F High Surge Film Surge Film TM Surface Mount Metal Glaze ce Mount Metal GlazeTM HSF 1 Watt and 1/2 Watt power rating HSF Series Metal GlazeTM thick film element fired at 1000C to solid ceramic *High Surge Film maximum operating temperature * 150C and 1/2 Watt power rating TM RoHS - compatible available Mountcomponents Metal Glaze *Surface maximum operating temperature * Up to triple the surge rating of the rugged CHP1 - Compatible Components Available costly surface-mount wirewound resistors * Replaces Metal GlazeTM thick film element fired at 1000C to solid ceramic * 1 Watt and 1/2 ratingCHP1 riple the surge rating of Watt the power rugged * 150C maximum operating temperature ces costly surface-mount wirewound resistors * RoHS - Compatible Components Available 60/40 SolderHigh over temperature nickel barrier * Up to triple the surge rating of the rugged CHP1 * Replaces costly surface-mount wirewound resistors dielectric coating 60/40 Solder over nickel barrier cal Data y nt High temperature dielectric coating Electrical Data Maximum Tolerance TCR IRC Working Maximum Resistance Tolerance TCR Product Maximum Industry Power IRC Rating Working Maximum Resistance Range (:) (%) (ppm/C) Type VoltageVoltageVoltage Power Rating Range (:) (%) (ppm/C) Category Footprint Type Voltage 2010 HSF-1/2 2512 HSF-1 HSF-1/2 1/2W @ 70C 1/2W @ 70C 300 HSF-1 1W @ 70C 1W @ 70C 350 300 700700 350 * * * * 10 * 10 * 10 10 200 High Surge 200 200 High Surge 200 Produ Catego High Su High Su Note*: Consult factory for available resistance values and maximum voltage. actory for available resistance values and maximum voltage. Environmental Data Characteristics Maximum Change nmental Data Temperature Coefficient Thermal Shock haracteristics As specified Low Temperature Operation 0.5% +0.01 ohm 0.5% +0.01 ohm High Temperature Exposure Solderability 2.5 x P x R for 5 seconds MIL-R-55342H Par 4.7.3 (-65C +150C, 5 cycles) MIL-R-55342H Par 4.7.6 (+150C for 100 hours) MIL-R-55342H Par 4.7.4 (-65C @ working voltage) MIL-R-55342H Par 4.7.7 (reflow soldered to board at 260C for 10 seconds) Par 4.7.5 95% min. coverageMIL-R-55342H MIL-STD-202, Method 208 (245C for 5 seconds) 0.5% +0.01 ohm Moisture Resistance Life Test perature Exposure MIL-R-55342H Par 4.7.5 0.25% +0.01 ohm Exposure MIL-R-55342H Par 4.7.4 (-65C @ working voltage) MIL-R-55342H Par 4.7.9 (-55C +125C) 0.5% +0.01 ohm perature Operation Resistance to Bonding 0.25% +0.01 ohm e Overload MIL-R-55342H Par 4.7.3 (-65CTest +150C, 5 cycles) Method 0.25% +0.01 ohm As specified Short Time Overload Shock MIL-R-55342H Par 4.7.9 (-55C +125C) +0.01 ohm Maximum0.5% Change ure Coefficient Test Method 0.5% +0.01 ohm 2.5MIL-R-55342H x P x R Par for4.7.8 5 seconds (10 cycles, total 240 hours) 0.5%ohm +0.01 ohm MIL-R-55342H MIL-R-55342H Par 4.7.10 (2000 hours at 70C 0.5% +0.01 Par 4.7.6 (+150C for intermittent) 100 hours) 1% +0.01 ohm Terminal Adhesion Strength 1200 gram push from underside of mounted chip for 60 seconds ce to Bonding no mechanical damage 0.25% +0.01 ohm MIL-R-55342H Par 4.7.7 (reflow soldered to board at 260C for 10 seco Resistance to Board bending lity General Note Resistance General Note Chip mounted in center of 90mm long board, deflected 5mm so 1% +0.01 ohm no mechanical damage as to exert pull on chip contacts for 10 seconds 95% min. coverage MIL-STD-202, Method 208 (245C for 5 seconds) 0.5% +0.01 ohm MIL-R-55342H Par 4.7.8 (10 cycles, total 240 hours) TT electronics reserves rightinto make changes in product without notice or liability. IRC reserves the right to makethe changes product specifi cation without notice orspecification liability. All is subject to IRC's own data and is considered at time going to print.accurate at time of going to print. Allinformation information is subject to TT electronics' ownaccurate data and is of considered 0.5% +0.01 ohm Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com (c) TT electronics plc 1% +0.01 ohm A subsidiary of www.bitechnologies.com www.irctt.com www.welwyn-tt.com TT electronics plc MIL-R-55342H Par 4.7.10 (2000 HSF-1 hours at 70C intermittent) Series Issue October 2010 Sheet 1 of 4 Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA 09. 11 HSF High Surge Film Surface Mount Film Metal GlazeTM High Surge HSF Series Mount Metal GlazeTM Surface Physical Data L C W Dimensions (Inches and (mm)) Industry Footprint IRC Type L (Length) W (Width/Diameter) C (Termination Width) 2010 HSF-1/2 0.200 0.010 (5.08 0.25) 0.079 0.006 (2.01 0.15) 0.030 0.010 (0.761 0.25) 2512 HSF-1 0.251 0.010 (6.38 0.25) 0.079 0.006 (2.01 0.15) 0.040 0.010 (1.02 0.25) 3612 HSF-2 0.367 0.010 (9.32 0.25) 0.105 0.006 (2.67 0.15) 0.050 0.010 (1.27 0.25) Recommended Solder Pad Dimensions (Reflow): F B A C A E D Industry Footprint Dimensions (Inches and mm)) A B C D E F HSF 1/2 2010 0.111 (1.93) 0.126 (2.36) 0.096 (1.47) 0.152 (2.49) 0.040 (0.81) 0.211 (5.36) HSF 1 2512 0.121 (3.07) 0.126 (3.20) 0.127 (3.23) 0.183 (4.65) 0.040 (1.02) 0.369 (9.37) HSF 2 3610 0.17 (4.32) 0.16 (4.06) 0.213 (5.41) 0.273 (6.93) 0.044 (1.12) 0.553 (14.05) Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com HSF-1 Series Issue October 2010 Sheet 2 of 4 General Note TT electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT electronics' own data and is considered accurate at time of going to print. www.bitechnologies.com www.irctt.com www.welwyn-tt.com (c) TT electronics plc 09. 11 HSF High Surge Film High Surge Surface Mount Film Metal GlazeTM TM Surface HSF Series Mount Metal Glaze IRC Solder Reflow Recommendations Sn-Pb Eutectic and Pb-Free Reflow Profiles tP TP Ramp-up Critical Zone TL to TP TL tL Temperature Tsmax Tsmin ts Preheat 25 Ramp-down t 25C to Peak Time * Based on Industry Standards and IPC recommendations Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 3C / second max. 3C / second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100C 150C 60 -120 seconds 150C 200C 60 -180 seconds Time maintained above - Temperature (TL) - Time (tL) 183C 60 - 150 seconds 217C 60 - 150 seconds Peak Temperature (TP) See Table 1 See Table 2 Average Ramp-up rate (Tsmax to Tp) Time within 5C of actual Peak Temperature (tp)2 Ramp-down Rate Time 25C to Peak Temperature 10 - 30 seconds 20 - 40 seconds 6C / second max. 6C / second max. 6 minutes max. 8 minutes max. Tabel 1: SnPb Eutectic Process Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 350 < 2.5 mm 240 +0/-5C 225 +0/-5C 2.5 mm 225 +0/-5C 225 +0/-5C Tabel 2: Pb-free Process Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 350 - 2000 Volume mm3 > 2000 < 1.6 mm 260C * 260C * 260C * 1.6 mm - 2.5 mm 260C * 250C * 245C * 2.5 mm 250C * 245C * 245C * Note 1: All temperatures refer to topside of the package, measured on the package body surface. Note 2: Time within 5 C of actual peak temperature (tp) specied for the reow proles is a "supplier" minimum and a "user" maximum. Note 1: Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks. Note 2: The maximum component temperature reached during reow depends on package thickness and volume. The use of convection reow processess reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. Note 3: Components intended for use in "leadfree" assembly process shall be evaluated using the "lead-free" peak temperature and proles dened in Table 1, 2 and reow prole whether or not lead-free. * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classication temperature at the rated MSL level. Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com General Note TT electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT electronics' own data and is considered accurate at time of going to print. HSF-1 Series Issue October 2010 Sheet 3 of 4 www.bitechnologies.com www.irctt.com www.welwyn-tt.com (c) TT electronics plc 09. 11 HSF High Surge Film High Film GlazeTM SurfaceSurge Mount Metal HSF Series Mount Metal GlazeTM Surface Surge Capability Data For Non-repetitive or Low Repetitive Rate Surges 1000000 Peak Power (Watts) 100000 10000 1000 100 10 1 1.0E-09 1.0E-08 1.0E-07 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 1.0E+00 Surge or Pulse Duration (Seconds) Power Derating Curve Note: Percent of Rated Power 100 80 Use for low repetitive pulses where the average power dissipation is not to exceed the component rating at 70C. Surge handling capacity for low-repetitive surges may be significantly greater than shown above. Contact factory 60 40 20 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Ambient Temperature (C) Ordering Data Sample Part No. HSF-1 100 11R0 K LF 13 IRC Type HSF-1/2 or HSF-1 Temperature Coefficient 50 = 50ppm/C; 100 = 100ppm/C Resistance Value Standard 4-digit resistance code. Consult factory for available values. Tolerance K = 10% Lead-Free Construction Packaging Code BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com HSF-1 Series Issue October 2010 Sheet 4 of 4 General Note TT electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT electronics' own data and is considered accurate at time of going to print. www.bitechnologies.com www.irctt.com www.welwyn-tt.com (c) TT electronics plc 09. 11