FREQUENCY MULTIPLIERS - PASSIVE - CHIP
2
2 - 10
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC204
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 4 - 8 GHz INPUT
v04.0907
General Description
Features
Functional Diagram
Conversion Loss: 17 dB
Fo, 3Fo, 4Fo Isolation: 38 dB
Passive: No Bias Required
Electrical Speci cations, TA = +25° C, As a Function of Drive Level
Typical Applications
The HMC204 is suitable for:
• Wireless Local Loop
• LMDS, VSAT, and Point-to-Point Radios
• Test Equipment
The HMC204 is a passive miniature frequency
doubler in a MMIC die. Suppression of undesired fun-
damental and higher order harmonics is 38 dB typical
with respect to input signal level. The doubler utilizes
the same GaAs Schottky diode/balun technology
found in Hittite MMIC mixers. It features small size,
no DC bias, and no measurable additive phase noise
onto the multiplied signal.
Input = +10 dBm Input = +12 dBm Input = +15 dBm
Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Units
Frequency Range, Input 5.5 - 7.5 5.0 - 8.0 4.0 - 8.0 GHz
Frequency Range, Output 11.0 - 15.0 10.0 - 16.0 8.0 - 16.0 GHz
Conversion Loss 17 20 17 20 18 21 dB
FO Isolation
(with respect to input level) 41 45 dB
3FO Isolation
(with respect to input level) 42 46 dB
4FO Isolation
(with respect to input level) 35 38 dB
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
2
2 - 11
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Conversion Gain
vs Temperature @ +15 dBm Drive Level Isolation @ +15 dBm Drive Level*
Input Return Loss vs. Drive Level
Output Return Loss for
Several Input Frequencies
*With respect to input level
-40
-35
-30
-25
-20
-15
-10
-5
0
3456789
+25 C
-55 C
+85 C
CONVERSION GAIN (dB)
INPUT FREQUENCY (GHz)
-20
-15
-10
-5
0
8 10121416
4 GHz In
6 GHz In
8 GHz In
RETURN LOSS (dB)
OUTPUT FREQUENCY (GHz)
-20
-15
-10
-5
0
3456789
Pin = + 8 dBm
Pin = +10 dBm
Pin = +12 dBm
Pin = +14 dBm
RETURN LOSS (dB)
INPUT FREQUENCY (GHz)
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
0 5 10 15 20 25 30 35
Fo
3Fo
4Fo
ISOLATION (dB)
FREQUENCY (GHz)
HMC204
v04.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 4 - 8 GHz INPUT
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
2
2 - 12
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Conversion Gain @ 25°C vs. Drive Level Output Return Loss with 4 GHz Input
Conversion Gain @ -55°C vs. Drive Level
Output Return Loss with 8 GHz Input
Conversion Gain @ +85°C vs. Drive Level
Output Return Loss with 6 GHz Input
-20
-15
-10
-5
0
8 10121416
+8 dBm
+10 dBm
+12 dBm
RETURN LOSS (dB)
OUTPUT FREQUENCY (GHz)
-40
-35
-30
-25
-20
-15
-10
-5
0
3456789
+8 dBm
+10 dBm
+12 dBm
+15 dBm
CONVERSION GAIN (dB)
INPUT FREQUENCY (GHz)
-20
-15
-10
-5
0
8 10121416
+8 dBm
+12 dBm
+10 dBm
RETURN LOSS (dB)
OUTPUT FREQUENCY (GHz)
-40
-35
-30
-25
-20
-15
-10
-5
0
3456789
+8 dBm
+10 dBm
+12 dBm
+15 dBm
CONVERSION GAIN (dB)
INPUT FREQUENCY (GHz)
-20
-15
-10
-5
0
8 10121416
+8 dBm
+10 dBm
+12 dBm
RETURN LOSS (dB)
OUTPUT FREQUENCY (GHz)
-40
-35
-30
-25
-20
-15
-10
-5
0
3456789
+10 dBm
+12 dBm
+15 dBm
+8 dBm
CONVERSION GAIN (dB)
INPUT FREQUENCY (GHz)
HMC204
v04.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 4 - 8 GHz INPUT
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
2
2 - 13
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Absolute Maximum Ratings
Outline Drawing
NOTES:
1. DIE THICKNESS IS 0.100 [0.004], BACKSIDE IS GROUND
2. BOND PADS ARE 0.100 [0.004] SQUARE
3. BOND PAD SPACING, CTR-CTR: 0.150 [0.006]
4. ALL DIMENSION IN INCHES [MILLIMETERS]
5. ALL TOLERANCES ARE ±0.025 [±0.001]
6. BOND PAD METALLIZATION: GOLD
7. BACKSIDE METALLIZATION: GOLD
Input Drive +27 dBm
Storage Temperature -65 to +150 °C
Operating Temperature -55 to +85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information [1]
Standard Alternate
WP-2 (Waffle Pack) [2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
HMC204
v04.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 4 - 8 GHz INPUT
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
2
2 - 14
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC204
v04.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 4 - 8 GHz INPUT
Pad Description
Pad Number Function Description Interface Schematic
1RFIN Pad is DC coupled
and matched to 50 Ohms.
2RFOUT Pad is AC coupled
and matched to 50 Ohms.
Die Bottom GND Die bottom must be connected to RF/DC ground.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
2
2 - 15
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD
protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry
nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning sys-
tems.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias
cables to minimize inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The
surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or  ngers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive
epoxy. The mounting surface should be clean and  at.
Epoxy Die Attach:
Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy  llet is observed around the perim-
eter of the chip once it is placed into position.
Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of
150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use
the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and
terminated on the package. RF bonds should be as short as possible.
HMC204
v04.0907
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 4 - 8 GHz INPUT
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D