MIXERS - DBL-BAL - SMT
9
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC329LM3
GaAs MMIC DOUBLE-BALANCED
SMT MIXER, 26 - 40 GHz
v01.0505
General Description
Features
Functional Diagram
Passive: No DC Bias Required
Input IP3: +19 dBm
LO/RF Isolation: 35 dB
Leadless SMT Package, 25 mm2
Electrical Speci cations, TA = +25° C
Typical Applications
The HMC329LM3 is ideal for:
• Point-to-Point Radios
• Point-to-Multi-Point Radios
• SATCOM
• RADAR
The HMC329LM3 is a 26 - 40 GHz surface mount,
passive, double-balanced MMIC mixer in a SMT
leadless chip carrier package. The mixer can be
used as a downconverter or upconverter. Excellent
isolations are provided by on-chip baluns. The chip
requires no external components and no DC bias.
All data is with the non-hermetic, epoxy sealed LM3
package mounted in a 50 Ohm test  xture. Utilizing
the HMC329LM3 eliminates the need for wire-
bonding, thereby providing a consistent connection
interface for the customer.
Parameter LO = +13 dBm, IF = 1 GHz LO = +13 dBm, IF = 1 GHz Units
Min. Typ. Max. Min. Typ. Max.
Frequency Range, RF & LO 26 - 32 32 - 40 GHz
Frequency Range, IF DC - 8 DC - 8 GHz
Conversion Loss 8 10 9 11 dB
Noise Figure (SSB) 8 10 9 11 dB
LO to RF Isolation 30 37 27 32 dB
LO to IF Isolation 29 35 24 30 dB
RF to IF Isolation 23 28 21 26 dB
IP3 (Input) 16 19 16 20 dBm
IP2 (Input) 45 55 46 56 dBm
1 dB Compression (Input) 9 11 7 10 dBm
* Unless otherwise noted, all measurements performed as downconverter, IF= 1 GHz.
MIXERS - DBL-BAL - SMT
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Conversion Gain vs.
Temperature @ LO = +13 dBm
Conversion Gain vs. LO Drive
Isolation vs.
Frequency @ LO +13 dBm
IF Bandwidth and IF Return Loss
@ LO = +13 dBm
LO and RF Return Loss
@ LO = +13 dBm
Upconverter Performance vs. LO Drive
HMC329LM3
GaAs MMIC DOUBLE-BALANCED
SMT MIXER, 26 - 40 GHz
v01.0505
-20
-16
-12
-8
-4
0
24 27 30 33 36 39 42
+ 25 C
+ 85 C
- 40 C
CONVERSION GAIN (dB)
FREQUENCY (GHz)
-20
-16
-12
-8
-4
0
24 27 30 33 36 39 42
RF RETURN LOSS
LO RETURN LOSS
FREQUENCY (GHz)
RETURN LOSS (dB)
-20
-16
-12
-8
-4
0
024681012
CONVERSION GAIN
IF RETURN LOSS
FREQUENCY (GHz)
RESPONSE (dB)
-20
-16
-12
-8
-4
0
24 27 30 33 36 39 42
+ 9 dBm
+ 11 dBm
+ 13 dBm
+ 15 dBm
FREQUENCY (GHz)
CONVERSION GAIN (dB)
-20
-16
-12
-8
-4
0
24 27 30 33 36 39 42
+ 9 dBm
+ 11 dBm
+ 13 dBm
+ 15 dBm
CONVERSION GAIN (dB)
FREQUENCY (GHz)
-50
-40
-30
-20
-10
0
24 26 28 30 32 34 36 38 40 42
RF/IF
LO/RF
LO/IF
ISOLATION (dB)
FREQUENCY (GHz)
MIXERS - DBL-BAL - SMT
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Input IP2 vs. LO Drive*
Input IP2 vs.
Temperature @ LO = +13 dBm
Input IP3 vs.
Temperature @ LO = +13 dBm
Input P1dB vs.
Temperature @ LO = +13 dBm
Input IP3 vs. LO Drive*
MxN Spurious
Outputs as a Down Converter
* Two-tone input power = -5 dBm each tone, 1 MHz spacing.
nLO
mRF01234
0xx7
119041
2695767
3746971
47474
RF = 31 GHz @ -10 dBm
LO = 32 GHz @ +13 dBm
All values in dBc below IF output power level.
HMC329LM3
GaAs MMIC DOUBLE-BALANCED
SMT MIXER, 26 - 40 GHz
v01.0505
0
5
10
15
20
25
26 28 30 32 34 36 38 40
+ 11 dBm
+ 13 dBm
+ 15 dBm
IP3 (dBm)
FREQUENCY (GHz)
5
7
9
11
13
15
26 28 30 32 34 36 38 40
+ 25 C
+ 85 C
- 40 C
P1dB (dBm)
FREQUENCY (GHz)
40
45
50
55
60
65
70
26 28 30 32 34 36 38 40
+ 25 C
+ 85 C
- 40 C
IP2 (dBm)
FREQUENCY (GHz)
40
45
50
55
60
65
70
26 28 30 32 34 36 38 40
+ 11 dBm
+ 13 dBm
+ 15 dBm
IP2 (dBm)
FREQUENCY (GHz)
0
5
10
15
20
25
26 28 30 32 34 36 38 40
+ 25 C
+ 85 C
- 40 C
IP3 (dBm)
FREQUENCY (GHz)
MIXERS - DBL-BAL - SMT
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20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
RF / IF Input +13 dBm
LO Drive +27 dBm
IF DC Current ±2 mA
Storage Temperature -65 to +150 °C
Operating Temperature -40 to +85 °C
ESD Sensitivity (HBM) Class 1B
Absolute Maximum Ratings
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
NOTES:
1. MATERIAL: PLASTIC
2. PLATING: GOLD OVER NICKEL
3. ALL DIMENSIONS IN INCHES (MILLIMETERS)
4. ALL TOLERANCES ARE ±0.005 (±0.13)
5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND
6. • INDICATES PIN 1
HMC329LM3
GaAs MMIC DOUBLE-BALANCED
SMT MIXER, 26 - 40 GHz
v01.0505
MIXERS - DBL-BAL - SMT
9
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Pin Number Function Description Interface Schematic
1, 2, 3 N/C This pin may be connected to the PCB
ground or left unconnected.
4RF This pin is DC coupled and matched to
50 Ohm from 25 to 40 GHz.
5IF
This pin is DC coupled. For applications not requiring
operation to DC, this port should be DC blocked externally
using a series capacitor whose value has been chosen to
pass the necessary IF frequency range. For operation to
DC, this pin must not source or sink more than 2 mA of cur-
rent or part non-function and possible part failure will result.
6LO This pin is DC coupled and matched to
50 Ohm from 25 to 40 GHz.
GND Package base must be soldered to PCB RF ground.
Pin Descriptions
HMC329LM3
GaAs MMIC DOUBLE-BALANCED
SMT MIXER, 26 - 40 GHz
v01.0505
MIXERS - DBL-BAL - SMT
9
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Evaluation PCB
Evaluation Circuit Board Layout Design Details
Layout Technique Micro Strip to CPWG
Material Rogers 4003 with 1/2 oz. Cu
Dielectric Thickness 0.008” (0.20 mm)
Microstrip Line Width 0.018” (0.46 mm)
CPWG Line Width 0.016” (0.41 mm)
CPWG Line to GND Gap 0.005” (0.13 mm)
Ground Via Hole Diameter 0.008” (0.20 mm)
The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-Signal-Ground
(GSG) probes for testing. Suggested probe pitch is 400 mm (16 mils). Alternatively, the board can be mounted
in a metal housing with 2.4 mm coaxial connectors.
LM3 package mounted to evaluation PCB
HMC329LM3
GaAs MMIC DOUBLE-BALANCED
SMT MIXER, 26 - 40 GHz
v01.0505
MIXERS - DBL-BAL - SMT
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Suggested LM3 PCB Land Pattern
NOTES:
1. DIMENSIONS ARE IN INCHES [MILLIMETERS]
2. PAD WIDTH SHOWN IS FOR SOLDERING ONLY.
BEYOND SOLDERING AREA ALL CONDUCTORS THAT
CARRY RF AND MICROWAVE SIGNALS SHOULD
HAVE 50 OHM CHARACTERISTIC IMPEDANCE.
HMC329LM3
GaAs MMIC DOUBLE-BALANCED
SMT MIXER, 26 - 40 GHz
v01.0505
MIXERS - DBL-BAL - SMT
9
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Recommended SMT Attachment Technique
Preparation & Handling of the LM3 Millimeterwave Package for Surface Mounting
The HMC LM3 package was designed to be compatible with high
volume surface mount PCB assembly processes. The LM3 package
requires a speci c mounting pattern to allow proper mechanical
attachment and to optimize electrical performance at millimeterwave
frequencies. This PCB layout pattern can be found on each LM3
product data sheet. It can also be provided as an electronic drawing
upon request from Hittite Sales & Application Engineering.
Follow these precautions to avoid permanent damage:
Cleanliness: Observe proper handling procedures to ensure clean
devices and PCBs. LM3 devices should remain in their original
packaging until component placement to ensure no contamination or damage to RF, DC & ground contact areas.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
General Handling: Handle the LM3 package on the top with a vacuum collet or along the edges with a sharp pair
of bent tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess
pressure to the top of the lid.
Solder Materials & Temperature Pro le: Follow the information contained in the application note. Hand soldering is
not recommended. Conductive epoxy attachment is not recommended.
Sold er Pa ste: Solder paste should be sel ecte d based o n the u ser’s ex perience and be compatible with the metallization
systems used. See the LM3 data sheet Outline drawing for pin & ground contact metallization schemes.
Solder Paste Application: Solder paste is generally applied to the PCB using either a stencil printer or dot placement.
The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure
consistent mechanical & electrical performance. Excess solder may create unwanted electrical parasitics at high
frequencies.
Solder Re ow: The soldering process is usually accomplished in a re ow oven but may also use a vapor phase
process. A solder re ow pro le is suggested above.
Prior to re owing product, temperature pro les should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and
varying component masses. The  nal pro le should be determined by mounting the thermocouple to the PCB at the
location of the device.
Follow solder paste and oven vendor’s recommendations when developing a solder re ow pro le. A standard pro le
will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock.
Allow enough time between reaching pre-heat temperature and re ow for the solvent in the paste to evaporate and the
ux to completely activate. Re ow must then occur prior to the  ux being completely driven off. The duration of peak
re ow temperature should not exceed 15 seconds. Packages have been quali ed to withstand a peak temperature of
235°C for 15 seconds. Verify that the pro le will not expose device to temperatures in excess of 235°C.
Cleaning: A water-based  ux wash may be used.
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012345678
TEMPERATURE (0C)
TIME (min)
HMC329LM3
GaAs MMIC DOUBLE-BALANCED
SMT MIXER, 26 - 40 GHz
v01.0505