20
Philips Semiconductors
The I2C-bus specification
The Fast-m ode I2C-bus specification has the following
additional features compared with the Standard-mode:
•The maximum bit rate is increased to 400 kbit/s.
•Timin g o f the serial data (SDA) and s erial clock (SCL )
signals has been adapted. There is no need for
compatibility with other bus systems such as CBUS
because they cannot operate at the increased bit rate.
•The inputs of Fast-mode devices incorporate spike
suppression and a Schmitt trigger at the SDA and SCL
inputs.
•The output buffers of Fast-mode devices incorporate
slope control of the falling edges of the SDA and SCL
signals.
•If the power supply to a Fast-mode device is switched
off, the SDA and SCL I/O pins must be floating so that
they don’t obstruct the bus lines.
•The external pull- up devi ces connected to the bus line s
must be adapted to accommodate the shorter maximum
permissible rise time for the Fast-mode I2C-b us. For bus
loads up to 200 pF, the pull-up device for each bus line
can be a resistor; for bus loads between 200 pF and
400 pF, the pull-up device can be a current source
(3 mA max.) or a switched resistor circuit (see Fig.43).
13 Hs-MODE
High-speed mode (Hs-mode) devices offer a quantum
leap in I2C-bus transfer speeds. Hs-mode devices can
transf er information at bit rates of up to 3.4 Mbit/s, yet they
remain fully do wnward compatib le with F ast- or
Standard-mode (F/S-mode) devices for bi-directional
communi ca t ion in a mixed-speed bus system. With the
except ion that arbitrati on and cloc k synchr oniz ation is not
performed during the Hs-mode transfer, the same serial
bus protocol and data format is maintained as with the
F/S-mode system. Depending on the application, new
devices may have a Fast or Hs-mode I2C-bus interface,
although Hs-mode devices are preferred as they can be
designed-in to a greater number of applications.
13.1 High speed transfer
To achieve a bit transfer of up to 3.4 Mbit/s the following
improvements have been made to the regular I2C-bus
specification:
•Hs-mode master devices have an open-drain output
buffer for the SDAH signal and a combination of an
open-drain pull-down and current-source pull-up circuit
on the SCLH output(1). This current-so urce circuit
shortens the rise time of the SCLH signal. Only the
current-source of one master is enabled at any one time,
and only during Hs-mode.
•No arbitration or clock synchronization is performed
during Hs-mode transfer in multi-master systems, which
speeds-up bit handling capabilities. The arbitration
procedure always finishes after a preceding master
code transmission in F/S-mode.
•Hs-mode master devices generate a serial clock signal
with a HIGH to LOW ratio of 1 to 2. This relieves the
timing requirements for set-up and hold times.
•As an option, Hs-mode master devices can have a
built-in bridge(1). During Hs-mode transfer, the high
speed data (SDAH) and high-speed seri al clock (SCLH)
lines of Hs-mode devices are separated by this bridge
from the SDA and SCL line s of F/S-mode dev ice s. This
reduces the capacitive load of the SDAH and SCLH
lines resulting in faster rise and fall times.
•The only difference between Hs-mode slave devices
and F/S-mode slave devices is the speed at which they
operate. Hs-mode slaves have open-drain output buffers
on the SCLH an d SDAH ou tputs. Optional pull-d own
transistors on the SCLH pin can be used to stretch the
LOW level of the SCLH signal, although this is only
allowed after the acknowled ge bit in Hs-mode transfers.
•The inputs of Hs-mode devices incorporate spike
suppression and a Schmitt trigger at the SDAH and
SCLH inputs.
•The output buffers of Hs-mode devices incorporate
slope control of the falling edges of the SDAH and SCLH
signals.
Figure 20 shows the physical I2C-bus configuration in a
system with only Hs- mode devic es. Pins SD A and SCL on
the master devices are only used in mixed-speed bus
systems and are not connected in an Hs-mode only
system. In such cases, these pins can be used for other
functions.
Optional se ries resistors Rs protect the I/O stages of the
I2C-bus devices from hi gh-v oltag e spik es on the bus lines
and minimize ringing and interference.
Pull-up resistors Rp main tain the SDAH and SCLH lin es at
a HIGH level when the bus is free and ensure the signals
are pulled up from a LOW to a HIGH level within the
required rise time. For higher capacitive bus-line loads
(>100 p F ), the resistor Rp can be replaced by external
current source pull-ups to meet the rise time requirements.
Unless pr oceeded by an ac kn owledge bi t, the ris e ti me of
the SCLH c lock puls es in Hs -m ode transfer s i s s ho rt ened
by the inte rnal current-source pull -up circuit MC S of the
active master.
(1) Patent application pending.