ADC088S102 www.ti.com SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 ADC088S102 8-Channel, 500 kSPS to 1 MSPS, 8-Bit A/D Converter Check for Samples: ADC088S102 FEATURES DESCRIPTION * * * * * The ADC088S102 is a low-power, eight-channel CMOS 8-bit analog-to-digital converter specified for conversion throughput rates of 500 kSPS to 1 MSPS. The converter is based on a successiveapproximation register architecture with an internal track-and-hold circuit. It can be configured to accept up to eight input signals at inputs IN0 through IN7. 1 2 Eight Input Channels Variable Power Management Independent Analog and Digital Supplies SPI/QSPI/MICROWIRE/DSP Compatible Packaged in 16-Lead TSSOP APPLICATIONS * * * * * The output serial data is straight binary and is compatible with several standards, such as SPI, QSPI, MICROWIRE, and many common DSP serial interfaces. Automotive Navigation Portable Systems Medical Instruments Mobile Communications Instrumentation and Control Systems The ADC088S102 may be operated with independent analog and digital supplies. The analog supply (VA) can range from +2.7V to +5.25V, and the digital supply (VD) can range from +2.7V to VA. Normal power consumption using a +3V or +5V supply is 1.8 mW and 8.0 mW, respectively. The power-down feature reduces the power consumption to 0.03 W using a +3V supply and 0.15 W using a +5V supply. KEY SPECIFICATIONS * * * * Conversion Rate: 500 kSPS to 1 MSPS DNL (VA = VD = 5.0 V): 0.3 LSB (max) INL (VA = VD = 5.0 V): 0.2 LSB (max) Power Consumption - 3V Supply: 1.8 mW (typ) - 5V Supply: 8.0 mW (typ) The ADC088S102 is packaged in a 16-lead TSSOP package. Operation is specified over the extended industrial temperature range of -40C to +105C. Connection Diagram CS 1 16 SCLK VA 2 15 DOUT AGND 3 14 DIN IN0 4 13 VD IN1 5 12 DGND ADC088S102 IN2 6 11 IN7 IN3 7 10 IN6 IN4 8 9 IN5 Figure 1. 16-Lead TSSOP See Package Number PW0016A 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2005-2013, Texas Instruments Incorporated ADC088S102 SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 www.ti.com Block Diagram IN0 . . . MUX T/H 10-BIT SUCCESSIVE APPROXIMATION ADC VA AGND AGND IN7 VD SCLK ADC088S102 CONTROL LOGIC CS DIN DOUT DGND Pin Descriptions and Equivalent Circuits Pin No. Symbol Equivalent Circuit Description ANALOG I/O 4 - 11 IN0 to IN7 Analog inputs. These signals can range from 0V to VREF. DIGITAL I/O 16 SCLK Digital clock input. The specified performance range of frequencies for this input is 8 MHz to 16 MHz. This clock directly controls the conversion and readout processes. 15 DOUT Digital data output. The output samples are clocked out of this pin on the falling edges of the SCLK pin. 14 DIN Digital data input. The ADC088S102's Control Register is loaded through this pin on rising edges of the SCLK pin. 1 CS Chip select. On the falling edge of CS, a conversion process begins. Conversions continue as long as CS is held low. 2 VA Positive analog supply pin. This voltage is also used as the reference voltage. This pin should be connected to a quiet +2.7V to +5.25V source and bypassed to GND with 1 F and 0.1 F monolithic ceramic capacitors located within 1 cm of the power pin. 13 VD Positive digital supply pin. This pin should be connected to a +2.7V to VA supply, and bypassed to GND with a 0.1 F monolithic ceramic capacitor located within 1 cm of the power pin. POWER SUPPLY 3 AGND The ground return for the analog supply and signals. 12 DGND The ground return for the digital supply and signals. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 ADC088S102 www.ti.com SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 Absolute Maximum Ratings (1) (2) Analog Supply Voltage VA -0.3V to 6.5V Digital Supply Voltage VD -0.3V to VA + 0.3V, max 6.5V -0.3V to VA +0.3V Voltage on Any Pin to GND Input Current at Any Pin (3) Package Input Current 10 mA (3) 20 mA See (4) Power Dissipation at TA = 25C ESD Susceptibility Human Body Model 2500V Machine Model 250V For soldering specifications: see product folder at http://www.ti.com/lit/SNOA549C Junction Temperature +150C Storage Temperature -65C to +150C (1) (2) (3) (4) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND or VIN > VA or VD), the current at that pin should be limited to 10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two. The absolute maximum junction temperature (TJmax) for this device is 150C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (JA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax - TA)/JA. In the 16-pin TSSOP, JA is 96C/W, so PDMAX = 1,200 mW at 25C and 625 mW at the maximum operating ambient temperature of 105C. Note that the power consumption of this device under normal operation is a maximum of 12 mW. The values for maximum power dissipation listed above will be reached only when the ADC088S102 is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided. Operating Ratings (1) (2) -40C TA +105C Operating Temperature VA Supply Voltage +2.7V to +5.25V VD Supply Voltage +2.7V to VA Digital Input Voltage 0V to VA Analog Input Voltage 0V to VA Clock Frequency (1) (2) 8 MHz to 16 MHz Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. All voltages are measured with respect to GND = 0V, unless otherwise specified. Package Thermal Resistance Package JA 16-lead TSSOP on 4-layer, 2 oz. PCB 96C / W Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 3 ADC088S102 SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 www.ti.com ADC088S102 Converter Electrical Characteristics (1) The following specifications apply for VA = VD = +2.7V to +5.25V, AGND = DGND = 0V, fSCLK = 8 MHz to 16 MHz, fSAMPLE = 500 kSPS to 1 MSPS, and CL = 50pF, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25C. Parameter Test Conditions Limits Typ (2) Units 8 Bits STATIC CONVERTER CHARACTERISTICS Resolution with No Missing Codes INL Integral Non-Linearity (End Point Method) 0.05 0.2 LSB (max) DNL Differential Non-Linearity 0.06 0.3 LSB (max) VOFF Offset Error +0.6 0.7 LSB (max) OEM Offset Error Match 0.02 0.2 LSB (max) FSE Full Scale Error +0.5 0.6 LSB (max) FSEM Full Scale Error Match 0.02 0.2 LSB (max) DYNAMIC CONVERTER CHARACTERISTICS FPBW Full Power Bandwidth (-3dB) SINAD Signal-to-Noise Plus Distortion Ratio fIN = 40.2 kHz, -0.02 dBFS 49.6 49.2 SNR Signal-to-Noise Ratio fIN = 40.2 kHz, -0.02 dBFS 49.6 49.3 dB (min) THD Total Harmonic Distortion fIN = 40.2 kHz, -0.02 dBFS -71.2 -63.7 dB (max) SFDR Spurious-Free Dynamic Range fIN = 40.2 kHz, -0.02 dBFS 67.9 63.9 dB (min) ENOB Effective Number of Bits fIN = 40.2 kHz 7.95 7.88 Bits (min) ISO Channel-to-Channel Isolation fIN = 20 kHz 69.6 dB Intermodulation Distortion, Second Order Terms fa = 19.5 kHz, fb = 20.5 kHz -75.5 dB Intermodulation Distortion, Third Order Terms fa = 19.5 kHz, fb = 20.5 kHz -71.8 dB IMD 8 MHz dB (min) ANALOG INPUT CHARACTERISTICS VIN Input Range IDCL DC Leakage Current CINA Input Capacitance 0 to VA V 1 A (max) Track Mode 33 pF Hold Mode 3 pF DIGITAL INPUT CHARACTERISTICS VA = VD = +2.7V to +3.6V 2.1 VA = VD = +4.75V to +5.25V 2.4 V (min) VA = VD = +2.7V to +5.25V 0.8 V (max) 0.01 1 A (max) 2 4 pF (max) VIH Input High Voltage VIL Input Low Voltage IIN Input Current VIN = 0V or VD CIND Digital Input Capacitance V (min) DIGITAL OUTPUT CHARACTERISTICS VOH Output High Voltage ISOURCE = 200 A VOL Output Low Voltage ISINK = 200 A to 1.0 mA, IOZH, IOZL Hi-Impedance Output Leakage Current COUT Hi-Impedance Output Capacitance (1) 2 Output Coding (1) (2) 4 VD - 0.5 V (min) 0.4 V (max) 1 A (max) 4 pF (max) Straight (Natural) Binary Data sheet min/max specification limits are ensured by design, test, or statistical analysis. Tested limits are ensured to TI's AOQL (Average Outgoing Quality Level). Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 ADC088S102 www.ti.com SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 ADC088S102 Converter Electrical Characteristics(1) (continued) The following specifications apply for VA = VD = +2.7V to +5.25V, AGND = DGND = 0V, fSCLK = 8 MHz to 16 MHz, fSAMPLE = 500 kSPS to 1 MSPS, and CL = 50pF, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25C. Parameter Test Conditions Typ Limits (2) Units POWER SUPPLY CHARACTERISTICS (CL = 10 pF) VA, VD Analog and Digital Supply Voltages Total Supply Current Normal Mode ( CS low) IA + ID Total Supply Current Shutdown Mode (CS high) Power Consumption Normal Mode ( CS low) PC Power Consumption Shutdown Mode (CS high) VA VD 2.7 V (min) 5.25 V (max) VA = VD = +2.7V to +3.6V, fSAMPLE = 1 MSPS, fIN = 40 kHz 0.6 1.2 mA (max) VA = VD = +4.75V to +5.25V, fSAMPLE = 1 MSPS, fIN = 40 kHz 1.6 2.2 mA (max) VA = VD = +2.7V to +3.6V, fSCLK = 0 kSPS 10 nA VA = VD = +4.75V to +5.25V, fSCLK = 0 kSPS 30 nA VA = VD = +3.0V fSAMPLE = 1 MSPS, fIN = 40 kHz 1.8 3.6 mW (max) VA = VD = +5.0V fSAMPLE = 1 MSPS, fIN = 40 kHz 8.0 11.0 mW (max) VA = VD = +3.0V fSCLK = 0 kSPS 0.03 W VA = VD = +5.0V fSCLK = 0 kSPS 0.15 W AC ELECTRICAL CHARACTERISTICS fSCLKMIN Minimum Clock Frequency fSCLK Maximum Clock Frequency fS Sample Rate Continuous Mode tCONVERT Conversion (Hold) Time DC SCLK Duty Cycle tACQ Acquisition (Track) Time Throughput Time tAD 0.8 50 MHz (min) MHz (max) 500 kSPS (min) 1 MSPS (max) 13 SCLK cycles 30 40 % (min) 70 60 % (max) 3 SCLK cycles 16 SCLK cycles Acquisition Time + Conversion Time Aperture Delay 8 16 4 ns Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 5 ADC088S102 SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 www.ti.com ADC088S102 Timing Specifications The following specifications apply for VA = VD = +2.7V to +5.25V, AGND = DGND = 0V, fSCLK = 8 MHz to 16 MHz, fSAMPLE = 500 kSPS to 1 MSPS, and CL = 50pF. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25C. Parameter Limits Typ (1) Units tCSH CS Hold Time after SCLK Rising Edge 0 10 ns (min) tCSS CS Setup Time prior to SCLK Rising Edge 5 10 ns (min) tEN CS Falling Edge to DOUT enabled 5 30 ns (max) tDACC DOUT Access Time after SCLK Falling Edge 17 27 ns (max) tDHLD DOUT Hold Time after SCLK Falling Edge 4 tDS DIN Setup Time prior to SCLK Rising Edge 3 10 ns (min) tDH DIN Hold Time after SCLK Rising Edge 3 10 ns (min) tCH SCLK High Time 0.4 x tSCLK ns (min) tCL SCLK Low Time 0.4 x tSCLK ns (min) CS Rising Edge to DOUT HighImpedance tDIS (1) Test Conditions ns (typ) DOUT falling 2.4 20 ns (max) DOUT rising 0.9 20 ns (max) Tested limits are ensured to TI's AOQL (Average Outgoing Quality Level). Timing Diagrams Power Down Power Up Track Power Up Hold Track Hold CS 1 2 3 4 5 6 8 7 9 10 11 12 13 14 15 1 16 2 3 4 5 6 7 8 SCLK Control register DIN DOUT ADD2 ADD1 ADD0 ADD2 DB9 FOUR ZEROS DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 ADD1 ADD0 DB9 SIX ZEROS DB8 DB7 Figure 2. ADC088S102 Operational Timing Diagram CS tCONVERT tACQ tCH SCLK 1 2 3 6 DB9 FOUR ZEROS DOUT 5 7 14 8 15 16 tDACC tDHLD tCL tEN DB8 DB7 DB6 tDIS B1 DB0 TWO ZEROS tDH tDS DIN 4 DONTC DONTC ADD2 ADD1 ADD0 DONTC DONTC DONTC Figure 3. ADC088S102 Serial Timing Diagram 6 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 ADC088S102 www.ti.com SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 SCLK tCSS CS tCSH CS Figure 4. SCLK and CS Timing Parameters Specification Definitions ACQUISITION TIME is the time required for the ADC to acquire the input voltage. During this time, the hold capacitor is charged by the input voltage. APERTURE DELAY is the time between the fourth falling edge of SCLK and the time when the input signal is internally acquired or held for conversion. CONVERSION TIME is the time required, after the input voltage is acquired, for the ADC to convert the input voltage to a digital word. CHANNEL-TO-CHANNEL ISOLATION is resistance to coupling of energy from one channel into another channel. CROSSTALK is the coupling of energy from one channel into another channel. This is similar to Channel-toChannel Isolation, except for the sign of the data. DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1 LSB. DUTY CYCLE is the ratio of the time that a repetitive digital waveform is high to the total time of one period. The specification here refers to the SCLK. EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise and Distortion or SINAD. ENOB is defined as (SINAD - 1.76) / 6.02 and says that the converter is equivalent to a perfect ADC of this (ENOB) number of bits. FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental drops 3 dB below its low frequency value for a full scale input. GAIN ERROR is the deviation of the last code transition (111...110) to (111...111) from the ideal (VREF - 1.5 LSB), after adjusting for offset error. INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from negative full scale (1/2 LSB below the first code transition) through positive full scale (1/2 LSB above the last code transition). The deviation of any given code from this straight line is measured from the center of that code value. INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components as a result of two sinusoidal frequencies being applied to an individual ADC input at the same time. It is defined as the ratio of the power in either the second or the third order intermodulation products to the sum of the power in both of the original frequencies. Second order products are fa fb, where fa and fb are the two sine wave input frequencies. Third order products are (2fa fb ) and (fa 2fb). IMD is usually expressed in dB. MISSING CODES are those output codes that will never appear at the ADC outputs. The ADC088S102 is specified not to have any missing codes. OFFSET ERROR is the deviation of the first code transition (000...000) to (000...001) from the ideal (i.e. GND + 0.5 LSB). SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal to the rms value of the sum of all other spectral components below one-half the sampling frequency, not including harmonics or d.c. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 7 ADC088S102 SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 www.ti.com SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the rms value of the input signal to the rms value of all of the other spectral components below half the clock frequency, including harmonics but excluding d.c. SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the input signal and the peak spurious signal where a spurious signal is any signal present in the output spectrum that is not present at the input, including harmonics but excluding d.c. TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dBc, of the rms total of the first five harmonic components at the output to the rms level of the input signal frequency as seen at the output. THD is calculated as THD = 20 x log10 A f22 + + A f62 A f12 where * Af1 is the RMS power of the input frequency at the output and Af2 through Af6 are the RMS power in the first 5 harmonic frequencies. THROUGHPUT TIME is the minimum time required between the start of two successive conversions. It is the acquisition time plus the conversion time. 8 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 ADC088S102 www.ti.com SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 Typical Performance Characteristics VA = VD = +5.0V, TA = +25C, fSAMPLE = 1 MSPS, fSCLK = 16 MHz, fIN = 40.2 kHz unless otherwise stated. DNL DNL Figure 5. Figure 6. INL INL Figure 7. Figure 8. DNL vs. Supply INL vs. Supply Figure 9. Figure 10. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 9 ADC088S102 SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) VA = VD = +5.0V, TA = +25C, fSAMPLE = 1 MSPS, fSCLK = 16 MHz, fIN = 40.2 kHz unless otherwise stated. 10 SNR vs. Supply THD vs. Supply Figure 11. Figure 12. ENOB vs. Supply DNL vs. VD with VA = 5.0 V Figure 13. Figure 14. INL vs. VD with VA = 5.0 V DNL vs. SCLK Duty Cycle Figure 15. Figure 16. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 ADC088S102 www.ti.com SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 Typical Performance Characteristics (continued) VA = VD = +5.0V, TA = +25C, fSAMPLE = 1 MSPS, fSCLK = 16 MHz, fIN = 40.2 kHz unless otherwise stated. INL vs. SCLK Duty Cycle SNR vs. SCLK Duty Cycle Figure 17. Figure 18. THD vs. SCLK Duty Cycle ENOB vs. SCLK Duty Cycle Figure 19. Figure 20. DNL vs. SCLK INL vs. SCLK Figure 21. Figure 22. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 11 ADC088S102 SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) VA = VD = +5.0V, TA = +25C, fSAMPLE = 1 MSPS, fSCLK = 16 MHz, fIN = 40.2 kHz unless otherwise stated. 12 SNR vs. SCLK THD vs. SCLK Figure 23. Figure 24. ENOB vs. SCLK DNL vs. Temperature Figure 25. Figure 26. INL vs. Temperature SNR vs. Temperature Figure 27. Figure 28. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 ADC088S102 www.ti.com SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 Typical Performance Characteristics (continued) VA = VD = +5.0V, TA = +25C, fSAMPLE = 1 MSPS, fSCLK = 16 MHz, fIN = 40.2 kHz unless otherwise stated. THD vs. Temperature ENOB vs. Temperature Figure 29. Figure 30. SNR vs. Input Frequency THD vs. Input Frequency Figure 31. Figure 32. ENOB vs. Input Frequency Power Consumption vs. SCLK Figure 33. Figure 34. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 13 ADC088S102 SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 www.ti.com FUNCTIONAL DESCRIPTION The ADC088S102 is a successive-approximation analog-to-digital converter designed around a chargeredistribution digital-to-analog converter. ADC088S102 OPERATION Simplified schematics of the ADC088S102 in both track and hold operation are shown in Figure 35 and Figure 36 respectively. In Figure 35, the ADC088S102 is in track mode: switch SW1 connects the sampling capacitor to one of eight analog input channels through the multiplexer, and SW2 balances the comparator inputs. The ADC088S102 is in this state for the first three SCLK cycles after CS is brought low. Figure 36 shows the ADC088S102 in hold mode: switch SW1 connects the sampling capacitor to ground, maintaining the sampled voltage, and switch SW2 unbalances the comparator. The control logic then instructs the charge-redistribution DAC to add or subtract fixed amounts of charge to or from the sampling capacitor until the comparator is balanced. When the comparator is balanced, the digital word supplied to the DAC is the digital representation of the analog input voltage. The ADC088S102 is in this state for the last thirteen SCLK cycles after CS is brought low. IN0 CHARGE REDISTRIBUTION DAC MUX SAMPLING CAPACITOR SW1 IN7 SW2 CONTRO L LOGI C + - AGND VA /2 Figure 35. ADC088S102 in Track Mode IN0 CHARGE REDISTRIBUTION DAC MUX IN7 SAMPLING CAPACITOR + SW1 SW2 CONTROL LOGIC - AGND VA /2 Figure 36. ADC088S102 in Hold Mode SERIAL INTERFACE An operational timing diagram and a serial interface timing diagram for the ADC088S102 are shown in The Timing Diagrams section. CS, chip select, initiates conversions and frames the serial data transfers. SCLK (serial clock) controls both the conversion process and the timing of serial data. DOUT is the serial data output pin, where a conversion result is sent as a serial data stream, MSB first. Data to be written to the ADC088S102's Control Register is placed on DIN, the serial data input pin. New data is written to DIN with each conversion. A serial frame is initiated on the falling edge of CS and ends on the rising edge of CS. Each frame must contain an integer multiple of 16 rising SCLK edges. The ADC's DOUT pin is in a high impedance state when CS is high and is active when CS is low. Thus, CS acts as an output enable. Similarly, SCLK is internally gated off when CS is brought high. 14 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 ADC088S102 www.ti.com SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 During the first 3 cycles of SCLK, the ADC is in the track mode, acquiring the input voltage. For the next 13 SCLK cycles the conversion is accomplished and the data is clocked out. SCLK falling edges 1 through 4 clock out leading zeros, falling edges 5 through 12 clock out the conversion result, MSB first, and falling edges 13 through 16 clock out trailing zeros. If there is more than one conversion in a frame (continuous conversion mode), the ADC will re-enter the track mode on the falling edge of SCLK after the N*16th rising edge of SCLK and re-enter the hold/convert mode on the N*16+4th falling edge of SCLK. "N" is an integer value. The ADC088S102 enters track mode under three different conditions. In Figure 2, CS goes low with SCLK high and the ADC enters track mode on the first falling edge of SCLK. In the second condition, CS goes low with SCLK low. Under this condition, the ADC automatically enters track mode and the falling edge of CS is seen as the first falling edge of SCLK. In the third condition, CS and SCLK go low simultaneously and the ADC enters track mode. While there is no timing restriction with respect to the falling edges of CS and SCLK, see Figure 4 for setup and hold time requirements for the falling edge of CS with respect to the rising edge of SCLK. During each conversion, data is clocked into a control register through the DIN pin on the first 8 rising edges of SCLK after the fall of CS. The control register is loaded with data indicating the input channel to be converted on the subsequent conversion (see Table 1 Table 2 Table 3). The user does not need to incorporate a power-up delay or dummy conversions as the ADC088S102 is able to acquire the input signal to full resolution in the first conversion immediately following power-up. The first conversion result after power-up will be that of IN0. Table 1. Control Register Bits Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 DONTC DONTC ADD2 ADD1 ADD0 DONTC DONTC DONTC Table 2. Control Register Bit Descriptions Bit #: Symbol: Description 7, 6, 2, 1, 0 DONTC Don't care. The values of these bits do not affect the device. 5 ADD2 4 ADD1 These three bits determine which input channel will be sampled and converted at the next conversion cycle. The mapping between codes and channels is shown in Table 3. 3 ADD0 Table 3. Input Channel Selection ADD2 ADD1 ADD0 Input Channel 0 0 0 IN0 (Default) 0 0 1 IN1 0 1 0 IN2 0 1 1 IN3 1 0 0 IN4 1 0 1 IN5 1 1 0 IN6 1 1 1 IN7 ADC088S102 TRANSFER FUNCTION The output format of the ADC088S102 is straight binary. Code transitions occur midway between successive integer LSB values. The LSB width for the ADC088S102 is VA / 256. The ideal transfer characteristic is shown in Figure 37. The transition from an output code of 0000 0000 to a code of 0000 0001 is at 1/2 LSB, or a voltage of VA / 512. Other code transitions occur at steps of one LSB. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 15 ADC088S102 SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 www.ti.com 111...111 111...000 | | ADC CODE 111...110 1 LSB = VA / 1024 011...111 000...010 | 000...001 000...000 0V +VA - 1.5LSB 0.5LSB ANALOG INPUT Figure 37. Ideal Transfer Characteristic ANALOG INPUTS An equivalent circuit for one of the ADC088S102's input channels is shown in Figure 38. Diodes D1 and D2 provide ESD protection for the analog inputs. The operating range for the analog inputs is 0 V to VA. Going beyond this range will cause the ESD diodes to conduct and result in erratic operation. The capacitor C1 in Figure 38 has a typical value of 3 pF and is mainly the package pin capacitance. Resistor R1 is the on resistance of the multiplexer and track / hold switch and is typically 500 ohms. Capacitor C2 is the ADC088S102 sampling capacitor, and is typically 30 pF. The ADC088S102 will deliver best performance when driven by a low-impedance source (less than 100 ohms). This is especially important when using the ADC088S102 to sample dynamic signals. Also important when sampling dynamic signals is a band-pass or lowpass filter which reduces harmonics and noise in the input. These filters are often referred to as anti-aliasing filters. VA D1 R1 C2 30 pF VIN C1 3 pF D2 Conversion Phase - Switch Open Track Phase - Switch Closed Figure 38. Equivalent Input Circuit DIGITAL INPUTS AND OUTPUTS The ADC088S102's digital inputs (SCLK, CS, and DIN) have an operating range of 0 V to VA. They are not prone to latch-up and may be asserted before the digital supply (VD) without any risk. The digital output (DOUT) operating range is controlled by VD. The output high voltage is VD - 0.5V (min) while the output low voltage is 0.4V (max). 16 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 ADC088S102 www.ti.com SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 Applications Information TYPICAL APPLICATION CIRCUIT A typical application is shown in Figure 39. The split analog and digital supply pins are both powered in this example by the TI LP2950 low-dropout voltage regulator. The analog supply is bypassed with a capacitor network located close to the ADC088S102. The digital supply is separated from the analog supply by an isolation resistor and bypassed with additional capacitors. The ADC088S102 uses the analog supply (VA) as its reference voltage, so it is very important that VA be kept as clean as possible. Due to the low power requirements of the ADC088S102, it is also possible to use a precision reference as a power supply. To minimize the error caused by the changing input capacitance of the ADC088S102, a capacitor is connected from each input pin to ground. The capacitor, which is much larger than the input capacitance of the ADC088S102 when in track mode, provides the current to quickly charge the sampling capacitor of the ADC088S102. An isolation resistor is added to isolate the load capacitance from the input source. 51: LP2950 0.1 PF VD 22: INPUT 0.1 PF 1.0 PF VA IN0 1 nF . . . ADC088S102 IN7 5V 1.0 PF 0.1 PF 1 PF SCLK CS DIN MICROPROCESSOR DSP DOUT AGND DGND Figure 39. Typical Application Circuit POWER SUPPLY CONSIDERATIONS There are three major power supply concerns with this product: power supply sequencing, power management, and the effect of digital supply noise on the analog supply. Power Supply Sequence The ADC088S102 is a dual-supply device. The two supply pins share ESD resources, so care must be exercised to ensure that the power is applied in the correct sequence. To avoid turning on the ESD diodes, the digital supply (VD) cannot exceed the analog supply (VA) by more than 300 mV, not even on a transient basis. Therefore, VA must ramp up before or concurrently with VD. Power Management The ADC088S102 is fully powered-up whenever CS is low and fully powered-down whenever CS is high, with one exception. If operating in continuous conversion mode, the ADC088S102 automatically enters power-down mode between SCLK's 16th falling edge of a conversion and the SCLK's 1st falling edge of the subsequent conversion (see Figure 2). In continuous conversion mode, the ADC088S102 can perform multiple conversions back to back. Each conversion requires 16 SCLK cycles and the ADC088S102 will perform conversions continuously as long as CS is held low. Continuous mode offers maximum throughput. In burst mode, the user may trade off throughput for power consumption by performing fewer conversions per unit time. This means spending more time in power-down mode and less time in normal mode. By utilizing this technique, the user can achieve very low sample rates while still utilizing an SCLK frequency within the electrical specifications. The Power Consumption vs. SCLK curve in the Typical Performance Curves section shows the typical power consumption of the ADC088S102. To calculate the power consumption (PC), simply multiply the fraction of time spent in the normal mode (tN) by the normal mode power consumption (PN), and add the fraction of time spent in shutdown mode (tS) multiplied by the shutdown mode power consumption (PS) as shown in Figure 40. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 17 ADC088S102 SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 www.ti.com PC = tN tN + tS u PN + tS tN + tS u PS Figure 40. Power Consumption Equation Power Supply Noise Considerations The charging of any output load capacitance requires current from the digital supply, VD. The current pulses required from the supply to charge the output capacitance will cause voltage variations on the digital supply. If these variations are large enough, they could degrade SNR and SINAD performance of the ADC. Furthermore, if the analog and digital supplies are tied directly together, the noise on the digital supply will be coupled directly into the analog supply, causing greater performance degradation than would noise on the digital supply alone. Similarly, discharging the output capacitance when the digital output goes from a logic high to a logic low will dump current into the die substrate, which is resistive. Load discharge currents will cause "ground bounce" noise in the substrate that will degrade noise performance if that current is large enough. The larger the output capacitance, the more current flows through the die substrate and the greater the noise coupled into the analog channel. The first solution to keeping digital noise out of the analog supply is to decouple the analog and digital supplies from each other or use separate supplies for them. To keep noise out of the digital supply, keep the output load capacitance as small as practical. If the load capacitance is greater than 50 pF, use a 100 series resistor at the ADC output, located as close to the ADC output pin as practical. This will limit the charge and discharge current of the output capacitance and improve noise performance. Since the series resistor and the load capacitance form a low frequency pole, verify signal integrity once the series resistor has been added. LAYOUT AND GROUNDING Capacitive coupling between the noisy digital circuitry and the sensitive analog circuitry can lead to poor performance. The solution is to keep the analog circuitry separated from the digital circuitry and the clock line as short as possible. Digital circuits create substantial supply and ground current transients. The logic noise generated could have significant impact upon system noise performance. To avoid performance degradation of the ADC088S102 due to supply noise, do not use the same supply for the ADC088S102 that is used for digital logic. Generally, analog and digital lines should cross each other at 90 to avoid crosstalk. However, to maximize accuracy in high resolution systems, avoid crossing analog and digital lines altogether. It is important to keep clock lines as short as possible and isolated from ALL other lines, including other digital lines. In addition, the clock line should also be treated as a transmission line and be properly terminated. The analog input should be isolated from noisy signal traces to avoid coupling of spurious signals into the input. Any external component (e.g., a filter capacitor) connected between the converter's input pins and ground or to the reference input pin and ground should be connected to a very clean point in the ground plane. We recommend the use of a single, uniform ground plane and the use of split power planes. The power planes should be located within the same board layer. All analog circuitry (input amplifiers, filters, reference components, etc.) should be placed over the analog power plane. All digital circuitry and I/O lines should be placed over the digital power plane. Furthermore, all components in the reference circuitry and the input signal chain that are connected to ground should be connected together with short traces and enter the analog ground plane at a single, quiet point. 18 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 ADC088S102 www.ti.com SNAS339B - SEPTEMBER 2005 - REVISED MARCH 2013 REVISION HISTORY Changes from Revision A (March 2013) to Revision B * Page Changed layout of National Data Sheet to TI format .......................................................................................................... 18 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: ADC088S102 19 PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) ADC088S102CIMT/NOPB ACTIVE TSSOP PW 16 92 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 105 088S102 CIMT ADC088S102CIMTX/NOPB ACTIVE TSSOP PW 16 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 105 088S102 CIMT (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 6-Nov-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device ADC088S102CIMTX/NOP B Package Package Pins Type Drawing TSSOP PW 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.95 B0 (mm) K0 (mm) P1 (mm) 5.6 1.6 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 6-Nov-2015 *All dimensions are nominal Device ADC088S102CIMTX/NOP B Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TSSOP PW 16 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE PW0016A TSSOP - 1.2 mm max height SCALE 2.500 SMALL OUTLINE PACKAGE SEATING PLANE C 6.6 TYP 6.2 A 0.1 C PIN 1 INDEX AREA 14X 0.65 16 1 2X 5.1 4.9 NOTE 3 4.55 8 9 B 0.30 0.19 0.1 C A B 16X 4.5 4.3 NOTE 4 1.2 MAX (0.15) TYP SEE DETAIL A 0.25 GAGE PLANE 0.15 0.05 0 -8 0.75 0.50 DETAIL A A 20 TYPICAL 4220204/A 02/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. www.ti.com EXAMPLE BOARD LAYOUT PW0016A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE SYMM 16X (1.5) (R0.05) TYP 1 16 16X (0.45) SYMM 14X (0.65) 8 9 (5.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK OPENING METAL UNDER SOLDER MASK METAL SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.05 MAX ALL AROUND NON-SOLDER MASK DEFINED (PREFERRED) 0.05 MIN ALL AROUND SOLDER MASK DEFINED SOLDER MASK DETAILS 15.000 4220204/A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN PW0016A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 16X (1.5) SYMM (R0.05) TYP 1 16X (0.45) 16 SYMM 14X (0.65) 8 9 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4220204/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. 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