FEATURES BENEFITS
Data rates scalable from 25Gb/s to 56Gb/s to support system
upgrades without costly redesigns
Meets Industry specifications such as Optical Internetworking
Forum (OIC), PCI Express, SATA, Fiber Channel, Infiniband, Ethernet,
SAS, IBTA and IEEE
92Ω nominal impedance Minimizes impedance discontinuities
Backwards mating and footprint compatible with ExaMAX® VS
Unique beam-on-beam interface and skew equalized leadframes Provides low crosstalk while eliminating insertion loss resonances
Reduces mating force up to 65% compared to traditional blade and
beam designs
Durable, reliable mating interface design eliminates crushed pins
2mm pitch for high density application
3mm pitch enables quad routing and lower PCB cost
Optimizes PCB routing
Integrates high and low speed signals in the same connector
Optimizes electrical performance and aspect ratio
Wide product range for various packaging options
Hermaphroditic mating interface protects mating beams
Modular, hard metric connector block design
Zero skew
Additional signal pin per column
High speed signal PCB hole: 0.36mm
Ground pin PCB hole: 0.50mm
12 to 96 differential pair node connector
Integrated guide design Improves mating performance using minimal board space
SUPPORTS MANY INDUSTRY STANDARD
SPECIFICATIONS; MIGRATION PATH TO
HIGHER BANDWIDTH APPLICATIONS
ExaMAX® backplane connector system meets industry
specifications requiring higher bandwidth applications
from 25Gb/s to 56Gb/s. The optimized connector design
delivers superior signal integrity performance resulting in
low crosstalk noise and low insertion loss while minimizing
channel performance variation for every differential pair. Each
signal wafer incorporates an innovative one-piece, embossed
ground structure to improve crosstalk performance through
56Gb/s. The simple, functional design contributes to a very
cost-effective solution.
TARGET MARKETS
EXAMAX® HIGH SPEED
BACKPLANE CONNECTOR SYSTEM
Innovative “pinless” connector system delivering superior
electrical performance at speeds 25 to 56Gb/s
The innovative beam-on-beam contact interface minimizes
residual stub for improved signal integrity performance
while providing exceptionally low mating forces
ExaMAX® optimizes design flexibility by integrating high
speed differential signals, low speed signals and power in
one connector
ExaMAX® product family is offered in industry standard
packaging options including traditional backplane, coplanar
board, orthogonal midplane and orthogonal direct mate,
mezzanine and cable to board