Data Sheet
Sept ember 4, 20 13
EVW010A0B Series (Eighth-Brick) DC-DC Converter Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§ This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be
followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards
Document No: DS09-006 ver. 1.2
PDF name: evw010_ds.pd
f
Features
Compliant to RoHS EU Directive 2002/95/EC
Compatible in a Pb-free or SnPb reflow
environment
High efficiency – 93.5% at 12V full load
Industry standard, DOSA compliant, Eighth brick
footprint
57.9mm x 22.9mm x 7.8mm
(2.28in x 0.90in x 0.31in)
Wide Input voltage range: 36-75 Vdc
Tightly regulated output
Constant switching frequency
Positive Remote On/Off logic
Input under/over voltage protection
Output overcurrent/voltage protection
Over-temperature protection
Remote sense
No minimum load required
No reverse current during output shutdown
Output Voltage adjust: 80% to 110% of Vo,nom
Operating temperature range (-40°C to 85°C)
UL* 60950-1Recognized, CSA† C22.2 No.
60950-1-03 Certified, and VDE‡ 0805:2001-12
(EN60950-1) Licensed
CE mark meets 73/23/EEC and 96/68/EEC
directives§
Meets the voltage and current requirements for
ETSI 300-132-2 and complies with and licensed
for Basic insulation rating per EN60950-1
2250 Vdc Isolation tested in compliance with
IEEE 802.3¤ PoE standards
ISO**9001 and ISO 14001 certified
manufacturing facilities
Applications
Distributed Power Architectures
Wireless Networks
Access and Optical Network Equipment
Enterprise Networks including Power over Ethernet
(PoE)
Options
Negative Remote On/Off logic
Over current/Over temperature/Over voltage
protections (Auto-restart)
Heat plate versions (-H)
Surface Mount version (-S)
Description
The EVW010A0B, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 10A of
output current and provide a precisely regulated output voltage of 12V over a wide range of input voltages (VIN = 36 -
75Vdc). The modules achieve typical full load efficiency of 93.5%. The open frame modules construction, available in
both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions.
Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and
overtemperature protection.
RoHS Compliant
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are
absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in
excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage
Continuous All VIN -0.3 80 Vdc
Transient (≤100 ms) All VIN,trans -0.3 100 Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
I/O Isolation voltage (100% factory Hi-Pot tested) All 2250 Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 36 48 75 Vdc
Maximum Input Current All IIN,max 3.4 3.7 Adc
(VIN= VIN, min to VIN, max, IO=IO, max)
Input No Load Current All IIN,No load
75 mA
(VIN = VIN, nom, IO = 0, module enabled)
Input Stand-by Current
All IIN,stand-by
20 mA
(VIN = VIN, nom, module disabled)
Inrush Transient All I2t 0.5 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to
VIN, max, IO= IOmax ; See Test configuration section)
All 20 mAp-p
Input Ripple Rejection (120Hz) All 50 dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a time-delay fuse with a maximum rating of 8 A (see Safety Considerations section). Based on the
information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a
lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 3
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Nominal Output Voltage Set-point All VO, set 11.76 12.0 12.24 Vdc
VIN=VIN, min, IO=IO, max, TA=25°C)
Output Voltage
All VO -3.0 +3.0 % VO, set
(Over all operating input voltage, resistive load,
and temperature conditions until end of life)
Output Regulation
Line (VIN=VIN, min to VIN, max) All
0.2 % VO, set
Load (IO=IO, min to IO, max) All 0.2 % VO, set
Temperature (Tref=TA, min to TA, max) All
1.0 % VO, set
Output Ripple and Noise on nominal output
(VIN=VIN, nom ,IO= IO, max , T
A
=T
A
, min to T
A
, max)
RMS (5Hz to 20MHz bandwidth) All 30 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) All 100 mVpk-pk
External Capacitance All CO 100 2,000 μF
Output Current All Io 0 10 Adc
Output Current Limit Inception (Hiccup Mode ) All IO, lim 105 115 130 % Io
(VO= 90% of VO, set)
Output Short-Circuit Current All IO, s/c 3 5 Arms
(VO≤250mV) ( Hiccup Mode )
Efficiency All η 93.5 %
VIN= VIN, nom, TA=25°C
IO=IO, max , VO= VO,set
Switching Frequency (Input ripple is ½ fsw) All fsw 370 kHz
Dynamic Load Response
(dIo/dt=0.1A/s; VIN = VIN, nom; TA=25°C)
Load Change from Io= 50% to 75% or 25% to
50% of Io,max;
Peak Deviation All Vpk 3 % VO, set
Settling Time (Vo<10% peak deviation) All ts 200 s
(dIo/dt=1A/s; VIN = VIN, nom; TA=25°C)
Load Change from Io= 50% to 75% or 25% to
50% of Io,max;
Peak Deviation All Vpk 5 % VO, set
Settling Time (Vo<10% peak deviation) All ts 200 s
Isolation Specifications
Parameter Device Symbol Min Typ Max Unit
Isolation Capacitance All Ciso 1000 pF
Isolation Resistance All Riso 10 MΩ
I/O Isolation Voltage (100% factory Hi-pot tested) All All 2250 Vdc
General Specifications
Parameter Device Symbol Min Typ Max Unit
Calculated Reliability based upon Telcordia SR-
332 Issue 2: Method I Case 3 (IO=80%IO, max,
TA=40°C, airflow = 200 lfm, 90% confidence)
All FIT 323.4 109/Hours
All MTBF 3,092,530 Hours
Weight (Open Frame) All 19
(0.67) g
(oz.)
Weight (with Heatplate) All 32
(1.13) g
(oz.)
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 4
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current All Ion/off 1.0 mA
Logic Low - On/Off Voltage All Von/off -0.7 1.0 Vdc
Logic High Voltage – (Typ = Open Collector) All Von/off 2.0 5.0 Vdc
Logic High maximum allowable leakage current All Ion/off 10 μA
Turn-On Delay1 and Rise Times
(IO=IO, max , VIN=VIN, nom, TA = 25 oC)
Case 1: On/Off input is set to Logic Low (Module
ON) and then input power is applied (Tdelay from
instant at which VIN = VIN, min until VO = 10% of VO,set)
All Tdelay ― 25 30 msec
Case 2: Input power is applied for at least 1 second
and then the On/Off input is set from OFF to ON (Tdelay
from instant Von/off toggles until VO = 10% of VO, set).
All Tdelay ― 12 20 msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set) All Trise ― 10 15 msec
Output voltage overshoot – Startup All
― 3 % VO, set
IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC
Remote Sense Range All VSENSE 10 % VO, set
(Max voltage drop is 0.5V)
Output Voltage Adjustment Range2 All 80 110 % VO, set
Output Overvoltage Protection All VO, limit 13.8 16.5 Vdc
Input Undervoltage Lockout All VUVLO
Turn-on Threshold 30 34.5 36 Vdc
Turn-off Threshold 30 32.5 Vdc
Hysterisis 1.5 2.0
Vdc
Input Overvoltage Lockout All VOVLO
Turn-off Threshold 80 83 Vdc
Turn-on Threshold 75 78 Vdc
Hysterisis 1 2
Vdc
Notes:
1. The module has an adaptable extended Turn-On Delay interval, Tdelay, of 4 seconds. The extended Tdelay will occur when the module restarts
following either: 1) the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and
then back to normal; or 2) toggling the on/off signal from on to off and back to on without removing the input voltage. The normal Turn-On Delay
interval, Tdelay, will occur whenever a module restarts with input voltage removed from the module for the preceding 1 second.
2. Maximum trim up possible only for Vin>40V.
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 5
Characteristic Curves
The following figures provide typical characteristics for the EVW010A0B (12V, 10A) at 25oC. The figures are identical
for either positive or negative remote On/Off logic.
EFFICIENCY, (%)
70
75
80
85
90
95
0246810
Vin = 48
V
Vin = 36
V
Vin = 75
V
OUTPUT VOLTAGE OUTPUT CURRENT
VO (V) (200mV/div) Io(A) (2A/div)
OUTPUT CURRENT, IO (A) TIME, t (100µs/div)
Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 1.0A/µS Dynamic
Load Change from 50% to 75% to 50% of full load (VIN
= VIN,NOM).
OUTPUT VOLTAGE
VO (V) (50mV/div)
On/Off VOLTAGE OUTPUT VOLTAGE
VO (V) (2V/div) VOn/Off (V) (2V/div)
TIME, t (2s/div) TIME, t (5ms/div)
Figure 2. Typical output ripple and noise (VIN = VIN,NOM,
Io = Io,max). Figure 5. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = VIN,NOM, Io = Io,max).
OUTPUT VOLTAGE OUTPUT CURRENT
VO (V) (200mV/div) Io(A) (2A/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VIN (V) (20V/div) VO (V) (2V/div)
TIME, t (100µs/div) TIME, t (10ms/div)
Figure 3. Trans ie n t Resp ons e to 0.1A /µS Dynamic
Load Change from 50% to 75% to 50% of full load (VIN
= VIN,NOM).
Figure 6. Typical Start-up Using Input Voltage (VIN =
VIN,NOM, Io = Io,max).
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 6
Test Configurations
TO OSCILLOSCOPE CURRENT PROBE
LTES T
12μH
BATTER Y
CS 220μF
E.S .R .< 0.1
@ 20 °C 10 0kHz
33-100μF
Vi n+
Vin-
NOTE: M easure input reflected ripple current with a simulated
source inductance (LTE S T) of 12μH. Capacitor CS offsets
possible battery imp edance. Measure current as shown
above.
Figure 7. Input Reflected Ripple Current Test
Setup.
NOTE: A ll voltage mea surements to be t aken at the mod ule
terminals, a s sho wn above. If sockets are used th en
Kelvin conn ections are required at the module terminals
to avoid me asureme nt errors due to socket contact
resistance.
V
O (+)
V
O
( – )
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
1uF
Figure 8. Output Ripple and Noise Test Setup.
Vout+
Vout-
Vin+
Vin-
RLOAD
Rcontact Rdistribution
Rcontact Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 9. Output Voltage and Efficiency Test
Setup.
=
VO. IO
VIN. IIN
x 100 %
Efficiency
Design Considerations
Input Fil tering
The power module should be connected to a low
ac-impedance source. Highly inductive source
impedance can affect the stability of the power
module. For the test configuration in Figure 7 a 33-
100μF electrolytic capacitor (ESR<0.1 at 100kHz),
mounted close to the power module helps ensure the
stability of the unit. Consult the factory for further
application guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and
separation requirements of the end-use safety agency
standard, i.e., UL 60950-1-3, CSA C22.2 No. 60950-
00, and VDE 0805:2001-12 (IEC60950-1).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75Vdc), for the module’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages,
including the ac mains.
One VIN pin and one VOUT pin are to be
grounded, or both the input and output pins are
to be kept floating.
The input pins of the module are not operator
accessible.
Another SELV reliability test is conducted on the
whole system (combination of supply source and
subject module), as required by the safety
agencies, to verify that under a single fault,
hazardous voltages do not appear at the
module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.
The power module has extra-low voltage (ELV)
outputs when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are rated 94V-0, or tested to the
UL60950 A.2 for reduced thickness.
For input voltages exceeding –60 Vdc but less than or
equal to –75 Vdc, these converters have been
evaluated to the applicable requirements of BASIC
INSULATION between secondary DC MAINS
DISTRIBUTION input (classified as TNV-2 in Europe)
and unearthed SELV outputs.
The input to these units is to be provided with a
maximum 8 A time-delay fuse in the ungrounded lead.
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 7
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the
module off during a logic high and on during a logic
low.
ON/OFF
Vin+
Vin-
Ion/off
Von/off
Vout+
TRIM
Vout-
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to
control the voltage (Von/off) between the ON/OFF
terminal and the VIN(-) terminal (see Figure 10). Logic
low is 0V ≤ Von/off ≤ 1.0V. The maximum Ion/off during a
logic low is 1mA, the switch should be maintain a
logic low level whilst sinking this current.
During a logic high, the typical maximum Von/off
generated by the module is 5V, and the maximum
allowable leakage current at Von/off = 5V is 1μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between
the remote-sense pins and the output terminals must
not exceed the output voltage sense range given in
the Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] 0.5 V
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim.
The amount of power delivered by the module is
defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can
be increased, which at the same output current would
increase the power output of the module. Care should
be taken to ensure that the maximum output power of
the module remains at or below the maximum rated
power (Maximum rated power = Vo,set x Io,max).
VO(+)
SENSE(+)
SENSE(–)
VO(–)
VI(+)
VI(-)
IOLOAD
CONTACT AND
DISTRIBUTION LOSS
E
SUPPLY II
CONTACT
RESISTANCE
Figure 11. Circuit Configuration for remote
sense .
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module
will only begin to operate once the input voltage is
raised above the undervoltage lockout turn-on
threshold, VUV/ON.
Once operating, the module will continue to operate
until the input voltage is taken below the undervoltage
turn-off threshold, VUV/OFF.
Overtemperature Protection
To provide protection under certain fault conditions,
the unit is equipped with a thermal shutdown circuit.
The unit will shutdown if the thermal reference point
Tref (Figure 13), exceeds 150oC (typical), but the
thermal shutdown is not intended as a guarantee that
the unit will survive temperatures beyond its rating.
The module can be restarted by cycling the dc input
power for at least one second or by toggling the
remote on/off signal for at least one second. If the
auto-restart option (4) is ordered, the module will
automatically restart upon cool-down to a safe
temperature.
Output Overvoltage Protection
The output over voltage protection scheme of the
modules has an independent over voltage loop to
prevent single point of failure. This protection feature
latches in the event of over voltage across the output.
Cycling the on/off pin or input voltage resets the
latching protection feature. If the auto-restart option
(4) is ordered, the module will automatically restart
upon an internally programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, then it will latch off
following the over current condition. The module can
be restarted by cycling the dc input power for at least
one second or by toggling the remote on/off signal for
at least one second. If the unit is configured with the
auto-restart option (4), it will remain in the hiccup
mode as long as the overcurrent condition exists; it
operates normally, once the output current is brought
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 8
Feature Descriptions (continued)
back into its specified range. The average output
current during hiccup is 10% IO, max.
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the VO(+) pin or the VO(-) pin.
VO(+)
VOTRIM
VO(-)
Rtrim-down
LOAD
VIN(+)
ON/OFF
VIN(-)
Rtrim-up
Figure 12. Circuit Configurat i on t o Tr im Ou tpu t
Voltage.
Connecting an external resistor (Rtrim-down) between
the TRIM pin and the Vo(-) (or Sense(-)) pin
decreases the output voltage set point. To maintain
set point accuracy, the trim resistor tolerance should
be ±1.0%.
The following equation determines the required
external resistor value to obtain a percentage output
voltage change of ∆%
22.10
%
511
downtrim
R
Where 100% ,
,
seto
desiredseto V
VV
For example, to trim-down the output voltage of the
module by 8% to 11.04V, Rtrim-down is calculated as
follows:
8%
22.10
8
511
downtrim
R
655.53
downtrim
R
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) (or Sense (+)) pin increases
the output voltage set point. The following equations
determine the required external resistor value to
obtain a percentage output voltage change of ∆%:
22.10
%
511
%225.1
%)100(11.5 ,seto
uptrim V
R
Where 100% ,
,
seto
setodesired
V
VV
For example, to trim-up the output voltage of the
module by 5% to 12.6V, Rtrim-up is calculated is as
follows:
5%
22.10
5
511
5225.1 )5100(0.1211.5
uptrim
R
8.938
uptrim
R
The voltage between the Vo(+) and Vo(–) terminals
must not exceed the minimum output overvoltage
protection value shown in the Feature Specifications
table. This limit includes any increase in voltage due
to remote-sense compensation and output voltage
set-point adjustment trim.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. The amount of power
delivered by the module is defined as the voltage at
the output terminals multiplied by the output current.
When using remote sense and trim, the output
voltage of the module can be increased, which at the
same output current would increase the power output
of the module. Care should be taken to ensure that
the maximum output power of the module remains at
or below the maximum rated power (Maximum rated
power = VO,set x IO,max).
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference point, Tref used in the
specifications for open frame modules is shown in
Figure 13. For reliable operation this temperature
should not exceed 122oC.
Figure 13. Tref Temperature Measureme nt
Location for open Frame Module.
The thermal reference point, Tref used in the
specifications for modules with heat plates (–H) is
shown in Figure 14. For reliable operation this
temperature should not exceed 114oC.
AIRFLOW
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 9
Thermal Considerations (continued)
Figure 14. Tref Temperature Measurement
Location for Heat plate Module.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the
maximum output current that can be delivered by the
open frame module versus local ambient temperature
(TA) for natural convection and up to 3m/s (600
ft./min) forced airflow are shown in Figure 15.
OUTPUT CURRENT, IO (A)
3
4
5
6
7
8
9
10
20 30 40 50 60 70 80 90
3.0 m/s
(600LFM)
2.0 m/s
(400LFM)
1.0 m/s
(200LFM)
0.5 m/s
(100LFM)
NC
AMBIENT TEMEPERATURE, TA (oC)
Figure 15. Outpu t Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
For additional power, the module is available with an
optional heatplate (-H), that allows for the use of
heatsinks to improve the thermal derating. Derating
curves showing the maximum output current that can
be delivered by the heatplate module with different
heatsink heights versus local ambient temperature
(TA) for natural convection and up to 3m/s (600
ft./min) forced airflow are shown in Figures 16 -19.
OUTPUT CURRENT, IO (A)
3
4
5
6
7
8
9
10
20 30 40 50 60 70 80 90
3.0 m/s
(600LFM)
2.0 m/s
(400LFM)
1.0 m/s
(200LFM)0.5 m/s
(100LFM) NC
AMBIENT TEMEPERATURE, TA (oC)
Figure 16. Output Current Derating for the Module
with Heatplate; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
OUTPUT CURRENT, IO (A)
3
4
5
6
7
8
9
10
20 30 40 50 60 70 80 90
2.0 m/s
(400LFM)
1.0 m/s
(200LFM)
0.5 m/s
(100LFM)
NC
AMBIENT TEMEPERATURE, TA (oC)
Figure 17. Output Current Derating for the Module
with Heatplate and 0.25 in. heatsink; Airflow in the
Transverse Direction from Vout(+) to Vout(-); Vin
=48V.
OUTPUT CURRENT, IO (A)
3
4
5
6
7
8
9
10
20 30 40 50 60 70 80 90
2.0 m/s
(400LFM)
1.0 m/s
(200LFM)
0.5 m/s
(100LFM)
NC
AMBIENT TEMEPERATURE, TA (oC)
Figure 18. Output Current Derating for the Module
with Heatplate and 0.5 in. heatsink; Airflow in th e
Transverse Direction from Vout(+) to Vout(-); Vin
=48V.
AIRFLOW
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 10
Thermal Considerations (continued)
OUTPUT CURRENT, IO (A)
3
4
5
6
7
8
9
10
20 30 40 50 60 70 80 90
1.0 m/s
(200LFM)
0.5 m/s
(100LFM)
NC
AMBIENT TEMEPERATURE, TA (oC)
Figure 19. Output Curr ent Derating for the Module
with Heatplate and 1.0 in. heatsink; Airflow in the
Transverse Direction from Vout(+) to Vout(-); Vin
=48V.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Through-Hole Soldering Information
The RoHS-compliant (Z codes) through-hole products
use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-
compliant components. The RoHS-compliant with
lead solder exemption (non-Z codes) through-hole
products use Sn/Pb solder and RoHS-compliant
components. Both non-Z and Z codes are designed to
be processed through single or dual wave soldering
machines. The pins have an RoHS-compliant finish
that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of
3C/s is suggested. The wave preheat process
should be such that the temperature of the power
module board is kept below 210C. For Pb solder,
the recommended pot temperature is 260C, while the
Pb-free solder pot is 270C max. Not all RoHS-
compliant through-hole products can be processed
with paste-through-hole Pb or Pb-free reflow process.
If additional information is needed, please consult with
your Lineage Power representative for more details.
Surface Mount Information
Pick and Place
The EVW010A0B modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 20. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Reflow Soldering Information
The surface mountable modules in the EVW family
use our newest SMT technology called “Column Pin”
(CP) connectors. Figure 21 shows the new CP
connector before and after reflow soldering onto the
end-board assembly.
EVW Board
Insulator
Solder Ball
End assembly PCB
Figure 21. Column Pin Connector Before and After
Reflow Soldering.
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag/Cu
(SAC) solder for –Z codes. The CP connector design
is able to compensate for large amounts of co-
planarity and still ensure a reliable SMT solder joint.
Typically, the eutectic solder melts at 183oC (Sn/Pb
solder) or 217-218 oC (SAC solder), wets the land,
and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on
the connection to ensure a reliable solder joint. There
are several types of SMT reflow
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 11
Surface Mount Information (continued)
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR.
The following instructions must be observed when
SMT soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
Tin Lead Soldering
The recommended linear reflow profile using Sn/Pb
solder is shown in Figure 22 and 23. For reliable
soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
REFLOW TEMP (C)
0
50
10 0
15 0
200
250
300
Preheat zo ne
max 4oCs-1
Soak zo ne
30-240s
Heat zone
max 4oCs-1
Peak Temp 235oC
Co oling
zo ne
1- 4 oCs-1
T
lim
above
205
o
C
REFLOW TIME (S)
Figure 22. Reco mm ended Re flow Profile for
Tin/Lead (Sn/Pb) process.
MAX TEMP SOLDER (C)
200
205
210
215
220
225
230
235
240
0 10 203040 5060
Figure 23. Time Limit, Tlim, Curv e Above 205oC for
Tin/Lead (Sn/Pb) process.
Lead Free Soldering
The –Z version of the EVW010A0B modules are lead-
free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 24.
Pe r J-STD-020 Re v. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Reflow Temp (°C)
Hea ting Zone
1°C/Second
Pe ak Temp 260°C
* Min. Time Above 235°C
15 Seco nds
*Time Above 217°C
60 Sec o nds
Cooling
Zone
Figure 24. Recommended linear reflow profile
using Sn/Ag/Cu solder.
MSL Rating
The EVW010A0B modules have a MSL rating of 2A.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: <40°C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Pow er Module s : Sold ering a nd Clean in g
Application Note (AN04-001).
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 12
EMC Considerations
The circuit and plots in Figure 25 shows a suggested configuration to meet the conducted emission limits of EN55022
Class B.
0
10
20
30
40
50
60
70
80
Level [dBµV]
150k 300k 500k 1M 2M 3M 4M 5M 7M 10M 30M
Frequency [Hz]
x
xx
x
x
x
x xMES CE0615090841_fin QP
MES CE0615090841_pre PK
0
10
20
30
40
50
60
70
80
Level [dBµV]
150k 300k 500k 1M 2M 3M 4M 5M 7M 10M 30M
Frequency [Hz]
+
++
+
+
+
+ +MES CE0615090841_fin AV
MES CE0615090841_pre AV
Figure 25. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 13
Mechanical Outline for Surface Mount Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View#
#Top side label includes Lineage Power name, product designation and date code.
Side
View
Bottom
View
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 14
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View#
#
Top side label includes Lineage Power name, product designation and date code.
Side
View
* For optional pin lengths, see Table 2 Device Options and Coding Scheme
Bottom
View
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 15
Mechanical Outline for Through-Hole Module with Heat Plate (-H)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View
Side
View
* For optional pin lengths, see Table 2 Device Options and Coding Scheme
Bottom
View#
# Bottom side label includes Lineage Power name, product designation and date code.
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 16
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
SMT Recommended Pad Layout (Component Side View)
TH Recommended Pad Layout (Component Side View)
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
LINEAGE POWER 17
Packaging Details
The surface mount versions of the EVW surface
mount modules (suffix –S) are supplied as standard in
the plastic tray shown in Figure 26. The tray has
external dimensions of 135.1mm (W) x 321.8mm (L) x
12.42mm (H) or 5.319in (W) x 12.669in (L) x 0..489in
(H).
Tray Specification
Material Antistatic coated PVC
Max surface resistivity 1012/sq
Color Clear
Capacity 12 power modules
Min order quantity 48 pcs (1 box of 4 full
trays)
Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box will
contain 4 full trays plus one empty hold down tray
giving a total number of 48 power modules.
Figure 26. Surface Mount Packaging Tray.
Data Sheet
September 4, 2013 EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
Document No: DS09-006 ver. 1.2
PDF name: evw010_ds.pdf
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product Codes Input Voltage Output
Voltage Output
Current On/Off
Logic Connector
Type Comcodes
EVW010A0B41Z 48V (36-75Vdc) 12V 10A Negative Through hole CC109143203
EVW010A0B64Z 48V (36-75Vdc) 12V 10A Positive Through hole CC109156015
EVW010A0B641Z 48V (36-75Vdc) 12V 10A Negative Through hole CC109158473
EVW010A0B41-HZ 48V (36-75Vdc) 12V 10A Negative Through hole CC109152781
EVW010A0B41-SZ 48V (36-75Vdc) 12V 10A Negative Surface mount CC109153516
Table 2. Device Options and Coding Scheme
Characteristic Characte r and Position Definition
Ratings
Form Factor E E = Eighth Brick
Family Designator V
Input Voltage W W = Wide Input Voltage Range, 36V -75V
Output Current 010A0 010A0 = 010.0 Amps Rated Output Current
Output Voltage B B = 12.0 Vout Nominal
Options
Pin Length
Omit = No Pin Trim
6 6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)
8 8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.)
Action following Omit = Latching Mode
Protective Shutdown 4 4 = Auto-restart following shutdown (Overcurrent/Overvoltage)
On/Off logic Omit = Positive Logic
1 1 = Negative Logic
-
Customer Specific XY XY = Customer Specific Modified Code, Omit for Standard Code
Mechanical Features
Omit = Standard open Frame Module
H H = Heat plate (not available with –S option)
S S = Surface mount connections
RoHS Omit = RoHS 5/6, Lead Based Solder Used
Z Z = RoHS 6/6 Compliant, Lead free
World Wide Headquarter s
Lineage Power Corporation
601 Shiloh Road, Plano, TX 75074, USA
+1-888-LINEAGE(546-3243)
(Outside U.S.A.: +1-972-244-WATT(9288))
www.lineagepower.com
e-mail: techsupport1@lineagepower.com
Asia-Pacific Headquarters
Tel: +86.021.54279977*808
Europe, Middle-East an d Africa Headquarters
Tel: +49.89.878067-280
India Headquarters
Tel: +91.80.28411633
Lineage Power reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or
a
pplication. No rights under any patent accompany the sale of any such product(s) or information.
Lineage Power DC-DC products are protected under various patents. Information on these patents is available at www.lineagepower.com/patents.
©
2010 Lineage Power Corporation, (Plano, Texas) All International Rights Reserved.
