from

national author ities.

Quick refer ence data  The Quick reference data is an

extract of th e product data given in the Limiting values and

Characteristics sections of this document, an d as such is

not complete, exhaus tive or legally binding.

Non-automotive qualified products  Unless this data

sheet expressly states that this specific NXP

Semiconductors product is au tomotive qualified, the

product is not suitable for automotive use. It is neither

qualified nor te sted in accordanc e with automot ive testing

or application requirements. NXP Semiconductors accepts

no liability for inclusion and/or use of non-automotive

qualified prod ucts in automotive eq uip m en t or

applications.

In the event that customer uses the product for design-in

and use in automotive applications to automotive

specifications and standards, customer (a) shall use the

product without NXP Semiconductors’ warranty of the

product for such au t omo tive application s, use and

specifications, and (b) whenever customer uses the

product for automotive applications beyond NXP

Semiconductors’ specifications such use shall be solely at

customer’s own ris k, and (c) customer fully inde m nifies

NXP Semiconductors for any liability, damages or failed

product clai ms r esult ing fr om custo mer desi gn an d us e o f

the product for automotive ap plic ations beyond NXP

Semiconductors ’ st andard warranty and NXP

Semiconductors’ product specifications.

NXP Semiconductors

provides High Performance Mixed Signal and Standard Product

solutions that leverage its leading RF, Analog, Power Management,

Interface, Security and Digital Processing expertise

Contact information

For additional information p lease visit: http://www.nxp.com

For sales offices addresses send e- mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information pr e sent ed in this documen t d oes not form par t o f an y q uotation or contra ct, is believed to be accur ate a nd re li a ble and may be chan ged

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or inte llectual property rights.

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimer s. No changes were made to the tech nical content, except for package outline

drawings which were updated to the latest version.

Printed in The Netherlands RM5/03/pp15 Date of release: 1997 Aug 15