4
Regulatory Information
The HCPL‑T251 is under approval by the following organizations:
UL
Approval under UL 1577, Component Recognition Pro‑
gram, File E55361.
CSA
Approval under CSA Component Acceptance Notice #5,
File CA 88324.
Insulation and Safety Related
Parameter Symbol Value Units Conditions
Minimum External Air Gap L(101) 7.1 mm Measured from input terminals to output
(Clearance) terminals, shortest distance through air.
Minimum External Tracking L(102) 7.4 mm Measured from input terminals to output
(Creepage) terminals, shortest distance path along body.
Minimum Internal Plastic Gap 0.08 mm Insulation thickness between emitter and detector;
(Internal Clearance) also known as distance through insulation
Tracking Resistance CTI ≥175 Volts DIN IEC 112/VDE 0303 Part 1
(Comparative Tracking Index)
Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1)
Absolute Maximum Ratings (Compared with HCPL‑3140)
HCPL-3140 HCPL-T251
Parameter Symbol Units Min. Max. Min. Max. Note
Operating Temperature TA °C ‑40 100 ‑20 85
“High” Peak Output Current IOH(PEAK) A 0.6 0.4 1
“High” Peak Output Current IOL(PEAK) A 0.6 0.4
Storage Temperature TS °C ‑55 125 ‑55 125
Average Input Current IF(AVG) mA 25 20 2
Peak Transient Input Current IF(TRAN) A 1.0 1.0
(<1 µs Pulse Width, 300 pps)
Reverse Input Voltage VR V 5 5
Supply Voltage (VCC ‑ VEE) V ‑0.5 35 ‑0.5 35
Output Voltage VO V 0 VCC 0 VCC
Output Power Dissipation PO mW 250 250 3
Lead Solder Temperature 260°C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile See Package Outline Drawings section
Notes:
1. Maximum pulse width = 10 µs, maximum duty cycle = 0.2%.
2. Derate linearly above 70°C free‑air temperature at a rate of 0.3 mA/°C.
3. Derate lineraly above 70°C free‑air temperature at a rate of 4.8 mW/°C.