Data Book
and Design Guide
TECCOR ELECTRONICS
1800 Hurd Drive
Irving, Texas 75038
United States of America
Phone: +1 972-580-7777
Fax: +1 972-550-1309
Web site: http://www.teccor.com
E-mail: sidactor.techsales@teccor.com
An Invensys company
Teccor Electronics is the proprietor of the SIDACtor®, Battrax®, and TeleLi n k ®
trademarks. All other brand names may be trademarks of their respective companies.
Teccor Electronics SIDACtor products are covered by these and other U.S. Patents:
4,685,120
4,827,497
4,905,119
5,479,031
5,516,705
All SIDACtor products are recognized and listed under UL file E133083 as a UL 497B
compliant device. All TeleLink fuses are recognized under UL file E191008 and are also
listed for CSA marking by certificate LR 702828.
Teccor Electronics reserves the right to make changes at any time in order to improve
designs and to supply the best products possible. The information in this catalog has
been carefully checked and is believed to be accurate and reliable; however, no liability
of any type shall be incurred by Teccor for the use of the circuits or devices described in
this publication. Furthermore, no license of any patent rights is implied or given to any
purchaser.
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© 2002 Teccor Electronics 1-1 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Product Selection
Guide
1Product Selection
Guide
Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Product Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Part Number Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Description of Part Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Quality and Reliability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-11
Standard Terms and Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
Product Description
http://www.teccor.com 1 - 2 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Product Description
SIDACtor components are solid state crowbar devices designed to protect telecom
equipment during hazardous transient conditions. Capitalizing on the latest in thyristor
advancements, Teccor makes SIDACtor devices with a patented ion implant technology.
This technology ensures effective protection within nanoseconds, up to 5000 A surge
current ratings, and simple solutions for regulatory requirements such as GR 1089,
TIA-968 (formerly known as FCC Part 68), ITU-T K.20, ITU-T K.21, and UL 60950.
Operation
In the standby mode, SIDACtor devices exhibit a high off-state impedance, eliminating
excessive leakage currents and appearing transparent to the circuits they protect. Upon
application of a voltage exceeding the switching voltage (VS), SIDACtor devices crowbar
and simulate a short circuit condition until the current flowing through the device is either
interrupted or drops below the SIDACtor device’s holding current (IH). Once this occurs,
SIDACtor devices reset and return to their high off-state impedance.
V-I Characteristics
Advantages
Compared to surge suppression using other technologies, SIDACtor devices offer absolute
surge protection regardless of the surge current available and the rate of applied voltage
(dv/dt). SIDACtor devices:
• Cannot be damaged by voltage
• Eliminate hysteresis and heat dissipation typically found with clamping devices
• Eliminate voltage overshoot caused by fast-rising transients
• Are non-degenerative
• Will not fatigue
• Have low capacitance, making them ideal for high-speed transmission equipment
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Product Description
Product Selection
Guide
© 2002 Teccor Electronics 1 - 3 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Applications
When protecting telecommunication circuits, SIDACtor devices are connected across Tip
and Ring for metallic protection and across Tip and Ground and Ring and Ground for
longitudinal protection. They typically are placed behind some type of current-limiting
device, such as Teccor’s F1250T Telelink slow blow fuse. Common applications include:
• Central office line cards (SLICs)
• T-1/E-1, ISDN, and xDSL transmission equipment
• Customer Premises Equipment (CPE) such as phones, modems, and caller ID adjunct
boxes
• PBXs, KSUs, and other switches
• Primary protection including main distribution frames, five-pin modules, building
entrance equipment, and station protection modules
• Data lines and security systems
• CATV line amplifiers and power inserters
• Sprinkler systems
For more information regarding specific applications, design requirements, or surge
suppression, please contact Teccor Electronics directly at +1 972-580-7777 or through our
local area representative. Access Teccor’s web site at http://www.teccor.com or
e-mail us at sidactor.techsales@teccor.com.
Product Packages
http://www.teccor.com 1 - 4 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Product Packages
Surface Mount Packages
DO-214AA
Modified
DO-214AA
Modified
MS-013 Six-pin
Surface Mount
(Fuse)
Balanced SIDACtor Device ✓
Battrax Dual Negative SLIC Protector ✓
Battrax Dual Positive/Negative SLIC
Protector
✓
Battrax Quad Negative SLIC Protector ✓
Battrax SLIC Protector ✓✓
CATV/HFC SIDACtor Device
CATV Line Amplifiers/Power Inserters
SIDACtor Device
Fixed Voltage SLIC Protector ✓✓
Four-port Metallic Line Protector
High Surge (D-rated) SIDACtor Device ✓
LCAS Asymmetrical Device ✓✓
Longitudinal Protector ✓✓
MC Balanced SIDACtor Device ✓
MC SIDACtor Device ✓✓
Multiport Balanced SIDACtor Device ✓
Multiport Quad SLIC Protector ✓
Multiport SIDACtor Device ✓
SIDACtor Device ✓✓✓
TeleLink Fuse ✓
Twin SLIC Protector ✓
Product Packages
Product Selection
Guide
© 2002 Teccor Electronics 1 - 5 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Through-hole Packages
TO-92
Modified
TO-220 TO-218 Hybrid SIP
✓✓Balanced SIDACtor Device
Battrax Dual Negative SLIC Protector
Battrax Dual Positive/Negative SLIC
Protector
Battrax Quad Negative SLIC Protector
Battrax SLIC Protector
✓✓ CATV/HFC SIDACtor Device
✓✓ CATV Line Amplifiers/Power Inserters
SIDACtor Device
✓Fixed Voltage SLIC Protector
✓Four-port Metallic Line Protector
✓High Surge (D-rated) SIDACtor Device
LCAS Asymmetrical Device
✓✓Longitudinal Protector
✓✓MC Balanced SIDACtor Device
✓✓✓ ✓MC SIDACtor Device
✓Multiport Balanced SIDACtor Device
Multiport Quad SLIC Protector
✓Multiport SIDACtor Device
✓✓✓ ✓SIDACtor Device
✓TeleLink Fuse
Twin SLIC Protector
Part Number Index
http://www.teccor.com 1 - 6 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Part Number Index
Note: For explanation of part numbers, see "Description of Part Number" on page 1-8.
Part Number Page
A1220U_4 2-36
A1225U_4 2-36
A2106A_ 2-32
A2106U_ 2-20
A2106U_6 2-24
A2106Z_ 2-40
A5030A_ 2-32
A5030U_ 2-20
A5030U_6 2-24
A5030Z_ 2-40
B1100C_ 2-52
B1101U_ 2-54
B1101U_4 2-58
B1160C_ 2-52
B1161U_ 2-54
B1161U_4 2-58
B1200C_ 2-52
B1201U_ 2-54
B1201U_4 2-58
B2050C_ 2-52
B3104U_ 2-56
B3164U_ 2-56
B3204U_ 2-56
F0500T 2-66
F1250T 2-66
F1251T 2-66
P0080E_ 2-16
P0080S_ 2-4
P0080SA MC 2-8
P0080SC MC 2-6
P0080SD 2-10
P0080Z_ 2-44
P0084U_ 2-22
P0300E_ 2-16
P0300S_ 2-4
P0300SA MC 2-8
P0300SC MC 2-6
P0300SD 2-10
P0300Z_ 2-44
P0304U_ 2-22
P0602A_ 2-28
P0602AC MC 2-30
P0602Z_ 2-42
P0640E_ 2-16
P0640EC MC 2-18
P0640S_ 2-4
P0640SC MC 2-6
P0640SD 2-10
P0640Z_ 2-44
P0641CA2 2-48
P0641S_ 2-46
P0641U_ 2-50
P0642S_ 2-14
P0644U_ 2-22
P0720E_ 2-16
P0720S_ 2-4
P0720SC MC 2-6
P0720SD 2-10
P0720Z_ 2-44
P0721CA2 2-48
P0721S_ 2-46
P0721U_ 2-50
P0722S_ 2-14
P0724U_ 2-22
P0900E_ 2-16
P0900S_ 2-4
P0900SC MC 2-6
P0900SD 2-10
P0900Z_ 2-44
P0901CA2 2-48
P0901S_ 2-46
P0901U_ 2-50
P0902S_ 2-14
P0904U_ 2-22
P1100E_ 2-16
P1100S_ 2-4
P1100SC MC 2-6
P1100SD 2-10
P1100Z_ 2-44
P1101CA2 2-48
Part Number Page
P1101S_ 2-46
P1101U_ 2-50
P1102S_ 2-14
P1104U_ 2-22
P1200S_ 2-38
P1300E_ 2-16
P1300S_ 2-4
P1300SC MC 2-6
P1300SD 2-10
P1300Z_ 2-44
P1304U_ 2-22
P1400AD 2-60
P1402A_ 2-28
P1402AC MC 2-30
P1402Z_ 2-42
P1500E_ 2-16
P1500EC MC 2-18
P1500S_ 2-4
P1500SC MC 2-6
P1500SD 2-10
P1500Z_ 2-44
P1504U_ 2-22
P1553A_ 2-32
P1553AC MC 2-34
P1553U_ 2-20
P1553Z_ 2-40
P1556U_ 2-24
P1602A_ 2-28
P1602AC MC 2-30
P1602Z_ 2-42
P1800AD 2-60
P1800E_ 2-16
P1800S_ 2-4
P1800SC MC 2-6
P1800SD 2-10
P1800Z_ 2-44
P1803A_ 2-32
P1803AC MC 2-34
P1803U_ 2-20
P1803Z_ 2-40
Part Number Page
Part Number Index
© 2002 Teccor Electronics 1-7 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Product Selection
Guide
P1804U_ 2-22
P1806U_ 2-24
P1900ME 2-64
P2000AA61 2-26
P2000S_ 2-38
P2103A_ 2-32
P2103AC MC 2-34
P2103U_ 2-20
P2103Z_ 2-40
P2106U_ 2-24
P2200AA61 2-26
P2202A_ 2-28
P2202AC MC 2-30
P2202Z_ 2-42
P2300E_ 2-16
P2300ME 2-64
P2300S_ 2-4
P2300SC MC 2-6
P2300SD 2-10
P2300Z_ 2-44
P2304U_ 2-22
P2353A_ 2-32
P2353AC MC 2-34
P2353U_ 2-20
P2353Z_ 2-40
P2356U_ 2-24
P2400AA61 2-26
P2500AA61 2-26
P2500S_ 2-38
P2600E_ 2-16
P2600EC MC 2-18
P2600S_ 2-4
P2600SC MC 2-6
P2600SD 2-10
P2600Z_ 2-44
P2604U_ 2-22
P2702A_ 2-28
P2702AC MC 2-30
P2702Z_ 2-42
P2703A_ 2-32
Part Number Page
P2703AC MC 2-34
P2703U_ 2-20
P2703Z_ 2-40
P2706U_ 2-24
P3000AA61 2-26
P3002A_ 2-28
P3002AC MC 2-30
P3002CA 2-12
P3002S_ 2-14
P3002Z_ 2-42
P3100AD 2-62
P3100E_ 2-16
P3100EC MC 2-18
P3100S_ 2-4
P3100SC MC 2-6
P3100SD 2-10
P3104U_ 2-22
P3100Z_ 2-44
P3203A_ 2-32
P3203AC MC 2-34
P3203U_ 2-20
P3203Z_ 2-40
P3206U_ 2-24
P3300AA61 2-26
P3403A_ 2-32
P3403AC MC 2-34
P3403U_ 2-20
P3403Z_ 2-40
P3406U_ 2-24
P3500E_ 2-16
P3500S_ 2-4
P3500SC MC 2-6
P3500SD 2-10
P3500Z_ 2-44
P3504U_ 2-22
P3602A_ 2-28
P3602AC MC 2-30
P3602Z_ 2-42
P4202A_ 2-28
P4202AC MC 2-30
Part Number Page
P4202Z_ 2-42
P4802A_ 2-28
P4802AC MC 2-30
P4802Z_ 2-42
P5103A_ 2-32
P5103AC MC 2-34
P5103U_ 2-20
P5106U_ 2-24
P6002A_ 2-28
P6002AC MC 2-30
P6002AD 2-62
P6002CA 2-12
P6002Z_ 2-42
Part Number Page
Description of Part Number
http://www.teccor.com 1 - 8 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Description of Part Number
The following illustration shows a description of a sample SIDACtor device part number.
P 210 2 A A
DEVICE TYPE
P = SIDACtor
PACKAGE TYPE
A = TO–220
C = Three-leaded DO-214
E = TO–92
M = TO-218
S = DO–214
U = Six-pin SOIC
Z = SIP
LEAD FORM OPTIONS
TO-220 modified type 60, 61, or 62
For U type:
3 = 3 chips
4 = 4 chips
6 = 6 chips
61
CONSTRUCTION VARIABLE
0 = One chip
1 = Unidirectional part
2 = Two chips
3 = Three chips
IPP RATING
A = 50 A (10x560 µs)
B = 100 A (10x560 µs)
C = 500 A (2x10 µs)
D = 1000 A (8x20 µs)
E = 3000 A (8x20 µs)
RP
PACKING OPTIONS
RP1 = TO-92 reel pack (0.100" lead spacing)
RP2 = TO-92 reel pack (0.200" lead spacing)
AP = Ammo pack
RP = Reel pack
TP = Tube pack
MEDIAN VOLTAGE RATING
210 = 210 V
0 = One SIDACtor Chip
2 = Two Matched SIDACtor Chips
3 = Three Matched SIDACtor Chips
Patented
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Description of Part Number
Product Selection
Guide
© 2002 Teccor Electronics 1 - 9 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
The following illustration shows a description of a sample Battrax device part number.
The following illustration shows a description of a sample asymmetrical SIDACtor device
part number.
B1 1 U A
DEVICE TYPE
B = Battrax
PACKAGE TYPE
C = Three-leaded DO-214
U = Six-pin SOIC
CONSTRUCTION VARIABLE
0 = No diode
1 = Diode
4 = Four Battrax Devives
IPP RATING
A = 50 A (10x560 µs)
B = 100 A (10x560 µs)
C = 500 A (2x10 µs)
HOLDING CURRENT
05 = 50 mA
10 = 100 mA
16 = 160 mA
20 = 200 mA
10
Battrax TYPE
1 = Negative
2 = Positive
3 = Dual
A1806 U C
DEVICE TYPE
A = Asymmetrical SIDACtor
PACKAGE TYPE
A = TO-220
M = TO-218
U = Six-pin SOIC
LEAD FORM OPTIONS
TO-220 modified type 60, 61, or 62
For U type:
3 = 3 chips
4 = 4 chips
6 = 6 chips
4
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RATING
A = 50 A (10x560 µs)
B = 100 A (10x560 µs)
C = 500 A (2x10 µs)
D = 1000 A (8x20 µs)
E = 3000 A (8x20 µs)
PACKING OPTIONS
AP = Ammo pack
RP = Reel pack
TP = Tube pack
MEDIAN VOLTAGE RATING
1806 = 180 V and 60 V
TP
3 = Three Matched SIDACtor chips
Patented
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Electrical Parameters
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+1 972-580-7777 SIDACtor® Data Book and Design Guide
Electrical Parameters
Electrical parameters are based on the following definition of conditions:
• On state (also referred to as the crowbar condition) is the low impedance condition
reached during full conduction and simulates a short circuit.
• Off state (also referred to as the blocking condition) is the high impedance condition prior
to beginning conduction and simulates an open circuit.
CO Off-state Capacitance — typical capacitance measured in off state
di/dt Rate of Rise of Current — maximum rated value of the acceptable rate of
rise in current over time
dv/dt Rate of Rise of Voltage — rate of applied voltage over time
ISSwitching Current — maximum current required to switch to on state
IDRM Leakage Current — maximum peak off-state current measured at VDRM
IHHolding Current — minimum current required to maintain on state
IPP Peak Pulse Current — maximum rated peak impulse current
ITOn-state Current — maximum rated continuous on-state current
ITSM Peak One-cycle Surge Current — maximum rated one-cycle AC current
VSSwitching Voltage — maximum voltage prior to switching to on state
VDRM Peak Off-state Voltage — maximum voltage that can be applied while
maintaining off state
VFOn-state Forward Voltage — maximum forward voltage measured at rated
on-state current
VTOn-state Voltage — maximum voltage measured at rated on-state current
Quality and Reliability
Product Selection
Guide
© 2002 Teccor Electronics 1 - 11 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Quality and Reliability
It is Teccor’s policy to ship quality products on time. We accomplish this through Total
Quality Management based on the fundamentals of customer focus, continuous
improvement, and people involvement.
In support of this commitment, Teccor applies the following principles:
• Employees shall be respected, involved, informed, and qualified for their job with
appropriate education, training, and experience.
• Customer expectations shall be met or exceeded by consistently shipping products that
meet the agreed specifications, quality levels, quantities, schedules, and test and
reliability parameters.
• Suppliers shall be selected by considering quality, service, delivery, and cost of
ownership.
• Design of products and processes will be driven by customer needs, reliability, and
manufacturability.
It is the responsibility of management to incorporate these principles into policies and
systems.
It is the responsibility of those in leadership roles to coach their staff and to reinforce these
principles.
It is the responsibility of each individual employee to follow the spirit of this statement to
ensure that we meet the primary policy — to ship quality products on time.
Standard Terms and Conditions
© 2002 Teccor Electronics 1 - 12 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Standard Terms and Conditions
Supplier shall not be bound by any term proposed by Buyer in the absence of written agreement to such term signed by an
authorized officer of Supplier.
(1) PRICE:
(A) Supplier reserves the right to change product prices at any time but, whenever practicable, Supplier will give Buyer at
least thirty (30) days written notice before the effective date of any price change. Unless Supplier has specifically
agreed in writing, signed by an authorized officer of Supplier, that a quoted price shall not be subject to change for a
certain time, all products shipped on or after the effective date of a price change may be billed at the new price level.
(B) Whenever Supplier agrees to a modification of Buyer's order (which modification must be in writing and signed by an
authorized officer of Supplier), Supplier reserves the right to alter its price, whether or not such price was quoted
as “firm”.
(C) Prices do not include federal, state or local taxes, now or hereafter enacted, applicable to the goods sold. Taxes will
be added by Supplier to the sales prices whenever Supplier has legal obligation to collect them and will be paid by
Buyer as invoiced unless Buyer provides Supplier with a proper tax exemption certificate.
(2) PRODUCTION: Supplier may, at its sole discretion and at any time, withdraw any catalog item from further production without
notice or liability to Buyer.
(3) INTEREST:
(A) All late payments shall bear interest thirty (30) days after the due date stated on the invoice until paid at the lower of one
and one-half percent per month or the maximum rate permitted by law. All interest becoming due shall, if not paid when
due, be added to principal and bear interest from the due date. At Supplier's option, any payment shall be applied first
to interest and then to principal.
(B) It is the intention of the parties to comply with the laws of the jurisdiction governing any agreement between the
parties relating to interest. If any construction of the agreement between the parties indicates a different right given
to Supplier to demand or receive any sum greater than that permissible by law as interest, such as a mistake in
calculation or wording, this paragraph shall override. In any contingency which will cause the interest paid or
agreed to be paid to exceed the maximum rate permitted by law, such excess will be applied to the reduction of
any principal amount due, or if there is no principal amount due, shall be refunded.
(4) TITLE AND DELIVERY: Title to goods ordered by Buyer and risk of loss or damage in transit or thereafter shall pass to Buyer
upon Supplier's delivery of the goods at Supplier's plant or to a common carrier for shipment to Buyer.
(5) CONTINGENCIES: Supplier shall not be responsible for any failure to perform due to causes reasonably beyond its control.
These causes shall include, but not be restricted to, fire, storm, flood, earthquake, explosion, accident, acts of public enemy,
war rebellion, insurrection, sabotage, epidemic, quarantine restrictions, labor disputes, labor shortages, labor slow downs
and sit downs, transportation embargoes, failure or delays in transportation, inability to secure raw materials or machinery for
the manufacture of its devices, acts of God, acts of the Federal Government or any agency thereof, acts of any state or local
government or agency thereof, and judicial action. Similar causes shall excuse Buyer for failure to take goods ordered by
Buyer, from the time Supplier receives written notice from Buyer and for as long as the disabling cause continues, other than
for goods already in transit or specially fabricated and not readily saleable to other buyers.
Supplier assumes no responsibility for any tools, dies, and other equipment furnished Supplier by Buyer.
(6) LIMITED WARRANTY AND EXCLUSIVE REMEDY: Supplier warrants all catalog products to be free from defects in materials
and workmanship under normal and proper use and application for a period of twelve (12) months from the date code on the
product in question (or if none, from the date of delivery to Buyer.) With respect to products assembled, prepared, or manu-
factured to Buyer's specifications, Supplier warrants only that such products will meet Buyer's specifications upon delivery.
As the party responsible for the specifications, Buyer shall be responsible for testing and inspecting the products for adher-
ence to specifications, and Supplier shall have no liability in the absence of such testing and inspection or if the product
passes such testing or inspection. THE ABOVE WARRANTY IS THE ONLY WARRANTY EXTENDED BY SUPPLIER, AND
IS IN LIEU OF AND EXCLUDES ALL OTHER WARRANTIES AND CONDITIONS, EXPRESSED OR IMPLIED (EXCEPT AS
PROVIDED HEREIN AS TO TITLE), ON ANY GOODS OR SERVICES SOLD OR RENDERED BY SUPPLIER, INCLUDING
ANY IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. THIS WARRANTY
WILL NOT CREATE WARRANTY COVERAGE FOR ANY ITEM INTO WHICH ANY PRODUCT SOLD BY SUPPLIER MAY
HAVE BEEN INCORPORATED OR ADDED.
SUPPLIER'S ENTIRE LIABILITY AND BUYER'S EXCLUSIVE REMEDY UNDER THIS WARRANTY SHALL BE, AT
SUPPLIER'S OPTION, EITHER THE REPLACEMENT OF, REPAIR OF, OR ISSUANCE OF CREDIT TO BUYER'S
ACCOUNT WITH SUPPLIER FOR ANY PRODUCTS WHICH ARE PROPERLY RETURNED BY BUYER DURING THE
WARRANTY PERIOD. All returns must comply with the following conditions:
Standard Terms and Conditions
Product Selection
Guide
© 2002 Teccor Electronics 1 - 13 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
(A) Supplier is to be promptly notified in writing upon discovery of defects by Buyer.
(B) Buyer must obtain a Return Material Authorization (RMA) number from the Supplier prior to returning product.
(C) The defective product is returned to Supplier, transportation charges prepaid by Buyer.
(D) Supplier's examination of such product discloses, to its satisfaction, that such defects have not been caused by
misuse, neglect, improper installation, repair, alteration, or accident.
(E) The product is returned in the form it was delivered with any necessary disassembly carried out by Buyer at Buyer's
expense.
IN NO EVENT SHALL SUPPLIER, OR ANYONE ELSE ASSOCIATED IN THE CREATION OF ANY OF SUPPLIER'S
PRODUCTS OR SERVICES, BE LIABLE TO BUYER FOR INCIDENTAL OR CONSEQUENTIAL DAMAGES OF ANY
NATURE INCLUDING LOSS OF PROFITS, LOSS OF USE, BUSINESS INTERUPTION, AND THE LIKE. BUYER
ACKNOWLEDGES THAT THE ABOVE WARRANTIES AND LIMITATIONS THEREON ARE APPROPRIATE AND
REASONABLE IN EFFECTUATING SUPPLIER'S AND BUYER'S MUTUAL INTENTION TO CONDUCT AN EFFICIENT
TRANSACTION AT PRICES MORE ADVANTAGEOUS TO BUYER THAN WOULD BE AVAILABLE IN THE PRESENCE
OF OTHER WARRANTIES AND ASSURANCES.
(7) PATENTS: Buyer shall notify Supplier in writing of any claim that any product or any part of use thereof furnished under this
agreement constitutes an infringement of any U.S. patent, copyright, trade secret, or other proprietary rights of a third party.
Notice shall be given within a reasonable period of time which should in most cases be within ten (10) days of receipt by
Buyer of any letter, summons, or complaint pertaining to such a claim. At its option, Supplier may defend at its expense any
action brought against Buyer to the extent that it is based on such a claim. Should Supplier choose to defend any such claim,
Supplier may fully participate in the defense, settlement, or appeal of any action based on such claim.
Should any product become, or in Supplier's opinion be likely to become, the subject of an action based on any such
claim, Supplier may, at its option, as the Buyer's exclusive remedy, either procure for the Buyer the right to continue
using the product, replace the product or modify the product to make it noninfringing. IN NO EVENT SHALL SUPPLIER
BE LIABLE FOR ANY INCIDENTAL OR CONSEQUENTIAL DAMAGES BASED ON ANY CLAIM OF INFRINGEMENT.
Supplier shall have no liability for any claim based on modifications of a product made by any person or entity other than
Supplier, or based on use of a product in conjunction with any other item, unless expressly approved by Supplier.
Supplier does not warrant goods against claims of infringement which are assembled, prepared, or manufactured to
Buyer's specifications.
(8) NON-WAIVER OF DEFAULT: Each shipment made under any order shall be treated as a separate transaction, but in the
event of any default by Buyer, Supplier may decline to make further shipments without in any way affecting its rights under
such order. If, despite any default by Buyer, Supplier elects to continue to make shipments, its action shall not constitute a
waiver of that or any default by Buyer or in any way affect Supplier's legal remedies for any such default. At any time, Sup-
plier's failure to exercise any right to remedy available to it shall not constitute a waiver of that right or remedy.
(9) TERMINATION: If the products to be furnished under this order are to be used in the performance of a Government contract
or subcontract, and the Government terminates such contract in whole or part, this order may be canceled to the extent it
was to be used in the canceled portion of said Government contract and the liability of Buyer for termination allowances shall
be determined by the then applicable regulations of the Government regarding termination of contracts. Supplier may cancel
any unfilled orders unless Buyer shall, upon written notice, immediately pay for all goods delivered or shall pay in advance
for all goods ordered but not delivered, or both, at Supplier's option.
(10) LAW: The validity, performance and construction of these terms and conditions and any sale made hereunder shall be gov-
erned by the laws of the state of Texas.
(11) ASSIGNS: This agreement shall not be assignable by either Supplier or Buyer. However, should either Supplier or Buyer be
sold or transferred in its entirety and as an ongoing business, or should Supplier or Buyer sell or transfer in its entirety and as
an ongoing concern, any division, department, or subsidiary responsible in whole or in part for the performance of this Agree-
ment, this Agreement shall be binding upon and inure to the benefit of those successors and assigns of Supplier, Buyer, or
such division, department, or subsidiary.
(12) MODIFICATION OF STANDARD TERMS AND CONDITIONS: No attempted or suggested modification of or addition to any
of the provisions upon the face or reverse of this form, whether contained or arising in correspondence and/or documents
passing between Supplier and Buyer, in any course of dealing between Supplier or Buyer, or in any customary usage preva-
lent among businesses comparable to those of Supplier and/or Buyer, shall be binding upon Supplier unless made and
agreed to in writing and signed by an officer of Supplier.
(13) QUANTITIES: Any variation in quantities of electronic components, or other goods shipped over or under the quantities
ordered (not to exceed 5%) shall constitute compliance with Buyer's order and the unit price will continue to apply.
NOTES
© 2002 Teccor Electronics 2-1 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
2Data Sheets
This section presents complete electrical specifications for Teccor’s SIDACtor solid state
overvoltage protection devices.
DO-214AA Package Symbolization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
DO-214AA
SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
MicroCapacitance (MC) SC SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
MicroCapacitance (MC) SA SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
High Surge Current (D-rated) SIDACtor Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
Compak Two-chip SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12
Ethernet/10BaseT/100BaseT Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
TO-92
SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16
MicroCapacitance (MC) SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18
Modified MS-013 (Six-pin Surface Mount)
Balanced Three-chip SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20
Multiport SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22
Multiport Balanced SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-24
Modified TO-220
SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-26
Two-chip SIDACtor Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-28
Two-chip MicroCapacitance (MC) SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-30
Balanced Three-chip SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-32
Balanced Three-chip MicroCapacitance (MC) SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . 2-34
LCAS
LCAS Asymmetrical Multiport Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-36
LCAS Asymmetrical Discrete Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-38
SIP Hybrid Overvoltage and Overcurrent Protector
Four-Port Balanced Three-chip Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-40
Four-Port Longitudinal Two-chip Protector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-42
Four-Port Metallic Line Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-44
SLICs
Fixed Voltage SLIC Protector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-46
Twin SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-48
Multiport SLIC Protector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-50
Battrax
Battrax SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-52
Battrax Dual Negative SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-54
Battrax Dual Positive/Negative SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-56
Battrax Quad Negative SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-58
CATVs
CATV and HFC SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-60
High Surge Current SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-62
CATV Line Amplifiers/Power Inserters SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-64
TeleLink Fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-66
Acronyms: CATV Community Antenna TV
HFC Hybrid Fiber Coax
LCAS Line Circuit Access Switch
SIP Single In-line Package
SLIC Subscriber Line Interface Circuit
DO-214AA Package Symbolization
© 2002 Teccor Electronics 2 - 3 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
DO-214AA Package Symbolization
Note: Date code is located below the symbolized part number.
Part Number Part Number Part Number
Catalog Symbolized Catalog Symbolized Catalog Symbolized
P0080SA P-8A P0901SC P91C P2300SB P23B
P0080SA MC P-8AM P1100SA P11A P2300SC P23C
P0080SB P-8B P1100SB P11B P2300SD P23D
P0080SC P-8C P1100SC P11C P2300SC MC P23CM
P0080SD P-8D P1100SD P11D P2500SA P25A
P0080SC MC P-8CM P1100SC MC P11CM P2500SB P25B
P0300SA P03A P1101CA2 P02A P2500SC P25C
P0300SA MC P03AM P1101SA P01A P2500SD P25D
P0300SB P03B P1101SC P01C P2500SC MC P25CM
P0300SC P03C P1200SA P12A P2600SA P26A
P0300SD P03D P1200SB P12B P2600SB P26B
P0300SC MC P03CM P1200SC P12C P2600SC P26C
P0640SA P06A P1200SD P12D P2600SD P26D
P0640SB P06B P1200SC MC P12CM P2600SC MC P26CM
P0640SC P06C P1300SA P13A P3002CB P30B
P0640SD P06D P1300SB P13B P3002SB P30B
P0640SC MC P06CM P1300SC P13C P3100SA P31A
P0641CA2 P62A P1300SD P13D P3100SB P31B
P0641SA P61A P1300SC MC P13CM P3100SC P31C
P0641SC P61C P1500SA P15A P3100SD P31D
P0720SA P07A P1500SB P15B P3100SC MC P31CM
P0720SB P07B P1500SC P15C P3500SA P35A
P0720SC P07C P1500SD P15D P3500SB P35B
P0720SD P07D P1500SC MC P15CM P3500SC P35C
P0720SC MC P07CM P1800SA P18A P3500SD P35D
P0721CA2 P72A P1800SB P18B P3500SC MC P35CM
P0721SA P71A P1800SC P18C P6002CB P60B
P0721SC P71C P1800SD P18D B1100CA B10A
P0900SA P09A P1800SC MC P18CM B1100CC B10C
P0900SB P09B P2000SA P20A B1160CA B16A
P0900SC P09C P2000SB P20B B1160CC B16C
P0900SD P09D P2000SC P20C B1200CA B12A
P0900SC MC P09CM P2000SD P20D B1200CC B12C
P0901CA2 P92A P2000SC MC P20CM B2050CA B25A
P0901SA P91A P2300SA P23A B2050CC B25C
SIDACtor Device
http://www.teccor.com 2 - 4 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
SIDACtor Device
DO-214AA SIDACtor solid state protection devices protect telecommunications equipment
such as modems, line cards, fax machines, and other CPE.
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
* For individual “SA”, “SB”, and “SC” surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for “SA” and “SB” product. “SC” capacitance is
approximately 2x the listed value. The off-state capacitance of the P0080SB is equal to the “SC” device.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
P0080S_ 6 25 4 5 800 2.2 50 100
P0300S_ 25 40 4 5 800 2.2 50 110
P0640S_ 58 77 4 5 800 2.2 150 50
P0720S_ 65 88 4 5 800 2.2 150 50
P0900S_ 75 98 4 5 800 2.2 150 50
P1100S_ 90 130 4 5 800 2.2 150 40
P1300S_ 120 160 4 5 800 2.2 150 40
P1500S_ 140 180 4 5 800 2.2 150 40
P1800S_ 170 220 4 5 800 2.2 150 30
P2300S_ 190 260 4 5 800 2.2 150 30
P2600S_ 220 300 4 5 800 2.2 150 30
P3100S_ 275 350 4 5 800 2.2 150 30
P3500S_ 320 400 4 5 800 2.2 150 30
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
B 250 250 150 100 80 30 500
C 500 400 200 150 100 30 500
SIDACtor Device
© 2002 Teccor Electronics 2 - 5 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
DO-214AA TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 90 °C/W
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
MicroCapacitance (MC) SC SIDACtor Device
http://www.teccor.com 2 - 6 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
MicroCapacitance (MC) SC SIDACtor Device
The DO-214AA SC MC SIDACtor series is intended for applications sensitive to load
values. Typically, high speed connections require a lower capacitance. CO values for the
MicroCapacitance device are 40% lower than a standard SC part.
This MC SIDACtor series is used to enable equipment to meet various regulatory
requirements including GR 1089, IEC 60950, UL 60950, and TIA-968 (formerly known as
FCC Part 68). Contact factory regarding ITU K.20, K.21, and K.45.
* For surge ratings, see table below.
** Contact factory for release date.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured at 1 MHz with a 2 V bias.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
P0080SC MC ** 6 25 4 5 800 2.2 50 55
P0300SC MC ** 25 40 4 5 800 2.2 50 35
P0640SC MC 58 77 4 5 800 2.2 150 60
P0720SC MC 65 88 4 5 800 2.2 150 60
P0900SC MC 75 98 4 5 800 2.2 150 60
P1100SC MC 90 130 4 5 800 2.2 150 50
P1300SC MC 120 160 4 5 800 2.2 150 50
P1500SC MC 140 180 4 5 800 2.2 150 50
P1800SC MC 170 220 4 5 800 2.2 150 40
P2300SC MC 190 260 4 5 800 2.2 150 40
P2600SC MC 220 300 4 5 800 2.2 150 40
P3100SC MC 275 350 4 5 800 2.2 150 40
P3500SC MC 320 400 4 5 800 2.2 150 40
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
C 500 400 200 150 100 30 500
MicroCapacitance (MC) SC SIDACtor Device
© 2002 Teccor Electronics 2 - 7 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
DO-214AA TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 90 °C/W
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
MicroCapacitance (MC) SA SIDACtor Device
http://www.teccor.com 2 - 8 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
MicroCapacitance (MC) SA SIDACtor Device
The DO-214AA SA MC SIDACtor series is intended for applications sensitive to load
values. Typically, high speed connections require a lower capacitance. CO values for the
MicroCapacitance device are 40% lower than a standard SA part.
This MC SIDACtor series is used to enable equipment to meet various regulatory
requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-
968 (formerly known as FCC Part 68).
* For surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured at 1 MHz with a 2 V bias.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
P0080SA MC 6 25 4 5 800 2.2 50 45
P0300SA MC 25 40 4 5 800 2.2 50 25
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
MicroCapacitance (MC) SA SIDACtor Device
© 2002 Teccor Electronics 2 - 9 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
DO-214AA TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 90 °C/W
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
High Surge Current (D-rated) SIDACtor Device
http://www.teccor.com 2 - 10 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
High Surge Current (D-rated) SIDACtor Device
DO-214AA SIDACtor solid state protection devices with a D surge rating protect
telecommunications equipment such as modems, line cards, fax machines, and other CPE.
These SIDACtor devices withstand simultaneous surges incurred in GR 1089 lightning
tests. (See "First Level Lightning Surge Test" on page 4-5.) Surge ratings are twice that of a
device with a C surge rating. This allows a discrete surface mount version of Teccor’s
patented “Y” configuration. (US Patent 4,905,119)
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
* For surge ratings, see table below.
** Contact factory for release date.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
P0080SD ** 6 25 4 5 800 2.2 50 200
P0300SD ** 25 40 4 5 800 2.2 50 220
P0640SD ** 58 77 4 5 800 2.2 50 100
P0720SD ** 65 88 4 5 800 2.2 50 100
P0900SD ** 75 98 4 5 800 2.2 50 100
P1100SD 90 130 4 5 800 2.2 50 80
P1300SD 120 160 4 5 800 2.2 50 80
P1500SD 140 180 4 5 800 2.2 50 80
P1800SD 170 220 4 5 800 2.2 50 60
P2300SD 190 260 4 5 800 2.2 50 60
P2600SD 220 300 4 5 800 2.2 50 60
P3100SD 275 350 4 5 800 2.2 50 60
P3500SD 320 400 4 5 800 2.2 50 60
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
D 1000 800 400 300 200 50 1000
High Surge Current (D-rated) SIDACtor Device
© 2002 Teccor Electronics 2 - 11 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
DO-214AA TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 90 °C/W
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Compak Two-chip SIDACtor Device
http://www.teccor.com 2 - 12 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Compak Two-chip SIDACtor Device
The modified DO-214AA SIDACtor device provides low-cost, longitudinal protection.
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
* For surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured between Pins 1-3 at 1 MHz with a 2 V bias.
• UL 60950 creepage requirements must be considered.
Electrical Parameters
Part
Number
VDRM
Volts
VS
Volts
VDRM
Volts
VS
Volts VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
Pins1-2, 2-3 Pins 1-3 Pins 1-3
P3002CA 140 180 280 360 4 5 800 1 120 15
P6002CA 275 350 550 700 4 5 800 1 120 15
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
1
2
3
(T)
(R)
(G)
Compak Two-chip SIDACtor Device
© 2002 Teccor Electronics 2 - 13 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified DO-214AA TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 85 °C/W
Pin 3
Pin 1
Pin 2
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Ethernet/10BaseT/100BaseT Protector
http://www.teccor.com 2 - 14 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Ethernet/10BaseT/100BaseT Protector
The DO-214AA SIDACtor Ethernet protection series is intended for applications sensitive to
load values. Typically, high speed connections require a lower capacitance. CO values are
40% lower than standard devices.
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
* For surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured at 1 MHz with a 2 V bias.
** Contact factory for release date of B-rated devices.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
P0642S_ 58 77 4 5 800 2.2 120 25
P0722S_ 65 88 4 5 800 2.2 120 25
P0902S_ 75 98 4 5 800 2.2 120 25
P1102S_ 90 130 4 5 800 2.2 120 20
P3002S_ 280 360 4 5 800 2.2 120 15
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
B** 250 250 150 100 80 30 500
Ethernet/10BaseT/100BaseT Protector
© 2002 Teccor Electronics 2 - 15 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
DO-214AA TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 90 °C/W
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
SIDACtor Device
http://www.teccor.com 2 - 16 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
SIDACtor Device
TO-92 SIDACtor solid state protection devices protect telecommunications equipment such
as modems, line cards, fax machines, and other CPE.
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68)
.
* For individual “EA”, “EB”, and “EC” surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for “EA” and “EB” product. “EC” capacitance is
approximately 2x the listed value. The off-state capacitance of the P0080EB is equal to the “EC” device.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
P0080E_ 6 25 4 5 800 2.2 50 100
P0300E_ 25 40 4 5 800 2.2 50 110
P0640E_ 58 77 4 5 800 2.2 150 50
P0720E_ 65 88 4 5 800 2.2 150 50
P0900E_ 75 98 4 5 800 2.2 150 50
P1100E_ 90 130 4 5 800 2.2 150 40
P1300E_ 120 160 4 5 800 2.2 150 40
P1500E_ 140 180 4 5 800 2.2 150 40
P1800E_ 170 220 4 5 800 2.2 150 30
P2300E_ 190 260 4 5 800 2.2 150 30
P2600E_ 220 300 4 5 800 2.2 150 30
P3100E_ 275 350 4 5 800 2.2 150 30
P3500E_ 320 400 4 5 800 2.2 150 30
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
B 250 250 150 100 80 30 500
C 500 400 200 150 100 50 500
SIDACtor Device
© 2002 Teccor Electronics 2 - 17 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
TO-92
TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 90 °C/W
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
MicroCapacitance (MC) SIDACtor Device
http://www.teccor.com 2 - 18 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
MicroCapacitance (MC) SIDACtor Device
The TO-92 MC SIDACtor series is intended for applications sensitive to load values.
Typically, high speed connections require a lower capacitance. CO values for MC devices
are 40% lower than a standard EC part.
This MC SIDACtor series is used to enable equipment to meet various regulatory
requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-
968 (formerly known as FCC Part 68) without the need of series resistors.
* For surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured at 1 MHz with a 2 V bias.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
P0640EC MC 58 77 4 5 800 2.2 150 60
P1500EC MC 140 180 4 5 800 2.2 150 50
P2600EC MC 220 300 4 5 800 2.2 150 40
P3100EC MC 275 350 4 5 800 2.2 150 40
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
C 500 400 200 150 100 50 500
MicroCapacitance (MC) SIDACtor Device
© 2002 Teccor Electronics 2 - 19 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
TO-92
TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 90 °C/W
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Balanced Three-chip SIDACtor Device
http://www.teccor.com 2 - 20 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Balanced Three-chip SIDACtor Device
This balanced protector is a surface mount alternative to the modified TO-220 package.
Based on a six-pin surface mount SOIC package, it uses Teccor’s patented “Y”
(US Patent 4,905,119) configuration. It is available in surge current ratings up to 500 A.
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
* For individual “UA”, “UB”, and “UC” surge ratings, see table below.
** Asymmetrical
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured between Pins 1-3 and 1-4 at 1 MHz with a 2 V bias and is a typical value for “UA” product. “UB”
and “UC” capacitance is approximately 2x higher.
• Device is designed to meet balance requirements of GTS 8700 and GR 974.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VDRM
Volts
VS
Volts VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pFPins 1-3, 1-4 Pins 3-4
P1553U_ 130 180 130 180 8 5 800 2.2 150 40
P1803U_ 150 210 150 210 8 5 800 2.2 150 40
P2103U_ 170 250 170 250 8 5 800 2.2 150 40
P2353U_ 200 270 200 270 8 5 800 2.2 150 40
P2703U_ 230 300 230 300 8 5 800 2.2 150 30
P3203U_ 270 350 270 350 8 5 800 2.2 150 30
P3403U_ 300 400 300 400 8 5 800 2.2 150 30
P5103U_ 420 600 420 600 8 5 800 2.2 150 30
A2106U_3 ** 170 250 50 80 8 5 800 2.2 120 40
A5030U_3 ** 400 550 270 350 8 5 800 2.2 150 30
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
B 250 250 150 100 80 30 500
C 500 400 200 150 100 50 500
1
4
6
3
25
Balanced Three-chip SIDACtor Device
© 2002 Teccor Electronics 2 - 21 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified MS-013 TJOperating Junction Temperature Range -40 to +125 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 60 °C/W
1
2
3
6
5
4
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Multiport SIDACtor Device
http://www.teccor.com 2 - 22 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Multiport SIDACtor Device
The multiport line protector is an integrated multichip solution for protecting multiple
twisted pair from overvoltage conditions. Based on a six-pin surface mount SOIC
package, it is equivalent to four discrete DO-214AA or two TO-220 packages. Available
in surge current ratings up to 500 A, the multiport line protector is ideal for densely
populated, high-speed line cards that cannot afford PCB inefficiencies or the use of
series power resistors.
SIDACtor devices are used to enable equipment to meet various regulatory
requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and
TIA-968 (formerly known as FCC Part 68).
* For individual “UA”, “UB”, and “UC” surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM, and VS is measured at 100 V/µs.
• Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “UA” product. “UB”
and “UC” capacitance is approximately 2x higher.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VDRM
Volts
VS
Volts VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pFPins 1-2, 3-2, 4-5, 6-5 Pins 1-3, 4-6
P0084U_ 6 25 12 50 4 5 800 2.2 50 100
P0304U_ 25 40 50 80 4 5 800 2.2 50 110
P0644U_ 58 77 116 154 4 5 800 2.2 150 50
P0724U_ 65 88 130 176 4 5 800 2.2 150 50
P0904U_ 75 98 150 196 4 5 800 2.2 150 50
P1104U_ 90 130 180 260 4 5 800 2.2 150 40
P1304U_ 120 160 240 320 4 5 800 2.2 150 40
P1504U_ 140 180 280 360 4 5 800 2.2 150 40
P1804U_ 170 220 340 440 4 5 800 2.2 150 30
P2304U_ 190 260 380 520 4 5 800 2.2 150 30
P2604U_ 220 300 440 600 4 5 800 2.2 150 30
P3104U_ 275 350 550 700 4 5 800 2.2 150 30
P3504U_ 320 400 640 800 4 5 800 2.2 150 30
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
B 250 250 150 100 80 30 500
C 500 400 200 150 100 50 500
1
(R
1
)
2
(G
1
)
3
(T
1
)
6
(T
2
)
4
(R
2
)
5
(G
2
)
Multiport SIDACtor Device
© 2002 Teccor Electronics 2 - 23 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified MS-013 TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 60 °C/W
1
2
3
6
5
4
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Multiport Balanced SIDACtor Device
http://www.teccor.com 2 - 24 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Multiport Balanced SIDACtor Device
This multiport balanced protector is a surface mount alternative to the modified TO-220
package. It is based on a six-pin surface mount SOIC package and uses Teccor’s
patented “Y” (US Patent 4,905,119) configuration. It is available in surge current ratings up
to 500 A.
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
* For individual “UA”, “UB”, and “UC” surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “UA” product. “UB”
and “UC” capacitance is approximately 10 pF higher.
• Device is designed to meet balance requirements of GTS 8700 and GR 974.
Electrical Parameters — Symmetrical
Part
Number *
VDRM
Volts
VS
Volts
VDRM
Volt
VS
Volts VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
Pins 1-2, 2-3, 1-3 Pins 4-5, 5-6, 4-6 Pins 3-2, 6-5, 1-2, 4-5
P1556U_ 130 180 130 180 8 5 800 2.2 150 50
P1806U_ 150 210 150 210 8 5 800 2.2 150 50
P2106U_ 170 250 170 250 8 5 800 2.2 150 40
P2356U_ 200 270 200 270 8 5 800 2.2 150 40
P2706U_ 230 300 230 300 8 5 800 2.2 150 40
P3206U_ 270 350 270 350 8 5 800 2.2 150 40
P3406U_ 300 400 300 400 8 5 800 2.2 150 40
P5106U_ 420 600 420 600 8 5 800 2.2 150 40
Electrical Parameters — Asymmetrical
Part
Number *
VDRM
Volts
VS
Volts
VDRM
Volt
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
Pins 1-2, 2-3, 4-5,
5-6 Pins 4-6, 1-3
A2106U_6 170 250 50 80 3.5 5 800 2.2 120 40
A5030U_6 400 550 270 350 3.5 5 800 2.2 150 30
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
B 250 250 150 100 80 30 500
C 500 400 200 150 100 50 500
1
4
6
3
25
Multiport Balanced SIDACtor Device
© 2002 Teccor Electronics 2 - 25 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified MS-013 TJOperating Junction Temperature Range -40 to +125 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 60 °C/W
1
2
3
6
5
4
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
SIDACtor Device
http://www.teccor.com 2 - 26 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
SIDACtor Device
The modified TO-220 Type 61 SIDACtor solid state protection device can be used in
telecommunication protection applications that do not reference earth ground.
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
* For surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
P2000AA61 180 220 4 5 800 2.2 150 30
P2200AA61 200 240 4 5 800 2.2 150 30
P2400AA61 220 260 4 5 800 2.2 150 30
P2500AA61 240 290 4 5 800 2.2 150 30
P3000AA61 270 330 4 5 800 2.2 150 30
P3300AA61 300 360 4 5 800 2.2 150 30
Surge Ratings
Series
IPP
0.2x310 µs
Amps
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
5x320 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 20 150 150 90 50 75 45 20 500
SIDACtor Device
© 2002 Teccor Electronics 2 - 27 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified
TO-220
Type 61
TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 50 °C/W
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Two-chip SIDACtor Device
http://www.teccor.com 2 - 28 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Two-chip SIDACtor Device
The two-chip modified TO-220 SIDACtor solid state device protects telecommunication
equipment in applications that reference Tip and Ring to earth ground but do not require
balanced protection.
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
* For individual “AA”, “AB”, and “AC” surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “AA” and “AB”
product. “AC” capacitance is approximately 2x the listed value.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VDRM
Volts
VS
Volts VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pFPins 1-2, 3-2 Pins 1-3
P0602A_ 25 40 50 80 4 5 800 2.2 50 110
P1402A_ 58 77 116 154 4 5 800 2.2 150 50
P1602A_ 65 95 130 190 4 5 800 2.2 150 50
P2202A_ 90 130 180 260 4 5 800 2.2 150 40
P2702A_ 120 160 240 320 4 5 800 2.2 150 40
P3002A_ 140 180 280 360 4 5 800 2.2 150 40
P3602A_ 170 220 340 440 4 5 800 2.2 150 40
P4202A_ 190 250 380 500 4 5 800 2.2 150 30
P4802A_ 220 300 440 600 4 5 800 2.2 150 30
P6002A_ 275 350 550 700 4 5 800 2.2 150 30
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
B 250 250 150 100 80 30 500
C 500 400 200 150 100 50 500
1
2
3
(T)
(R)
(G)
Two-chip SIDACtor Device
© 2002 Teccor Electronics 2 - 29 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified
TO-220
TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 50 °C/W
PIN 1
PIN 2
PIN 3
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Two-chip MicroCapacitance (MC) SIDACtor Device
http://www.teccor.com 2 - 30 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Two-chip MicroCapacitance (MC)
SIDACtor Device
The two-chip modified TO-220 MC SIDACtor solid state device protects telecommunication
equipment in applications that reference Tip and Ring to earth ground but do not require
balanced protection.
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
* For surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VDRM
Volts
VS
Volts VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pFPins 1-2, 3-2 Pins 1-3
P0602AC MC 25 40 50 80 4 5 800 2.2 50 60
P1402AC MC 58 77 116 154 4 5 800 2.2 150 60
P1602AC MC 65 95 130 190 4 5 800 2.2 150 60
P2202AC MC 90 130 180 260 4 5 800 2.2 150 50
P2702AC MC 120 160 240 320 4 5 800 2.2 150 50
P3002AC MC 140 180 280 360 4 5 800 2.2 150 50
P3602AC MC 170 220 340 440 4 5 800 2.2 150 40
P4202AC MC 190 250 380 500 4 5 800 2.2 150 40
P4802AC MC 220 300 440 600 4 5 800 2.2 150 40
P6002AC MC 275 350 550 700 4 5 800 2.2 150 40
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
C 500 400 200 150 100 50 500
1
2
3
(T)
(R)
(G)
Two-chip MicroCapacitance (MC) SIDACtor Device
© 2002 Teccor Electronics 2 - 31 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified
TO-220
TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 50 °C/W
PIN 1
PIN 2
PIN 3
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Balanced Three-chip SIDACtor Device
http://www.teccor.com 2 - 32 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Balanced Three-chip SIDACtor Device
The three-chip modified TO-220 SIDACtor balanced solid state device is designed for
telecommunication protection systems that reference Tip and Ring to earth ground.
Applications include any piece of transmission equipment that requires balanced protection.
This device is built using Teccor’s patented “Y” (US Patent 4,905,119) configuration.
The SIDACtor device is used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20,K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
* For individual “AA”, “AB”, and “AC” surge ratings, see table below.
** Asymmetrical
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “AA” product. “AB”
and “AC” capacitance is approximately 2x the listed value.
• Device is designed to meet balance requirements of GTS 8700 and GR 974.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VDRM
Volts
VS
Volts VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pFPins 1-2, 2-3 Pins 1-3
P1553A_ 130 180 130 180 8 5 800 2.2 150 40
P1803A_ 150 210 150 210 8 5 800 2.2 150 40
P2103A_ 170 250 170 250 8 5 800 2.2 150 40
P2353A_ 200 270 200 270 8 5 800 2.2 150 40
P2703A_ 230 300 230 300 8 5 800 2.2 150 30
P3203A_ 270 350 270 350 8 5 800 2.2 150 30
P3403A_ 300 400 300 400 8 5 800 2.2 150 30
P5103A_ 420 600 420 600 8 5 800 2.2 150 30
A2106A_3 ** 170 250 50 80 8 5 800 2.2 120 40
A5030A_3 ** 400 550 270 350 8 5 800 2.2 150 30
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
B 250 250 150 100 80 30 500
C 500 400 200 150 100 50 500
1
2
3
Balanced Three-chip SIDACtor Device
© 2002 Teccor Electronics 2 - 33 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified
TO-220
TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 50 °C/W
PIN 1
PIN 2
PIN 3
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Balanced Three-chip MicroCapacitance (MC) SIDACtor Device
http://www.teccor.com 2 - 34 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Balanced Three-chip MicroCapacitance (MC)
SIDACtor Device
The balanced three-chip TO-220 MC SIDACtor solid state device protects telecommunica-
tion equipment in high-speed applications that are sensitive to load values and that require
a lower capacitance. CO values for the MC are 40% lower than a standard AC part.
This MC SIDACtor series is used to enable equipment to meet various regulatory
requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and
TIA-968 (formerly known as FCC Part 68) without the need of series resistors.
* For surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias.
• Device is designed to meet balance requirements of GTS 8700 and GR 974.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VDRM
Volts
VS
Volts VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pFPins 1-2, 2-3 Pins 1-3
P1553AC MC 130 180 130 180 8 5 800 2.2 150 40
P1803AC MC 150 210 150 210 8 5 800 2.2 150 40
P2103AC MC 170 250 170 250 8 5 800 2.2 150 40
P2353AC MC 200 270 200 270 8 5 800 2.2 150 40
P2703AC MC 230 300 230 300 8 5 800 2.2 150 30
P3203AC MC 270 350 270 350 8 5 800 2.2 150 30
P3403AC MC 300 400 300 400 8 5 800 2.2 150 30
P5103AC MC 420 600 420 600 8 5 800 2.2 150 30
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
C 500 400 200 150 100 50 500
1
2
3
Balanced Three-chip MicroCapacitance (MC) SIDACtor Device
© 2002 Teccor Electronics 2 - 35 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified
TO-220
TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 50 °C/W
PIN 1
PIN 2
PIN 3
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
LCAS Asymmetrical Multiport Device
http://www.teccor.com 2 - 36 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
LCAS Asymmetrical Multiport Device
This is an integrated multichip solution for protecting multiple twisted pair from
overvoltage conditions. Based on a six-pin surface mount SOIC package, it is
equivalent to four discrete DO-214AA or two TO-220 packages. Available in surge
current ratings up to 500 A, the multiport line protector is ideal for densely populated
line cards that cannot afford PCB inefficiencies or the use of series power resistors.
For a diagram of an LCAS (Line Circuit Access Switch) application, see Figure 3.21.
* For individual “UA”, “UB”, and “UC” surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “UA” product. “UB”
and “UC” capacitance is approximately 2x higher.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VDRM
Volts
VS
Volts VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
Pins 3-2, 6-5 Pins 1-2, 4-5 Pins 3-2, 6-5, 1-2, 4-5
A1220U_4 100 130 180 220 4 5 800 2.2 120 30
A1225U_4 100 130 230 290 4 5 800 2.2 120 30
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
B 250 250 150 100 80 30 500
C 500 400 200 150 100 50 500
1
(R
1
)
2
(G
1
)
3
(T
1
)
6
(T
2
)
4
(R
2
)
5
(G
2
)
LCAS Asymmetrical Multiport Device
© 2002 Teccor Electronics 2 - 37 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified MS-013 TJOperating Junction Temperature Range -40 to +125 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 60 °C/W
1
2
3
6
5
4
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
LCAS Asymmetrical Discrete Device
http://www.teccor.com 2 - 38 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
LCAS Asymmetrical Discrete Device
These DO-214AA SIDACtor devices are intended for LCAS (Line Circuit Access Switch)
applications that require asymmetrical protection in discrete (individual) packages. They
enable the protected equipment to meet various regulatory requirements including
GR 1089, ITU K.20, K.21, K.45, IEG 60950, UL 60950, and TIA-968.
* For individual “SA”, “SB”, and “SC” surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “SA” and “SB”
product. “SC” capacitance is approximately 10 pF higher.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
P1200S_ 100 130 4 5 800 2.2 120 40
P2000S_ 180 220 4 5 800 2.2 120 30
P2500S_ 230 290 4 5 800 2.2 120 30
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
B 250 250 150 100 80 30 500
C 500 400 200 150 100 50 500
LCAS Asymmetrical Discrete Device
© 2002 Teccor Electronics 2 - 39 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
DO-214AA TJOperating Junction Temperature Range -40 to +125 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 60 °C/W
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Four-Port Balanced Three-chip Protector
http://www.teccor.com 2 - 40 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Four-Port Balanced Three-chip Protector
This hybrid Single In-line Package (SIP) protects four twisted pairs from overcurrent and
overvoltage conditions. Comprised of twelve discrete DO-214AA SIDACtor devices and
eight TeleLink surface mount fuses, it is ideal for densely populated line cards that cannot
afford PCB inefficiencies or the use of series power resistors. Surge current ratings up to
500 A are available.
* For individual “ZA,” “ZB,” and “ZC” surge ratings, see table below.
** Asymmetrical
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured between Pins 4-3 and Pins 2-3 at 1 MHz with a 2 V bias and is a typical value for “ZA” product.
“ZB” and “ZC” capacitance is approximately 10 pF higher.
• Device is designed to meet balance requirements of GTS 8700 and GR 974.
1
2
3
4
5
Tip
Gnd
Ring
F2
F1
Z1
Z3
Z2
6
7
8
9
10
Tip
Gnd
Ring
F4
F3
Z4
Z6
Z5
11
12
13
14
15
Tip
Gnd
Ring
F6
F5
Z7
Z9
Z8
16
17
18
19
20
Tip
Gnd
Ring
F8
F7
Z10
Z12
Z11
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
Pins 2-3, 4-3, 7-8, 9-8,
12-13, 14-13, 17-18, 19-18
Pins 2-4, 7-9,
12-14, 17-19 Pins 1-3
P1553Z_ 130 180 130 180 8 5 800 2.2 150 40
P1803Z_ 150 210 150 210 8 5 800 2.2 150 40
P2103Z_ 170 250 170 250 8 5 800 2.2 150 40
P2353Z_ 200 270 200 270 8 5 800 2.2 150 40
P2703Z_ 230 300 230 300 8 5 800 2.2 150 30
P3203Z_ 270 350 270 350 8 5 800 2.2 150 30
P3403Z_ 300 400 300 400 8 5 800 2.2 150 30
A2106Z_ ** 170 250 50 80 8 5 800 2.2 120 40
A5030Z_ ** 400 550 270 350 8 5 800 2.2 150 30
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
B 250 250 150 100 80 30 500
C 500 400 200 150 100 50 500
Four-Port Balanced Three-chip Protector
© 2002 Teccor Electronics 2 - 41 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
SIP TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 90 °C/W
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Waveform
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (TJ) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Four-Port Longitudinal Two-chip Protector
http://www.teccor.com 2 - 42 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Four-Port Longitudinal Two-chip Protector
This hybrid Single In-line Package (SIP) protects four twisted pairs from overcurrent and
overvoltage conditions. Comprised of eight discrete DO-214AA SIDACtor devices and eight
TeleLink surface mount fuses, it is ideal for densely populated line cards that cannot afford
PCB inefficiencies or the use of series power resistors. Surge current ratings up to 500 A
are available.
* For individual “ZA,” “ZB,” and “ZC” surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured between Pins 4-3 and Pins 2-3 at 1 MHz with a 2 V bias and is a typical value for “ZA” product.
“ZB” and “ZC” capacitance is approximately 2x higher.
• Device is designed to meet balance requirements of GTS 8700 and GR 974.
• Lower capacitance MC versions may be available. Contact factory for further information.
1
2
3
4
5
Tip
Gnd
Ring
F2
F1
Z1
Z2
6
7
8
9
10
Tip
Gnd
Ring
F4
F3
Z3
Z4
11
12
13
14
15
Tip
Gnd
Ring
F6
F5
Z5
Z6
16
17
18
19
20
Tip
Gnd
Ring
F8
F7
Z7
Z8
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
Pins 2-3, 4-3, 7-8, 9-8,
12-13, 14-13, 17-18, 19-18
Pins 2-4, 7-9,
12-14, 17-19
Pins
2-3, 3-4
P0602Z_ 25 40 50 80 4 5 800 2.2 50 110
P1402Z_ 58 77 116 154 4 5 800 2.2 150 50
P1602Z_ 65 95 130 190 4 5 800 2.2 150 50
P2202Z_ 90 130 180 260 4 5 800 2.2 150 40
P2702Z_ 120 160 240 320 4 5 800 2.2 150 40
P3002Z_ 140 180 280 360 4 5 800 2.2 150 40
P3602Z_ 160 220 320 440 4 5 800 2.2 150 40
P4202Z_ 190 250 380 500 4 5 800 2.2 150 30
P4802Z_ 220 300 440 600 4 5 800 2.2 150 30
P6002Z_ 275 350 550 700 4 5 800 2.2 150 30
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
B 250 250 150 100 80 30 500
C 500 400 200 150 100 50 500
Four-Port Longitudinal Two-chip Protector
© 2002 Teccor Electronics 2 - 43 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
SIP TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 90 °C/W
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Waveform
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (TJ) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Four-Port Metallic Line Protector
http://www.teccor.com 2 - 44 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Four-Port Metallic Line Protector
The four-port hybrid Single In-line Package (SIP) line protector protects multiple twisted pair
from overcurrent and overvoltage conditions. Based on a SIP, it is equivalent to four
discrete DO-214AA SIDACtor devices and four surface mount fuses. Available in surge
current ratings up to 500 A, this four-port SIP line protector is ideal for densely populated
line cards that cannot afford PCB inefficiencies or the use of series power resistors.
* For individual “ZA,” “ZB,” and “ZC” surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for “ZA” and “ZB” product. “ZC” capacitance is
approximately 2x the listed value.
• Lower capacitance MC versions may be available. Contact factory for further information.
1
3
2
Tip
Ring
F1
Z1
4
6
5
Tip
Ring
F2
Z2
7
9
8
Tip
Ring
F3
Z3
10
12
11
Tip
Ring
F4
Z4
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
P0080Z_ 6 25 4 5 800 2.2 50 100
P0300Z_ 25 40 4 5 800 2.2 50 110
P0640Z_ 58 77 4 5 800 2.2 150 50
P0720Z_ 65 88 4 5 800 2.2 150 50
P0900Z_ 75 98 4 5 800 2.2 150 50
P1100Z_ 90 130 4 5 800 2.2 150 40
P1300Z_ 120 160 4 5 800 2.2 150 40
P1500Z_ 140 180 4 5 800 2.2 150 40
P1800Z_ 170 220 4 5 800 2.2 150 30
P2300Z_ 190 260 4 5 800 2.2 150 30
P2600Z_ 220 300 4 5 800 2.2 150 30
P3100Z_ 275 350 4 5 800 2.2 150 30
P3500Z_ 320 400 4 5 800 2.2 150 30
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
B 250 250 150 100 80 30 500
C 500 400 200 150 100 50 500
Four-Port Metallic Line Protector
© 2002 Teccor Electronics 2 - 45 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
SIP TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 90 °C/W
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Waveform
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (TJ) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Fixed Voltage SLIC Protector
http://www.teccor.com 2 - 46 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Fixed Voltage SLIC Protector
These DO-214AA unidirectional protectors are constructed with a SIDACtor device and an
integrated diode. They protect SLICs (Subscriber Line Interface Circuits) from damage
during transient voltage activity and enable line cards to meet various regulatory
requirements including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-
968 (formerly known as FCC Part 68).
For specific design criteria, see details in Figure 3.21.
* For individual “SA” and “SC” surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• VDRM is measured at IDRM.
• VS and VF are measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for “SA” and “SB” product. “SC” capacitance is
approximately 2x the listed value.
• Parallel capacitive loads may affect electrical parameters.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
VF
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
P0641S_ 58 77 4 5 5 800 1 120 70
P0721S_ 65 88 4 5 5 800 1 120 70
P0901S_ 75 98 4 5 5 800 1 120 70
P1101S_ 95 130 4 5 5 800 1 120 70
Surge Ratings (Preliminary Data)
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
C 500 400 200 120 100 50 500
(T/R)
(G)
Cathode
Fixed Voltage SLIC Protector
© 2002 Teccor Electronics 2 - 47 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
DO-214AA TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 90 °C/W
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
DRM
V
DRM
V
T
+V
+I
V
S
I
S
I
T
V
F
-V
-I
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Twin SLIC Protector
http://www.teccor.com 2 - 48 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Twin SLIC Protector
Subscriber Line Interface Circuits (SLIC) are highly susceptible to transient voltages, such
as lightning and power cross conditions. To minimize this threat, Teccor provides this dual-
chip, fixed-voltage SLIC protector device.
For specific design criteria, see details in Figure 3.23.
* For surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• VDRM is measured at IDRM.
• VS and VF are measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured across pins 1-2 or 2-3 at 1 MHz with a 2 V bias. Capacitance across pins 1-3 is approximately
half.
• Parallel capacitive loads may affect electrical parameters.
• Compliance with GR 1089 or UL 60950 power cross tests may require special design considerations. Contact the factory for further
information.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VDRM
Volts
VS
Volts VT
Volts
VF
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pFPins 1-2, 2-3 Pins 1-3
P0641CA2 58 77 58 77 4 5 5 800 1 120 60
P0721CA2 65 88 65 88 4 5 5 800 1 120 60
P0901CA2 75 98 75 98 4 5 5 800 1 120 60
P1101CA2 95 130 95 130 4 5 5 800 1 120 60
Surge Ratings (Preliminary Data)
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
1
3
2
(T)
(G)
(R)
Twin SLIC Protector
© 2002 Teccor Electronics 2 - 49 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified DO-214AA TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 85 °C/W
Pin 3
Pin 1
Pin 2
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
DRM
V
DRM
V
T
+V
+I
V
S
I
S
I
T
V
F
-V
-I
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (TJ) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Multiport SLIC Protector
http://www.teccor.com 2 - 50 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Multiport SLIC Protector
This multiport line protector is designed as a single-package solution for protecting
multiple twisted pair from overvoltage conditions. Based on a six-pin SOIC package, it
is equivalent to four discrete DO-214AA packages. Available in surge current ratings
up to 500 A for a 2x10 µs event, the multiport line protector is ideal for densely
populated line cards that cannot afford PCB inefficiencies or the use of series power
resistors.
For specific design criteria, see details in Figure 3.24.
* For individual “UA” and “UC” surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• VDRM is measured at IDRM.
• VS and VF are measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured across pins 1-2, 2-3, 4-5, or 5-6 at 1 MHz with a 2 V bias and is a typical value. Capacitance
across pins 1-3 or 4-6 is approximately half. “UC” capacitance is approximately 2x the listed value for “UA” product.
• Parallel capacitive loads may affect electrical parameters.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VDRM
Volts
VS
Volts
VT
Volts
VF
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
Pins
1-2, 2-3,
4-5, 5-6
Pins
1-3, 4-6
P0641U_ 58 77 58 77 4 5 5 800 1 120 70
P0721U_ 65 88 65 88 4 5 5 800 1 120 70
P0901U_ 75 98 75 98 4 5 5 800 1 120 70
P1101U_ 95 130 95 130 4 5 5 800 1 120 70
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
C 500 400 200 120 100 50 500
1
4
6
3
25
(T
1
)
(R
1
)
(G
1
)
(T
2
)
(R
2
)
(G
2
)
Multiport SLIC Protector
© 2002 Teccor Electronics 2 - 51 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified MS-013 TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 60 °C/W
1
2
3
6
5
4
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
DRM
V
DRM
V
T
+V
+I
V
S
I
S
I
T
V
F
-V
-I
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (TJ) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Battrax SLIC Protector
http://www.teccor.com 2 - 52 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Battrax SLIC Protector
This solid state protection device can be referenced to either a positive or negative voltage
source. The B1xx0C_ is for a -VREF and the B2050C_ is for a +VREF
. Designed using an
SCR and a gate diode, the B1xx0C_ Battrax begins to conduct at |-VREF| + |-1.2 V| while the
B2050C_ Battrax begins to conduct at |+VREF|+|1.2V|.
For a diagram of a Battrax application, see Figure 3.29.
* For individual “CA” and “CC” surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• IPP ratings assume VREF = ±48 V.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. “CC” product is approximately 2x the listed value.
• Positive Battrax information is preliminary data.
• VREF maximum value for the negative Battrax is -200 V.
• VREF maximum value for the positive Battrax is 110 V.
Pin 3
(-VREF)
Pin 1
(Line)
Pin 2
(Ground)
Gate
-Battrax
B1xx0C_
Pin 3
(+VREF)
Pin 2
(Ground)
Pin 1
(Line)
+Battrax
B2050C_
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IGT
mAmps
IT
Amps
IH
mAmps
CO
pF
B1100C_ |-VREF| + |-1.2 V| |-VREF| + |-10 V| 4 5 100 1 100 50
B1160C_ |-VREF| + |-1.2 V| |-VREF| + |-10 V| 4 5 100 1 160 50
B1200C_ |-VREF| + |-1.2 V| |-VREF| + |-10 V| 4 5 100 1 200 50
B2050C_ |+VREF| + |1.2 V| |+VREF| + |10 V| 4 5 50 1 5 50
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 60 50 40 500
C 500 400 200 150 100 50 500
Battrax SLIC Protector
© 2002 Teccor Electronics 2 - 53 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified DO-214AA TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 85 °C/W
Pin 3
(V
REF
)
Pin 1
(Line) Pin 2
(Ground)
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
DRM
V
DRM
V
T
+V
+I
V
S
I
S
I
T
-V
-I
V-I Characteristics for Negative Battrax
I
H
I
DRM
V
DRM
V
T
+V
+I
V
S
I
S
I
T
-V
-I
V-I Characteristics for Positive Battrax
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (TJ) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Battrax Dual Negative SLIC Protector
http://www.teccor.com 2 - 54 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Battrax Dual Negative SLIC Protector
This solid state Battrax protection device is referenced to a negative voltage source. Its
dual-chip package also includes internal diodes for transient protection from positive
surge events.
For a diagram of a Battrax application, see Figure 3.27.
* For individual “UA” and “UC” surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• IPP ratings assume a VREF = -48 V.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. “UC” product is approximately 2x the listed value.
• VREF maximum value for the B1101, B1161, and/or B1201 is -200 V.
** Call factory for release date.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
VF
Volts
IDRM
µAmps
IGT
mAmps
IT
Amps
IH
mAmps
CO
pF
B1101U_ |-VREF| + |-1.2V| |-VREF| + |-10V| 4 5 5 100 1 100 50
B1161U_ |-VREF| + |-1.2V| |-VREF| + |-10V| 4 5 5 100 1 160 50
B1201U_ |-VREF| + |-1.2V| |-VREF| + |-10V| 4 5 5 100 1 200 50
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
C** 500 400 200 120 100 50 500
1 32
5
(T) (-V
REF
) (R)
(G)
Battrax Dual Negative SLIC Protector
© 2002 Teccor Electronics 2 - 55 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified MS-013 TJOperating Junction Temperature Range -40 to +125 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 60 °C/W
1
2
3
6
5
4
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
DRM
V
DRM
V
T
+V
+I
V
S
I
S
I
T
V
F
-V
-I
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (TJ) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Battrax Dual Positive/Negative SLIC Protector
http://www.teccor.com 2 - 56 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Battrax Dual Positive/Negative SLIC Protector
This Battrax device protects Subscriber Line Interface Circuits (SLIC) that use both a
positive and negative Ring voltage. It limits transient voltages with rise times of 100 V/
µs to VREF ±10 V.
Teccor’s six-pin Battrax devices are constructed using four SCRs and four gate diodes.
The SCRs conduct when a voltage that is more negative than -VREF (and/or more
positive than +VREF) is applied to the cathode (Pins 1 and 3) of the SCR. During
conduction, the SCRs appear as a low-resistive path which forces all transients to be
shorted to ground.
For a diagram of a Battrax application, see Figure 3.30.
* For individual “UA” and “UC” surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• IPP ratings assume a VREF = ±48 V.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. “UC” product is approximately 2x the listed value.
• Positive Battrax information is preliminary data.
• VREF maximum value for the negative Battrax is -200 V.
• VREF maximum value for the positive Battrax is 110 V.
** Call factory for release date.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IGT
mAmps
IT
Amps
IH
mAmps
CO
pF
B3104U_ |-VREF| + |±1.2V| |-VREF| + |±10V| 4 5 100 1 100 50
B3164U_ |-VREF| + |±1.2V| |-VREF| + |±10V| 4 5 100 1 160 50
B3204U_ |-VREF| + |±1.2V| |-VREF| + |±10V| 4 5 100 1 200 50
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
C** 500 400 200 120 100 50 500
13
2
(T) (-V
REF
)(R)
Ground
4, 6
5
(+V
REF
)
Battrax Dual Positive/Negative SLIC Protector
© 2002 Teccor Electronics 2 - 57 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified MS-013 TJOperating Junction Temperature Range -40 to +125 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 60 °C/W
1
2
3
6
5
4
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
Positive Battrax
Characteristics
Negative Battrax
Characteristics
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (T
J
) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
Battrax Quad Negative SLIC Protector
http://www.teccor.com 2 - 58 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Battrax Quad Negative SLIC Protector
This Battrax device is an integrated overvoltage protection solution for SLIC-based
(Subscriber Line Interface Circuit) line cards. This six-pin device is constructed using
four SCRs and four gate diodes.
The device is referenced to VBAT and conducts when a voltage that is more negative
than -VREF is applied to the cathode (pins 1, 3, 4, or 6) of the SCR. During conduction,
all negative transients are shorted to Ground. All positive transients are passed to
Ground by steering diodes.
For specific diagrams showing these Battrax applications, see Figure 3.28.
* For individual “UA” and “UC” surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• IPP ratings assume a VREF = ±48 V.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. “UC” product is approximately 2x the listed value.
• VREF maximum value for the negative Battrax is -200 V.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IGT
mAmps
IT
Amps
IH
mAmps
CO
pF
B1101U_4 |-VREF| + |-1.2V| |-VREF| + |-10V| 4 5 100 1 100 50
B1161U_4 |-VREF| + |-1.2V| |-VREF| + |-10V| 4 5 100 1 160 50
B1201U_4 |-VREF| + |-1.2V| |-VREF| + |-10V| 4 5 100 1 200 50
Surge Ratings
Series
IPP
2x10 µs
Amps
IPP
8x20 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
A 150 150 90 50 45 20 500
C 500 400 200 120 100 50 500
1
(T)
3
(R)
2
(-VREF)
Ground
5
(T)
6
(R)
4
Battrax Quad Negative SLIC Protector
© 2002 Teccor Electronics 2 - 59 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified MS-013 TJOperating Junction Temperature Range -40 to +125 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 60 °C/W
1
2
3
6
5
4
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
Positive Battrax
Characteristics
Negative Battrax
Characteristics
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (TJ) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
CATV and HFC SIDACtor Device
http://www.teccor.com 2 - 60 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
CATV and HFC SIDACtor Device
This SIDACtor device is a 1000 A solid state protection device offered in a TO-220 package.
It protects equipment located in the severe surge environment of Community Antenna TV
(CATV) applications.
Used in Hybrid Fiber Coax (HFC) applications, this device replaces the gas tube
traditionally used for station protection, because a SIDACtor device has a much tighter
voltage tolerance.
* For surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
Pins 1-3
P1400AD 120 160 3 5 800 2.2 50 200
P1800AD 170 220 5.5 5 800 2.2 50 150
Surge Ratings
Series
IPP
8x20 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
D 1000 250 120 500
13
CATV and HFC SIDACtor Device
© 2002 Teccor Electronics 2 - 61 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Thermal Considerations
Package Symbol Parameter Value Unit
Modified
TO-220
TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 60 °C/W
13
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (TJ) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
High Surge Current SIDACtor Device
http://www.teccor.com 2 - 62 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
High Surge Current SIDACtor Device
This SIDACtor device is a 1000 A solid state protection device offered in a TO-220 package.
It protects equipment located in the severe surge environment of Community Antenna TV
(CATV) applications.
This device can replace the gas tubes traditionally used for station protection because
SIDACtor devices have much tighter voltage tolerances.
* For surge ratings, see table below.
* For surge ratings, see table below.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
Pins 1-3
P6002AD 550 700 5.5 5 800 2.2 50 60
1
2
3
(T)
(R)
(G)
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps
IH
mAmps
CO
pF
Pins 1-3
P3100AD 280 360 5.5 5 800 2.2 120 115
Surge Ratings
Series
IPP
8x20 µs
Amps
IPP
10x1000 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
D 1000 250 120 1000
High Surge Current SIDACtor Device
© 2002 Teccor Electronics 2 - 63 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Note: P6002AD is shown. P3100AD has no center lead.
Thermal Considerations
Package Symbol Parameter Value Unit
Modified
TO-220
TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
RqJA Thermal Resistance: Junction to Ambient 60 °C/W
PIN 1
PIN 2
PIN 3
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (TJ) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
CATV Line Amplifiers/Power Inserters SIDACtor Device
http://www.teccor.com 2 - 64 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
CATV Line Amplifiers/Power Inserters
SIDACtor Device
This SIDACtor device is a 5000 A solid state protection device offered in a non-isolated
TO-218 package. It protects equipment located in the severe surge environment of CATV
(Community Antenna TV) applications.
In CATV line amplifiers and power inserters, this device can replace the gas tubes
traditionally used for station protection because SIDACtor devices have much tighter
voltage tolerances.
* For surge ratings, see table below.
** IT is a free air rating; heat sink IT rating is 25 A.
General Notes:
• All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
• VDRM is measured at IDRM.
• VS is measured at 100 V/µs.
• Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
• Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.
Electrical Parameters
Part
Number *
VDRM
Volts
VS
Volts
VT
Volts
IDRM
µAmps
IS
mAmps
IT
Amps **
IH
mAmps
CO
pF
P1900ME 140 220 4 5 800 2.2/25 50 750
P2300ME 180 260 4 5 800 2.2/25 50 750
Surge Ratings
Series
IPP
8x20 µs
Amps
ITSM
60 Hz
Amps
di/dt
Amps/µs
E 5000 400 500
12
CATV Line Amplifiers/Power Inserters SIDACtor Device
© 2002 Teccor Electronics 2 - 65 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
* RqJC rating assumes the use of a heat sink and on state mode for extended time at 25 A, with average power dissipation of 29.125 W.
Thermal Considerations
Package Symbol Parameter Value Unit
TO-218
TJOperating Junction Temperature Range -40 to +150 °C
TSStorage Temperature Range -65 to +150 °C
TCMaximum Case Temperature 100 °C
RqJC * Thermal Resistance: Junction to Case 1.7 °C/W
RqJA Thermal Resistance: Junction to Ambient 56 °C/W
123
2
(No
Connection)
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
V-I Characteristics
50
100
0
t
r
t
d
0
Peak
Value
Half Value
t – Time (µs)
I
PP
– Peak Pulse Current – %I
PP
t
r
= rise time to peak value
t
d
= decay time to half value
Waveform = t
r
x t
d
tr x td Pulse Wave-form
-8
-40 -20 0 20 40 60 80 100 120 140 160
-6
-4
0
2
4
6
8
10
12
14
Junction Temperature (TJ) – ˚C
Percent of V
S
Change – %
25 ˚C
Normalized VS Change versus Junction Temperature
0.4
-40 -20 0 20 40 60 80 100 120 140 160
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Case Temperature (T
C
) – ˚C
Ratio of
I
H
I
H
(T
C
= 25 ˚C)
25 ˚C
Normalized DC Holding Current versus Case Temperature
TeleLink Fuse
http://www.teccor.com 2 - 66 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
TeleLink Fuse
The TeleLink Surface Mount (SM) surge resistant fuse offers circuit protection without
requiring a series resistor. When used in conjunction with the SIDACtor Transient Voltage
Suppressor (TVS), the TeleLink SM fuse and the SIDACtor TVS provide a complete
regulatory-compliant solution for standards such as GR 1089, TIA-968 (formerly known as
FCC Part 68), UL 60950, and ITU K.20 and K.21. No series resistor is required for the
F1250T and F1251T to comply with these standards.
Contact factory for enhanced K.20 and K.21 details.
* Interrupt test characterized at 50° to 70° phase angle. Phase angles approximating 90° may result in damage to the body of the fuse.
Notes:
• The TeleLink SM fuse is designed to carry 100% of its rated current for four hours and 250% of its rated current for one second
minimum and 120 seconds maximum. Typical time is four to 10 seconds. For optimal performance, an operating current of 80% or
less is recommended.
• I2t is a non-repetitive RMS surge current rating for a period of 16.7 ms.
Notes:
• Typical inductance @ 4 µH up to 500 MHz.
• Resistance changes 0.5% for every °C.
• Resistance is measured at 10% rated current.
Surge Ratings
TeleLink SM Fuse
IPP
2x10 µs
Amps
IPP
10x160 µs
Amps
IPP
10x560 µs
Amps
IPP
10x1000 µs
Amps
F0500T not rated 75 45 35
F1250T 500 160 115 100
F1251T 500 160 115 100
Interrupting Values
TeleLink SM
Fuse
Voltage
Rating
Current
Rating
I2t Measured
at DC Rated
Voltage
Interrupting Rating
Voltage, Current MIN TYP MAX
F0500T 250 V 500 mA 1.3 A2s 600 V, 40 A 1 ms 2 ms 60 ms
F1250T 250 V 1.25 A 22.2 A2s 600 V, 60 A * 1 ms 2 ms 60 ms
F1251T 250 V 2 A 30 A2s 600 V, 60 A * 1 ms 2 ms 60 ms
Resistance Ratings
TeleLink SM Fuse
Typical Voltage Drop
@ Rated Current
DC Cold Resistance
MIN MAX
F0500T 0.471 V 0.420 W0.640 W
F1250T 0.205 V 0.107 W0.150 W
F1251T 0.110 V 0.050 W0.100 W
TeleLink Fuse
© 2002 Teccor Electronics 2 - 67 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Qualification Data
The F1250T and F1251T meet the following test conditions per GR 1089 without additional series resistance.
However, in-circuit test verification is required. Note that considerable heating may occur during Test 4 of the
Second Level AC Power Fault Test.
* Test 5 simulates a high impedance induction fault. For specific information, please contact Teccor Electronics.
Notes:
• Power fault tests equal or exceed the requirements of UL 60950 3rd edition.
• Test 4 is intended to produce a maximum heating effect. Temperature readings can exceed 150 °C.
• Test 2 may be dependent on the closing angle of the voltage source. Fuse is characterized at 50° to 70°. Closing angles
approximating 90° may result in damage to the body of the fuse.
• Use caution when routing internal traces adjacent to the F1250T and F1251T.
First Level Lightning Surge Test
Test
Surge Voltage
Volts
Wave-form
µs
Surge Current
Amps
Repetitions Each
Polarity
1 ±600 10x1000 100 25
2 ±1000 10x360 100 25
3 ±1000 10x1000 100 25
4 ±2500 2x10 500 10
5 ±1000 10x360 25 5
Second Level Lightning Surge Test
Test
Surge Voltage
Volts
Wave-form
µs
Surge Current
Amps
Repetitions Each
Polarity
1 ±5000 2x10 500 1
First Level AC Power Fault Test
Test
Applied Voltage, 60 Hz
VRMS
Short Circuit Current
Amps Duration
1500.3315 min
2 100 0.17 15 min
3 200, 400, 600 1 at 600 V 60 applications, 1 s each
4 1000 1 60 applications, 1 s each
5 * * 60 applications, 5 s each
6 600 0.5 30 s each
7 600 2.2 2 s each
8 600 3 1 s each
9 1000 5 0.5 s each
Second Level AC Power Fault Test for Non-Customer Premises Equipment
Test
Applied Voltage, 60 Hz
VRMS
Short Circuit Current
Amps Duration
1 120, 277 30 30 min
2 600 60 5 s
36007 5 s
4 100-600 2.2 at 600 V 30 min
TeleLink Fuse
http://www.teccor.com 2 - 68 © 2002 Teccor Electronics
+1 972-580-7777 SIDACtor® Data Book and Design Guide
Time Current Curve
Time in seconds
Current in Amperes
.01
.02
.03
.04
.05
.06
.07
.08
.09
.1
.2
.3
.4
.5
.6
.7
.8
.9
1
2
3
4
5
6
7
8
9
10
20
30
40
50
60
70
80
90
100
200
300
400
500
600
700
800
1000
F0500T
F1250T F1251T
.1
.2
.3
.4
.5
.6
.7
.8
.9
1
2
3
4
5
6
78
9
10
20
30
40
50
60
70
80 90
100
TeleLink Fuse
© 2002 Teccor Electronics 2 - 69 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Data Sheets
Temperature Derating Curve
Operating temperature is -55 °C to +125 °C with proper correction factor applied.
Chart of Correction Factor
* Higher currents and PCB layout designs can affect this parameter.
Notes:
• Readings are measured at rated current after temperature stabilizes
• The F1250T meets the requirements of UL 248-14. However, board layout, board trace widths, and ambient
temperature values can cause higher than expected rises in temperature. During UL testing, the typical
recorded heat rise for the F1250T at 2.2 A was 120 °C.
Maximum Temperature Rise
TeleLink Fuse Temperature Reading
F0500T £75 °C (167 °F) *
F1250T £75 °C (167 °F) *
F1251T £75 °C (167 °F) *
30
-55 -60 -40 -20 0 20 40 60 80 100 125
40
50
60
70
80
90
100
110
Ambient ˚C
Percent of Rating
Effect on
Current Rating
120
130
140
150
Package Symbolization
Marking F0500T F1250T F1251T
Manufactured in
USA
Manufactured in
Tai wan
FU F U
FT F T
JU J U
JT J T
NU N U
NT N T
NOTES
© 2002 Teccor Electronics 3-1 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Reference Designs
3Reference Designs
This section offers specific examples of how SIDACtor devices can be used to ensure long-
term operability of protected equipment and uninterrupted service during transient electrical
activity. For additional line interface protection circuits, see "Regulatory Compliant
Solutions" on page 4-34.
Customer Premises Equipment (CPE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
High Speed Transmission Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
ADSL Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
HDSL Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
ISDN Circuit Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
Pair Gain Circuit Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-11
T1/E1 Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14
Additional T1 Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
T3 Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
Analog Line Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17
PBX Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25
CATV Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-26
Primary Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-29
Secondary Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-31
Triac Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-33
Data Line Protectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34
LAN / WAN Protectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-35
10Base-T Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-35
100Base-T Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36
Note: The circuits referenced in this section represent typical interfaces used in
telecommunications equipment. SIDACtor devices are not the sole components
required to pass applicable regulatory requirements such as UL 60950, GR 1089, or
TIA-968 (formerly known as FCC Part 68), nor are these requirements specifically
directed at SIDACtor devices.
Customer Premises Equipment (CPE)
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Reference Designs
Customer Premises Equipment (CPE)
CPE is defined as any telephone terminal equipment which resides at the customer’s site
and is connected to the Public Switched Telephone Network (PSTN). Telephones, modems,
caller ID adjunct boxes, PBXs, and answering machines are all considered CPE.
Protection Requirements
CPE should be protected against overvoltages that can exceed 800 V and against surge
currents up to 100 A. In Figure 3.1 through Figure 3.6, SIDACtor devices were chosen
because their associated peak pulse current (IPP) rating is sufficient to withstand the
lightning immunity test of TIA-968 (formerly known as FCC Part 68) without the additional
use of series line impedance. Likewise, the fuse shown in Figure 3.1 through Figure 3.6
was chosen because the amps2time (I2t) rating is sufficient to withstand the lightning
immunity tests of TIA-968 without opening, but low enough to pass UL power cross
conditions.
The following regulatory requirements apply:
• TIA-968 (formerly known as FCC Part 68)
• UL 60950
All CPE intended for connection to the PSTN must be registered in compliance with
TIA-968. Also, because the National Electric Code mandates that equipment intended for
connection to the telephone network be listed for that purpose, consideration should be
given to certifying equipment with an approved safety lab such as Underwriters
Laboratories.
CPE Reference Circuits
Figure 3.1 through Figure 3.6 show examples of interface circuits which meet all applicable
regulatory requirements for CPE. The P3100SB and P3100EB are used in these circuits
because the peak off-state voltage (VDRM) is greater than the potential of a Type B ringer
superimposed on a POTS (plain old telephone service) battery.
150 VRMS Ö2 + 56.6 VPK = 268.8 VPK
Note that the circuits shown in Figure 3.1 through Figure 3.6 provide an operational solution
for TIA-968 (formerly known as FCC Part 68). However TIA-968 allows CPE designs to
pass non-operationally as well.
For a non-operational solution, coordinate the IPP rating of the SIDACtor device and the I2t
rating of the fuse so that (1) both will withstand the Type B surge, and (2) during the Type A
surge, the fuse will open. (See Table 5.1, Surge Rating Correlation to Fuse Rating on page
5-8.)
Note: For alternative line interface protection circuits, see "Regulatory Compliant Solutions"
on page 4-34.
Customer Premises Equipment (CPE)
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Figure 3.1 Basic CPE Interface
Figure 3.2 Transformer Coupled Tip and Ring Interface
Figure 3.3 Modem Interface
P3100SB
or
P3100EB
To Protected
Components
Tip
F1250T
Ring
P3100SB
or
P3100EB
Ring
Detect
Ring
+
+
-
-
Transmit / Receive
Tip
F1250T
Ring
Detect
P3100SB
or
P3100EB
Relay Transmit/
Receive
Circuitry
Tip
Ring
F1250T
Customer Premises Equipment (CPE)
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Reference Designs
Figure 3.4 CPE Transistor Network Interface — Option 1
Figure 3.5 CPE Transistor Network Interface — Option 2
Transistor
Network
Interface
Option 1
P3100SB
or
P3100EB
Ringer
Hook Switch
Dialer
IC
Speech
Network
DTMF Handset
Tip
Ring
F1250T
Transistor
Network
Interface
Ringer
Hook Switch
Option 2
P1800SB
or
P1800EB
Dialer
IC Speech
Network
DTMF Handset
Tip
Ring
F1250T
Customer Premises Equipment (CPE)
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Figure 3.6 Two-line CPE Interface
P3100SB
or
P3100EB
Transistor
Network
Interface
P3100SB
or
P3100EB
Transistor
Network
Interface
Ring
Detect
Tip
Ring
Tip
Ring
F1250T
F1250T
Ring
Detect
Note: Different Ground References Shown.
High Speed Transmission Equipment
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Reference Designs
High Speed Transmission Equipment
High speed transmission equipment encompasses a broad range of transmission protocols
such as T1/E1, xDSL, and ISDN. Transmission equipment is located at the central office,
customer premises, and remote locations.
Protection Requirements
Transmission equipment should be protected against overvoltages that can exceed 2500 V
and surge currents up to 500 A. In Figure 3.7 through Figure 3.17, SIDACtor devices were
chosen because their associated peak pulse current (IPP) rating is sufficient to withstand the
lightning immunity tests of GR 1089 without the additional use of series line impedance.
Likewise, the fuse shown in Figure 3.7 through Figure 3.17 was chosen because the
amps2time (I2t) rating is sufficient to withstand the lightning immunity tests of GR 1089, but
low enough to pass GR 1089 current limiting protector test and power cross conditions
(both first and second levels).
The following regulatory requirements apply:
• TIA-968 (formerly known as FCC Part 68)
• GR 1089-CORE
• ITU-T K.20/K.21
• UL 60950
Most transmission equipment sold in the US must adhere to GR 1089. For Europe and
other regions, ITU-T K.20/K.21 is typically the recognized standard.
ADSL Circuit Protection
Asymmetric Digital Subscriber Lines (ADSLs) employ transmission rates up to 6.144 Mbps
from the Central Office Terminal (COT) to the Remote Terminal (RT) and up to 640 kbps
from the RT to the COT at distances up to 12,000 feet. (Figure 3.7)
Figure 3.7 ADSL Overview
Digital
Network
Local Loop Remote SiteCentral Office Site
ADSL
transceiver
unit
ATU-C
ATU-R
ADSL transceiver unit
PSTN
voice
data
POTS
video
Splitter
up to 12 kft
High Speed Transmission Equipment
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Protection Circuitry
Longitudinal protection was not used at either the ADSL Transceiver Unit – Central Office
(ATU-C) interface or the ADSL Transceiver Unit – Remote (ATU-R) interface due to the
absence of earth ground connections. (Figure 3.8) In both instances, the P3500SC MC
SIDACtor device and the F1250T TeleLink fuse provide metallic protection. For ATUs not
isolated from earth ground, reference the HDSL protection topology.
Figure 3.8 ADSL Protection
Component Selection
The P3500SC MC SIDACtor device and F1250T TeleLink fuse were chosen to protect the
ATUs because both components meet GR 1089 surge immunity requirements without the
use of additional series resistance. Although the P3100 series SIDACtor device may be
used to meet current ANSI specifications, Teccor recommends the P3500 series to avoid
interference with the 20 VP-P x DSL signal on a 150 V rms ringing signal superimposed on a
56.5 V battery.
HDSL Circuit Protection
HDSL (High-bit Digital Subscriber Line) is a digital line technology that uses a 1.544 Mbps
(T1 equivalent) transmission rate for distances up to 12,000 feet, eliminating the need for
repeaters. The signaling levels are a maximum of ±2.5 V while loop powering is typically
under 190 V. (Figure 3.9)
TIP
RING
ADSL
chip set
P3500SC MC
F1250T
High Speed Transmission Equipment
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Figure 3.9 HDSL Overview
Protection Circuitry
Longitudinal protection is required at both the HDSL Transceiver Unit – Central Office
(HTU-C) and HDSL Transceiver Unit – Remote (HTU-R) interfaces because of the ground
connection used with loop powering. Two P2300SC MC SIDACtor devices provide
overvoltage protection and two F1250T TeleLink fuses (one on Tip, one on Ring) provide
overcurrent protection. (Figure 3.10) For the transceiver side of the coupling transformer,
additional overvoltage protection is provided by the P0080SA SIDACtor device. The
longitudinal protection on the primary coil of the transformer is an additional design
consideration for prevention of EMI coupling and ground loop issues.
Figure 3.10 HDSL Protection
DS-1 Rate
Interface
(1.544 Mbps)
DS-1 Rate
Interface
(1.544 Mbps)
Central Office Site Remote Site
784 kbps Full-Duplex loop
784 kbps Full-Duplex loop
< 12,000 ft, 200 kHz BW
+2.5 V signal level
2B1Q, ZO=135 W
HTU-C HTU-R
HDSL transceiver unit HDSL transceiver unit
P2300SC MC
P2300SC MC
F1250T
F1250T
Tip
Ring
P0080SA MC
P2300SC MC
P2300SC MC
F1250T
F1250T
Tip
Ring
P0080SA MC
TX
RX
HDSL
Transceiver
Power
Sink
HTU-C/HTU-R Interface Protection
High Speed Transmission Equipment
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Component Selection
The P2300SC MC SIDACtor device and the F1250T TeleLink fuse were chosen because
both components meet GR 1089 surge immunity requirements without the use of additional
series resistance. The P2300SC MC voltage rating was selected to ensure loop powering
up to 190 V. For loop powering greater than 190 V, consider the P2600SC MC. The
P0080SA MC SIDACtor device was chosen to eliminate any sneak voltages that may
appear below the voltage rating of the P2300SC MC.
ISDN Circuit Protection
Integrated Services Digital Network (ISDN) circuits require protection at the Network
Termination Layer 1 (NT1) U-interface and at the Terminating Equipment (TE) or
Terminating Adapter (TA) S/T interface. Signal levels at the U-interface are typically ±2.5 V;
however, with sealing currents and maintenance loop test (MLT) procedures, voltages
approaching 150 V rms can occur. (Figure 3.11)
Figure 3.11 ISDN Overview
Protection Circuitry
Longitudinal protection was not used at either the U- or the TA/TE-interface due to the
absence of an earth-to-ground connection. (Figure 3.12) At the U-interface, the
P2600SC MC SIDACtor device and F1250T TeleLink fuse provide metallic protection, while
the TA/TE-interface uses the P0640SC MC SIDACtor device and F1250T TeleLink fuse.
Figure 3.12 also shows interfaces not isolated from earth ground.
ISDN Compliant
Central Office Switching
System
Network
Termination
Layer 1
NT1
CO
ISDN DSL
2-Wire,
160 kbps
2B1Q ±2.5 V
U
Reference
TA
TE
NT2
PBX
TE
TA
S
S
S Reference, 4-Wire
T Reference
4-Wire
T
T
T
Terminal
Adapter
Terminal Equipment
(ISDN
Compliant)
POTS
Non-ISDN
Terminal
B1 B2
D
ISDN Terminal
B1
B2
D
High Speed Transmission Equipment
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Reference Designs
Figure 3.12 ISDN Protection
Component Selection
The “SC MC” SIDACtor devices and F1250T TeleLink fuse were chosen because these
components meet GR 1089 surge immunity requirements without the use of additional
series resistance. An MC is chosen to reduce degradation of data rates. The P2600SC MC
voltage rating was selected to ensure coordination with MLT voltages that can approach
150 V rms. The voltage rating of the P0640SC MC was selected to ensure coordination with
varying signal voltages.
Pair Gain Circuit Protection
A digital pair gain system differs from an ISDN circuit in that ring detection, ring trip, ring
forward, and off-hook detection are carried within the 64 kbps bit stream for each channel
rather than using a separate D channel. The pair gain system also uses loop powering from
10 V up to 145 V with a typical maximum current of 75 mA. (Figure 3.13)
Figure 3.13 Pair Gain Overview
Tip
Ring
P2600SC MC
Power
Source
ISDN
Transceiver
F1250T
TX
P0640SC MC
RX
F1250T
F1250T
Power
Sink
P0640SC MC
RX
TX
ISDN
Transceiver
ISDN U-Interface ISDN S/T Interface
Switching
System
Line powered
DSL 2-Wire,
160 kbps
2B1Q
POTS
Line 1
Line 2
MDF Central Office
Terminal (COT)
VF
1
VF
2
HF
VF
1
VF
2
HF
Remote
Te r mi n al
Remote Terminal (RT)
building or pedestal
mounted
POTS
Customer
Premises
(CP)
Central Office (CO)
High Speed Transmission Equipment
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Protection Circuitry
Longitudinal protection is required at the Central Office Terminal (COT) interface because of
the ground connection used with loop powering. (Figure 3.14) Two P1800SC MC SIDACtor
devices provide overvoltage protection and two F1250T TeleLink fuses (one on Tip, one on
Ring) provide overcurrent protection. For the U-interface side of the coupling transformer,
the illustration shows the P0080SA MC SIDACtor device used for additional overvoltage
protection.
Figure 3.14 Pair Gain COT Protection
For Customer Premises (CP) and Remote Terminal (RT) interfaces where an earth ground
connection is not used, only metallic protection is required. Figure 3.15 shows metallic
protection satisfied using a single P3100SC MC across Tip and Ring and a single F1250T
on either Tip or Ring to satisfy metallic protection.
Tip1
Ring1
P0080SA
Tip2
Ring2
Power
Source
U-Interface
Tip
Ring
P1800SC MC
P1800SC MC
F1250T
F1250T
Central Office Terminal (COT) Interface
High Speed Transmission Equipment
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Reference Designs
Figure 3.15 Pair Gain RT Protection
Component Selection
The “SC MC” SIDACtor device and F1250T TeleLink fuse were chosen because both
components meet GR 1089 surge immunity requirements without the use of additional
series resistance. An MC is chosen to reduce degradation of data rates. The voltage rating
of the P1800SC MC was selected to ensure coordination with loop powering up to 150 V.
The voltage rating of the P3100SC MC was selected to ensure coordination with POTS
ringing and battery voltages.
Tip
Ring
P3100SC MC
U-Interface
F1250T
P3100SC MC
F1250T
F1250T
CPE
P3100SC MC
Line 1
Line 2
CPE Interface
Remote Terminal Interface
Ring Detect
Ring Trip
Ring Forward
Off-Hook
Detection
Power
Sink
High Speed Transmission Equipment
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T1/E1 Circuit Protection
T1/E1 networks offer data rates up to 1.544 Mbps (2.058 for E1) on four-wire systems.
Signal levels on the transmit (TX) pair are typically between 2.4 V and 3.6 V while the
receive (RX) pair could go as high as 12 V. Loop powering is typically ±130 V at 60 mA,
although some systems can go as high as 150 V. (Figure 3.16)
Figure 3.16 T1/E1 Overview
Protection Circuitry
Longitudinal protection is required at the Central Office Terminal (COT) interface because of
the ground connection used with loop powering. (Figure 3.17) Two P1800SC MC SIDACtor
devices provide overvoltage protection and two F1250T TeleLink fuses (one on Tip, one on
Ring) provide overcurrent protection. The P1800SC MC device is chosen because its VDRM
is compliant with TIA-968 regulations, Section 4.4.5.2, “Connections with protection paths
to ground.” These regulations state:
Approved terminal equipment and protective circuitry having an
intentional dc conducting path to earth ground for protection purposes at
the leakage current test voltage that was removed during the leakage
current test of section 4.3 shall, upon its replacement, have a 50 Hz or
60 Hz voltage source applied between the following points:
a. Simplexed telephone connections, including Tip and Ring, Tip-1
and Ring-1, E&M leads and auxiliary leads
b. Earth grounding connections
The voltage shall be gradually increased from zero to 120 V rms for
approved terminal equipment, or 300 V rms for protective circuitry, then
maintained for one minute. The current between (a) and (b) shall not
Central Office
Line powered DLC Four-wire,1.544 Mbps/2.048 Mbps
T1 Transceiver
TX Pair
3000 ft 6000 ft
RX Pair
Line Regenerator Line Regenerator
High Speed Transmission Equipment
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Reference Designs
exceed 10 mAPK at any time. As an alternative to carrying out this test
on the complete equipment or device, the test may be carried out
separately on components, subassemblies, and simulated circuits,
outside the unit, provided that the test results would be representative of
the results of testing the complete unit.
Figure 3.17 T1/E1 Protection
The peak voltage for 120 V rms is 169.7 V. The minimum stand-off voltage for the P1800 is
170 V, therefore, the P1800SC MC will pass the test in Section 4.4.5.2 by not allowing
10 mA of current to flow during the application of this test voltage.
For the transceiver side of the coupling transformer, additional overvoltage protection is
shown in Figure 3.17 using the P0300SA SIDACtor device. When an earth ground
connection is not used, only metallic protection is required. Metallic protection is satisfied
using a single P0640SC MC SIDACtor device across Tip and Ring and a single F1250T
TeleLink fuse on either Tip or Ring.
Component Selection
The “SC MC” SIDACtor device and F1250T TeleLink fuse were chosen because these
components meet GR 1089 surge immunity requirements without the use of additional
series resistance. An MC is chosen to reduce degradation of data rates. The voltage rating
of the P1800SC MC was selected to ensure loop powering up to 150 V. The voltage rating
of the P0640SC MC was selected to ensure coordination with varying voltage signals.
T1
Transceiver
P0300SA
P1800SC MC
P1800SC MC
F1250T F1250T
P0640SC MC
TX
RX
Power
Source
P0640SC MC
P1800SC MC
P1800SC MC
F1250T F1250T
P0300SA
RX
TX
T1
Transceiver
COT Regenerator
F1250T
F1250T
High Speed Transmission Equipment
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Additional T1 Design Considerations
A T1 application can be TIA-968 approved as two different possible device types. An XD
device means an external CSU is used and the unit does not have to meet the
TIA-968 environmental test conditions, but it must connect only behind a separately
registered DE device. This XD equipment does not have to meet the T1 pulse template
requirements. If not classified as an XD device, then typically the application must adhere to
TIA-968 environmental test conditions.
T3 Protection
The capacitance across the pair of wires = (D1 || D2) + P0640EC/SC. The diode
capacitance is approximately (10 pF || 10 pF) 20 pF. Then adding the capacitive effect of
the P0640EC/SCMC, which is typically 60 pF, the total capacitance across the pair of wires
is approximately 15 pF. The MUR 1100E diodes are fast-switching diodes that will exhibit
this level of capacitance. MURS160T3 is a surface mount equivalent. (Figure 3.18)
Figure 3.18 T3 Protection
Alternately, the advanced P0642SA exhibits very low capacitance and can be used as a
stand-alone device.
Figure 3.19 Alternate T3 Protection
P0640EC/SC MC or
P0720EC/SC MC
D1 D2
F1250T
P0642SA
Analog Line Cards
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Reference Designs
Analog Line Cards
Given that line cards are highly susceptible to transient voltages, network hazards such as
lightning and power cross conditions pose a serious threat to equipment deployed at the
central office and in remote switching locations. To minimize this threat, adequate levels of
protection must be incorporated to ensure reliable operation and regulatory compliance.
Protection Requirements
When designing overvoltage protection for analog line cards, it is often necessary to
provide both on-hook (relay) and off-hook (SLIC) protection. This can be accomplished in
two stages, as shown in Figure 3.20.
Figure 3.20 SLIC Overview
The following regulatory requirements may apply:
• GR 1089-CORE
• ITU-T K.20/K.21
• UL 60950
• TIA-968 (formerly known as FCC Part 68)
On-Hook (Relay) Protection
On-hook protection is accomplished by choosing a SIDACtor device that meets the
following criteria to ensure proper coordination between the ring voltage and the maximum
voltage rating of the relay to be protected.
VDRM > VBATT + VRING
VS £ VRelay Breakdown
This criterion is typically accomplished using two P2600S_ SIDACtor devices (where _
denotes the surge current rating) connected from Tip to Ground and Ring to Ground.
However, for applications using relays such as an LCAS (Line Card Access Switch),
consider the P1200S_ from Tip to Ground and the P2000S_ from Ring to Ground.
R
E
L
A
Y
S
L
I
C
On Hook
Protection
Off Hook
Protection
F1250T
F1250T
Analog Line Cards
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Off-Hook (SLIC) Protection
Off-hook protection is accomplished by choosing a SIDACtor device that meets the
following criteria to ensure proper coordination between the supply voltage (VREF) and the
maximum voltage rating of the SLIC to be protected.
VDRM > VREF
VS £ VSLIC Breakdown
This criterion can be accomplished in a variety of different ways. For applications using an
external ring generator and a fixed battery voltage, two P0641S_ SIDACtor devices
(P0721S_, P0901S_, or P1101S_ depending on the value of VREF) are used — one Tip to
Ground, one Ring to Ground. For applications using a ring-generating SLIC such as AMD’s
Am79R79, the B1XX0C_ or B1XX1U_ can be used.
IPP Selection
The IPP of the SIDACtor device must be greater than or equal to the maximum available
surge current (IPK(available)) of the applicable regulatory requirements. Calculate the maximum
available surge current by dividing the peak surge voltage supplied by the voltage generator
(VPK) by the total circuit resistance (RTOTAL). The total circuit resistance is determined by
adding the source resistance (RS) of the surge generator to the series resistance in front of
the SIDACtor device on Tip and Ring (RTIP and RRING).
IPP ³ IPK(available)
IPK(available) = VPK / RTOTAL
For metallic surges:
RTOTAL = RS + RTIP + RRING
For longitudinal surges:
RTOTAL = RS + RTIP
RTOTAL = RS + RRING
Reference Diagrams
Figure 3.21 shows the use of Teccor’s “SC” rated SIDACtor devices and the F1250T
TeleLink fuse to meet the surge immunity requirements of GR 1089. Teccor’s P1200SC and
P2000SC, specifically designed to protect Agere Systems (formerly Lucent
Microelectronics) Line Card Access Switch (LCAS), provide on-hook protection. Two
P0641SCs provide off-hook protection. Any additional series resistance is absent because
the “C” series SIDACtor device and F1250T TeleLink fuse are designed to withstand
GR 1089 surges without the aid of additional components such as line feed resistors and
PTCs.
Analog Line Cards
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Reference Designs
Figure 3.21 SLIC Protection for LCAS
Figure 3.22 illustrates uses of asymmetrical SIDACtor protection for overvoltage conditions
and the F1250T for overcurrent conditions.
Figure 3.22 SLIC Asymmetrical Protection
S
L
I
C
F1250T
F1250T
P1200SC
P2000SC
P0641SC
P0641SC
Tip
Ring
L
C
A
S
S
L
I
C
F1250T
F1250T
P2500SC
Tip
Ring
A
G
E
R
E
with internal
protection
P2500SC
P1200SC
Analog Line Cards
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Figure 3.23 illustrates the use of the P2600SA and P0721CA2 for overvoltage protection
and the F0500T for overcurrent protection in addition to 20 W of series resistance on both
Tip and Ring. The series resistance is required to limit the transient surge currents to within
the surge current rating of the “A” series SIDACtor devices and the F0500T TeleLink fuse.
Figure 3.23 SLIC Protection with Fixed Voltage SIDACtor Devices
The illustration of SLIC protection in Figure 3.24 shows Teccor’s Battrax device protecting
Legerity’s (formerly AMD’s) Am79R79 from overvoltages and uses a F1250T to protect
against sustained power cross conditions. The Battrax product was designed specifically to
protect SLICs that cannot withstand potential differences greater than VREF ±10V.
Figure 3.24 SLIC Protection with Programmable Voltage SIDACtor Devices
R
E
L
A
Y
S
L
I
C
F0500T
F0500T
P2600SA
P2600SA
P0721CA2
20 Ω
20 Ω
Tip
Ring
F1250T
F1250T
Legerity
Am79R79
-VREF
B1XX0CC
B1XX0CC
-VREF
0.1 µF
0.1µF
Tip
Ring
1N4935/
MUR120
1N4935/
MUR120
Analog Line Cards
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Reference Designs
Figure 3.25 shows protection of a SLIC using 20 W series resistors on both Tip and Ring in
addition to Teccor’s Battrax (B1100CC) and a diode bridge (General Semiconductor part
number EDF1BS). However, the overshoot caused by the diode bridge must be considered.
The series resistance (a minimum of 20 W on Tip and 20 W on Ring) limits the simultaneous
surge currents of 100 A from Tip to Ground and 100 A from Ring to Ground (200 A total) to
within the surge current rating of the SA-rated SIDACtor device and Battrax. The diode
bridge shunts all positive voltages to Ground, and the B1100CC shunts all negative
voltages greater than |-VREF -1.2 V| to Ground.
Figure 3.25 SLIC Protection with a Single Battrax Device
R
E
L
A
Y
S
L
I
C
F0500T
F0500T
P3100SA
P3100SA
20 Ω
20 Ω
B1100CC
EDF1BS
0.1 µF
-VREF
Tip
Ring
Analog Line Cards
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In Figure 3.26 an application that requires 50 W Line Feed Resistors (LFR) uses one
B1160CC and two EDF1BS diode bridges in place of multiple SLIC protectors. The
overshoot caused by the diode bridge must be considered; however, with this approach it is
imperative that the sum of the loop currents does not exceed the Battrax’s holding current.
In the application shown in Figure 3.26, each loop current would have to be limited to
80 mA. For applications requiring the protection of four twisted pair with one Battrax, use
the B1200CC and limit each individual loop current to 50 mA.
Figure 3.26 SLIC Protection with a Single Battrax Device
Figure 3.27 and Figure 3.28 show circuits that use negative Battrax devices containing an
internal diode for positive surge protection. This obviates using the discrete diodes shown in
Figure 3.24.
R
E
L
A
Y
S
L
I
C
EDF1BS
-VREF
R
E
L
A
Y
S
L
I
C
P3100SA
P3100SA
50 Ω LFR
EDF1BS
B1160CC
50 Ω LFR
50 Ω LFR
50 Ω LFR
Tip
Ring
Tip
Ring
P3100SA
P3100SA
0.1 µF
Analog Line Cards
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Reference Designs
Figure 3.27 SLIC Protection with a Dual Battrax Device
Figure 3.28 SLIC Protection with a Single Battrax Quad Negative Device
F1250T
F1250T
Am79R79
T
R
0.1 µF
-VREF
B1xx1U_
F1250T
F1250T
Am79R79
T1
R1
F1250T
F1250T
Am79R79
B1XX1U_
T2
R2
-VREF
0.1 µF
1
3
2
6
4
5
Analog Line Cards
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Figure 3.29 shows two negative Battrax discrete parts and two positive Battrax discrete
parts. This arrangement is required for SLIC applications using both the positive and
negative ringing signals. Figure 3.30 shows a similar application but with the two negative
Battrax discrete parts and two positive Battrax discrete parts integrated into a single surface
mount package.
Figure 3.29 SLIC Protection with discrete positive and negative Battrax Devices
Figure 3.30 SLIC Protection with a Battrax Dual Positive/Negative device
F1250T
F1250T
SLIC
0.1 µF
Tip
Ring
+VREF
+VREF -VREF
-VREF
B2050C_
0.1 µF
B1xx0C_
B2050C_ B1xx0C_
F1250T
F1250T
SLIC
0.1 µF
Tip
Ring
+VREF
+VREF -VREF
-VREF
B3104UC
0.1 µF
PBX Systems
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Reference Designs
PBX Systems
Branch Exchange Switches
PBXs, KSUs, and PABXs contain line cards that support various transmission protocols
such as ISDN, T1/E1, HDSL, and ADSL (Figure 3.31). PBXs also have features such as a
POTS (plain old telephone service) pull-through which allows stations to have outside line
access in the event of power failure. All incoming lines to the PBX are subject to
environmental hazards such as lightning and power cross.
Figure 3.31 PBX Overview
Protection Requirements
Branch exchange switches should be protected against overvoltages that can exceed
800 V and surge currents up to 100 A.
The following regulatory requirements apply:
• TIA-968 (formerly known as FCC Part 68)
• UL 60950
Branch Exchange Reference Circuit
See the following sections of this data book for interface circuits used to protect of PBX line
cards:
• For POTS protection, see "Customer Premises Equipment (CPE)" on page 3-3.
• For ADSL protection, see "ADSL Circuit Protection" on page 3-7.
• For HDSL protection, see "HDSL Circuit Protection" on page 3-8.
• For ISDN protection, see "ISDN Circuit Protection" on page 3-10.
• For T1/E1 protection, see "T1/E1 Circuit Protection" on page 3-14.
• For Station Protection, see "Analog Line Cards" on page 3-17.
Stations
To Networ
k
Logic
PBX POTS
T1/E1
ADSL
HDSL
ISDN
Line Cards
Matrix
Switch
Station
Cards
Station
Cards
Station Primary
Protection
CATV Equipment
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CATV Equipment
As cable providers enter the local exchange market, protection of CATV (Community
Antenna TV) equipment becomes even more critical in order to ensure reliable operation of
equipment and uninterrupted service.
Protection Requirements
CATV line equipment should be able to withstand overvoltages that exceed 6000 V and
surge currents up to 5000 A. CATV station protectors should be able to withstand
overvoltages that exceed 5000 V and surge currents up to 1000 A. The SIDACtor devices
illustrated in Figure 3.32 through Figure 3.35 meet these requirements.
The following regulatory requirements may apply:
• UL 497C
• SCTE IPS-SP-204
• SCTE Practices
• NEC Article 830
Power Inserter and Line Amplifier Reference Circuit
Figure 3.32 and Figure 3.33 show how the P1900ME SIDACtor device is used to protect
line amplifiers and power supplies versus using two SCRs and one SIDACtor device
(Figure 3.34). The P1900ME is used because the peak off-state voltage (VDRM) is well
above the peak voltage of the CATV power supply (90 VRMS Ö2), and the peak pulse current
rating (IPP) is 3000 A.
Figure 3.32 CATV Amplifier Diagram
90 V
AC
P1900ME
Power
Supply
CATV
Amplifiers
CATV Equipment
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Reference Designs
Figure 3.33 CATV Amplifier Protection (incorporated into a power inserter module)
Figure 3.34 CATV Amplifier Protection
Station Protection Reference Circuit
Figure 3.35 shows a P1400AD SIDACtor device used in a CATV station protection
application. Note that a compensation inductor may be required to meet insertion and
reflection loss requirements for CATV networks. If so, the inductor should be designed to
saturate quickly and withstand surges up to 200 V and 1000 A. An inductor with a core
permeability of approximately 900 Wb/A·m and wound with 24-gauge wire to an inductance
Power
Port
P1900ME
90 V
AC
RF
To Line
Amplifiers
90 V
AC
RF
P1800EC
K
A
G
K
A
G
To Line
Amplifiers
CATV Equipment
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of 20 µH to 30 µH is an example of a suitable starting point, but the actual value depends on
the design and must be verified through laboratory testing.
Figure 3.35 CATV Station Protection
Compensating
Inductor
UL Approved
Coaxial Fuse Line
To Protected
Equipment
P1400AD
Primary Protection
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Reference Designs
Primary Protection
Primary telecommunications protectors must be deployed at points where exposed twisted
pairs enter an office building or residence. This requirement is mandated in North America
by the National Electric Code (NEC) to protect end users from the hazards associated with
lightning and power cross conditions.
Primary protection is provided by the local exchange carrier and can be segregated into
three distinct categories:
• Station protection — typically associated with a single twisted pair
• Building entrance protection — typically associated with multiple (25 or more) twisted
pair
• Central office protection — typically associated with numerous twisted pair feeding into a
switch
Station protectors provide primary protection for a single-dwelling residence or office. The
station protector is located at the Network Interface Unit (NIU), which acts as the point of
demarcation, separating the operating company’s lines from the customer’s.
Building entrance protection is accomplished by installing a multi-line distribution panel with
integrated overvoltage protection. These panels are normally located where multiple twisted
pairs enter a building.
A five-pin protection module plugged into a Main Distribution Frame (MDF) provides Central
and Remote Office protection. Like station and building entrance protection, the MDF is
located where exposed cables enter the switching office.
Teccor also offers a full line of five-pin protectors. For further details, contact factory at
protectionsystems@teccor.com or +1 972-580-7777.
Protection Requirements
Station protectors must be able to withstand 300 A 10x1000 surge events. The building
entrance protectors and CO protectors must be able to withstand 100 A 10x1000 surge
events. Figure 3.36 shows building entrance protector and CO protector asymmetrical
solutions. Figure 3.37 shows building entrance protector and CO protector balanced
solutions.
The following regulatory requirements apply:
• UL 497
• GR 974-CORE
• ITU K.28
Primary Protection Reference Circuit
Figure 3.36 and Figure 3.37 show different configurations used in primary protection. Note
that the peak off-state voltage (VDRM) of any device intended for use in primary protection
applications should be greater than the potential of a Type B ringer superimposed on a
POTS (plain old telephone service) battery.
150 VRMS Ö2 + 56.6 VPK = 268.8 VPK
Primary Protection
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Figure 3.36 Primary Protection
Figure 3.37 Balanced Primary Protection
P6002AC
or
P6002AD
4 W Heat Coil
Thermal
Overload Voltage-only
Protection
Voltage and
Sneak Current
Protection
P6002AC
or
P6002AD
Thermal
Overload Voltage-only
Protection
Voltage and
Sneak Current
Protection
4 W Heat Coil
P3203AC
P3203AC
Secondary Protection
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Reference Designs
Secondary Protection
Secondary protectors (stand alone units or integrated into strip protectors and UPSs) are
adjunct devices used to enhance the protection level of customer premise equipment
(CPE). Due to the inadequate level of protection designed into CPE, secondary protectors
often are required to prevent premature failure of equipment exposed to environmental
hazards (Figure 3.38).
Figure 3.38 CPE Secondary Protection
Protection Requirements
Secondary protectors should be able to withstand overvoltages that can exceed 800 V and
surge currents up to 100 A. Figure 3.39 illustrates a SIDACtor device selected because the
associated peak pulse current (IPP) is sufficient to withstand the lightning immunity tests of
TIA-968 (formerly known as FCC Part 68) without the additional use of series line
impedance. Likewise, Figure 3.39 illustrates a fuse selected because the amps2time (I2t)
rating is sufficient to withstand the lightning immunity tests of TIA-968, but low enough to
pass UL power cross conditions.
Figure 3.39 CPE Protection
Telephone
Network
Tip Phone
Fax/Modem
Primary
Protector Line
Impedance
Customer
Premise Equipment
Network
Interface Secondary
Protector
Ring
PS
To CPE
Equipment
P3203AB
or
P3203AC
Tip
Ring
F1250T
F1250T
Secondary Protection
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Secondary Protection Reference Circuit
Figure 3.38 also shows an example of an interface design for a secondary protector. The
P3203AB SIDACtor device is used because the peak off-state voltage (VDRM) is greater
than the potential of a Type B ringer signal superimposed on the POTS (plain old telephone
service) battery.
150 VRMS Ö2 + 56.6 VPK = 268.8 VPK
Coordination between the station protector and the secondary protector occurs due to the
line impedance between the two devices. The line impedance helps ensure that the primary
protector will begin to conduct while the secondary protector limits any of the let-through
voltage to within the VS rating of the SIDACtor device.
Triac Protection
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Reference Designs
Triac Protection
Thyristors
Damage can occur to a thyristor if the thyristor’s repetitive peak off-state voltage is
exceeded. A thyristor’s repetitive peak off-state voltage may be exceeded due to dirty AC
power mains, inductive spikes, motor latch up, and so on.
Thyristor Reference Circuit
Figure 3.40 and Figure 3.41 show two different methods of protecting a triac. In Figure 3.40,
a SIDACtor device is connected from MT2 to the gate of the triac. When the voltage applied
to the triac exceeds the SIDACtor device’s VDRM, the SIDACtor device turns on, producing a
gate current which turns the triac on.
Figure 3.40 TRIAC Protection
The circuit in Figure 3.41 places a SIDACtor device across MT2 and MT1 of the triac. In this
instance the SIDACtor device protects the triac by turning on and shunting the transient
before it exceeds the VDRM rating of the triac.
Figure 3.41 TRIAC Protection
With both methods, consider the following designs when using a SIDACtor device to protect
a thyristor:
• VDRM of the SIDACtor device < VDRM of Triac
• SIDACtor device VDRM > 120% VPK(power supply)
• SIDACtor device must be placed behind the load
MT2
Triac
To
Gating
Circuitry
Hot
Neutral
MT1
SIDACtor
Load
47 Ω
MT2
Triac
To
Gating
Circuitry
Hot
Neutral
MT1
SIDACtor
Load
Data Line Protectors
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Data Line Protectors
In many office and industrial locations, data lines (such as RS-232 and ethernet) and AC
power lines run in close proximity to each other, which often results in voltage spikes being
induced onto the data line, causing damage to sensitive equipment.
Protection Requirements
Data lines should be protected against overvoltages that can exceed 1500 V and surge
currents up to 50 A.
Data Line Reference Circuit
Figure 3.42 shows how a SIDACtor device is used to protect low voltage data line circuits.
Figure 3.42 Data Line Protection
RS-232
I.C.
TXD
P0080SA
or
P0300SA
RXD
CTS
P0080SA
or
P0300SA
P0080SA
or
P0300SA
LAN / WAN Protectors
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Reference Designs
LAN / WAN Protectors
10Base-T Protection
Capacitance across the pair of wires = (D1 || D2) + P0640EA/SA
The MUR 1100E diodes capacitance is approximately (10 pF || 10 pF) 20 pF. Then, adding
the capacitive effect of the SIDACtor (typically 50 pF), the total capacitance across the pair
of wires is approximately 14 pF. This provides a GR 1089 intra-building compliant design.
(Figure 3.43)
Note: MURS160T3 is an SMT equivalent of the MUR 1100E.
Figure 3.43 10Base-T Metallic-only Protection
Figure 3.44 shows an application requiring longitudinal protection.
Figure 3.44 10Base-T Metallic and Longitudinal Protection
D1 D2
F0500T
D1 D2
D3 D4
F0500T
F0500T
LAN / WAN Protectors
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100Base-T Protection
Capacitance across the pair of wires = (D1 || D2) + P0640EA/SA + (D3 || D4)
The MUR 1100E pair of diodes capacitance is approximately (10 pF || 10 pF) 20 pF. Then,
adding the capacitive effect of the P0640EA/SA (typically 50pF), the total capacitance
across the pair of wires is approximately 8 pF. This will provide a GR 1089 intra-building
compliant design. (Figure 3.45)
Note: MURS160T3 is a SMT equivalent of the MUR 1100E.
Figure 3.45 100 Base-T Protection
The P0642SA is a very low capacitance device that requires no compensating diodes.
(Figure 3.46)
Figure 3.46 100 Base-T Protection Without External Compensation
P0640EA/SA
D1 D2
D3 D4
P0642SA
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Regulatory
Requirements
4Regulatory
Requirements
Due to the enormous cost of interrupted service and failed network equipment, telephony
service providers have adopted various specifications to help regulate the reliability and
performance of the telecommunications products that they purchase. In Europe and much
of the Far East, the most common standards are ITU-T K.20 and K.21. In North America,
most operating companies base their requirements on GR 1089, TIA-968 (formerly known
as FCC Part 68), and UL 60950.
Note: This section is a paraphrase of existing documents and does not cover the listed
regulatory requirements in their entirety. This information is intended to be used only
as a reference. For exact specifications, obtain the referenced document from the
appropriate source.
GR 1089–Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
ITU-T K.20 and K.21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10
TIA/EIA-IS-968 (formerly known as FCC Part 68) . . . . . . . . . . . . . . . . . . . . . . . . . 4-14
UL 60950 3rd Edition (formerly UL 1950, 3rd edition) . . . . . . . . . . . . . . . . . . . . . . 4-16
UL 497 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24
UL 497A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27
UL 497B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-30
UL 497C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-32
Regulatory Compliant Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34
Surge Waveforms for Various Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-37
GR 1089–Core
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Regulatory
Requirements
GR 1089–Core
In the United States, the telecommunication network is primarily operated by the Regional
Bell Operating Companies (RBOC) who follow the standards set by GR 1089 or a derivative
thereof. GR 1089–Core (often referred to as GR 1089), “Electromagnetic Compatibility and
Electrical Safety Generic Criteria for Network Telecommunications Equipment,” covers the
requirements for telecommunications equipment connected to the outside world through
twisted pair. It also addresses the criteria for protection from lightning and AC power cross
disturbances.
Because twisted pair are metallic conductors exposed to lightning and AC power faults,
GR 1089 documents the requirements to be met by manufacturers of public switched
telephone network (PSTN) equipment to ensure safe and reliable operation.
The criteria for these standards are based on transient conditions at exposed sites, such as
remote facilities, central offices, and customers’ premises where operating companies
provide some type of primary voltage protection to limit transient voltages to 1000 V peak
for surge conditions and 600 V rms for power cross conditions.
All network equipment shall be listed by a Nationally Recognized Testing Laboratory
(NRTL) if the equipment is directly powered by Commercial AC. Network equipment located
on customer premises shall be listed by NRTL.
In conjunction with primary voltage protectors, operating companies also may incorporate
fuse links if there is the possibility of exposing the twisted pair to outside power lines. These
fuse links are equivalent to 24- or 26-gauge copper wire and are coordinated with the
current-carrying capacity of the voltage protector.
The last element of protection that may be provided by the operating company are current
limiters which, if provided, are found on the line side of the network equipment after the
primary voltage protection device. These current limiters typically come in the form of heat
coils and have a continuous rating of 350 mA.
Requirements
Equipment required to meet GR 1089 must be designed to pass:
• Both First and Second Level Lightning Surge and AC Power Fault Tests
• Current Limiter Test
• Short Circuit Test
A minimum of three units are tested for each of the operating states in which the Equipment
Under Test (EUT) may be expected to function — idle, transmit, receive, on-hook, off-hook,
talking, dialing, ringing, and testing. Table 4.1 and Table 4.2 show test connections, and
Figure 4.1 shows the connection appearances.
GR 1089–Core
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Notes:
• When performing longitudinal tests, the test generator will have a dual output.
• Refer to Table 4.2 for switch positions for each test condition.
Note: Other outside plant leads associated with the unit should be grounded during the test and the test repeated with these leads
terminated as in service. Leads that do not connect to outside plant should be terminated as appropriate for the operating
mode(s) of the unit.
Figure 4.1 Connection Appearances
Passing Criteria
Passing criteria for the First Level Lightning Surge Test and the First Level AC Power Fault
Test is that the EUT will not be damaged and that it will operate as intended after the stress
is removed. Passing criteria for the Second Level Lightning Surge Test and Second Level
Table 4.1 Test Conditions
Test Two-wire Interface Four-wire Interface
A 1. Tip to Generator, Ring to Ground
2. Ring to Generator, Tip to Ground
3. Tip and Ring to Generator simultaneously
1. Each lead (T, R, T1, R1) to the Generator with the other three
leads grounded
2. Tip and Ring to Generator, simultaneously; T1 and R1 to
Ground
3. T1 and R1 to Generator, simultaneously; Tip and Ring to
Ground
B Tip and Ring to Generator simultaneously T, R, T1, R1 to Generator simultaneously
Table 4.2 Connections to Test Generator
Condition S1 S2 S3 S4
Condition A-1 of Table 4.1 Closed Open Open Closed
Condition A-2 of Table 4.1 Open Closed Closed Open
Condition A-3 of Table 4.1 Closed Open Closed Open
T
E
R
M
T
E
R
M
Associated
Outside
Plant
Leads
Switch Unit
Under Test
Tip
S2
Ring
S4
S1
S3
Limiting
Resistance
(If Specified)
Test Generator
Voltage
Source
GR 1089–Core
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Regulatory
Requirements
AC Power Fault Test is that the EUT may be damaged, but it may not become a fire,
fragmentation, or electrical safety hazard. Passing criteria for the Current Limiter Test is that
the EUT may be damaged but it may not exceed the acceptable time/current criteria (that is,
cannot cause the wiring simulator as shown in Figure 4.2 to open) nor become a fire,
fragmentation, or electrical safety hazard.
The indicator used in measuring fire, fragmentation, and electrical safety hazards is a
bleached, untreated cotton cheesecloth wrapped around the EUT. Compliance with testing
is determined by the absence of ignition, charring, and the ejection of molten material or
fragments.
First Level Lightning Surge Test
To pass the First Level Lightning Surge Test, the EUT must be undamaged and continue to
operate properly after the stress is applied. This is referred to as passing “operationally.”
Table 4.3 presents the conditions for the First Level inter-building criteria. Applicants have
the option to submit their equipment to meet surges 1, 2, 4, and 5 or surges 3, 4, and 5.
Table 4.4 presents the conditions for the intra-building criteria.
Notes:
1. Primary protectors are removed for all tests.
2. For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s)
and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors.
3. Test 1 and 2 can be replaced with Test 3 or vice versa.
4. Alternatively, a surge generator of 1.2x50 µs open-circuit voltage waveform (8x20 µs short-circuit current waveform) per
IEEE C62.41 may be used. The current shall be limited by the inclusion of a series 3 W resistor placed externally to the surge
generator.
5. This test is to be performed on up to 12 Tip and Ring pairs simultaneously.
Notes:
• For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s)
and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors.
• Alternatively, a surge generator of 1.2x50 µs open-circuit voltage waveform (8x20 µs short-circuit current waveform) per
IEEE C62.41 may be used. The current shall be limited by the inclusion of a series 6 W resistor for Test 1 and a 12 W resistor for
Test 2, placed externally to the surge generator.
Table 4.3 First Level Lightning Surge Test
Test
(Notes 1 & 2)
Surge Voltage
(VPK)
Waveform
(µs)
Surge Current
per Conductor
(A)
Repetitions
Each Polarity
Test
Connections
(Table 4.1, Figure 4.1)
1 ±600 10x1000 100 25 A
2 (Note 3) ±1000 10x360 100 25 A
3 (Note 3) ±1000 10x1000 100 25 A
4 (Note 4) ±2500 2x10 500 10 B
5 (Note 5) ±1000 10x360 25 5 B
Table 4.4 Intra-Building Lightning Surge Test
Test
Surge Voltage
(VPK)
Wave-form
(µs)
Surge Current
per Conductor
(A)
Repetitions Each
Polarity
Test Connections
(Table 4.1, Figure 4.1)
1±800 2x10 100 1 A1, A2
2±1500 2x10 100 1 B
GR 1089–Core
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Second Level Lightning Surge Test
The Second Level Lightning Surge Test, presented in Table 4.5, does not require the EUT
to pass operationally, but GR 1089 does require that the EUT not become a fire,
fragmentation, or electrical safety hazard. This is referred to as passing “non-operationally.”
Notes:
• Primary protectors are removed.
• For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s)
and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors.
• Alternatively, a surge generator of 1.2x50 µs open-circuit voltage waveform (8x20 µs short-circuit current waveform) per
IEEE C62.41 may be used. The current shall be limited by the inclusion of a series 8 W resistor placed externally to the surge
generator.
AC Power Fault Tests
Power companies and telephone operating companies often share telephone poles and
trenches; therefore, network equipment is often subjected to the voltages seen on power
lines. If direct contact between the telephone line and the primary power line occurs, the
operating company’s network equipment may see as much as 600 V rms for five seconds,
by which time the power company’s power system should clear itself. If direct contact
occurs with the secondary power line, voltages will be limited to 277 V rms; however, these
voltages may be seen indefinitely because the resultant current may be within the operating
range of the power system, and the power system will not reset itself.
Another risk involved with power lines is indirect contact. Because of the large magnetic
fields created by the currents in the power lines, large voltages may be induced upon phone
lines via electro-magnetic coupling. In this instance voltages should be limited to
1000 V peak and 600 V rms using primary protectors, while the current will be limited by the
current-carrying capacity of the 24-gauge wire.
Table 4.5 Second Level Lightning Surge Test
Tes t
Surge
Voltage
(VPK)
Waveform
(µs)
Surge Current
(A)
Repetitions Each
Polarity
Tes t Connection s
(Table 4.1, Figure 4.1)
1 ±5000 2x10 500 1 B
GR 1089–Core
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First Level AC Power Fault Criteria
Table 4.6 presents test conditions for the First Level AC Power Fault Test. The EUT is
required to pass operationally.
Notes:
1. For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s)
and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors.
2. Test 5 simulates a high impedance induction fault. For specific information, please contact Teccor Electronics.
3. Test conditions 6 through 9 are objective, not mandatory, requirements.
4. Sufficient time may be allowed between applications to preclude thermal accumulation.
Second Level AC Power Fault Criteria
Test conditions for the Second Level AC Power Fault Test are dependent on whether the
EUT is intended for customer premises equipment or non-customer premises equipment. In
both instances, although the EUT is not required to pass operationally, it may not become a
fire, fragmentation, or electrical safety hazard.
Second Level AC Power Fault Criteria for Non-customer Premises
Equipment
Table 4.7 presents test conditions for non-customer premises equipment. (Note that test
conditions 1, 3, and 4 may be omitted if the EUT has previously met UL 60950.) See
Figure 4.1 for test connection appearances.
Table 4.6 First Level AC Power Fault Test
Tes t
Applied Voltage,
60 Hz
(VRMS)
Short Circuit
Current per
Conductor
(A) Duration
Primary
Protectors
Tes t Connections
(Table 4.1, Figure 4.1)
1 (Note 1) 50 0.33 15 min Removed A
2 (Note 1) 100 0.17 15 min Removed A
3 (Note 1) 200, 400, 600 1A at 600 V 60 applications,
1 s each
Removed A
4 (Note 4) 1000 1 60 applications,
1 s each
In place B
5 (Note 2) N/A N/A 60 applications,
5 s each
Removed N/A
6 (Note 3) 600 0.5 30 s Removed A
7 (Note 3) 600 2.2 2 s Removed A
8 (Note 3) 600 3 1 s Removed A
9 (Note 3) 1000 5 0.5 s In place B
GR 1089–Core
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Notes:
1. Primary protectors are removed for all tests.
2. For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s)
and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors.
3. This test is to be performed between the ranges of 100 V to 600 V and is intended to produce the greatest heating affect.
4. Test 5 simulates a high impedance induction fault. Specific information regarding this test is available upon request.
5. These tests are repeated using a short-circuit value just below the operating threshold of the current limiting device, or, if the EUT
uses a fuse as current limiting protection, the fuse may be bypassed and the short circuit current available adjusted to 135% of the
fuse rating.
6. Intra-building, second level lower fault test uses test condition 1 only. The applied voltage is at 120 V rms only.
Second Level AC Power Fault for Customer Premises Equipment
For customer premises equipment, the EUT is tested to the conditions presented in
Table 4.8 and connected to a circuit equivalent to that shown in Figure 4.2. During this test,
the wiring simulator cannot open. For equipment that uses premises type of wiring, the
wiring simulator is a 1.6 A Type MDQ fuse from Bussman. For equipment that is connected
by cable, the wiring simulator is a piece of 26-gauge copper wire.
Notes:
1. Applied between exposed surfaces and Ground
2. The 60 Hz signal is applied with an initial amplitude of 30 V rms and increased by 20% every 15 minutes until one of the following
occurs:
— Voltage reaches the maximum specified
— Current reaches 20 A or the wiring simulator opens
— EUT fails open circuit
3. If the EUT fails open circuit, the test continues for an additional 15 minutes to ensure that another component of the EUT does not
create a fire, fragmentation, or electrical safety hazard.
Table 4.7 Second Level AC Power Fault Test for Non-Customer Premises Equipment
Test
(Notes 1, 2)
Applied Voltage, 60 Hz
(VRMS)
Short Circuit Current
per Conductor
(A)
(Note 5) Duration
Test Connections
(Table 4.1, Figure 4.1)
1 120, 277 25 15 min A
2 600 60 5 s A
3600 7 5 s A
4 (Note 3) 100-600 2.2A at 600 V 15 min A
5 (Note 4) N/A N/A 15 min N/A
Table 4.8 Second Level AC Power Fault for Customer Premises Equipment
Test
Applied Voltage, 60 Hz
(VRMS)
(Notes 2, 3)
Source Impedance
W
Test Connections
(Table 4.1, Figure 4.2)
1300 20 (Note 1)
2600 20 A
GR 1089–Core
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Figure 4.2 Second Level AC Power Fault and Current Limiter Connection
Current Limiting Protector Test
The purpose of the Current Limiting Protector Test, presented in Table 4.9, is to determine if
the EUT allows an excessive amount of current flow under power fault conditions. During
this test, the EUT is connected to a circuit equivalent to that shown in Figure 4.2 with a
1.6 A Type MDQ fuse from Bussman used as the wiring simulator. If the EUT draws enough
current to open the fuse, then the acceptable time/current criteria have not been met, and
external current limiting protectors must be specified for use with that equipment in the
manufacturer’s documentation.
Short-circuit Test
In addition to the AC Power Fault and Current Limiter Tests, equipment must also pass a
Short-circuit Test to comply with GR 1089. During this test, a short-circuit condition is
applied to the following Tip and Ring appearances for 30 minutes while the EUT is powered
and under operating conditions:
• Tip-to-Ring, Tip-to-Ground with Ring open circuit
• Ring-to-Ground with Tip open circuit
• Tip- and Ring-to-Ground simultaneously for 30 minutes
At no time will the short circuit exceed 1 W. For equipment with more than one twisted pair,
the short circuit is applied to all twisted pair simultaneously. To comply with the short circuit
test, the EUT must function normally after the short-circuit condition is removed, and a fire
hazard may not be present. The equipment shall not require manual intervention to restore
service.
Equipment
Tip
Wiring
Simulator
Ring
Chassis
Ground
20
Variable
60 Hz ac
Voltage
Source 0-600 V
(A) Metallic
AC Equipment Ground
(Green Wire Ground)
Equipment
Tip
Ring
Chassis
Ground
20
Wiring
Simulator
20
Variable
60 Hz ac
Voltage
Source 0-600 V
(B) Longitudinal
AC Equipment Ground
(Green Wire Ground)
Wiring
Simulator
Table 4.9 Current Limiting Protector Test
Test
Applied Voltage, 60 Hz
(VRMS)
Source Impedance
WDuration
Test Connections
(Table 4.1, Figure 4.2
1600 2 15 min A
ITU-T K.20 and K.21
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ITU-T K.20 and K.21
Although the International Telecommunication Union (ITU) does not have the authority to
legislate that organizations follow their recommendations, their standards are recognized
throughout Europe and the Far East.
ITU-T, the Telecommunication Standardization Sector of the ITU, developed fundamental
testing methods that cover various environmental conditions to help predict the survivability
of network and customer-based switching equipment. The testing methods cover the
following conditions:
• Surges due to lightning strikes on or near twisted pair and plant equipment (excluding a
direct strike)
• Short-term induction of AC voltage from adjacent power lines or railway systems
• Direct contact between telecommunication lines and power lines (often referred to as
AC power cross)
Two ITU-T standards apply for most telecommunications equipment connected to the
network:
• ITU-T K.20
• ITU-T K.21
ITU-T K.20 is primarily for switching equipment powered by the central office; however, for
complex subscriber equipment, test administrators may choose either K.20 or K.21,
depending on which is deemed most appropriate.
Note: Both standards are intended to address equipment reliability versus equipment
safety. For specific concerns regarding equipment safety, research and follow
national standards for each country in which the equipment is intended for use.
K.21 covers telecommunication equipment installed in customer premises. Equipment
submitted under these requirements must meet one of two levels: basic or enhanced.
Guidelines for determining under which level the equipment under test (EUT) falls can be
found in ITU-T K.11, but note that the final authority rests with the test administrator.
ITU-T K.44 describes the test conditions used in K.20 and K.21.
ITU-T defines the following acceptance criteria:
• Criterion A states that equipment shall withstand the test without damage and shall
operate properly after the test. It is not required to operate correctly during the test.
• Criterion B states that a fire hazard shall not occur as a result of the tests. Any damage
shall be confined to a small part of the equipment.
Table 4.10 shows the lightning surge test conditions for ITU K.20. Figure 4.3 shows the
connection schematic for the lightning surge tests. Table 4.11 shows the power cross test
conditions for ITU K.20. Figure 4.4 shows the connection schematic for the power cross
tests. Table 4.12 and Table 4.13 show the same test conditions respectively for ITU K.21.
ITU-T K.20 and K.21
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* One-minute rest between repetitions
** This test is not conducted if primary protection is used.
Figure 4.3 Connection Appearances
Table 4.10 K.20 Lightning Test Conditions for Telecom Equipment in Central Office/Remote Terminal
Voltage (10x700 µs)
Current (5x310 µs)
Basic/Enhanced
(A) Repetitions * Primary Protection
Acceptance
Criteria
Single Port
Metallic and
Longitudinal
Basic/Enhanced
Multiple Ports
Longitudinal Only
Basic/Enhanced
1 kV/1.5 kV 25/37.5 ±5 None ** A
4 kV/4 kV 100/100 ±5 Installed if used A
1.5 kV/1.5 kV 37.5/37.5 ±5 None A
4 kV/6 kV 100/150 ±5 Installed if used A
A
25 Ω
BE
Equipment Under Test
Decoupling
Elements
Surge
Generator
A
25 Ω
R3 = 25 Ω BE
Equipment Under Test
Decoupling
Elements
Surge
Generator
a) Transversal test
b) Longitudinal test
ITU-T K.20 and K.21
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Figure 4.4 Connection Appearances (R = 10 W, 20 W, 40 W, 80 W, 160 W, 300 W, 600 W, and 1000 W
for the various power cross tests)
* One-minute rest between repetitions
* One-minute rest between repetitions
** Reduce to 1.5 kV if SPD connects to GRD.
*** Does not apply if primary protectors are used.
A
R
RBE
Equipment
Under Test
Timing Circuit
Generator
Ua.c.
Table 4.11 K.20 Power Cross Test Conditions for Telecom Type Ports, Metallic, and Longitudinal
Voltage
Basic/Enhanced
Current (5x310 µs)
Basic/Enhanced
(A)
Duration
Basic/Enhanced Repetitions *
Primary
Protection
Acceptance Criteria
Basic/Enhanced
600 V/600 V
50 Hz or 60 Hz
1/1 0.2 s 5 None A/A
600/1.5 kV
50 Hz or 60 Hz
1/7.5 1 s/2 s 5 None A/A
230/230 V
50 Hz or 60 Hz
23/23 15 min 1 None B/B
11.5/11.5 B/B
5.75/5.75 B/B
2.875/2.875 B/B
1.44/1.44 B/A
0.77/0.77 B/A
0.38/0.38 B/A
0.23/0.23 B/B
Table 4.12 K.21 Lightning Test Conditions for Telecom Equipment on Customer Premises
Voltage (10x700 µs)
Current (5x310 µs)
Basic/Enhanced
(A) Repetitions *
Primary
Protection
Acceptance
Criteria
Single Port Multiple Ports
Longitudinal Only
(kV)
Basic/Enhanced
Longitudinal
(kV)
Basic/Enhanced
Metallic
(kV)
Basic/Enhanced
1.5/6 ** 37.5/150 ±5 None A ***
4/6 100/150 ±5 Installed if used A
1.5/1.5 1.5/1.5 37.5/37.5 ±5 None A ***
4/6 4/6 100/150 ±5 Installed if used A
ITU-T K.20 and K.21
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* One-minute rest between repetitions
Table 4.13 K.21 Power Cross Test Conditions for Telecom Type Ports, Metallic, and Longitudinal
Voltage
Basic/Enhanced
Current
Basic/Enhanced
(A)
Duration
Basic/Enhanced Repetitions *
Primary
Protection
Acceptance Criteria
Basic/Enhanced
600 V / 600 V
50 Hz or 60 Hz
1/1 0.2 s 5 None A/A
600 V / 1.5 kV
50 Hz or 60 Hz
1/7.5 1 s/2 s 5 Installed if
used
A/A
230 V / 230 V
50 Hz or 60 Hz
23/23 15 min 1 None B/B
11.5/11.5 B/B
5.75/5.75 B/B
2.875/2.875 B/B
1.44/1.44 B/A
0.77/0.77 B/A
0.38/0.38 B/A
0.23/0.23 B/B
TIA-968 (formerly known as FCC Part 68)
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TIA-968 (formerly known as FCC Part 68)
TIA-968 applies to all terminal equipment connected to the Public Switched Telephone
Network (PSTN) and holds the “rule of law” by congressional order.
The purpose of TIA-968 is to provide a set of uniform standards to protect the telephone
network from any damage or interference caused by the connection of terminal equipment.
This standard includes environmental simulations such as vibration tests, temperature and
humidity cycling, drop tests and tests for hazardous voltages and currents, as well as tests
for signal power levels, line balance, on-hook impedance, and billing protection. All these
standards must be met before and after the environmental tests are applied.
Overvoltage Test
TIA-968 compliant equipment must undergo an overvoltage test that includes a Type A and
Type B Metallic Voltage Surge and a Type A and Type B Longitudinal Voltage Surge. These
surges are part of the environmental simulation, and although a provision does allow the
EUT to reach an open circuit failure mode during the Type A tests, failures must:
1. Arise from an intentional design that will cause the phone to be either disconnected from
the public network or repaired rapidly
2. Be designed so that it is substantially apparent to the end user that the terminal
equipment is not operable
A common example of an acceptable failure would be an open circuit due to an open
connection on either Tip or Ring.
For Type B surges, equipment protection circuitry is not allowed to fail. The EUT must be
designed to withstand Type B surges and continue to function in all operational states.
Metallic Voltage Surge
The Type A and Type B Metallic Voltage Surges are applied in both the positive and
negative polarity across Tip and Ring during all operational states (on-hook, off-hook,
ringing, and so on). The Type A surge is an 800 V, 100 A peak surge while the Type B
surge is a 1000 V, 25 A peak surge, as presented in Table 4.14.
Notes:
• For Type A surges, the EUT may pass either “operationally” or “non-operationally.”
• For Type B surges, the EUT must pass “operationally.”
• The peak current for the Type A longitudinal surge is the total available current from the surge generator.
• The peak current for the Type B longitudinal surge is the current supplied to each conductor.
Table 4.14 TIA-968 Voltage Surge
Surge
Type
Peak
Voltage
(VPK)
Rise &
Decay Time
(Voltage Waveform)
Peak
Current
(A)
Rise &
Decay Time
(Current Waveform)
Repetitions
Each Polarity
Metallic A ±800 10x560 µs 100 10x560µs 1
Longitudinal A ±1500 10x160 µs 200 10x160µs 1
Metallic B ±1000 9x720 µs 25 5x320µs 1
Longitudinal B ±1500 9x720 µs 37.5 5x320µs 1
TIA-968 (formerly known as FCC Part 68)
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Longitudinal Voltage Surge
The Type A and Type B Longitudinal Voltage Surges are applied in both positive and
negative polarity during all operational states. The Type A surge is a 1500 V, 200 A peak
surge applied to the EUT with Tip and Ring tied together with respect to Ground. The
Type B Longitudinal Voltage Surge is a simultaneous surge in which 1500 V and 37.5 A are
applied concurrently to Tip with respect to Ground and Ring with respect to Ground, as
presented in Table 4.14.
Note: Type B surge requirements guarantee only a minimum level of surge protection. For
long term reliability of terminal equipment, consideration should be given to
complying with Type A surges operationally.
On-hook Impedance Limitations
Another important aspect of TIA-968 is on-hook impedance, which is affected by transient
protection. On-hook impedance is analogous to the leakage current between Tip and Ring,
and Tip, Ring, and Ground conductors during various on-hook conditions. "On-hook
Impedance Measurements" (next paragraph) outlines criteria for on-hook impedance and is
listed as part of the Ringer Equivalent Number (REN). The REN is the largest of the unitless
quotients not greater than five; the rating is specified as the actual quotient followed by the
letter of the ringer classification (for example, 2B).
On-hook Impedance Measurements
On-hook impedance measurements are made between Tip and Ring and between Tip and
Ground and Ring and Ground. For all DC voltages up to and including 100 V, the DC
resistance measured must be greater than 5 MW. For all DC voltages between 100 V and
200 V, the DC resistance must be greater than 30 kW. The REN values are then determined
by dividing 25 MW by the minimum measured resistance up to 100 V and by dividing
150 kW by the minimum measured resistance between 100 V and 200 V.
On-hook impedance is also measured during the application of a simulated ringing signal.
This consists of a 40 V rms through 150 V rms ringer signal at frequencies ranging from
15.3 Hz to 68 Hz superimposed on a 56.5 V dc for a class “B” ringer. During this test, the
total DC current may not exceed 3 mA. In addition, the minimum DC resistance measured
between Tip and Ring must be greater than 1600 W, while the DC resistance measured
between the Tip and Ring conductors and Ground must be greater than 100 kW. The REN
values for the simulated ringing test are determined by dividing the maximum DC current
flowing between Tip and Ring by 0.6 mA, and by dividing 8000 W by the minimum
impedance value measured.
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
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UL 60950 3rd Edition
(formerly UL 1950, 3rd edition)
After the divestiture of the AT&T/Bell system, the National Electric Code (NEC)
implemented Article 800-4, which mandates that “all equipment intended for connection to
the public telephone network be listed for that purpose” in order to ensure electrical safety.
A manufacturer can meet this requirement by listing their product with Underwriters
Laboratories under UL 60950 (based on IEC 60950, 3rd edition).
NEC requires all telecommunication wiring that enters a building to pass through a primary
protector, which is designed to limit AC transients in excess of 600 V rms. These transients
are due to the fact that telephone lines run in close proximity to AC power lines. Most
telecommunication equipment uses a secondary overvoltage protector such as the
SIDACtor device. The secondary devices typically limit transients in excess of 350 V rms.
Therefore, a potentially dangerous condition exists because of the voltage threshold
difference of the primary protector and the secondary protector. To minimize this danger,
compliance with UL 60950 overvoltage tests is required.
UL 60950 covers equipment with a rated voltage (primary power voltage) not exceeding
600 V and equipment designed to be installed in accordance with NEC NFPA 70. This
standard does not apply to air-conditioning equipment, fire detection equipment, power
supply systems, or transformers.
The effective date of UL 60950 allows new products submitted through April 1, 2003 to be
evaluated using the requirements of either UL 60950 or UL 1950, 3rd edition. After April 1,
2003, all new product submittals must be evaluated using only UL 60950.
Products certified by UL to requirements of UL 1459 prior to April 1, 2000 may continue to
be certified without further reinvestigation until April 1, 2005, provided no significant
changes or revisions are made to the products. Products certified by UL to requirements of
UL 1950 3rd edition prior to April 1, 2003 may continue to be certified without further
reinvestigation until April 1, 2005.
In order to have the UL Mark applied after April 1, 2005, all products, including those
previously certified by UL, must comply with UL 60950.
UL 69050 is intended to prevent injury or harm due to electrical shock, energy hazards, fire,
heat hazards, mechanical hazards, radiation hazards, and chemical hazards.
It defines three classes of equipment:
• Class 1 — protection achieved by basic insulation
• Class 2 — protection achieved by double or reinforced insulation
• Class 3 — protection relying upon supply from SELV circuits (voltages up to 40 V peak
or 60 V dc)
UL 60950 also defines five categories of insulation:
• Functional
• Basic
• Supplementary
• Reinforced
• Double
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
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UL 60950 Terminology
The following definitions assist in understanding UL 60950:
Creepage distance is the shortest distance between two conductors, measured along the
surface of the insulation. DC voltages shall be included in determining the working voltage
for creepage distances. (The peak value of any superimposed ripple or short disturbances,
such as cadenced ringing signals, shall be ignored.)
Clearance distance is the shortest distance between two conductive parts or between a
conductive part and the outer surface of the enclosure measured through air. DC voltages
and the peak value of any superimposed ripple shall be included in determining the working
voltage for clearance distances.
Creepage and clearance distances are also subject to the pollution degree of the
equipment:
• Pollution degree 1 — components and assemblies that are sealed to prevent ingress of
dust and moisture
• Pollution degree 2 — generally applicable to equipment covered by UL 60950
• Pollution degree 3 — equipment is subject to conductive pollution or to dry non-
conductive pollution, which could become conductive due to expected condensation.
To ensure safe operating conditions of the equipment, UL 60950 focuses on the insulation
rating of the circuit(s) under consideration. Table 4.15 and Table 4.16 indicate the required
creepage and clearance distances depending on material group, pollution degree, working
voltage, and maximum transient voltage in the secondary circuit. For a typical
telecommunication application with a working voltage of 200 V, pollution degree 2, material
group IIIb, the creepage distance is 2 mm. The clearance distance is 2 mm for reinforced
insulation.
SELV Secondary circuit whose voltage values do not exceed a safe value
(voltage less than hazardous levels of 42.4 V peak or 60 V dc)
TNV Telecommunication Network Voltage (a secondary circuit)
TNV3 ³ SELV but with exposure to surges
TNV2 ³ SELV but without exposure to surges
TNV1 £ SELV with exposure to surges
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
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* Voltage peak or DC
** Voltage rms (sinusoidal)
Note: F = Functional
B/S = Basic/Supplementary
R = Reinforced
Note: Linear interpolation is permitted between the nearest two points, the calculated spacing being rounded to the next higher 0.1 mm
increment.
The following separations require the specified insulation grade:
• TNV3 from TNV3 — functional insulation
• TNV3 from SELV — basic insulation
• TNV3 from TNV1 — basic insulation
• TNV3 from TNV2 — basic insulation
Table 4.15 Minimum Clearances in Secondary Circuits (millimeters)
Working
Voltage up
to and
including
Nominal AC Mains Supply voltage
£ 150 V
(transient rating for Secondary
Circuit 800 V)
Nominal AC Mains Supply voltage
> 150 V £ 300 V
(transient rating for Secondary
Circuit 1500 V)
Nominal AC
Mains Supply
voltage
> 300 V £ 600 V
(transient rating
for Secondary
Circuit 2500 V)
Circuit Not
Subject to
Transient
Overvoltages
V * V **
Pollution
Degrees 1 and 2
Pollution
Degree 3
Pollution
Degrees 1 and 2
Pollution
Degree 3
Pollution
Degrees
1, 2, and 3
Pollution
Degrees 1 and 2
only
F B/S R F B/S R F B/S R F B/S R F B/S R F B/S R
71 50 0.4 0.7 1.4 1 1.3 2.6 0.7 1 2 1 1.3 2.6 1.7 2 4 0.4 0.4 0.8
140 100 0.6 0.7 1.4 1 1.3 2.6 0.7 1 2 1 1.3 2.6 1.7 2 4 0.6 0.7 1.4
210 150 0.6 0.9 1.8 1 1.3 2.6 0.7 1 2 1 1.3 2.6 1.7 2 4 0.6 0.7 1.4
280 200 F 1.1; B/S 1.4; R 2.8 1.7 2 4 1.1 1.1 2.2
420 300 F 1.6; B/S 1.94; R 3.8 1.7 2 4 1.4 1.4 2.8
Table 4.16 Minimum Creepage Distances (millimeters)
Working
Voltage
V
RMS or DC
Functional, Basic, and Supplementary Insulation
Pollution Degree 1 Pollution Degree 2 Pollution Degree 3
Material Group Material Group Material Group
I, II, IIIa, or IIIb III IIIa or IIIb III IIIa or IIIb
£ 50 Use the Clearance from the
appropriate table
0.6 0.9 1.2 1.5 1.7 1.9
100 0.711.41.822.2
125 0.8 1.1 1.5 1.9 2.1 2.4
150 0.8 1.1 1.6 2 2.2 2.5
200 1 1.4 2 2.5 2.8 3.2
250 1.3 1.8 2.5 3.2 3.6 4
300 1.6 2.2 3.2 4 4.5 5
400 2 2.8 4 5 5.6 6.3
600 3.2 4.5 6.3 8 9.6 10
800 4 5.6 8 10 11 12.5
1000 5 7.1 10 12.5 14 16
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
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Requirements
The application must meet the creepage and clearance distances and electric strength of
Section 5.3.2 of UL 60950 for functional insulation. The electric strength test (Table 5B of
UL 60950) lists 1 kV to 1.5 kV as the test voltages for functional and supplementary grade
of insulation and 2 kV to 3 kV for reinforced grade of insulation.
Separation requirements are tested (Section 6.2.2.1 of UL 60950) by applying an impulse
test and an electric strength test:
• Impulse test allows for the SIDACtor device to turn on (either a 10x700 2.5 kV 62.5 A or
1 kV 37.5 A 10 times with 60-second rest period).
• Electric strength test allows the SIDACtor device to be removed (60 Hz at rated voltage
for 60 seconds).
These are applied between Ground and all Tip and Rings connected together, and/or
between Ground and all conductors intended to be connected to other equipment
connected together.
Basic insulation is not required if all the following conditions are met:
• SELV, TNV1 circuit is connected to the protective earth.
• Installation procedures specify that protective earth terminal shall have a permanent
connection to earth.
• Any TNV2 or TNV3 circuit with an external port connection intended to receive signals in
excess of SELV (60 V dc or 50 V peak) will have the maximum normal expected
operating voltage applied to it for up to 30 minutes without deterioration. (If no maximum
normal specification exists then 120 V 100 mA 60 Hz is applied.)
(In other words, if a permanent Ground connection is made, then creepage distances may
not be required.)
Any surge suppressor that bridges the insulation (connects to Ground) shall have a
minimum DC turn on voltage of 1.6 times the rated voltage UNLESS one of the following
occurs (Section 6.1.2.2 of UL 60950):
• Equipment is permanently connected or uses an industrial plug and socket-outlet.
• Equipment is installed by service personnel.
• Equipment has provision for a permanently connected protective earth.
ANNEX C of UL 60950 covers transformers.
The secondary side is loaded for maximum heating effect. The maximum working voltage is
applied to the primary. The DC peak value of any superimposed ripple shall be included.
The permitted temperature limits for the windings depend on the classification:
• Class A limit is 150 °C.
• Class B limit is 175 °C.
• Class E limit is 165 °C.
• Class F limit is 190 °C.
• Class H limit is 210 °C.
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
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Overvoltage Flowchart
The overvoltage flowchart in Figure 4.5 shows specific guidelines for determining
overvoltage requirements applicable to specific designs.
Figure 4.5 Overvoltage Flowchart
No
No
No
No
No
Ye s
100 A
2
-S
Limiting
1
No Overvoltage Testing
Connects to Outside Cable
Ye s Ye s
1.3 A
Limiting
2
26 AWG
Line Cord
3
Ye s
Pass 1
Ye s
Pass 6.1.2
4
Fire Enclosure
and Spacings
5
Ye s
Ye s
Acceptable
Fire
Enclosure
No
No
Ye s
Pass 5
Pass 2
6
Pass 3, 4
7
Ye s
No
No
No
Ye s
Not
Acceptable
Notes:
1. Current Limiting — Equipment that has a method for limiting current to an I2t rating of 100A2s
2. Current Limiting — Equipment that has a method for limiting current to 1.3 A max steady state
3. 26 AWG Line Cord — Minimum 26 American Wire Gauge (AWG) telecommunications line cord either supplied with the
equipment or described in the safety instructions
4. Clause 6.3.3 — The telephone line must be adequately isolated from earth for the operating mode being considered and
at a voltage of 120 V rms. Refer to Section 6.1.2 of UL 60950.
5. Fire Enclosure and Spacing — Fire enclosures minimize fire hazards by containing any emission of flame, molten metal,
flaming drops, or glowing particles that could be emitted by the equipment under fault conditions. Fire enclosure
construction is covered in Section 4.4.6 of UL 60950. Spacing applies to parts in the TNV circuits that might ignite under
overvoltage conditions. Spacing requirements mandate that parts be separated from internal materials of flammability
class V-2 or lower, by at least 25 mm of air or a barrier material of flammability class V-1 or better. Parts also should be
separated from openings in the top or sides of the enclosure by at least 25 mm of air or a material barrier.
6. Test Condition 2 is not required for equipment with 1.3 A limiting.
7. Test Conditions 3 and 4 are not required for connections limited to outside cable less than 1,000 m.
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
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Passes 1, 2, 3, 4, and 5 shown in Figure 4.5 refer respectively to Tests L1 and M1, L2 and
M2, L3 and M3, L4 and M4, and L5 shown in Table 4.17.
Equipment may be subject to the overvoltage tests shown in Table 4.17. The tests are
designed to simulate the following:
• Contact with primary power
• Short-term induction as a result of a primary power fault to a multi-earth neutral
• Long duration power fault to Ground
• Direct contact between the power mains and a telecommunications cable
Notes:
• ISDN S/T interface only L1, L2, L5, M1, and M2.
• Reduce to 135% rated value of fuse if Test 3 resulted in open condition.
• L4 and M4 are conducted only if SIDACtor VS ³ 285 VS and then run at voltage level just below VS.
• For test conditions M1, L1, M5, and L5 a wiring simulator (MDL 2 A fuse) is used.
• Compliance means no ignition or charring of the cheesecloth, and/or the wiring simulator does not open.
• If the secondary protector simulator is used (MDQ 1.6), it is allowed to open.
• Tests 2, 3, and 4 are required only if the unit is not a fire enclosure.
• Figure 4.6 and Figure 4.7 show the M (metallic) and L (longitudinal) test connections.
Figure 4.6 Metallic Connection Appearances
Table 4.17 UL 60950 Overvoltage Test
Test
Voltage
(VRMS)
Current
(A) Time Comments
L1 600 V 40 1.5 s
L2 600 V 7 5 s
L3 600 V 2.2 30 min Reduce to 135% fuse rating
L4 200 V 2.2 30 min Reduce to 135% fuse rating
L5 120 V 25 30 min
M1 600 V 40 1.5 s
M2 600 V 7 5 s
M3 600 V 2.2 30 min Reduce to 135% fuse rating
M4 600 V 2.2 30 min Reduce to 135% fuse rating
Equipment
Under Test
Telecommunication
Network Connection
Points
Secondary Protector
Simulator or
Wiring Station
Timed
Switch
Current
Limiting
Resistor
Variable
Voltage
Source Equipment
Earth
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
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Figure 4.7 Longitudinal Connection Appearances
Overvoltage Test Procedures
Use the following criteria when applying the overvoltage tests presented in Table 4.17:
1. Test Set-up — Equipment is to be mounted as it is intended to be used. Tests may be
conducted on either the equipment as an assembly, individual subassemblies, or a
partial assembly containing those components which may be exposed to an overvoltage
condition.
2. Indicators — Before testing, two single pieces of cheesecloth are to be wrapped tightly
around the assembly, subassembly, or partial assembly. The cheesecloth acts as an
indicator for conditions that may result in fire.
3. Line Cords — Equipment with a removable telecommunications line cord is to be
connected to the test circuit with a line cord having 0.4 mm (26 AWG) or larger copper
wire conductors and not more than 1 W total resistance.
4. Functional Circuitry — UL mandates that functional circuitry must be used for each
overvoltage test conducted. This allows repair or replacement of damaged circuitry
before subsequent testing. Alternatively, separate samples may be used for each test.
5. Wiring Simulators — A wiring simulator is used to indicate whether the maximum I2t
imposed upon telecommunications wiring has been exceeded. For Tests 1 and 5, a
wiring simulator is to be used unless the equipment is specified for use with a suitable
secondary protector or a secondary protector simulator. The wiring simulator can consist
of one of the following:
a. 50mm length of 0.2 mm (32 AWG) bare or enameled solid copper wire (for test
condition 1)
b. Bussman Mfg. Co. Type MDL-2A fuse (for test condition 1)
c. 300 mm length of 0.4 mm (26 AWG) solid copper wire which connects to a
representative installation (includes wiring an connectors)
[This option is used when the manufacturer specifies the complete installation from
the network interface to the equipment.]
d. Current probe used with a 300 mm length of 0.5 mm (24 AWG) copper wire (for test
condition 1)
Equipment
Under Test
Secondary Protector
Simulators or
Wiring Stations
Timed
Switch
Equipment
Earth
Current
Limiting
Resistors
Variable
AC Voltage
Source
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
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Regulatory
Requirements
Note: Test conditions 2, 3, and 4 do not require the use of a wiring simulator or a secondary
protector simulator. Any secondary protection simulators used in Tests 1 and 5
should be similar to the test fuse used in UL 497A, “Standard for Secondary
Protectors for Communications Circuits.”
Overvoltage Test Compliance
Equipment is deemed compliant if each of the following conditions are met during test:
• Absence of ignition or charring of the cheesecloth indicator
(Charring is deemed to have occurred when the threads are reduced to char by a
glowing or flaming condition.)
• Wiring simulator does not open during test condition 1 or 5
• For test condition 1, presented in Table 4.17, the integral I2t measured with a current
probe is less than 100 A2s.
After completion of the overvoltage tests, equipment must comply with either the Dielectric
Voltage-withstand Test requirements with all components in place or the Leakage Current
Test requirements.
Special Considerations Regarding the SIDACtor Device and UL 60950
The epoxy used for SIDACtor devices is UL recognized and the encapsulated body passes
UL 94V-0 requirements for flammability.
The only specific requirements of UL 60950 that pertain to the SIDACtor device itself are
the impulse test and the mandate that components be UL recognized. All other UL 60950
requirements pertain to the equipment being evaluated.
UL 497
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UL 497
UL 497 Series of Safety Standards
The UL 497 series is a family of three safety standards that provides requirements for
protection devices used in low-voltage circuits.
• UL 497 addresses requirements for primary protectors used in paired communications
circuits.
• UL 497A covers secondary protectors for use in single or multiple pair-type
communications circuits.
• UL 497B addresses protectors used in data communication and fire alarm circuits.
• UL 497C addresses protectors for coaxial circuits.
The focus of UL 497 is to ensure that paired communication circuit protectors do not
become a fire or safety hazard. The requirements in UL 497 cover any protector that is
designed for paired communications circuits and is employed in accordance with Article 800
of the National Electric Code. The protectors covered in UL 497 include solid state primary
and station protectors. These circuit protectors are intended to protect equipment, wiring,
and service personnel against the effects of excessive voltage potential and currents in the
telephone lines caused by lightning, power cross, power induction, and rises in Ground
potential.
UL 497 Construction and Performance Requirements
The “Construction” section covers the following requirements:
• General
• Enclosures
• Protection Against Corrosion
• Field-wiring Connections
• Components
• Spacing
The “Performance” section covers the following requirements:
• General
• Line Fuse Test
• Instrument Fuse Test
• Arrestor Test
• Polymeric Material Test
• Rubber Materials Test
• Corrosion Test, Outdoor Use Protector
• Jarring Test
• Water Spray Test
• Drop Test
• Cover Replacement Test
• Strain Relief Test
• Replacement Arrestors Installation Test
• Appliqué Assemblies Installation Test
• Dielectric Voltage-withstand Test
• Manufacturing and Production Tests
• Marking
UL 497
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Regulatory
Requirements
Performance Tests
Key performance tests which concern overvoltage protectors are detailed in the arrestor
test section. Specific requirements are:
• Breakdown Voltage Measurement — Arrestors are to be tested in the protector blocks or
panels in which they are intended to be employed. Arrestors are required to break down
within ±25% of the manufacturer’s specified breakdown rating. In no case shall the
breakdown voltage exceed 750 V peak when subjected to the strike voltage test shown
in Figure 4.8. At no time during this test will the supply voltage be increased at a rate
greater than 2000 V/µs.
• Impulse Spark-over Voltage Measurement — The arrestor must break down at less than
1000 V peak when subjected to a single impulse potential. Arrestors are to be tested in
each polarity with a rate of voltage rise of 100 V/µs, ±10%.
• Abnormal Operation — Single pair fuseless arrestors must be able to simultaneously
carry 30 A rms at 480 V rms for 15 minutes without becoming a fire hazard. A fire hazard
is determined by mounting the arrestor on a vertical soft wood surface and covering the
unit with cheesecloth. Any charring or burning of the cheesecloth results in test failure.
During this test, although the arrestors may short, they must not have an impulse spark-
overvoltage or DC breakdown voltage greater than 1500 V peak.
• Discharge Test — Protectors must comply with the strike voltage requirements after
being subjected to five successive discharges from a 2 µF capacitor charged to
1000 V dc. (Figure 4.9).
• Repeated Discharge Test — The arrestor must continue to break down at or below its
maximum rated breakdown voltage after being subjected to 500 discharges from a
0.001 µF capacitor charged to a potential of 10,000 V dc. The interval between pulses is
five seconds. Arrestors are to be tested in each polarity, and it is acceptable for the
protector to short circuit following the discharge testing. (Figure 4.9)
Figure 4.8 UL 497 Breakdown Voltage Measurement
Tes t
Specimen
C1
R2
10 Ω
5 W
R1
50,000 Ω
25 W
Variable DC Supply
0-1000 V
V
UL 497
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Figure 4.9 UL 497 Discharge Test
Test
Specimen
Spot
Switch
C1
R2
10 Ω
5 W
R1
5 MΩ
50 W
Variable
DC Supply *
0-12,000 V
*Or Voltage Capability Necessary to
Develop 10,000 V Across Capacitor
V
UL 497A
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Regulatory
Requirements
UL 497A
UL 497A addresses secondary protectors for use in single or multiple pair-type
communication circuits intended to be installed in accordance with Article 800 of the
National Electric Code and to have an operating voltage of less than 150 V rms with respect
to Ground. The purpose of UL 497A is to help reduce the risk of fire, electric shock, or injury
resulting from the deployment and use of these protectors. UL 497A requirements do not
cover telephone equipment or key systems.
UL 497A Construction, Risk of Injury, and Performance Requirements
The “Construction” section covers the following requirements:
• General
• Product Assembly
• Enclosures
• Internal Material
• Accessibility and Electric Shock
• Protection Against Corrosion
• Cords
• Current-carrying Parts
• Internal Wiring
• Interconnecting Cords and Cables
• Insulating Material
• Printed Wiring
• Spacing
The “Risk of Injury” section covers the following requirements:
• Modular Jacks
• Sharp Edges
• Stability
• Protection of Service Personnel
The “Performance” section covers the following requirements:
• General
• Impulse Voltage Measurement
• Overvoltage Test
• Endurance Conditioning
• Component Temperature Test
• Drop Test
• Crush Test
• Leakage Current Test
• Dielectric Voltage-withstand Test
• Rain Test
• Maximum Moment Measurement Test
• Weather-o-meter and Micro Tensile Strength Test
• Thermal Aging and Flame Test
• Electric Shock Current Test
• Manufacturing and Production Line Test
• Marking, Installation, and Instructions
UL 497A
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Performance Tests
The following key performance tests relate to overvoltage protection of the secondary
protectors:
1. Impulse Voltage Measurement Test — Secondary protectors must break down within
±25% of the manufacturer’s breakdown rating when tested in each polarity with a rate of
voltage rise of 100 V/µs, ±10%. Note that the manufacturer may assign separate
breakdown voltage ratings for the Breakdown Voltage Measurement Test. This
requirement only applies to secondary protectors that connect between Tip and Ring of
the telephone loop.
2. Breakdown Voltage Measurement Test — Secondary protectors must break down within
±25% of the manufacturer’s breakdown rating when tested in each polarity with a rate of
voltage rise no greater than 2000 V/s. The secondary protector is to be mounted in
accordance with the manufacturer’s installation instructions and then subjected to the
test circuit shown in Figure 4.10. This requirement applies only to secondary protectors
connected between Tip and Ring or Tip/Ring and Ground of the telephone loop.
3. Overvoltage Test — Secondary protectors must limit current and extinguish or open the
telephone loop without loss of its overvoltage protector, indication of fire risk, or electric
shock. Upon completion of this test, samples must comply with the Dielectric Voltage-
withstand Test.
The overvoltage test is used to determine the effects on secondary protectors and is shown
in Table 4.18. Test connections are shown in Figure 4.11.
Test Compliance
Compliance with the overvoltage test is determined by meeting the following criteria:
• Cheesecloth indicator may not be either charred or ignited
• Wiring simulator (1.6 A Type MDQ fuse or 26 AWG line cord) may not be interrupted
• Protector meets the applicable dielectric voltage withstand requirements after the
completion of the overvoltage tests
Notes:
1. Apply Tests L1, L2, and L5 between Tip and Ground or Ring and Ground.
2. Apply Tests L3 and L4 simultaneously from both Tip and Ring to Ground.
Table 4.18 UL 497A Overvoltage Test
Test
Voltage
(VRMS)
Current
(A) Time Connection
L1 600 40 1.5 s (Note 1, Figure 4.11)
L2 600 7 5 s (Note 1, Figure 4.11)
L3 600 2.2, 1, 0.5, 0.25 30 min at each
current level
(Note 2, Figure 4.11)
L4 200 V rms or just below
the breakdown voltage of the
overvoltage protection device
2.2 A or just below the interrupt
value of the current interrupting
device
30 min (Note 2, Figure 4.11)
L5 240 24 30 min (Note 1, Figure 4.11)
UL 497A
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Figure 4.10 UL 497A Breakdown Voltage Measurement Test
Figure 4.11 UL 497A Overvoltage Test
Tes t
Specimen
C1
R2
10 Ω
5 W
R1
50,000 Ω
25 W
Variable DC Supply
0-1000 V
V
Equipment
Under Test
Secondary Protector
Simulator or
Wiring Station
Circuit for Common Mode (Longitudinal)
Overvoltage Tests
Circuit for Differential Mode (Metallic)
Overvoltage Tests
Timed
Switch
Equipment
Ground
Current
Limiting
Resistors
Variable
AC Voltage
Source
Equipment
Under Test
Telecommunication
Network Connection
Points
Secondary Protector
Simulator or
Wiring Station
Timed
Switch
Current
Limiting
Resistor
Variable
Voltage
Source Equipment
Ground
Equipment
Ground
UL 497B
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UL 497B
UL 497B provides requirements for protectors used in communication and fire alarm
circuits. This standard does not cover devices for primary protection or protection devices
used on telephone lines. SIDACtor devices are components recognized in accordance with
UL 497B under UL file number E133083.
Construction and Performance Requirements
The “Construction” section covers the following requirements:
• General
• Corrosion Protection
• Field-wiring Connections
• Components
• Spacing
• Fuses
The “Performance” section covers the following requirements:
• General
• Strike Voltage Breakdown
• Endurance Conditioning
• Temperature Test
• Dielectric Voltage-withstand Test
• Vibration Conditioning
• Jarring Test
• Discharge Test
• Repeated Discharge Test
• Polymeric Materials Test
• High Temperature Test
• Marking
Performance Requirements Specific to SIDACtor Devices
1. Strike Voltage Breakdown Test — Protectors are required to break down within the
manufacturer’s specified breakdown range or within 10% of a nominal single breakdown
voltage rating. (Figure 4.12)
2. Endurance Conditioning — Protectors are subjected to 50 impulse cycles. Each cycle is
a 1000 V peak, 10 A, 10x1000 µs pulse. Pulses are applied in one polarity at 10-second
intervals and then repeated in the opposite polarity.
3. Variable Ambient Conditioning — Protectors must comply with the strike voltage
requirements after being subjected to an ambient temperature of 0 °C for four hours and
again after being subjected to an ambient temperature of 49 °C for an additional four
hours.
4. Discharge Test — Protectors must comply with strike voltage requirements after being
subjected to five successive discharges from a 2 µF capacitor charged to 1000 V dc.
(Figure 4.13)
5. Repeated Discharge Test — Protectors must not break down at a voltage higher than the
manufacturer’s maximum rated breakdown voltage nor lower than rated stand-off
UL 497B
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Regulatory
Requirements
voltage after being subjected to 500 discharges from a 0.001 µF capacitor charged to
10,000 V dc. The discharges are applied in five-second intervals between one side of the
protector and Ground. Upon completion of the discharge tests, protectors are once again
required to meet the strike voltage requirement. (Figure 4.13)
Note: The epoxy used to construct a SIDACtor device body meets UL 94V-0 requirements
for flammability.
Figure 4.12 UL 497B Strike Voltage Breakdown Test
Figure 4.13 UL 497B Discharge Test
Tes t
Specimen
C1
R2
10 Ω
5 W
R1
50,000 Ω
25 W
Variable DC Supply
0-1000 V
V
Test
Specimen
Spot
Switch
C1
R2
10 Ω
5 W
R1
5 MΩ
50 W
Variable
DC Supply *
0-12,000 V
*Or Voltage Capability Necessary to
Develop 10,000 V Across Capacitor
V
UL 497C
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UL 497C
UL 497C requirements cover protectors for use on coaxial cable circuits. This standard
covers construction and performance requirements.
UL 497C Construction and Performance Requirements
The “Construction” section covers the following requirements:
• General
• Corrosion Protection
• Field-wiring Connections
• Components
• Spacing
• Enclosures
The “Performance” section covers the following requirements:
• General
• I2t Limiting
• Abnormal Sustained Current
• Component Temperature Test
• Breakdown Voltage Measurement
• Impulse Spark-over Voltage Measurement
• Limited Short-circuit Test
• High Current Ground Path Test
• Cable Shield Fuse Test
• Endurance Conditioning Test
• Induced Low Current Test
• Distortion Test
• Flame Test
• Impact Test (Polymeric Enclosures)
• Jarring Test
• Water Spray Test
• Leakage Current Test
• Dielectric Voltage-withstand Test
• Ultraviolet Light and Water Exposure
• Tensile Strength and Elongation Tests
• Air Oven Aging
• Ozone Exposure
Performance Requirements Specific to SIDACtor Devices
1. Strike Voltage Breakdown Test — Protectors are required to break down within ±25% of
the manufacturer’s specified breakdown range but no higher than 750 V at £ 2 kV/s rise
time.
2. Endurance Conditioning — Protectors are subjected to 500 impulse cycles. Each cycle is
a 1000 V peak, 10 A, 10x1000 µs pulse. Pulses are applied in one polarity at 10-second
intervals and then repeated in the opposite polarity. Then, 100 cycles of 1000 V peak,
100 A, 10x1000 µs pulse are applied to three new protectors. Finally, two cycles of
UL 497C
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Requirements
1000 V peak, 5000 A, 8x20 µs pulse are applied to three new protectors, with a rest
period of one minute between surges.
3. Variable Ambient Conditioning — Protectors must comply with the strike voltage
requirements after being subjected to an ambient temperature of 25 °C for four hours
and again after being subjected to an ambient temperature of 90 °C for an additional four
hours.
4. Discharge Test — Protectors must comply with strike voltage requirements after being
subjected to a discharge of 1000 V, 100 ± 10 V/µs, 10 A impulse.
Regulatory Compliant Solutions
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Regulatory Compliant Solutions
When determining the most appropriate solution to meet the lightning and AC power fault
conditions for regulatory requirements, coordination is essential between the SIDACtor
device, fuse, and any series impedance that may be used.
Figure 4.14 through Figure 4.19 show templates in which this coordination is considered for
the most cost effective and reliable solutions available. For exact design criteria and
information regarding the applicable regulatory requirements, refer to the SIDACtor device
and fuse selection criteria in this Section 4, “Regulatory Requirements”, and in Section 5,
“Technical Notes”.
GR 1089 and ITU-T K.20 and K.21
Figure 4.14 and Figure 4.15 show line interface protection circuits to meet GR 1089 surge
immunity requirements without the additional use of series resistance. Use the “C” series
SIDACtor device and F1250T to meet GR 1089 surge immunity requirements. Use the
“A” series SIDACtor device and F0500T to meet ITU-T K.20 and K.21 basic surge immunity
requirements without the additional use of resistance.
The enhanced surge immunity requirements of ITU K.20 and K.21 require the use of “C”
rated SIDACtor devices if no series resistor is used.
.
Figure 4.14 Balanced Line Protection using Teccor’s “AC” or “AA” series
Figure 4.15 Metallic-only Solution using Teccor’s “SC” or “SA” series.
Tip
Ring
To
Protected
Equipment
F1250T
F1250T
Tip
Ring
To
Protected
Equipment
F1250T / F0500T
Regulatory Compliant Solutions
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Regulatory
Requirements
TIA-968 (formerly known as FCC Part 68) and UL 60950
Because equipment that is tested to TIA-968 (formerly known as FCC Part 68)
specifications is also generally tested to UL 60950 specifications, it is easiest to look at a
solution that meets both FCC and UL requirements simultaneously.
TIA-968 Operational Solution and UL 60950
Figure 4.16 and Figure 4.17 show line interface protection circuits that meet UL 60950
power cross requirements and pass TIA-968 Type A and Type B lightning immunity tests
operationally.
Figure 4.16 Balanced Line Protection using Teccor’s “AC” Series
Figure 4.17 Metallic-only Solution using Teccor’s “SB” or “EB” Series
TIA-968 Non-Operational Solution and UL 60950
Although the circuits shown in Figure 4.16 and Figure 4.17 provide an operational solution
for TIA-968, TIA-968 allows telecommunications equipment to pass Type A surges non-
operationally as well. For non-operational TIA-968 solutions, coordinate the IPP rating of the
SIDACtor device and the I2t rating of the fuse so that both will withstand the TIA-968 Type B
surge, but that during the Type A surge the fuse will open.
Tip
Ring
To
Protected
Equipment
F1250T
F1250T
Tip
Ring
To
Protected
Equipment
F1250T
Regulatory Compliant Solutions
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Figure 4.18 and Figure 4.19 are line interface protection circuits that meet UL power cross
requirements and pass TIA-968 lightning immunity surge A tests “non-operationally”.
Figure 4.18 Balanced Line Protection using Teccor’s “AA” Series
Figure 4.19 Metallic-only Solution using Teccor’s “SA” or “EA” Series
Tip
Ring
To
Protected
Equipment
F0500T
F1250T
Tip
Ring
To
Protected
Equipment
F0500T
Surge Waveforms for Various Standards
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Regulatory
Requirements
Surge Waveforms for Various Standards
TIA-968 now replaces FCC Part 68, except for hearing aid compatibility (HAC), volume
control, and indoor cabling. This has become harmonized with Canadian requirements.
Various countries around the world have adopted this regulation.
GR 1089 is a standard generally supported by the US Regional Bell Operating Companies
(RBOC). It is updated by Telcordia Technology (formerly Bellcore). The RBOC typically
requires compliance with GR 1089 for any of their telecom purchases.
ITU is a specialized agency of the UN devoted to international harmonization. Most
European countries recognize the ITU standards.
CNET is the Centre National d’etudes de Telecommunications, a French organization.
VDE is the Verband Deutsher Elektrotechniker, a Federation of German electrical
engineers. VDE is very similar to the IEEE (Institute of Electrical and Electronics Engineers)
but is national in scope rather than global.
ANSI is the American National Standards Institute, which is a non-government organization.
The British equivalent to this is BSI.
IEC is the International Electrotechnical Commission, a result of Europe’s move toward a
single market structure and its drive to formalize and harmonize member countries’
requirements.
FTZ R12 is a German specification.
Table 4.19 and Table 4.20 show the recommended SIDACtor device surge rating for each
standard.
Surge Waveforms for Various Standards
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* At 7.5 A the F1250T will open, which is not allowed for enhanced requirements of ITU K.20 and K.21.
Table 4.19 Surge Waveforms for Various Standards
Standard
Voltage
Voltage
Waveform Current
Current
Waveform
SIDACtor
Device
Volts µs Amps µs w/o series R
TIA-968 (formerly
known
as FCC Part 68)
Surge A Metallic 800 10x560 100 10x560 B or C
Surge A Longitudinal 1500 10x160 200 10x160 C
Surge B Metallic 1000 9x720 25 5x320 A, B, or C
Surge B Longitudinal 1500 9x720 37.5 5x320 A, B, or C
GR 1089 Test 1 600 10x1000 100 10x1000 C
Test 2 1000 10x360 100 10x360 B or C
Test 3 1000 10x1000 100 10x1000 C
Test 4 2500 2x10 500 2x10 C
Test 5 1000 10x360 25 10x360 A, B, or C
ITU K.17 1500 10x700 37.5 5x310 A, B, or C
RLM 88, CNET 1500 0.5x700 38 0.2x310 A, B, or C
CNET 131-24 1000 0.5x700 25 0.8x310 A, B, or C
VDE 0433 2000 10x700 50 5x310 A, B, or C
VDE 0878 2000 1.2x50 50 1x20 A, B, or C
IEC 61000-4-5 2kV 10x700 50 5x310 A, B, or C
4kV 10x700 100 8x20 C
FTZ R12 2000 10x700 50 5x310 A, B, or C
Table 4.20 Surge Waveforms for Various Standards
Standard
Voltage
Voltage
Waveform Current
Current
Waveform
SIDACtor
Device
Volts
Basic/
Enhanced µs
Amps
Basic/
Enhanced
µs
Basic/
Enhanced
w/o series R
Basic/
Enhanced
ITU K.20 Basic single port 1 kV/4 kV 10x700 25/100 5x310 A, B, C/B, C
Enhanced single 1.5 kV/4 kV 10x700 37.5/100 5x310 A, B, C/B, C
Basic multiple ports 1.5 kV/4 kV 10x700 37.5/100 5x310 A, B, C/B, C
Enhanced multiple 1.5 kV/6 kV 10x700 37.5/100 5x310 A, B, C/C
Basic power cross 600 50 Hz, 60 Hz 1 0.2 s F1250T
Enhanced power cross 600/1.5 kV 50 Hz, 60 Hz 1/7.5 0.2 s/2 s F1250T *
ITU K.21 Basic single port 1.5 kV/4 kV 10x700 37.5/100 5x310 A, B, C/B, C
Enhanced single 1.5 kV/6 kV 10x700 37.5/150 5x310 A, B, C/C
Basic multiple ports 1.5 kV/4 kV 10x700 37.5/100 5x310 A, B, C/B, C
Enhanced multiple 1.5 kV/6 kV 10x700 37.5/150 5x310 A, B, C/C
Basic power cross 600 50 Hz, 60Hz 1 0.2 s F1250T
Enhanced power cross 600/1.5 kV 50 Hz, 60Hz 1/7.5 0.2 s/2 s F1250T *
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Technical Notes
5Technical Notes
This section is offered to help answer any questions not previously addressed in this data
book regarding the SIDACtor device and its implementation.
Construction and Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
SIDACtor Device Selection Criteria . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5
Fuse Selection Criteria . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8
Overvoltage Protection Comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
Overcurrent Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14
PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18
SIDACtor Soldering Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-22
TeleLink Fuse Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-25
Telecommunications Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-26
Lightning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-27
Construction and Operation
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Technical Notes
Construction and Operation
SIDACtor devices are thyristor devices used to protect sensitive circuits from electrical
disturbances caused by lightning-induced surges, inductive-coupled spikes, and AC power
cross conditions. The unique structure and characteristics of the thyristor are used to create
an overvoltage protection device with precise and repeatable turn-on characteristics with
low voltage overshoot and high surge current capabilities.
Key Parameters
Key parameters for SIDACtor devices are VDRM, IDRM, VS, IH, and VT
, as shown in Figure 5.1.
VDRM is the repetitive peak off-state voltage rating of the device (also known as stand-off
voltage) and is the continuous peak combination of AC and DC voltage that may be applied
to the SIDACtor device in its off-state condition. IDRM is the maximum value of leakage
current that results from the application of VDRM. Switching voltage (VS) is the maximum
voltage that subsequent components may be subjected to during a fast-rising (100 V/µs)
overvoltage condition. Holding current (IH) is the minimum current required to maintain the
device in the on state. On-state voltage (VT) is the maximum voltage across the device
during full conduction.
Figure 5.1 V-I Characteristics
Operation
The SIDACtor device operates much like a switch. In the off state, the device exhibits
leakage currents (IDRM) less than 5 µA, making it invisible to the circuit it is protecting. As a
transient voltage exceeds the SIDACtor device’s VDRM, the device begins to enter its
protective mode with characteristics similar to an avalanche diode. When supplied with
enough current (IS), the SIDACtor device switches to an on state, shunting the surge from
the circuit it is protecting. While in the on state, the SIDACtor device is able to sink large
I
H
I
T
I
S
I
DRM
V
DRM
V
T
+V
-V
+I
-I
V
S
Construction and Operation
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amounts of current because of the low voltage drop (VT) across the device. Once the
current flowing through the device is either interrupted or falls below a minimum holding
current (IH), the SIDACtor resets, returning to its off state. If the IPP rating is exceeded, the
SIDACtor device typically becomes a permanent short circuit.
Physics
The SIDACtor device is a semiconductor device which is characterized as having four
layers of alternating conductivity: PNPN. (Figure 5.2) The four layers include an emitter
layer, an upper base layer, a mid-region layer, and a lower base layer. The emitter is
sometimes referred to as a cathode region, with the lower base layer being referred to as
an anode region.
As the voltage across the SIDACtor device increases and exceeds the device’s VDRM, the
electric field across the center junction reaches a value sufficient to cause avalanche
multiplication. As avalanche multiplication occurs, the impedance of the device begins to
decrease, and current flow begins to increase until the SIDACtor device’s current gain
exceeds unity. Once unity is exceeded, the SIDACtor device switches from a high
impedance (measured at VS) to a low impedance (measured at VT) until the current flowing
through the device is reduced below its holding current (IH).
Figure 5.2 Geometric Structure of Bidirectional SIDACtor devices
P
N
N
NP
SIDACtor Device Selection Criteria
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Technical Notes
SIDACtor Device Selection Criteria
When selecting a SIDACtor device, the following criteria should be used:
Off-state Voltage (VDRM)
The VDRM of the SIDACtor device must be greater than the maximum operating voltage of
the circuit that the SIDACtor device is protecting.
Example 1:
For a POTS (Plain Old Telephone Service) application, convert the maximum operating
Ring voltage (150 V rms) to a peak voltage, and add the maximum DC bias of the central
office battery:
150 VRMS Ö2 + 56.6 VPK = 268.8 VPK
\ VDRM > 268.8 V
Example 2:
For an ISDN application, add the maximum voltage of the DC power supply to the
maximum voltage of the transmission signal (for U.S. applications, the U-interface will not
have a DC voltage, but European ISDN applications may):
150 VPK + 3 VPK = 153 VPK
\ VDRM > 153 V
Switching Voltage (VS)
The VS of the SIDACtor device should be equal to or less than the instantaneous peak
voltage rating of the component it is protecting.
Example 1:
VS £ VRelay Breakdown
Example 2:
VS £ SLIC VPK
Peak Pulse Current (IPP)
For circuits that do not require additional series resistance, the surge current rating (IPP) of
the SIDACtor device should be greater than or equal to the surge currents associated with
the lightning immunity tests of the applicable regulatory requirement (IPK):
IPP ³ IPK
For circuits that use additional series resistance, the surge current rating (IPP) of the
SIDACtor device should be greater than or equal to the available surge currents associated
with the lightning immunity tests of the applicable regulatory requirement (IPK(available)):
IPP ³ IPK(available)
SIDACtor Device Selection Criteria
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The maximum available surge current is calculated by dividing the peak surge voltage (VPK)
by the total circuit resistance (RTOTAL):
IPK(available) = VPK/RTOTAL
For longitudinal surges (Tip-Ground, Ring-Ground), RTOTAL is calculated for both Tip and
Ring:
RSOURCE = VPK/IPK
RTOTAL = RTIP + RSOURCE
RTOTAL = RRING + RSOURCE
For metallic surges (Tip-Ring):
RSOURCE = VPK/IPK
RTOTAL = RTIP + RRING + RSOURCE
Example 1:
A modem manufacturer must pass the Type A surge requirement of TIA-968 (formerly
known as FCC Part 68) without any series resistance.
IPK = 100 A, 10x560 µs
IPP ³ 100 A, 10x560 µs
Therefore, either a “B” rated or “C” rated SIDACtor device would be selected.
Example 2:
A line card manufacturer must pass the surge requirements of GR 1089 with 30 W on Tip
and 30 W on Ring.
IPK = 100 A, 10x1000 µs
VPK = 1000 V
RSOURCE = VPK/IPK = 10 W
RTOTAL = RSOURCE + RTIP = 40 W
IPK (available) = VPK/RTOTAL = 1000 V/40 W
\ IPP ³ 25 A
Holding Current (IH)
Because TIA-968 4.4.1.7.3 specifies that registered terminal equipment not exceed
140 mA dc per conductor under short-circuit conditions, the holding current of the SIDACtor
device is set at 150 mA.
For specific design criteria, the holding current (IH) of the SIDACtor device must be greater
than the DC current that can be supplied during an operational and short circuit condition.
SIDACtor Device Selection Criteria
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Technical Notes
Off-State Capacitance (CO)
Assuming that the critical point of insertion loss is 70% of the original signal value, the
SIDACtor device can be used in most applications with transmission speeds up to 30 MHz.
For transmission speeds greater than 30 MHz, the new MC series is highly recommended.
Fuse Selection Criteria
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Fuse Selection Criteria
A fuse can be relied upon to operate safely at its rated current, at or below its rated voltage.
This voltage rating is covered by the National Electric Code (NEC) regulations and is a
requirement of UL as protection against fire risk. The standard voltage ratings used by fuse
manufacturers for most small dimension fuses are 32 V, 63 V, 125 V, 250 V, and 600 V.
Fuses are not sensitive to changes in voltage; however, they are sensitive to changes in
current. The fuse will maintain “steady-state” operation from zero volts to the maximum
voltage rating. It is not until the fuse element melts and internal arcing occurs, that circuit
voltage and available power become an issue. The interrupt rating of the fuse addresses
this issue. Specifically, the voltage rating determines the ability of the fuse to suppress
internal arcing that occurs after the fuse link melts.
For telecommunication applications, a voltage rating of 250 V is chosen because of the
possibility of power line crosses. A three-phase voltage line will have voltage values up to
220 V. It is desirable for the voltage rating of the fuse to exceed this possible power cross
event.
UL 60950 has a power cross test condition that requires a fuse to have an interrupt rating of
40 A at 600 V. GR 1089 contains a power cross test condition that requires a fuse to have
an interrupt rating of 60 A at 600 V. A 125 V-rated part will not meet this requirement.
A 250 V part with special design consideration, such as Teccor’s F1250T TeleLink
fuse, does meet this requirement.
Because fuses are rated in terms of continuous voltage and current-carrying capacity, it is
often difficult to translate this information in terms of peak pulse current ratings. To simplify
this process, Table 5.1 shows the surge rating correlation to fuse rating.
Notes:
• The IPP ratings apply to a 2AG (glass body) slow blow fuse only.
• Because there is a high degree of variance in the fusing characteristics, the IPP ratings listed should only be used as approximations.
Table 5.1 Surge Rating Correlation to Fuse Rating
Fuse Rating
(mA)
Equivalent IPP Rating
10x160 µs
(A)
10x560 µs
(A)
10x1000 µs
(A)
250301510
350452520
400503025
500653530
600754535
750906550
1000 130 85 65
1250 160 115 100
Fuse Selection Criteria
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Technical Notes
Peak Pulse Current (IPP)
For circuits that do not require additional series resistance, the surge current rating (IPP) of
the fuse should be greater than or equal to the surge currents associated with the lightning
immunity tests of the applicable regulatory requirement (IPK):
IPP ³ IPK
For circuits that use additional series resistance, the surge current rating (IPP) of the fuse
should be greater than or equal to the available surge currents associated with the lightning
immunity tests of the applicable regulatory requirement (IPK(available)):
IPP ³ IPK(available)
The maximum available surge current is calculated by dividing the peak surge voltage (VPK)
by the total circuit resistance (RTOTAL):
IPK(available) = VPK/RTOTAL
For longitudinal surges (Tip-Ground, Ring-Ground), RTOTAL is calculated for both Tip and
Ring:
RSOURCE = VPK/IPK
RTOTAL = RTIP + RSOURCE
RTOTAL = RRING + RSOURCE
For metallic surges (Tip-Ring):
RSOURCE = VPK/IPK
RTOTAL = RTIP + RRING + RSOURCE
Overvoltage Protection Comparison
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Overvoltage Protection Comparison
The four most commonly used technologies for overvoltage protection are:
• SIDACtor devices
• Gas Discharge Tubes (GDTs)
• Metal Oxide Varistors (MOVs)
• TVS diodes
All four technologies are connected in parallel with the circuit being protected, and all exhibit
a high off-state impedance when biased with a voltage less than their respective blocking
voltages.
SIDACtor devices
A SIDACtor device is a PNPN device that can be thought of as a TVS diode with a gate.
Upon exceeding its peak off-state voltage (VDRM), a SIDACtor device will clamp a transient
voltage to within the device’s switching voltage (VS) rating. Then, once the current flowing
through the SIDACtor device exceeds its switching current, the device will crowbar and
simulate a short-circuit condition. When the current flowing through the SIDACtor device is
less than the device’s holding current (IH), the SIDACtor device will reset and return to its
high off-state impedance.
Advantages
Advantages of the SIDACtor device include its fast response time (Figure 5.3), stable
electrical characteristics, long term reliability, and low capacitance. Also, because the
SIDACtor device is a crowbar device, it cannot be damaged by voltage and it has extremely
high surge current ratings.
Restrictions
Because the SIDACtor device is a crowbar device, it cannot be used directly across the
AC line; it must be placed behind a load. Failing to do so will result in exceeding the
SIDACtor device’s surge current rating, which may cause the device to enter a permanent
short-circuit condition.
Applications
Although found in other applications, SIDACtor devices are primarily used as the principle
overvoltage protector in telecommunications and data communications circuits. For
applications outside this realm, follow the design criteria in "SIDACtor Device Selection
Criteria" on page 5-5.
Gas Discharge Tubes
Gas tubes are either glass or ceramic packages filled with an inert gas and capped on each
end with an electrode. When a transient voltage exceeds the DC breakdown rating of the
device, the voltage differential causes the electrodes of the gas tube to fire, resulting in an
arc, which in turn ionizes the gas within the tube and provides a low impedance path for the
Overvoltage Protection Comparison
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Technical Notes
transient to follow. Once the transient drops below the DC holdover voltage and current, the
gas tube returns to its off state.
Advantages
Gas tubes have high surge current and low capacitance ratings. Current ratings can be as
high as 500 A for 200 impulses, and capacitance ratings can be as low as 1 pF with a zero-
volt bias.
Restrictions
Gas tubes have a limited shelf life and their performance degrades with usage. Out of the
four devices discussed, gas tubes exhibit the slowest response time and highest peak
voltage measurement. (Figure 5.3)
Applications
Because gas tubes are large and require a substantial amount of time to reach full
conduction, they are rarely used as board-level components. Consequently, gas tubes are
not normally used in telecommunications applications other than station protection
modules.
Metal Oxide Varistors
Metal Oxide Varistors (MOVs) are two-leaded, through-hole components typically shaped in
the form of discs. Manufactured from sintered oxides and schematically equivalent to two
back-to-back PN junctions, MOVs shunt transients by decreasing their resistance as
voltage is applied.
Advantages
Since MOVs surge capabilities are determined by their physical dimensions, high surge
current ratings are available. Also, because MOVs are clamping devices, they can be used
as transient protectors in secondary AC power line applications.
Restrictions
Like gas tubes, MOVs have slow response times resulting in peak clamping voltages which
can be greater than twice the device’s voltage rating. (Figure 5.3) MOVs also have long-
term reliability and performance issues due to their tendency to fatigue, high capacitance,
and limited packaging options.
Applications
Although MOVs are restricted from use in many telecom applications (other than disposable
equipment), they are useful in AC applications where a clamping device is required and
tight voltage tolerances are not.
Overvoltage Protection Comparison
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TVS Diodes
Transient Voltage Suppressor (TVS) diodes are clamping voltage suppressors that are
constructed with back-to-back PN junctions. During conduction, TVS diodes create a low
impedance path by varying their resistance as voltage is applied across their terminals.
Once the voltage is removed, the diode will turn off and return to its high off-state
impedance.
Advantages
Because TVS diodes are solid state devices, they do not fatigue nor do their electrical
parameters change as long as they are operated within their specified limits. TVS diodes
effectively clamp fast-rising transients and are well suited for low-voltage applications that
do not require large amounts of energy to be shunted.
Restrictions
Because TVS diodes are clamping devices, they have two inherent weaknesses. First, TVS
diodes are both voltage- and current-limited, so careful consideration should be given to
using these in applications that require large amounts of energy to be shunted. Secondly,
as the amount of current flowing through the device increases, so does its maximum
clamping voltage.
Applications
Due to their low power ratings, TVS diodes are not used as primary interface protectors
across Tip and Ring; they are used as secondary protectors that are embedded within a
circuit.
Overvoltage Protection Comparison
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Technical Notes
dv/dt Chart
Figure 5.3 shows a peak voltage comparison between SIDACtor devices, gas discharge
tubes, MOVs, and TVS diodes, all with a nominal stand-off voltage rating of 230 V. The
X axis represents the dv/dt (rise in voltage with respect to time) applied to each protector,
and the Y axis represents the maximum voltage drop across each protector.
Figure 5.3 Overshoot Levels versus dv/dt
200
300
400
500
600
700
800
1000
900
230 V Devices
Gas Tube
0.001 0.01 0.1 1 10 100 1000
Avalanche Diode
MOV
SIDACtor
dv/dt – Volts/µs
Breakover Voltage – Volts
Overcurrent Protection
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Overcurrent Protection
In addition to protecting against overvoltage conditions, equipment should also be protected
from overcurrent conditions using either PTCs, fuses, power/line feed resistors, or
flameproof resistors. In all instances the overcurrent protector is a series element placed in
front of the overvoltage protector on either Tip or Ring for metallic (closed loop)
applications and on both Tip and Ring for longitudinal (grounded) applications.
PTCs
PTCs are positive temperature coefficient thermistors used to limit current. During a fault
condition, heat is generated at a rate equal to I2R. When this heat becomes sufficient, the
PTC increases its resistance asymptotically until the device simulates an open circuit,
limiting the current flow to the rest of the circuit. As the fault condition drops below the
PTC’s holding current, the device begins to reset, approximating its original off-state value
of impedance.
Advantages
Because PTCs are resettable devices, they work well in a variety of industrial applications
where electrical components cannot withstand multiple, low-current faults.
Restrictions
Although PTCs are well suited for the industrial environment and in many telecom
applications, they exhibit some limitations that have prevented them from being endorsed
by the entire telecommunications industry. Limitations include low surge current ratings,
unstable resistance, and poor packaging options.
Applications
PTCs are used in a variety of applications. In addition to protecting telecommunications
equipment, PTCs are also used to prevent damage to rechargeable battery packs, to
interrupt the current flow during a motor lock condition, and to limit the sneak currents that
may cause damage to a five-pin module.
Fuses
Due to their stability, fuses are one of the most popular solutions for meeting AC power
cross requirements for telecommunications equipment. Similar to PTCs, fuses function by
reacting to the heat generated due to excessive current flow. Once the fuses I2t rating is
exceeded, the center conductor opens.
Advantages
Fuses are available in both surface mount and through-hole packages and are able to
withstand the applicable regulatory requirements without the use of any additional series
impedance. Chosen correctly, fuses only interrupt a circuit when extreme fault conditions
exist and, when coordinated properly with an overvoltage protector, offer a very competitive
and effective solution for transient immunity needs.
Overcurrent Protection
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Technical Notes
Advantages include:
• Elimination of series line resistance enabling longer loop lengths
• Precise longitudinal balance allowing better transmission quality
• Robust surge performance which eliminates costly down time due to nuisance blows
• Greater surge ratings than resettable devices, ensuring regulatory compliance
• Non-degenerative performance
• Available in surface mount packaging which uses less Printed Circuit Board (PCB) real
estate, eliminates mixed technologies, and reduces manufacturing costs
Weaknesses
Because a fuse does not reset, consideration should be given to its use in applications
where multiple fault occurrences are likely. For example, AC strip protectors and ground
fault interrupting circuits (GFIC) are applications in which an alternative solution might be
more prudent.
Applications
Telecommunications equipment best suited for a fuse is equipment that requires surface
mount technology, accurate longitudinal balance, and regulatory compliance without the
use of additional series line impedance.
Selection Criteria
For circuits that do not require additional series resistance, the surge current rating (IPP) of
the TeleLink SM fuse should be greater than or equal to the surge currents associated with
the lightning immunity tests of the applicable regulatory requirement (IPK).
IPP ³ IPK
For circuits that use additional series resistance, the surge current rating (IPP) of the
TeleLink SM fuse should be greater than or equal to the available surge currents associated
with the lightning immunity tests of the applicable regulatory requirement (IPK (available)).
IPP ³ IPK (available)
The maximum available surge current is calculated by dividing the peak surge voltage (VPK)
by the total circuit resistance (RTOTAL).
IPP ³ IPK (available) = VPK/RTOTAL
For longitudinal surges (Tip-Ground, Ring-Ground), RTOTAL is calculated for both Tip and
Ring.
RTOTAL = RTIP + RSOURCE
RTOTAL = RRING + RSOURCE
For metallic surges (Tip-Ring):
RTOTAL = RTIP + RRING + RSOURCE
Overcurrent Protection
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To select the most appropriate combination of TeleLink SM fuse and SIDACtor device,
decide the regulatory requirement your equipment must meet:
For applications that do not require agency approval or multiple listings, contact the factory.
Power/Line Feed Resistors
Typically manufactured with a ceramic case or substrate, power and line feed resistors
have the ability to sink a great deal of energy and are capable of withstanding both lightning
and power cross conditions.
Advantages
Power and line feed resistors are available with very tight resistive tolerances, making them
appropriate for applications that require precise longitudinal balance.
Restrictions
Because power and line feed resistors are typically very large and are not available in a
surface mount configuration, these devices are less than desirable from a manufacturing
point of view. Also, because a thermal link is typically not provided, power and line feed
resistors may require either a fuse or a PTC to act as the fusing element during a power
cross condition.
Applications
Power and line feed resistors are typically found on line cards that use overvoltage
protectors that cannot withstand the surge currents associated with applicable regulatory
requirements.
Flameproof Resistors
For cost-sensitive designs, small (1/8 W - 1/4 W), flameproof metal film resistors are often
used in lieu of PTCs, fuses, and power or line feed resistors. During a transient condition,
flameproof resistors open when the resultant energy is great enough to melt the metal used
in the device.
Advantages
Flameproof resistors are inexpensive and plentiful.
Regulatory Requirement TeleLink SM Fuse SIDACtor Device
GR 1089 F1250T C Series
TIA-968, Type A F1250T B Series
TIA-968, Type B F0500T A Series
ITU K.20 F1250T A Series
ITU K.21 Basic/Enhanced F1250T A Series
UL 60950 All All
Overcurrent Protection
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Technical Notes
Restrictions
Flameproof resistors are not resistive to transient conditions and are susceptible to
nuisance blows.
Applications
Outside of very inexpensive customer premise equipment, small resistors are rarely used
as a means to protect telecommunications equipment during power fault conditions.
PCB Layout
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PCB Layout
Because the interface portion of a Printed Circuit Board (PCB) is subjected to high voltages
and surge currents, consideration should be given to the trace widths, trace separation, and
grounding.
Trace Widths
Based on the Institute for Interconnecting and Packaging Electronic Currents, IPC D 275
specifies the trace widths required for various current-carrying capacities. This is very
important for grounding conditions to ensure the integrity of the trace during a surge event.
The required width is dependent on the amount of copper used for the trace and the
acceptable temperature rise which can be tolerated. Teccor recommends a 0.025 inch trace
width with 1 ounce copper. (For example, a 38-AWG wire is approximately equal to 8 mils to
10 mils. Therefore, the minimum trace width should be greater than 10 mils.)
Figure 5.4 Current versus Area
The minimum width and thickness of conductors on a PCB is determined primarily by the
current-carrying capacity required. This current-carrying capacity is limited by the allowable
temperature rise of the etched copper conductor. An adjacent ground or power layer can
significantly reduce this temperature rise. A single ground plane can generally raise the
allowed current by 50%. An easy approximation can be generated by starting with the
information in Figure 5.4 to calculate the conductor cross-sectional area required. Once this
0
.125
.25
.50
1
2
3
4
5
8
12
0110 20 100 150 300 400 500 600 700
Conductor Cross-Section Area (sq mils)
530 50 70 200 250
6
10
15
20
25
30
Current in Amperes
.75
1.5
7
10 ˚C
20 ˚C
30 ˚C
35
45 ˚C
60 ˚C
75 ˚C Allowable
Temperature
Rise
PCB Layout
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SIDACtor® Data Book and Design Guide +1 972-580-7777
Technical Notes
has been done, Figure 5.5 shows the conversion of the cross-sectional area to the required
conductor width, dependent on the copper foil thickness of the trace.
Figure 5.5 Conductor Width versus Area
Trace Separation
Tip and Ring traces are subjected to various transient and overvoltage conditions. To
prevent arcing between traces, minimum trace separation should be maintained. UL 60950
will provide additional information regarding creepage and clearance requirements, which
are dependent on the Comparative Tracking Index (CTI) rating of the PCB, working voltage,
and the expected operating environment. See "UL 60950 3rd Edition (formerly UL 1950, 3rd
edition)" on page 4-16 of this data book.
A good rule of thumb for outside layers is to maintain a minimum of 18 mils for 1kV isolation.
Route the Tip and Ring traces towards the edge of the PCB away from areas containing
static sensitive devices.
Grounding
Although often overlooked, grounding is a very important design consideration when laying
out a protection interface circuit. To optimize its effectiveness, several things should be
considered in sequence:
1. Provide a large copper plane with a grid pattern for the Ground reference point.
2. Decide if a single-point or a multi-point grounding scheme is to be used. A single-point
(also called centralized) grounding scheme is used for circuit dimensions smaller than
one-tenth of a wavelength (l = 300,000/frequency) and a multi-point (distributed)
grounding scheme is used for circuit trace lengths greater than one-fourth of a
wavelength.
.350
.300
.250
.030
.010
.005
.001
0 1 10 20 100 150 300 400 500 600 700
Conductor Cross-Section Area (sq mils)
5 30 50 70 200 250
Conductor width in inches
.050
.020
0
.070
.100
.150
.200
(1 oz/ft2) 0.0014"
(1/2 oz/ft2) 0.0007"
(2 oz/ft2) 0.0028"
(3 oz/ft2) 0.0042"
PCB Layout
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3. Because traces exhibit a certain level of inductance, keep the length of the ground trace
on the PCB as short as possible in order to minimize its voltage contribution during a
transient condition. In order to determine the actual voltage contributed to trace
inductance, use the following equations:
V = L (di/dt)
L = 0.0051 r [loge 2r/(t+w) +½ - logeG] in µH
where r = length of trace
G = function of thickness and width as provided in Table 5.3
t = trace thickness
w = trace width
For example, assume circuit A is protected by a P3100SC with a VS equal to 300 V and a
ground trace one inch in length and a self-inductance equal to 2.4 µH/inch. Assume
circuit B has the identical characteristics as Circuit A, except the ground trace is five inches
in length instead of one inch in length. If both circuits are surged with a 100 A, 10x1000 µs
wave-form, the results would be as shown in Table 5.2:
Other practices to ensure sound grounding techniques are:
1. Cross signal grounds and earth grounds perpendicularly in order to minimize the field
effects of “noisy” power supplies.
2. Make sure that the ground fingers on any edge connector extend farther out than any
power or signal leads in order to guarantee that the ground connection invariably is
connected first.
Table 5.2 Overshoot Caused by Trace Inductance
VL = L (di/dt) SIDACtor device VS
Total protection level
(VL + VS)
Circuit A VL = 2.4 µH (100 A/10 µs) = 24 V 300 V 324 V
Circuit B VL = 12 µH (100 A/10 µs) = 120 V 300 V 420 V
PCB Layout
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Technical Notes
Note: Sides of the rectangle are t and w. The geometric mean distance R is given by:
logeR = loge(t+w) - 1.5 + logeG. R = K(t+w), logeK = -1.5 + logeG.
Table 5.3 Values of Constants for the Geometric Mean Distance of a Rectangle
t/w or w/t KLogeG
0.000 0.22313 0.0
0.025 0.22333 0.00089
0.050 0.22346 0.00146
0.100 0.22360 0.00210
0.150 0.22366 0.00239
0.200 0.22369 0.00249
0.250 0.22369 0.00249
0.300 0.22368 0.00244
0.350 0.22366 0.00236
0.400 0.22364 0.00228
0.450 0.22362 0.00219
0.500 0.22360 0.00211
0.500 0.22360 0.00211
0.550 0.22358 0.00203
0.600 0.22357 0.00197
0.650 0.22356 0.00192
0.700 0.22355 0.00187
0.750 0.22354 0.00184
0.800 0.22353 0.00181
0.850 0.22353 0.00179
0.900 0.22353 0.00178
0.950 0.223525 0.00177
1.000 0.223525 0.00177
0.000 0.0 0.0
SIDACtor Soldering Recommendations
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SIDACtor Soldering Recommendations
When placing surface mount components, a good solder bond is critical because:
• The solder provides a thermal path in which heat is dissipated from the packaged silicon
to the rest of the board.
• A good bond is less subject to thermal fatiguing and results in improved component
reliability.
Reflow Soldering
The preferred technique for mounting the DO-214AA package is to reflow-solder the device
onto a PCB-printed circuit board, as shown in Figure 5.6.
Figure 5.6 Reflow Soldering Procedure
For reliable connections, the PCB should first be screen printed with a solder paste or
fluxed with an easily removable, reliable solution, such as Alpha 5003 diluted with benzyl
alcohol. If using a flux, the PCB should be allowed to dry to touch at room temperature (or in
a 70 °C oven) prior to placing the components on the solder pads.
Relying on the adhesive nature of the solder paste or flux to prevent the devices from
moving prior to reflow, components should be placed with either a vacuum pencil or
automated pick and place machine.
With the components in place, the PCB should be heated to a point where the solder on the
pads begins to flow. This is typically done on a conveyor belt which first transports the PCB
through a pre-heating zone. The pre-heating zone is necessary in order to reduce thermal
shock and prevent damage to the devices being soldered, and should be limited to a
maximum temperature of 165 °C for 10 seconds.
After pre-heating, the PCB goes to a vapor zone, as shown in Figure 5.7. The vapor zone is
obtained by heating an inactive fluid to its boiling point while using a vapor lock to regulate
the chamber temperature. This temperature is typically 215 °C, but for temperatures in
excess of 215 °C, care should be taken so that the maximum temperature of the leads does
1. Screen print solder paste
(or flux)
2. Place component
(allow flux to dry)
3. Reflow solder
SIDACtor Soldering Recommendations
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Technical Notes
not exceed 275 °C and the maximum temperature of the plastic body does not exceed
250 °C. (Figure 5.8)
Figure 5.7 Principle of Vapor Phase Soldering
Figure 5.8 Reflow Soldering Profile
During reflow, the surface tension of the liquid solder draws the leads of the device towards
the center of the soldering area, correcting any misalignment that may have occurred
during placement and allowing the device to set flush on the pad. If the footprints of the pad
are not concentrically aligned, the same effect can result in undesirable shifts as well.
Therefore, it is important to use a standard contact pattern which leaves sufficient room for
self-positioning.
After the solder cools, connections should be visually inspected and remnants of the flux
removed using a vapor degreaser with an azeotrope solvent or equivalent.
Transport
Cooling pipes
PC board
Heating
elements
Boiling liquid (primary medium)
Vapor phase
zone
Vapor lock
(secondary
medium)
Time (Seconds)
0
0
20
40
60
80
100
120
140
160
180
200
220
240
30 60 90 120 150 180 210 240 270 300
Temperature – ˚C
Pre-heat Soak Reflow Cool
Down
0.5 - 0.6 ˚C/s
1.3 - 1.6 ˚C/s
<2.5 ˚C/s
<2.5 ˚C/s
Peak Temperature
220 ˚C - 245 ˚C
Soaking Zone Reflow Zone
Pre-heating Zone
( 2 min. MAX )
60 - 90 s typical
( 2-4 min MAX )
( 2 min. MAX )
30 - 60 s typical
260
SIDACtor Soldering Recommendations
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Wave Soldering
Another common method for soldering components to a PCB is wave soldering. After
fluxing the PCB, an adhesive is applied to the respective footprints so that components can
be glued in place. Once the adhesive has cured, the board is pre-heated and then placed in
contact with a molten wave of solder which has a temperature between 240 °C and 260 °C
and permanently affixes the component to the PCB. (Figure 5.8 and Figure 5.10)
Although a popular method of soldering, wave soldering does have drawbacks:
• A double pass is often required to remove excess solder.
• Solder bridging and shadows begin to occur as board density increases.
• Wave soldering uses the sharpest thermal gradient.
Figure 5.9 Wave Soldering Surface Mount Components Only
Figure 5.10 Wave Soldering Surface Mount and Leaded Components
Apply glue
Screen print glue
Place component Cure glue
Wave solder
PC board
Insert
leaded
components
Turn over the
PC board
Apply
glue
Place
SMDs
Cure
glue
Turn over the
PC board
Wave solder
TeleLink Fuse Soldering
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Technical Notes
TeleLink Fuse Soldering
For wave soldering a TeleLink fuse, the following temperature and time are recommended:
• Reservoir temperature of 260 °C (500 °F)
• Time in reservoir — three seconds maximum
For infrared, the following temperature and time are recommended:
• Temperature of 240 °C (464 °F)
• Time — 30 seconds maximum
Hand soldering is not recommended for this fuse because excessive heat can affect the
fuse performance. Hand soldering should be used only for rework and low volume samples.
Note the following recommendations for hand soldering:
• Maximum tip temperature of 240 °C (464 °F)
• Minimize the soldering time at temperature to achieve the solder joint. Measure the fuse
resistance before and after soldering. Any fuse that shifts more than ±3% should be
replaced. An increase in resistance above this amount increases the possibility of a
surge failure, and a decrease in resistance may cause low overloads to exceed the
maximum opening times.
• Inspect the solder joint to ensure an adequate solder fillet has been produced without
any cracks or visible defects.
Telecommunications Protection
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Telecommunications Protection
Because early telecommunications equipment was constructed with components such as
mechanical relays, coils, and vacuum tubes, it was somewhat immune to lightning and
power cross conditions. But as cross bar and step-by-step switches have given way to more
modern equipment such as digital loop carriers, repeater amplifiers, and multiplexers, an
emphasis has been put on protecting this equipment against system transients caused by
lightning and power cross conditions.
Lightning
During an electrical storm, transient voltages are induced onto the telecommunications
system by lightning currents which enter the conductive shield of suspended cable or
through buried cables via ground currents.
As this occurs, the current traveling through the conductive shield of the cable produces an
equal voltage on both the Tip and Ring conductors at the terminating ends. Known as a
longitudinal voltage surge, the peak value and wave-form associated with this condition is
dependent upon the distance the transient travels down the cable and the materials with
which the cable is constructed.
Although lightning-induced surges are always longitudinal in nature, imbalances resulting
from terminating equipment and asymmetric operation of primary protectors can result in
metallic transients as well. A Tip-to-Ring surge is normally seen in terminating equipment
and is the primary reason most regulatory agencies require telecom equipment to have
both longitudinal and metallic surge protection.
Power Cross
Another system transient that is a common occurrence for telecommunications cables is
exposure to the AC power system. The common use of poles, trenches, and ground wires
results in varying levels of exposure which can be categorized as direct power cross, power
induction, and ground potential rise.
Direct power cross occurs when a power line makes direct contact to telecommunications
cables. Direct contact is commonly caused by falling trees, winter icing, severe
thunderstorms, and vehicle accidents. Direct power cross can result in large currents being
present on the line.
Power induction is common where power cables and telecommunications cables are run in
close proximity to one another. Electromagnetic coupling between the cables results in
system transients being induced onto the telecommunications cables, which in turn can
cause excessive heating and fires in terminal equipment located at the cable ends.
Ground potential rise is a result of large fault currents flowing to Ground. Due to the varying
soil resistivity and multiple grounding points, system potential differences may result.
Lightning
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Technical Notes
Lightning
Lightning is one of nature’s most common and dangerous phenomena. At any one time,
approximately 2,000 thunderstorms are in progress around the globe, with lightning striking
the earth over 100 times per second. According to IEEE C.62, during a single year in the
United States lightning strikes an average of 52 times per square mile, resulting in 100
deaths, 250 injuries, and over 100 million dollars in damage to equipment property.
The Lightning Phenomenon
Lightning is caused by the complex interaction of rain, ice, up drafts, and down drafts that
occur during a typical thunderstorm. The movement of rain droplets and ice within the cloud
results in a large build up of electrical charges at the top and bottom of the thunder cloud.
Normally, positive charges are concentrated at the top of the thunderhead while negative
charges accumulate near the bottom. Lightning itself does not occur until the potential
difference between two charges is great enough to overcome the insulating resistance of air
between them.
Formation of Lightning
Cloud-to-ground lightning begins forming as the level of negative charge contained in the
lower cloud levels begins to increase and attract the positive charge located at Ground.
When the formation of negative charge reaches its peak level, a surge of electrons called a
stepped leader begins to head towards the earth. Moving in 50-meter increments, the
stepped leader initiates the electrical path (channel) for the lightning strike. As the stepped
leader moves closer to the ground, the mutual attraction between positive and negative
charges results in a positive stream of electrons being pulled up from the ground to the
stepped leader. The positively charged stream is known as a streamer. When the streamer
and stepped leader make contact, it completes the electrical circuit between the cloud and
ground. At that instant, an explosive flow of electrons travels to ground at half the speed of
light and completes the formation of the lightning bolt.
Lightning Bolt
The initial flash of a lightning bolt results when the stepped leader and the streamer make
connection resulting in the conduction of current to Ground. Subsequent strokes (3-4) occur
as large amounts of negative charge move farther up the stepped leader. Known as return
strokes, these subsequent bolts heat the air to temperatures in excess of 50,000 °F and
cause the flickering flash that is associated with lightning. The total duration of most
lightning bolts lasts between 500 ms and one second.
During a lightning strike, the associated voltages range from 20,000 V to 1,000,000 V while
currents average around 35,000 A. However, maximum currents associated with lightning
have been measured as high as 300,000 A.
NOTES
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Mechanical Data
6Mechanical Data
The following section describes the mechanical specifications of SIDACtor products.
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
DO-214AA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
Modified DO-214AA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
TO-92 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5
MS-013 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6
Modified TO-220 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7
TO-218 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8
TeleLink Surface Mount Fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-9
Single In-line Protector (SIP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-10
Summary of Packing Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-12
Packing Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14
DO-214AA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14
TO-92 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-15
Modified MS-013 Six-pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16
Modified TO-220 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17
TeleLink Surface Mount Fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18
Lead Form Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20
Modified TO-220 Type 60 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20
Modified TO-220 Type 61 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-21
Modified TO-220 Type 62 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-21
Package Dimensions
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Mechanical Data
Package Dimensions
DO-214AA
The DO-214AA package is designed to meet mechanical standards as set forth in JEDEC
publication number 95.
Note: A stripe is marked on some parts, to indicate the cathode. IPC-SM-782 recommends 2.4 instead of 2.0.
Notes:
• Dimensions and tolerances per ASME Y14.5M-1994
• Mold flash shall not exceed 0.13 mm per side.
• Dimensions B and C apply to plated leads.
• All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one
minute from leads to case over the operating temperature range)
• Dimension “C” is measured on the flat section of the lead.
Dimension
Inches Millimeters
MIN MAX MIN MAX
A 0.140 0.155 3.56 3.94
B 0.205 0.220 5.21 5.59
C 0.077 0.083 1.96 2.11
D 0.166 0.180 4.22 4.57
E 0.036 0.056 0.91 1.42
F 0.073 0.083 1.85 2.11
G 0.004 0.008 0.10 0.20
H 0.077 0.086 1.95 2.18
J 0.043 0.053 1.09 1.35
K 0.008 0.012 0.20 0.30
L 0.039 0.049 0.99 1.24
.079
(2.0)
.110
(2.8)
.079
(2.0)
PAD OUTLINE
(MM)
H
K
JE
F
L
G
A
C
B
D
CASE
TEMPERATURE
MEASUREMENT
POINT
Package Dimensions
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Modified DO-214AA
The Modified DO-214AA package is a three-leaded surface mount (SM) package.
Note: A stripe is marked on some parts, to indicate the cathode. IPC-SM-782 recommends 2.4 instead of 2.0.
Notes:
• Dimensions and tolerancing per ASME Y14.5M-1994
• Mold flash shall not exceed 0.13 mm per side.
• Dimensions B and C apply to plated leads.
• All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one
minute from leads to case over the operating temperature range)
Dimension
Inches Millimeters
MIN MAX MIN MAX
A 0.140 0.155 3.56 3.94
B 0.205 0.220 5.21 5.59
C 0.077 0.083 1.96 2.11
D 0.166 0.180 4.22 4.57
E 0.036 0.056 0.91 1.42
F 0.073 0.083 1.85 2.11
G 0.004 0.008 0.10 0.20
H 0.077 0.086 1.95 2.18
J 0.043 0.053 1.09 1.35
K 0.008 0.012 0.20 0.30
L 0.039 0.049 0.99 1.24
M 0.022 0.028 0.56 0.71
N 0.027 0.033 0.69 0.84
P 0.052 0.058 1.32 1.47
.079
(2.0)
.040
(1.0)
.030
(.76)
.079
(2.0)
.079
(2.0)
.110
(2.8)
PAD OUTLINE
(MM)
H
K
JE
FL
G
AC
B
M
D
TEMPERATURE
MEASUREMENT
POINT
NP
PIN 3
PIN 1
PIN 2
Package Dimensions
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SIDACtor® Data Book and Design Guide +1 972-580-7777
Mechanical Data
TO-92
The TO-92 is designed to meet mechanical standards as set forth in JEDEC publication
number 95.
Notes:
• Type 70 lead form as shown is standard for the E package.
• All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one
minute from leads to case over the operating temperature range)
• Mold flash shall not exceed 0.13 mm per side.
Dimension
Inches Millimeters
MIN MAX MIN MAX
A 0.176 0.196 4.47 4.98
B 0.500 12.70
D 0.095 0.105 2.41 2.67
E 0.150 3.81
F 0.046 0.054 1.16 1.37
G 0.135 0.145 3.43 3.68
H 0.088 0.096 2.23 2.44
J 0.176 0.186 4.47 4.73
K 0.088 0.096 2.23 2.44
L 0.013 0.019 0.33 0.48
M 0.013 0.017 0.33 0.43
N 0.060 1.52
A
B
TEMPERATURE
MEASUREMENT POINT
MT2/PIN 3
MT1/PIN 1
E
HG
F
D
K
J
L
M
N
Package Dimensions
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+1 972-580-7777 SIDACtor® Data Book and Design Guide
MS-013
The MS-013 is designed to meet mechanical standards as set forth in JEDEC publication
number 95.
Notes:
• Dimensions and tolerances per ASME Y14.5M-1982
• Mold flash shall not exceed 0.13 mm per side.
• All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one
minute from leads to case over the operating temperature range)
Dimension
Inches Millimeters
MIN MAX MIN MAX
A 0.360 0.364 9.14 9.25
B 0.348 0.352 8.84 8.94
C 0.352 0.356 8.94 9.04
D 0.138 0.138 3.51 3.51
E 0.400 0.412 10.16 10.46
F 0.051 1.30
G 0.043 1.09
H 0.051 1.30
J 0.118 3.00
K 0.089 2.26
L 0.293 0.293 0.30 7.44
M 0.289 0.293 7.34 7.44
N 0.089 0.093 2.26 2.36
P 0.045 0.045 1.14 1.14
R 0.034 0.036 0.86 0.91
S 0.008 0.008 0.20 0.20
T 0.036 0.036 0.91 0.91
U 0.020 0.51
W 0.010 0.010 0.25 0.25
X 0.023 0.023 0.58 0.58
E
M
7 ˚ TYP
MOLD SPLIT LINE
A
B
C
D7 ˚ TYP
A
F
G
FH
J
K
1
7 ˚ TYP
7 ˚ TYP
L
N
P
BURR SIDE
4 ˚
MIN LENGTH
OF FLAT 0.08
DETAIL A
SCALE 20:1
R
[.065]
1.65
T
U
W
X
96 ˚
[.460]
11.68
[.138]
3.50 [.059]
1.50
PAD OUTLINE
A
Package Dimensions
© 2002 Teccor Electronics 6 - 7 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Mechanical Data
Modified TO-220
The Modified TO-220 package is designed to meet mechanical standards as set forth in
JEDEC publication number 95.
Notes:
• All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one
minute from leads to case over the operating temperature range)
• Mold flash shall not exceed 0.13 mm per side.
Dimension
Inches Millimeters
MIN MAX MIN MAX
A 0.400 0.410 10.16 10.42
D 0.360 0.375 9.14 9.53
F 0.110 0.130 2.80 3.30
G 0.540 0.575 13.71 14.61
H 0.025 0.035 0.63 0.89
J 0.195 0.205 4.95 5.21
K 0.095 0.105 2.41 2.67
L 0.075 0.085 1.90 2.16
M 0.070 0.085 1.78 2.16
N 0.018 0.024 0.46 0.61
O 0.178 0.188 4.52 4.78
P 0.290 0.310 7.37 7.87
D
F
P
G
A O
TEMPERATURE
MEASUREMENT
POINT
PIN 3
PIN 2
PIN 1
J
H
L
KM
N
Package Dimensions
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+1 972-580-7777 SIDACtor® Data Book and Design Guide
TO-218
The TO-218 package is designed to meet mechanical standards as set forth in JEDEC
publication number 95.
Notes:
• Mold flash shall not exceed 0.13 mm per side.
• Maximum torque to be applied to mounting tab is 8 in-lbs. (0.904 Nm).
• Pin 3 has no connection.
• Tab is non-isolated (connects to middle pin).
Dimension
Inches Millimeters
MIN MAX MIN MAX
A 0.810 0.835 20.57 21.21
B 0.610 0.630 15.49 16.00
C 0.178 0.188 4.52 4.78
D 0.055 0.070 1.40 1.78
E 0.487 0.497 12.37 12.62
F 0.635 0.655 16.13 16.64
G 0.022 0.029 0.56 0.74
H 0.075 0.095 1.91 2.41
J 0.575 0.625 14.61 15.88
K 0.211 0.219 5.36 5.56
L 0.422 0.437 10.72 11.10
M 0.100 0.110 2.54 2.79
N 0.045 0.055 1.14 1.40
P 0.095 0.115 2.41 2.92
R 0.008 0.016 0.20 0.41
S 0.038 0.048 0.97 1.22
T 0.025 0.032 0.64 0.81
U 0.159 0.163 4.04 4.14
V 0.090 0.100 2.29 2.54
C
D
H
G
F
B
A
E
T
C
Measurement Point
U DIA.
P
PIN 3
J
PIN 2
PIN 1
M
N 3 Times
K
L
R
Q
Note: Maximum torque
to be applied to mounting
tab is 8 in-lbs. (0.904 Nm).
W
Tab is
connected to
PIN 2
Package Dimensions
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SIDACtor® Data Book and Design Guide +1 972-580-7777
Mechanical Data
TeleLink Surface Mount Fuse
The following illustration shows the end view dimensions of a TeleLink fuse:
The following illustration shows the top view or side view dimensions of a TeleLink fuse:
The following illustration shows the footprint dimensions of a TeleLink fuse:
.109 ± .006
(2.77 ± 0.15)
Dimensions are in inches
(and millimeters)
.109 ± .006
(2.77 ± 0.15)
.055 ± .010
(1.40 ± 0.25)
.109 ± .006
(2.77 ± 0.15)
.405 ± .008
(10.29 ± 0.20)
.055 ± .010
(1.40 ± 0.25)
Dimensions are in inches
(and millimeters)
.204
(5.2)
.145
3.7
.157
(4.0)
.496
(12.6)
Dimensions are in inches
(and millimeters)
Package Dimensions
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+1 972-580-7777 SIDACtor® Data Book and Design Guide
Single In-line Protector (SIP)
The following illustration shows a balanced three-chip SIP protector:
The following illustration shows a longitudinal two-chip SIP protector:
2.250 +0.010 / -0.002
(57.150 +0.254 -0.051)
0.450 +0.010 / -0.002
(11.430 +0.254 -0.051)
0.500 (12.70) max
0.110 ± 0.010
(2.794 ±0.254)
0.100 ± 0.010 non-cumulative
(2.540 ±0.254)
0.040 ± 0.004
(1.016 ±0.102)
0.260
(6.604)
max
0.010 typ
(0.025)
Dimensions are in
inches (millimeters).
2.250 +0.010 / -0.002
(57.150 +0.254 -0.051)
0.450 +0.010 / -0.002
(11.430 +0.254 -0.051)
0.500 (12.70) max
0.110 ± 0.010
(2.794 ±0.254)
0.100 ± 0.010 non-cumulative
(2.540 ±0.254)
0.040 ± 0.004
(1.016 ±0.102)
0.260
(6.604)
max
0.010 typ
(0.025)
0.075 ± 0.010
(1.905 ±0.254) 0.020 (0.508) typ
Dimensions are in
inches (millimeters).
Package Dimensions
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SIDACtor® Data Book and Design Guide +1 972-580-7777
Mechanical Data
The following illustration shows a four-port metallic line SIP protector:
1.300 +0.010 / -0.002
(33.02 +0.25 / -0/05)
0.500 max
(12.70)
0.450 +0.010 / -0.002
(11.43 +0.25 / -0.05)
0.120 ± 0.015
(3.05 ± 0.38)
0.100 ± 0.008 non-cumulative
(2.54 ± 0.20)
0.040 ± 0.004
(1.02 ± 0.10)
Dimensions are in
inches (millimeters).
0.260 max
(6.60)
0.100 ± 0.010
(2.54 ± 0.25)
Front Bac
k
Front
Back
0.010 typ
(0.025)
0.020 typ
(0.05)
Summary of Packing Options
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Summary of Packing Options
Package Type Description
Packing
Quantity
Added
Suffix
Industry
Standard
DO-214AA
SA, SB, SC, SD, including MC
Embossed Carrier Reel Pack 2500 RP EIA-481-1
Bulk Pack 1000 BP N/A
TO-92
EA, EB, EC, including MC
Note: Standard lead spacing for TO-92
reel pack is 0.200”.
Bulk Pack 2000 N/A
Tape and Reel Pack 2000 RP1, RP2 EIA-468-B
Ammo Pack 2000 AP EIA-468-B
Modified MS-013 Tape and Reel Pack 1500 RP EIA-481-1
Bulk Pack 500 BP
Tube Pack 50 per tube,
50 tubes per container
TP EIA-481-1
TO-220
AA, AB, AC, AD
Bulk Pack 500 N/A
Tape and Reel Pack 700 RP EIA-468-B
Tape and Reel Pack for
Type 61 lead form
700 RP EIA-468-B
Tube Pack 50 per tube,
10 tubes per container
TP EIA-468-B
TO-218
ME
Bulk Pack 250 N/A
3-lead
Type 61
Summary of Packing Options
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SIDACtor® Data Book and Design Guide +1 972-580-7777
Mechanical Data
TeleLink Surface Mount Fuse Embossed Carrier Reel Pack 2500 RP EIA-481-B
Bulk Pack 5000 BP N/A
Balanced Longitudinal SIP Plastic trays 150/tray None None
Metallic SIP Plastic trays 300/tray None None
Package Type Description
Packing
Quantity
Added
Suffix
Industry
Standard
Packing Options
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Packing Options
DO-214AA
Tape and reel packing options meet all specifications as set forth in EIA-481-1. Standard reel
pack quantity is 2500. Bulk pack quantity is 500.
The following illustration shows the DO-214AA component orientation for P0641S, P0721S,
P0901S, and P1101S:
The following illustration shows the modified DO-214 tape and reel:
3-lead
0.472
(12.0) 0.36
(9.2)
0.315
(8.0)
0.157
(4.0)
0.49
(12.4)
0.512 (13.0) Arbor
Hole Dia.
12.99
(330.0)
Dimensions
are in inches
(and millimeters).
Direction of Feed
0.059 DIA
(1.5) Cover tape
CATHODE
0.472
(12.0) 0.374
(9.5)
0.315
(8 0)
0.157
(4.0)
Pin 2
Anode
Cthd Gt Di i i i h
Packing Options
© 2002 Teccor Electronics 6 - 15 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Mechanical Data
TO-92
Tape and reel packing options meet all specifications as set forth in EIA-468-B. Standard reel
pack quantity is 2000.
Notes:
• Part number suffix RP2 denotes 0.200” (5 mm) lead spacing and is Teccor’s default value.
• Part number suffix RP1 denotes 0.100” (2.54 mm) lead spacing and is available upon request.
The following figure shows the TO-92 Ammo Pack option:
Flat Down
1.62
(41.2)
0.708
(18.0) 0.354
(9.0)
0.236
(6.0)
0.02
(0.5)
0.50
(12.7)
14.17
(360.0)
0.20
(5.08)
0.125 (3.2) MAX
1.27
(32.2)
1.97
(50.0)
0.50
(12.7)
0.25
(6.35)
Dimensions
are in inches
(and millimeters).
Direction of Feed
0.157 DIA
(4.0)
Flat down
25 Devices per fold
0.708
(18.0)
1.27
(32.2)
0.125 (3.2) MAX
1.62
(41.2)
MAX
0.50
(12.7)
0.354
(9.0)
0.236
(6.0)
0.02 (0.5)
0.20 (5.08)
0.50
(12.7)
0.25
(6.35)
Direction of Feed
Dimensions
are in inches
(and millimeters).
1.85
(47.0)
13.3
(338.0)
12.2
(310.0)
1.85
(47.0)
0.157 DIA
(4.0)
Packing Options
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Modified MS-013 Six-pin
Tape and reel packing options meet all specifications as set forth in EIA-468-B. Standard reel
pack quantity is 1500.
The following illustration shows the tube pack:
1
2
3
6
5
4
Direction of Feed
.646
(16.4)
.512 (13.0) Arbor
Hole Dia.
14.173
(360)
.630
(16.0)
Dimensions are in inches
(and millimeters)
Component/Tape Layout
1,500 Devices per Reel
.472
(12.0)
.157
(4.0)
Int
e
ri
o
r
o
f th
e
T
ube
.
0
4
5
(
1.14
)
.1
65
(
4.19
)
.1
50
(
3.81
)
90
˚
.
5
2
5
(
13.34
)
A
.22
5
(
5.72
)
M
essa
g
e Locatio
n
.
3
1
0
(
7.87
)
.1
08
.
005
2
0
.
000
±
.
030
(
508.00
±
0.76
)
.
0
2
0
±
(
0.51
±
0.13
)
WALL TYP.
.110
(2.79)
A
6
Dimensions are in inches
(and millimeters)
Packing Options
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SIDACtor® Data Book and Design Guide +1 972-580-7777
Mechanical Data
Modified TO-220
Tape and reel packing options meet all specifications as set forth in EIA-468-B. Standard reel
pack quantity is 700.
The following illustration shows the tube pack:
Type 61
1.626
(41.15)
0.720
(18.29) 0.360
(9.14)
0.240
(6.10) 0.019
(0.5)
0.750 ± 0.010
(19.05 ± 0.25)
0.500
(12.7)
0.100
(2.54) 0.100
(2.54)
14.173
(360.0)
Component/Tape Layout
Dimensions are in inches
(and millimeters).
1.968
(50.0)
Direction of Feed
Standard Reel Pack (RP)
REF
22.0 ± .2
(559 ± 5)
.220
(5.58)
.160
(4.06)
1.
300
(
136.25
)
1.250 ± .015
(31.75)
.630 ± .015
(16.00 ± 0.38)
.140
(3.56)
.025 ± .005
(0.64 ± 0.13)
TYP. WALL
Dimensions are in inches
(and millimeters)
Packing Options
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TeleLink Surface Mount Fuse
The following illustration shows the TeleLink embossed carrier tape:
4˚ Max.
Section 'A'-'A'
.0135±.0005
(.343±.013)
+.012
-.004
+.30
-.10
.945
(24.00)
8˚ Max.
.436±.004
(11.07±.10)
.453±.004
(11.50±.10)
.124±.004
(1.75±.10)
.436±.004
(3.15±.10) .157±.004
(4.00±.10)
.059±.010
(1.50±.25) Dia.
.079±.004
(2.00±.10)
.059±.004
(1.50±.10) Dia.
'A'
'B'
'A'
'B'
.315±.004
(8.00±.10)
.129±.004
(3.28±.10) 24 mm Black
Anti-static Carrier Tape
Dimensions are in inches
(and millimeters)
Packing Options
© 2002 Teccor Electronics 6 - 19 http://www.teccor.com
SIDACtor® Data Book and Design Guide +1 972-580-7777
Mechanical Data
The following illustration shows the TeleLink 13-inch (330 mm), injection-molded, high-
impact, anti-static, white, plastic reel. Material conforms to EIA-481-1. Surface resistivity is
1011 W/square. Materials comply with ASTM D-257.
Access hole
greater than
40.00 at slot
1.575 location
.512±.008
(13.00±.20)
Arbor hole
2.362±.039
(60.00±1.00)
Hub dia.
2.00
.079
(Drive Spokes)
min.
.795
(20.20) min.
Tape slot depth
greater than .394 (10.00)
12.992
(330.00)
Max dia.
1.19
(30.40)
Measured
at hub
1.00±.069
(25.65±1.75)
Measured at
outer edge
.197±.020
(5.00±.51)
Tape starter slot
.960
(24.40)
Measured
at hub
+.079
-.00
+2.00
-.00
Dimensions are in inches
(and millimeters)
Lead Form Options
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Lead Form Options
Modified TO-220 Type 60
Dimension
Inches Millimeters
Min Max Min Max
A 0.485 12.32
B 0.162 0.192 4.11 4.88
C 0.162 0.192 4.11 4.88
0.324
(8.23)
0.047
(1.19)
Dia. ref.
0.177
(4.50)
.645±.025
(16.38±0.64)
30˚
Dimensions are in inches
(and millimeters)
A
B
C
Lead Form Options
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Mechanical Data
Modified TO-220 Type 61
Modified TO-220 Type 62
Dimension
Inches Millimeters
Min Max Min Max
A 0.030 0.060 0.762 1.52
Dimension
Inches Millimeters
Min Max Min Max
A 0.172 0.202 4.37 5.13
B 0.440 0.460 11.18 11.68
C 0.120 0.130 3.05 3.30
A
PIN 1 PIN 3
5˚ TYP.
A
B
C
NOTES
