SCHOTTKY RECTIFIER 1.1 Amp
11DQ09
11DQ10
PD-2.289 rev. A 11/97
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Dimensions in millimeters and inches
Conform to JEDEC Outline DO-204AL (DO-41)
CASE STYLE AND DIMENSIONS
Major Ratings and Characteristics
IF(AV) Rectangular 1.1 A
waveform
VRRM 90 / 100 V
IFSM @ tp = 5 µs sine 90 A
VF@ 1 Apk, TJ
= 25°C 0.85 V
TJrange - 40 to 125 °C
Characteristics 11DQ.. Units The 11DQ.. axial leaded Schottky rectifier has been optimized
for very low forward voltage drop, with moderate leakage.
Typical applications are in switching power supplies, convert-
ers, free-wheeling diodes, and reverse battery protection.
Low profile, axial leaded outline
High purity, high temperature epoxy encapsulation for
enhanced mechanical strength and moisture resistance
Very low forward voltage drop
High frequency operation
Guard ring for enhanced ruggedness and long term
reliability
Description/Features
11DQ09, 11DQ10
PD-2.289 rev. A 11/97
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Part number 11DQ09 11DQ10
VRMax. DC Reverse Voltage (V)
VRWM Max. Working Peak Reverse Voltage (V)
Voltage Ratings
90 100
IF(AV) Max. Average Forward Current 1.1 A 50% duty cycle @ TC = 48°C, rectangular wave form
* See Fig. 4
IFSM Max. Peak One Cycle Non-Repetitive 90 5µs Sine or 3µs Rect. pulse
Surge Current * See Fig. 6 15 10ms Sine or 6ms Rect. pulse
Absolute Maximum Ratings
Parameters 11DQ.. Units Conditions
AFollowing any rated
load condition and with
rated VRRM applied
VFM Max. Forward Voltage Drop 0.85 V @ 1A
* See Fig. 1 (1) 0.96 V @ 2A
0.68 V @ 1A
0.78 V @ 2A
IRM Max. Reverse Leakage Current 0.5 mA TJ = 25 °C
* See Fig. 2 (1) 1.0 m A TJ = 125 °C
CTTypical Junction Capacitance 35 pF VR = 5VDC, (test signal range 100Khz to 1Mhz) 25°C
LSTypical Series Inductance 8. 0 n H Measured lead to lead 5mm from package body
TJ = 25 °C
TJ = 125 °C
VR = rated VR
Parameters 11DQ.. Units Conditions
Electrical Specifications
(1) Pulse Width < 300µs, Duty Cycle <2%
TJMax. Junction Temperature Range -40 to 125 °C
Tstg Max. Storage Temperature Range -40 to 125 °C
RthJA Max. Thermal Resistance Junction 130 °C/W DC operation
to Ambient Without cooling fin
RthJA Typical Thermal Resistance Junction 81 °C/W PC board mounted [L = 8mm (0.315 in.)]
to Ambient with PC Board Mounted Solder land area 100mm2 (0.155 in2.)
wt Approximate Weight 0.33(0.012) g (oz.)
Case Style DO-204AL(DO-41)
Thermal-Mechanical Specifications
Parameters 11DQ.. Units Conditions
11DQ09, 11DQ10
PD-2.289 rev. A 11/97
3
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Fig. 3 - Typical Junction Capacitance
Vs. Reverse Voltage
Fig. 2 - Typical Values of Reverse Current
Vs. Reverse Voltage
Fig. 1 - Maximum Forward Voltage Drop Characteristics
0.1
1
10
0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
Instantaneous Forwar d Current - I ( A )
F
FM
T = 1 25 °C
T = 25 ° C
J
J
Forward Voltage Drop - V (V)
0.00001
0.0001
0.001
0.01
0.1
1
0 20406080100
R
R
100°C
75°C
50°C
25°C
R ever se V oltage - V (V)
Reverse Current - I (m A)
T = 125°C
J
10
100
0 20406080100
T = 25 °C
J
R
T
Junction Capacitance - C (pF)
Rev erse Volt age - V (V)
11DQ09, 11DQ10
PD-2.289 rev. A 11/97
4www.irf.com
Fig. 5 - Forward Power Loss CharacteristicsFig. 4 - Maximum Ambient Temperature Vs. Average Forward
Current, Printed Circuit Board Mounted
Fig. 6 - Maximum Non-Repetitive Surge Current
20
30
40
50
60
70
80
90
100
110
120
130
0 0.4 0.8 1.2 1.6
DC
Allow able Case Tempera ture - (°C)
F(AV)
R (D C) = 81°C/W
thJC
Average Forward Current - I (A)
PC Board Mo u nte d
0
0.2
0.4
0.6
0.8
1
1.2
0 0.4 0.8 1.2 1.6
DC
Average Power Lo ss - (W atts)
F(AV)
D = 0. 08
D = 0. 17
D = 0. 25
D = 0. 33
D = 0. 50
RMS Li mi t
Average Forward Current - I (A)
10
100
10 100 1000 10000
FSM
Non-Repetit ive Surge Curre nt - I (A)
At Any Rated Load C ond iti on
And With Rated V Applied
Following Surge
RRM
p
Square Wave Puls e Durat ion - t (micro sec)
