High Power Infrared Emitter (850 nm)
Version 1.6
SFH 4232A
Ordering Information
Features:
!"#
$%&'
()$*))+#
Package: (,)+
Applications
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(&
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Notes
-)%%).%&%&*%
*/%0%)%&&
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Type: Total Radiant Flux Ordering Code
56"7
IF = 1 A, tp = 10 ms
(893:; 2<3# =2;::
Note: Measured with integrating sphere.
Version 1.6 SFH 4232A
Maximum Ratings ,;>?$#
Characteristics ,;>?$#
Parameter Symbol Values Unit
@)%) ,)A, 3 ?$
B) ,C ?$
&& D D
8% 8 ;
(
)E.->#
8( ;
0) 0 "
1(-%&
;F(!1(-;!B1-1$B(9G#
D1(- +D
,C%) B( !"
NoteH For the forward current and power consumption please see "maximum permissible forward current" diagram
Parameter Symbol Values Unit
0+&
8>;.)>#
I)+ '2
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I% '
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8>;.)>#
KI :
9 L M2 ?
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8>;.)>#
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8>;.)>P#
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Version 1.6 SFH 4232A
:
Grouping ,;>?$#
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8>;.)>#
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Group Min Total Radiant Flux Max Total Radiant Flux
IF = 1 A, tp = 10 ms IF = 1 A, tp = 10 ms
56"7 56"7
(893:;-; 3 2:
(893:;-G '
(893:;1; 2:
Note: Measured with integrating sphere.
Only one group in one package unit ( variation lower 1.6:1)
Relative Total Radiant Flux #page 11
Φe / Φe (1A) = f(IF), TA = 25°C, Single pulse,
tp= 100μs
Max. Permissible Forward Current
IF = f(TS), RthJS = 10 K/W
Parameter Symbol Values Unit
OHF05526
I
F
A10 5 10 5
1
10
-2
10
-3
10
5
10
10
5
-1
5
0
e(1 A)
e
Φ
1
10
0
10
-1-2
Φ
-40
100
0
200
400
300
500
˚C
T
S
700
600
800
F
I
900
mA
1100 OHF05527
-20 0 20 40 60 80 120
3
Version 1.6 SFH 4232A
Forward Current #page 11
IF = f(VF), single pulse, tp = 100 µs, TA= 25°C
Permissible Pulse Handling Capability
IF = f(tp), TS = 85 °C, duty cycle D = parameter
Radiation Characteristics #page 11
Irel = f(ϕ), TA= 25°C
1
I
OHF05607
F
V
F
A
V
100
1
10
10-2
10-1
1.2 1.4 1.6 1.8 2
-1-5 -4 -3 -2
10 10 10 10 10
0.8 012
10 s
t
p
10 10
A
I
F
t
P
DT
=
T
P
tI
F
OHF05528
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.1
0.5
1
0.1
0.33
0.2
0.02
0.05
=
0.01
D
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
0˚10˚20˚40˚ 30˚ OHL01660
50˚
60˚
70˚
80˚
90˚
100˚ 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
Version 1.6 SFH 4232A
Package Outline
Dimensions in mm (inch).
Note:
Corrosion robustness better than EN 60068-2-60 (method 4): with enhanced corrosion test: 40°C / 90%rh
/ 15ppm H2S / 336h
Type:
SFH 4232A
Package
Golden Dragon
Approximate Weight:
0.2 g
2
Version 1.6 SFH 4232A
Recommended Solder Pad
Dimensions in mm (inch).
Attention
Anode and Heatsink are electrically connected
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
Solder resist
Freies Kupfer
Bare Copper
Lötpasten Schablone
Solder paste stencil
Lötstopplack
OHAY0681
0.3 (0.012)
Kupfer
Copper
1.6 (0.063)
11.6 (0.457)
12.0 (0.472)
2.3 (0.091)
2.3 (0.091)
10 (0.394)
1.6 (0.063)
11.6 (0.457)
3 Lötstellen
3 solder points
Thermal enhanced PCB
Thermisch optimiertes PCB
ø4.0 (0.157)
Heatsink attach
ø4.0 (0.157)
ø2.5 (0.098)
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Version 1.6 SFH 4232A
4
Taping
Dimensions in mm (inch).
OHA04612
Profile Feature
Profil-Charakteristik
Ramp-up rate to preheat*)
25 °C to 150 °C
2 3 K/s
Time tS
TSmin to TSmax
tS
tL
tP
TL
TP
100 12060
10 20 30
80 100
217
2 3
245 260
3 6
Time
25 °C to TP
Time within 5 °C of the specified peak
temperature TP - 5 K
Ramp-down rate*
TP to 100 °C
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature
Peak temperature
Time above liquidus temperature
Symbol
Symbol
Unit
Einheit
Pb-Free (SnAgCu) Assembly
Minimum MaximumRecommendation
K/s
K/s
s
s
s
s
°C
°C
480
OHAY0508
1.55 (0.061) 2 (0.079)
4 (0.157)
6.35 (0.250)
8 (0.315)
1.75 (0.069)
11.5 (0.453)
12.4 (0.488)
24 (0.945)
0.3 (0.012)
0.3 (0.012)
1.9 (0.075)
7.35 (0.289)
Cathode/Collector Side
'
Version 1.6 SFH 4232A
Tape dimensions [mm]
Tape dim ensions in m m
Reel dimensions [mm]
Reel dim ensions in m m
Barcode-Product-Label (BPL)
Tape and Reel
24 mm tape with 800 pcs. on ∅ 180 mm reel
WP0P1P2D0E F
3R:! 3M 'M
M
M M 4M M
A W Nmin W1W2max
' 3 2! 33R :3
D0
2
P
P
0
1
P
W
F E
Direction of unreeling
N
W1
2
W
A
OHAY0324
Label
Leader:
Trailer:
13.0
Direction of unreeling
±0.25
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
OHA04563
(G) GROUP:
1234567890(1T) LOT NO: (9D) D/C: 1234
(X) PROD NO: 123456789
(6P) BATCH NO: 1234567890
LX XXXX
RoHS Compliant
BIN1: XX-XX-X-XXX-X
ML
XTemp ST
XXX °C X
Pack: RXX
DEMY XXX
X_X123_1234.1234 X
9999(Q)QTY:
Semiconductors
OSRAM Opto
XX-XX-X-X
EXAMPLE
X_X123_1234.1234 XX_X123_1234.1234 X
EXAMPLE
EXAMPLE
EXAMPLE
XXXXXX
X_X123_1234.1234 XX_X123_1234.1234 X
XX-XX-X-XXX-XX-X-X
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
XXXXXX
X_X123_1234.1234 XX_X123_1234.1234 X
XX-XX-X-XXX-XX-X-X
EXAMPLE
Pack: RXX
XXX
X_X123_1234.1234 XX_X123_1234.1234 X
XX-XX-X-X
EXAMPLE
Pack: RXXPack: RXX
DEMY DEMY
EXAMPLE
12341234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:(9D) D/C:
12341234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
1234
EXAMPLE
Pack: RXXPack: RXX
DEMY
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:(9D) D/C:
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:
(9D) D/C:
1234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
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EXAMPLE
EXAMPLE
EXAMPLE
12345678901234567890
EXAMPLE
EXAMPLE
EXAMPLE
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EXAMPLE
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EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(6P) BATCH NO:(6P) BATCH NO:
12345678901234567890
SemiconductorsSemiconductors
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(6P) BATCH NO:(6P) BATCH NO:
12345678901234567890
EXAMPLE
SemiconductorsSemiconductors
OSRAM OptoOSRAM Opto
EXAMPLE
EXAMPLE
1234567890
X_X123_1234.1234 X
Pack: RXX
DEMY
X_X123_1234.1234 X
(9D) D/C:
1234
(9D) D/C:
1234567890
(6P) BATCH NO:
1234567890
OSRAM Opto
XXX
X_X123_1234.1234 X
XX-XX-X-X
Pack: RXX
DEMY
Semiconductors
Version 1.6 SFH 4232A
N
Dry Packing Process and Materials
FH
&)%)+%%*%%%%
%%)+%9%&
+B1-1$
Transportation Packing and Materials
Dimensions of transportation box in mm
Width Length Height
NM NM 3M
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10% bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
OHA02044
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY:2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18DEMY
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
1
1
(1T) LOT NO:
210021998
123GH1234
02
4 5
(Q)QTY:2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18DEMY
OSRAM
Packing
Sealing label
Barcode label
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Barcode label
Version 1.6 SFH 4232A
Disclaimer
)&%)%&*%
Attention please!
,%*))%*%%%
,%&%%&%-S)
%*
8)S)(@/
)%%%%.)%&
Packing
0)+")T
G+)+*+.%U*)8)+
%%*%).&&
%
Components used in life-support devices or systems must be expressly authorized for such purpose!
$ )V * % )) %&VV ) ))&
@(;@(
V# ; ) ) % )) %& * *
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Version 1.6 SFH 4232A
Glossary
# Typical Values: - ) % ) 1-. ) %
% ) , %
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*%
Version 1.6 SFH 4232A
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
