Low IQ, Low Dropout 900mA Fixed Voltage Regulator
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Features
Applications
• Notebook Computer
• PDA or Portable Equipments
• Noise-Sensitive Instrumentation Systems
• Low Noise : 50µVRMS (100Hz to 100kHz)
• Low Quiescent Current : 50µA (No load)
• Low Dropout Voltage : 210mV (@900mA)
• Very Low Shutdown Current : < 1µA
• Fixed Output Voltage : 1.3V ~ 3.4V
• Stable with 4.7µF Output Capacitor
• Stable with Aluminum , Tantalum, or Ceramic
Capacitors
• Reverse Current Protection
• No Protection Diodes Needed
• Built-in Thermal Protection
• Built-in Current Limit Protection
• Controlled Short Circuit Current : 200mA
• Fast Transient Response
• Short Setting Time
• SOT-89, SOT-89-5, SOT-223, SOP-8 ,TO-252,
and TO-252-5 Packages
• Lead Free and Green Devices Available
(RoHS Compliant)
Pin Configuration
SOT-89 (Top View)SOP-8 (Top View)
SOT-223 (Top View)TO-252-5 (Top View)
General Description
The APL5901/2 is a micropower, low noise, and low drop-
out linear regulator. Operate from 2.7V to 6V input voltage
and deliver up to 900mA. Typical output noise is just
50µVRMS with the addition of an external 0.1µF bypass ca-
pacitor in the BP pin and the typical dropout voltage is only
210mV at 900mA loading. Designed for use in battery-
powered system, the low 50µA quiescent current makes
it an ideal choice.
Design with an internal P-channel MOSFET pass
transistor, the APL5901/2 maintain a low supply current,
independent of the load current and dropout voltage. Other
features including reverse current protection, thermal-
shutdown protection, and current-limit protection ensure
specified output current and controlled short-circuit
current. The APL5901/2 regulator come in a miniature
SOT-89, SOT-89-5, SOT-223, SOP-8, TO-252, and TO-
252-5 packages.
TO-252 (Top View)
APL5901
SOT-89-5 (Top View)
SOT-223 (Top View)
APL5902
1
2
3
4 5
6
7
8IN
GND
GND
SHDN BYP
GND
GND
OUT
TAB is GND
1 2 3
VOUTVIN
VIN GND VOUT
1 2 3
TAB is GND
VINVOUTGND
1 2 3
TAB is VOUT
VINGNDVOUT
1 2 3
5 4
SHDNBP GND
VOUT
GNDVIN
1 2 3
TAB is GND
BP
VOUT
GND
VIN
1
2
3
4
5
TAB is GND
SHDN
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw2
Ordering and Marking Information
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Symbol Parameter Rating Unit
VIN, VOUT Input Voltage or Out Voltage 6.5 V
SHDN
Shutdown Control Pin 6.5 V
PD Power Dissipation Internally Limited W
TSTG Storage Temperature Range -65 to +150 °C
TL Lead Temperature, 10 Seconds 260 °C
Note 1 : Stresses beyond the absolute maximum rating may damage the device and exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Absolute Maximum Ratings (Note 1)
Symbol Parameter Typical Value Unit
RTH,JA
Thermal Resistance – Junction to Ambient SOT-89
SOT-223
SOP-8
TO-252
180
135
150
50
°C/W
RTH,JC
Thermal Resistance – Junction to Case SOT-89
SOT-223
SOP-8
TO-252
38
15
20
6
°C/W
TJ Operating Junction Temperature
Control Section
Power Transistor
0 to 125
0 to 150 °C
Thermal Characteristics
Package Code
D : SOT-89 D5 : SOT-89-5 U : TO-252
U5 : TO-252-5 V : SOT-223 K : SOP-8
Operating Ambient Temperature Range
C : 0 to 70 oC
Handling Code
TR : Tape & Reel
Voltage Code
13 : 1.3V ~ 34 : 3.4V
Assembly Material
L : Lead Free Device G : Halogen and Lead Free Device
APL5901/2
Handling Code
Temperature Range
Package Code
Voltage Code
APL5901/2
XXXXX13
APL5901/2 13 D/V/K :XXXXX - Date Code , 13 - 1.3V
13
APL5901/2
XXXXX
APL5901/2 13 U :XXXXX - Date Code , 13 - 1.3V
Assembly Material
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw3
Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1µF, COUT=4.7µF, SHDN=VIN, TJ=0 to 125°C.
Typical values refer to TJ=25°C.
Electrical Characteristics
APL5901/2
Symbol
Parameter Test Conditions Min. Typ.
Max. Unit
VIN Input Voltage 2.7 - 6 V
VOUT Output Voltage VOUT+1.0V< VCC<6.0V, 0mA< IOUT < IMAX VOUT –2%
VOUT
VOUT +2%
V
ILIMIT Circuit Current Limit VIN=4.3V - 1.5 - A
ISHORT Short Current VOUT=0V - 200 - mA
IOUT Load Current
900 - - mA
REGLINE
Line Regulation
V
OUT+0.5V< VCC<6.0V, I = 1mA - 4 10 mV
REGLOAD
Load Regulation VIN =VOUT+1.0V, 0mA< IOUT < IMAX - 1 6 mV
1.3V≤VOUT<1.5V - 1100
1300
1.5V≤VOUT<2V - 900 1050
2V≤VOUT<2.5V - 500 700
VDROP Dropout Voltage (Note2) IOUT =900mA
2.5V≤VOUT<3.4V - 280 380
mV
PSRR Ripple Rejection F≤1kHz, 1Vpp at VIN = VOUT+1.0V 55 65 - dB
No load - 50 100
Quiescent Current IOUT=900mA - 370 450 µA
Shutdown Supply Current (Note3)
Shutdown = low
IOUT=0, VCC =6.0V - 0.01
1 µA
100Hz<f<100kHz, typical load,
CBP=0.01µF, COUT = 1µF - 50 - µVrms
Noise (Note3) 100Hz<f<100kHz, typical load,
CBP=0.1µF, COUT = 1µF - 40 -
Shutdown Recovery Delay (Note3)
CBP=0.01µF,COUT=1µF, no load - 7 - ms
IQ
CBP=0.1µF,COUT=1µF, no load - 70 -
OTS Over-Temperature Shutdown - 150 - °C
Over-Temperature Shutdown
Hysteresis Hysteresis - 10 - °C
TC Output-Voltage Temperature
Coefficient - 50 - ppm/°C
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw4
Note 2 : Dropout voltage definition : VIN-VOUT when VOUT is 2% below the value of VOUT for VIN = VOUT + 0.5V
Note 3 : For 5-pin devices only.
Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1µF, COUT=4.7µF, SHDN=VIN, TJ=0 to 125°C.
Typical values refer to TJ=25°C.
Electrical Characteristics (Cont.)
APL5901/2
Symbol
Parameter Test Conditions Min. Typ.
Max. Unit
COUT Output Capacitor 4.2 4.7 5.2 µF
ESR 0.02 0.1 1 Ohm
Shutdown Input
Threshold (Note3) VOUT+1.0V< VIN
<6.0V
0.4 0.7 1.6 V
ISHDN Shutdown input Bias Current
(Note3) VSHDN =VIN - 0.01
100 nA
Input Reverse Leakage Current
VOUT-VIN=0.1V - 0.1 0.5 µA
Reverse Protection
Threshold - 11 50 mV
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw5
APL5901/2-33
APL5901/2-33
APL5901/2-33
0
0.5
1
1.5
2
2.5
3
3.5
0 1 2 3 4 5 6
0
50
100
150
200
250
300
350
0123456
0
50
100
150
200
250
300
350
400
0150 300 450 600 750 900
0
0.5
1
1.5
2
2.5
3
3.5 44.5 55.5 6
Typical Operating Characteristics
Current Limit vs. Input Voltage
Input Voltage (V)
Current Limit (mA)
Ground Pin Current vs. Output Current
Ground Pin Current vs. Load Current (µA)
Output Current (mA)
Ground Pin Current vs. Input Voltage
Input Voltage (V)
Ground Pin Current vs. Load Current (µA)
Input Voltage vs. Output Voltage
Input Voltage (V)
Output Voltage (V)
APL5901/2-33
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw6
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
0150 300 450 600 750 900
APL5901/2-33
-100
+0
-90
-80
-70
-60
-50
-40
-30
-20
-10
20
200k
50
100
200
500
1k
2k
5k
10k
20k
50k
100k
0.4
0.5
0.6
0.7
0.8
0.9
1
33.5 44.5 55.5 6
-12
-10
-8
-6
-4
-2
0
00.5 11.5 22.5 3
SHDN Threshold Voltage vs. Input Voltage
SHDN Threshold Voltage (V)
Input Voltage (V)
PSRR vs. Frequency
Frequency (HZ)
PSRR (dB)
IOUT =50mA
COUT=10µF
CBP=0.1µF
Output Current vs. Output Voltage
Output Current (µA)
Output Voltage (V)Output Current (mA)
Dropout Voltage (mV)
VIN=0V
VIN=0VVIN=4V
VIN=5V
APL5901/2-33
APL5901/2-33
Dropout Voltage vs. Output Current
VOUT=1.5V
VOUT=1.8V
VOUT=3.3V
VOUT=2.5V
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw7
0
50
100
150
200
250
300
350
400
450
500
00.1 0.2 0.3 0.4
-100u
100u
-80u
-60u
-40u
-20u
0
20u
40u
60u
80u
010m
2m 4m 6m 8m
Output Noise
Time (s)
VOUT (50µV/div)
VIN=4.3V
IOUT =0mA
COUT=10uF
CBP=0.1uF
Output Noise vs. Bypass Capacitor
Output Noise (µV)
Bypass Capacitor (µF)
Load-Transient Response
Output Voltage (50mV/div)
Time (10µs/div)
VOUT
IOUT=1mA~900mA
Time (40µs/div)
VOUT
VIN
Line-Transient Response
VIN=VOUT+1V
COUT=4.7µF
Output Voltage (20mV/div)
APL5901/2-33 APL5901/2-33
APL5901/2-33APL5901/2-33
4V
3V
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw8
0.001
0.01
0.1
1
0150 300 450 600 750 900
VOUT
COUT=1µF
No Load
Entering Shutdown
Time (1µs/div)
VOUT
vSHDN
Shutdown Exit Delay
Time (20µs/div)
VOUT
vSHDN
CBP=100nF
No Load
Time (200µs/div)
VOUT=3.3V
Region of Stable ESR vs. Load Current
Load Current (mA)
COUT ESR (Ω)
Shutdown Exit Delay
unstable
stable
APL5901/2-33 APL5901/2-33
APL5901/2-33
APL5901/2-33
3.3V
4V
3.3V
4V
0V
0V
0V
0V
3.3V
4V
0V
0V
CBP=10nF
No Load
Typical Operating Characteristics (Cont.)
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw9
3.25
3.27
3.29
3.31
3.33
3.35
-40 040 80 120
Output Voltage vs. Temperature
Temperature (°C )
Output Voltage (V)
APL5901/2-33
Pin Description
PIN
NO. NAME I/O FUNCTION
1 VIN I Supply voltage input.
2 GND
Ground pins of the circuitry, and all ground pins must be soldered to PCB with proper
power dissipation.
3 SHDN(Note 4)
I Shutdown control pin, low = off , high = normal. Don’t leave open.
4 BP(Note 4) O Bypass signal pin in fixed output type device
5 VOUT O Output pin of the regulator.
Note 4 : These pins do not exist in 3-pin package.
Typical Application Circuit
Typical Operating Characteristics (Cont.)
BP
VOUT
VIN
GND
SHDN
VOUT
CIN
1µFoff
on
APL5901
INPUT
2.7V to 6V
0.01µFCBP
COUT
4.7µF
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw10
The minimum input-output voltage difference (dropout)
determines the lowest usable supply voltage. In battery-
powered systems, this will determine the useful end-of-
life battery voltage. Because the APL5901/2 use a p-chan-
nel MOSFET pass transistor, the dropout voltage is the
function of drain-to-source on-resistance (RDS(ON)) multi-
plied by the load current.
The APL5901/2 load-transient response graphs in typical
characteristics show the transient response. A step change
in the load current from 10mA to 900mA at 10µs will cause
a 20mV transient spike. Larger output capacitor and lower
ESR can reduce transient spike.
Application Information
The APL5901/2 use at least a 1µF capacitor on the input,
and this capacitor can be Aluminum, Tantalum, or Ce-
ramic capacitor. The input capacitor with larger value and
lower ESR provides better PSRR and line-transient
response.
Load-Transient Consideration
Input-Output (Dropout)Voltage
Reverse Current Protection
Current Limit
The APL5901/2 have a current-limit protection. The ouptut
voltage will drop close to zero volt when load current
reaches the limit, and then the load current will be limited
at 200mA after output voltage is below 0.7V. When the
load current back to the value where limiting started, the
output voltage and current will return to normal value.
When output is shortened to the ground, the APL5901/2
will keep short circuit current at 200mA .
Shutdown/Enable
The APL5901/2 have an active high enable function. Force
EN high (>1.6V) enables the regulator, EN low (<0.4V)
disables the regulator and enter the shutdown mode. In
Capacitor Selection and Regulator Stability
The output capacitor also can use Aluminum, Tantalum,
or Ceramic capacitor, and a minimum value of 4.7µF and
ESR above 0.02Ω is recommended. A larger output ca-
pacitor can reduce noise and improve load-transient
response, stability, and PSRR. Note that some ceramic
dielectrics exhibit large capacitance and ESR variation
with temperature. When using this capacitor, a minimum
10µF or more may be required to ensure that the stability
at low temperature operation. Use a bypass capacitor at
BP pin for low output nvise. Increasing the capacitance
will slightly decrease the output noise but increase the
start-up time.
The APL5901/2 have an internal reverse protection, it does
not need an external schottky diode to connect the regu-
lator input and output. If the output voltage is forced above
the input voltage by more than 11mV, the IC will be shut-
down and the ground pin current is below 0.1µA.
Thermal Protection
Thermal protection limits total power dissipation in the
device. When the junction temperature exceeds TJ=+15oC,
the thermal sensor generates a logic signal to turn off the
pass transistor and allows IC to cool. When the IC’s junc-
tion temperature is down by 10oC, the thermal sensor
will turn the pass transistor on again, resulting in a pulsed
output during continuous thermal protection. Thermal
protection is designed to protect the APL5901/2 in the
event of fault conditions. For continuous operation, do
not exceed the absolute maximum junction temperature
of TJ=+150oC.
Operating Region and Power Dissipation
The thermal resistance of the case to circuit board, and
the rate of air flow all control the APL5901/2’s maximum
power dissipation. The power dissipation across the
device is PD = IOUT (VIN-VOUT) and the maximum power dis-
sipation is:
PDMAX = (TJ-TA) / (θJC +θCA)
shutdown mode, the quiescent current can reduce below
1µA. The EN pin cannot be floating, a floating EN pin may
cause an indeterminate state on the output. If it is no use,
connect to VIN for normal operation.
where TJ-TA is the temperature difference between the
junction and ambient air, θJC is the thermal resistance of
the package, and θCA is the thermal resistance through
the printed circuit board, copper traces, and other materi-
als to the ambient air.
The GND pin of the APL5901 provides an electrical con-
nection to the ground and channeling heat away. If power
dissipation is large, connect the GND pin to the ground
using a large pad or a ground plane can improve the
problem of over heat of IC.
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw11
Package Information
SOT-89
S
Y
M
B
OMIN. MAX.
MILLIMETERS
SOT-89
MIN. MAX.
INCHES
A
C
e1
e
B
B1
D
D1
H
EL
E1
1.60
0.44
0.35 0.44
4.40 4.60
1.62 1.83
0.56
2.13
A
B
C
D
D1
E
E1
e
e1
B1 0.36 0.48
3.00 BSC
3.94 4.25
2.29 2.60
2.29
0.118 BSC
0.063
0.017
0.014 0.019
0.014 0.017
0.173 0.181
0.064 0.072
0.084
0.155 0.167
0.090 0.102
0.090
0.022
L0.89 0.035
H
1.50 BSC 0.059 BSC
1.40
1.20 0.047
0.055
L
Note : Follow JEDEC TO-243 AA.
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw12
Package Information
SOT-89-5
S
Y
M
B
OMIN. MAX.
MILLIMETERS
SOT-89-5
MIN. MAX.
INCHES
B
1.60
0.36
0.35 0.44
4.40 4.60
1.62 1.83
0.56
2.13
A
B
C
D
D1
E
E1
e
e1 3.00 BSC
3.94 4.25
2.29 2.60
2.29
0.118 BSC
0.063
0.014
0.014 0.017
0.173 0.181
0.064 0.072
0.084
0.155 0.167
0.090 0.102
0.090
0.022
L0.89 0.035
H
1.50 BSC 0.059 BSC
1.40
1.20 0.047
0.055
L
D
D1
e1
e
EL
E1
AC
H
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw13
Package Information
SOT-223
A
A2
VIEW A
0.25
L
GAUGE PLANE
SEATING PLANE
A1
D
E
e1
e
b2
E1
SEE
VIEW A
c
b
°
0
S
Y
M
B
O
LMIN. MAX.
1.80
0.02
0.66 0.84
2.90 3.10
0.23 0.33
0.10
6.70
A
A1
b
b2
c
D
E
E1
e
MILLIMETERS
A2 1.50 1.70
2.30 BSC
SOT-223
3.30 3.70
6.30 6.70
7.30
0.091 BSC
MIN. MAX.
INCHES
0.071
0.001
0.059 0.067
0.026 0.033
0.114 0.122
0.009 0.013
0.264
0.130 0.146
0.248 0.264
0.287
0.004
0
L0.75 0.030
e1 4.60 BSC 0.181 BSC
°
10
°
0
°
10
°
0
Note : 1. Follow from JEDEC TO-261 AA.
2. Dimension D and E1 are determined at the outermost extremes
of the plastic exclusive of mold flash, tie bar burrs, gate burrs,
and interlead flash, but including any mismatch between the top
and bottom of the plastic body.
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw14
Package Information
TO-252
S
Y
M
B
O
LMIN. MAX.
2.39
4.95 5.46
0.46 0.61
0.13
5.33
A
A1
b3
c
c2
D
D1
E
MILLIMETERS
b0.50 0.89
2.29 BSC
TO-252
4.57
6.35 6.73
6.22
0.090 BSC
MIN. MAX.
INCHES
0.094
0.020 0.035
0.195 0.215
0.018 0.024
0.210
0.180
0.250 0.265
2.18
0.245
0.086
0.005
E1
0.035
0.070
0.410
L3
H
L
e
9.40
0.90
0.46 0.89
1.78
10.41 0.370
0.035
0.018
0.040
L4 1.02
0.150
3.81
0.89 2.03 0.035 0.080
0 8°
0°8°
0°
0
0.25
GAUGE PLANE L
A1
VIEW A
SEATING PLANE
L4 L3
D
E
e
b3
H
A
SEE VIEW A
c2
bc
E1
D1
6.00
Note : Follow JEDEC TO-252 .
6.00
0.236
0.236
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw15
S
Y
M
B
O
LMIN. MAX.
2.39
4.32 5.46
0.46 0.61
0.13
5.33
A
A1
b3
c
c2
D
D1
E
MILLIMETERS
b0.50 0.89
1.27 BSC
TO-252-5
4.57
6.35 6.73
6.22
0.050 BSC
MIN. MAX.
INCHES
0.094
0.020 0.035
0.170 0.215
0.018 0.024
0.210
0.180
0.250 0.265
2.18
0.245
0.086
0.005
E1
0.035
0.070
0.410
L3
H
L
e
9.40
1.40
0.46 0.89
1.78
10.41 0.370
0.055
0.018
0.150
3.81
0.89 2.03 0.035 0.080
00
°
8
°
0
°
8
°
0
0.25
GAUGE PLANE L
A1
VIEW A
SEATING PLANE
L3
D
E
b3
H
A
SEE VIEW A
c2
bc
E1
D1
e
6.00
6.00
0.236
0.236
Package Information
TO-252-5
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw16
Package Information
SOP-8
S
Y
M
B
O
LMIN. MAX.
1.75
0.10
0.17 0.25
0.25
A
A1
c
D
E
E1
e
h
L
MILLIMETERS
b0.31 0.51
SOP-8
0.25 0.50
0.40 1.27
MIN. MAX.
INCHES
0.069
0.004
0.012 0.020
0.007 0.010
0.010 0.020
0.016 0.050
0
0.010
1.27 BSC 0.050 BSC
A2 1.25 0.049
0
°
8
°
0
°
8
°
D
e
E
E1
SEE VIEW A
cb
h X 45
°
A
A1A2
L
VIEW A
0.25
SEATING PLANE
GAUGE PLANE
Note: 1. Follow JEDEC MS-012 AA.
2. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.
3. Dimension “E” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
3.80
5.80
4.80
4.00
6.20
5.00 0.189 0.197
0.228 0.244
0.150 0.157
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw17
Application
A H T1 C d D W E1 F
178.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.50±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
SOT-89
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
4.80±0.20
4.50±0.20
1.80±0.20
Application
A H T1 C d D W E1 F
330.0±2.00
50 MIN.
16.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
16.0±0.30
1.75±0.10
7.50±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
TO-252
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.80±0.20
10.40±0.20
2.50±0.20
Application
A H T1 C d D W E1 F
320.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.00±0.30
1.75±0.10
5.50±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
SOT-223
4.00±0.10
8.00±0.10
2.00±0.50
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.90±0.20
7.50±0.20
2.10±0.20
Application
A H T1 C d D W E1 F
330.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
SOP-8
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.40±0.20
5.20±0.20
2.10±0.20
(mm)
Carrier Tape & Reel Dimensions
A
E1
A
B
W
F
T
P0
OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
H
T1
A
d
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw18
Devices Per Unit
Package Type Unit Quantity
SOT-89 Tape & Reel 1000
TO-252 Tape & Reel 2500
SOT-223 Tape & Reel 2500
SOP-8 Tape & Reel 2500
Taping Direction Information
SOT-89
TO-252
USER DIRECTION OF FEED
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw19
Taping Direction Information
SOT-223
SOP-8
USER DIRECTION OF FEED
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw20
Test item Method Description
SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec
HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C
PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C
TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V
Latch-Up JESD 78 10ms, 1tr > 100mA
Reflow Condition (IR/Convection or VPR Reflow)
t 25 C to Peak
tp
Ramp-up
tL
Ramp-down
ts
Preheat
Tsmax
Tsmin
TL
TP
25
Temperature
Time
Critical Zone
TL to TP
°
Reliability Test Program
Classification Reflow Profiles
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate
(TL to TP) 3°C/second max. 3°C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL) 183°C
60-150 seconds 217°C
60-150 seconds
Peak/Classification Temperature (Tp)
See table 1 See table 2
Time within 5°C of actual
Peak Temperature (tp) 10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright ANPEC Electronics Corp.
Rev. B.3 - Sep., 2008
APL5901/2
www.anpec.com.tw21
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated
classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL
level.
Customer Service
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350
<2.5 mm 240 +0/-5°C 225 +0/-5°C
≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Classification Reflow Profiles (Cont.)
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
