Description
This family of T-13/4 tinted, diffused LED lamps is
widely used in general purpose indicator applications.
Diusants, tints, and optical design are balanced to yield
superior light output and wide viewing angles. Several
intensity choices are available in each color for increased
design exibility.
Features
• High intensity
• Choice of 4 bright colors
– High Eciency Red
– Orange
– Yellow
– High Performance Green
• Popular T-13/4 diameter package
• Selected minimum intensities
• Wide viewing angle
• General purpose leads
• Reliable and rugged
• Available on tape and reel
Selection Guide
Luminous Intensity
Material/ Iv (mcd) at 10 mA
Color Part Number Min. Max.
HLMP-3301 5.4 –
HLMP-3301-D00xx 2.1 –
GaP HER HLMP-3301-F00xx 5.4 –
HLMP-3301-FG0xx 5.4 17.2
HLMP-3762 8.6 –
HLMP-3762-G00xx 8.6 –
HLMP-3401 5.7 –
HLMP-3401-E00xx 5.7 –
HLMP-3401-EF0xx 5.7 18.4
GaP Yellow HLMP-3401-EFBxx 5.7 18.4
HLMP-3862 9.2 –
HLMP-3862-F00xx 9.2 –
HLMP-3862-FGBxx 9.2 29.4
HLMP-D401 5.4 –
GaP Orange HLMP-D401-D00xx 2.1 –
HLMP-D401-EF0xx 3.4 10.8
HLMP-D401-F00xx 5.4 –
HLMP-3507 4.2 –
HLMP-3507-D00xx 4.2 –
GaP Green HLMP-3507-EF0xx 6.7 21.2
HLMP-3962 10.6 –
HLMP-3962-F00xx 10.6 –
HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762,
HLMP-3862, HLMP-3962, HLMP-D401
T-13/4 (5 mm) Diused LED Lamps
Data Sheet
2
Package Dimensions
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Option
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
B1: Right Angle Housing, Uneven Leads
B2: Right Angle Housing, Even Leads
DD: Ammo Pack
R4: Tape & Reel, Counter Clockwise
Color Bin Options
0: Full Color Bin Distribution
B: Color Bins 2 & 3 only
Maximum Iv Bin Options
0: Open (no max. limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Brightness Level
0x: Less Brightness
62: Higher Brightness
Color Options
3,7: GaP HER
4,8: GaP Yellow (except D4xx)
5,9: GaP Green
Package Options
3: T-1 3/4 (5 mm)
D: T-1 3/4 (5 mm) GaP Orange
3
Optical/Electrical Characteristics at TA = 25°C
Test
Symbol Parameter Color Min. Typ. Max. Units Condition
2q1/2 Included Angle High Eciency Red 60 Deg. IF = 10 mA
Between Half Orange 60 See Note 1
Luminous Intensity Yellow 60
Points Green 60
lPEAK Peak Wavelength High Eciency Red 635 nm Measurement
Orange 600 at Peak
Yellow 583
Green 565
Dl1/2 Spectral Line Halfwidth HER/Orange 40 nm
Yellow 36
Green 28
ld Dominant Wavelength High Eciency Red 626 nm See Note 2
Orange 602
Yellow 585
Green 569
ts Speed of Response High Eciency Red 90 ns
Orange 280
Yellow 90
Green 500
C Capacitance High Eciency Red 11 pF VF = 0;
Orange 4 f = 1 MHz
Yellow 15
Green 18
RqJ-PIN Thermal Resistance All 260 °C/W Junction to
Cathode Lead
VF Forward Voltage HER/Orange 1.9 2.4 V IF = 10 mA
Yellow 2.0 2.4
Green 2.1 2.7
VR Reverse Breakdown All 5.0 V IR = 100 µA
Voltage
hV Luminous Ecacy High Eciency Red – 145 lumens See Note 3
Orange 380 Watt
Yellow – 500
Green 595
Notes:
1. q1/2 is the o-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which denes the color of
the device.
3. Radiant intensity, Ie, in Watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the
luminous ecacy in lumens/Watt.
4
Figure 1. Relative intensity vs. wavelength
Absolute Maximum Ratings at TA = 25°C
Green/
Parameter HER/Orange Yellow Emerald Green Units
Peak Forward Current 90 60 90 mA
Average Forward Current[1] 25 20 25 mA
DC Current[2] 30 20 30 mA
Power Dissipation[3] 135 85 135 mW
Reverse Voltage (IR = 100 µA) 5 5 5 V
Transient Forward Current[4] 500 500 500 mA
(10 µsec Pulse)
LED Junction Temperature 110 110 110 °C
Operating Temperature Range -40 to +100 -40 to +100 -20 to +100 °C
Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 °C
Notes:
1. See Figure 5 (Red/Orange), 10 (Yellow), or 15 (Green) to establish pulsed operating conditions.
2. For Red, Orange and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C.
3. 1.8 mW/°C. For Yellow series derate power linearly from 50°C at 1.6 mW/°C.
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maxi-
mum Ratings.
ORANGE
WAVELENGTH – nm
RELATIVE INTENSITY
1.0
0.5
0500 550 600 650 700 750
YELLOW
EMERALD GREEN
GREEN
T = 25° C
A
HIGH EFFICIENCY RED
5
T-13/4 High Eciency Red, Orange Diused Lamps
Figure 3. Relative luminous intensity vs.
DC forward current
Figure 2. Forward current vs. forward voltage
characteristics
Figure 4. Relative eciency (luminous intensity per
unit current) vs. peak LED current
Figure 5. Maximum tolerable peak current vs.
pulse duration. (IDC MAX as per MAX ratings)
Figure 6. Relative luminous intensity vs. angular displacement
6
T-13/4 Yellow Diused Lamps
Figure 8. Relative luminous intensity vs.
forward current
Figure 7. Forward current vs. forward voltage
characteristics
Figure 9. Relative eciency (luminous intensity per
unit current) vs. peak current
Figure 10. Maximum tolerable peak current vs.
pulse duration. (IDC MAX as per MAX ratings)
Figure 11. Relative luminous intensity vs. angular displacement
7
T-13/4 Green/Emerald Green Diused Lamps
Figure 15. Maximum tolerable peak current vs.
pulse duration. (IDC MAX as per MAX ratings)
Figure 16. Relative luminous intensity vs. angular displacement
Figure 12. Forward current vs. forward voltage
characteristics
Figure 13. Relative luminous intensity vs.
DC forward current
Figure 14. Relative eciency (luminous intensity per
unit current) vs. peak LED current
8
Intensity Bin Limits
Intensity Range (mcd)
Color Bin Min. Max.
D 2.4 3.8
E 3.8 6.1
F 6.1 9.7
G 9.7 15.5
H 15.5 24.8
I 24.8 39.6
J 39.6 63.4
K 63.4 101.5
L 101.5 162.4
M 162.4 234.6
N 234.6 340.0
Red/Orange O 340.0 540.0
P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
E 6.5 10.3
F 10.3 16.6
G 16.6 26.5
H 26.5 42.3
I 42.3 67.7
J 67.7 108.2
K 108.2 173.2
L 173.2 250.0
M 250.0 360.0
Yellow N 360.0 510.0
O 510.0 800.0
P 800.0 1250.0
Q 1250.0 1800.0
R 1800.0 2900.0
S 2900.0 4700.0
T 4700.0 7200.0
U 7200.0 11700.0
V 11700.0 18000.0
W 18000.0 27000.0
9
Intensity Bin Limits, continued
Intensity Range (mcd)
Color Bin Min. Max.
D 4.7 7.6
E 7.6 12.0
F 12.0 19.1
G 19.1 30.7
H 30.7 49.1
I 49.1 78.5
J 78.5 125.7
K 125.7 201.1
L 201.1 289.0
Green M 289.0 417.0
N 417.0 680.0
O 680.0 1100.0
P 1100.0 1800.0
Q 1800.0 2700.0
R 2700.0 4300.0
S 4300.0 6800.0
T 6800.0 10800.0
U 10800.0 16000.0
V 16000.0 25000.0
W 25000.0 40000.0
Maximum tolerance for each bin limit is ±18%.
Tolerance for each bin limit is ±0.5 nm.
Color Categories
Lambda (nm)
Color Category # Min. Max.
6 561.5 564.5
5 564.5 567.5
Green 4 567.5 570.5
3 570.5 573.5
2 573.5 576.5
1 582.0 584.5
3 584.5 587.0
Yellow 2 587.0 589.5
4 589.5 592.0
5 592.0 593.0
1 597.0 599.5
2 599.5 602.0
3 602.0 604.5
Orange 4 604.5 607.5
5 607.5 610.5
6 610.5 613.5
7 613.5 616.5
8 616.5 619.5
10
Mechanical Option Matrix
Mechanical Option Code Denition
00 Bulk Packaging, minimum increment 500 pcs/bag
01 Tape & Reel, crimped leads, minimum increment 1300 pcs/bag
02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag
B1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
B2 Right Angle Housing, even leads, minimum increment 500 pcs/bag
DD Ammo Pack, straight leads with minimum increment 2K/pack
R4 Tape & Reel, straight leads, counter clockwise, anode lead leaving the reel rst
Note:
All categories are established for classication of products. Products may not be available in all categories. Please contact your local Avago repre-
sentative for further clarication/information.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4258EN
AV02-1558EN - October 13, 2008
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must be
taken to avoid any excessive mechanical stress induced
to LED package. Otherwise, cut the leads of LED to length
after soldering process at room temperature. The solder
joint formed will absorb the mechanical stress of the
lead cutting from traveling to the LED chip die attach
and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those parts
without stando.
• Recommended soldering conditions:
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell time
in the solder wave. Customer is advised to periodically
check on the soldering prole to ensure the soldering
prole used is always conforming to recommended
soldering condition.
• If necessary, use xture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive thermal
stresses to LED components when heated. Therefore,
the soldered PCB must be allowed to cool to room
temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
Manual Solder
Wave Soldering Dipping
Pre-heat Temperature 105 °C Max. –
Pre-heat Time 30 sec Max. –
Peak Temperature 250 °C Max. 260 °C Max.
Dwell Time 3 sec Max. 5 sec Max.
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm
(0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch)
0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
Figure 17. Recommended wave soldering prole
LAMINAR WAVE BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT WAVE
FLUXING
PREHEAT
0 10 20
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – °C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.