Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010
APL5601/5602
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Low Dropout 600mA Fixed Voltage Linear Regulator
The APL5601/5602 family of low-power and low dropout
linear regulators which operate from 2.9V to 6V input volt-
age and deliver up to 600mA output current. Typical drop-
out voltage is only 220mV (typical) at 600mA output. The
APL5601/5602 regulators with low 140µA quiescent cur-
rent are ideal for battery-powered system appliances. The
APL5601/5602 regulators are stable with a 2.2µF ceramic
capacitor. The features of current-limit, short circuit cur-
rent-limit, and over-temperature protection protect the
device against currnet over loads and overtemperature.
The APL5601/5602 regulators come in SOT-23-3, SOT-
89, and SOT-223 packages.
FeaturesGeneral Description
Applications
•CD/DVD-ROM, CD-R/W
•Networking System, LAN Card, ADSL/Cable Modem
•Set-Top Box
•PC Peripherals
•Battery-Powered System
Simplified Application Circuit
•Low Dropout Voltage: 220mV (Typical) @600mA
• Wide Input Voltage from 2.9V~6V
• Low Quiescent Current: 140µA
• Output Voltage Range : 1~5V
•Fixed Output Voltage with 2% Accuracy
•Stable with a Low ESR, 2.2µF Output Capacitance
•Short Circuit Current-Limit
•Over-Temperature Protection
•Current-Limit Protection
•Internal Soft-Start
•SOT-23-3, SOT-89, and SOT-223 Packages
• Lead Free and Green Devices Available
(RoHS Compliant)
Pin Configuration
VIN VOUT
CIN COUT
1µF2.2µF
VIN VOUT
GND
APL5601/5602
VOUT 2 3 VIN
SOT-23-3
(Top View)
APL5601
GND 1
SOT-223
(Top View)
APL5601
VIN 2
VOUT 3
GND 1
VIN
(Tab)
SOT-89
(Top View)
VIN
(Tab)
VIN 2
VOUT 3
GND 1
APL5601
GND
(Tab)
GND 2
VIN 3
VOUT 1
SOT-89
(Top View)
APL5602
SOT-223
(Top View)
APL5602
GND 2 GND
(Tab)
VIN 3
VOUT 1
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw2
APL5601/5602
Ordering and Marking Information
Marking for SOT-23-3
Product Name Marking
APL5601-10A 61aX
APL5601-12A 615X
APL5601-15A 619X
APL5601-18A 61CX
APL5601-25A 61JX
APL5601-28A 61MX
APL5601-30A 61OX
APL5601-31A 61PX
APL5601-33A 61RX
APL5601-50A 61ZX
Note: The last character in the Marking, “X”, refers to date code.
Absolute Maximum Ratings (Note 2)
Symbol Parameter Rating Unit
VIN VIN Supply Voltage (VIN to GND) -0.3 to 6.5 V
VOUT Output Voltage (VOUT to GND) -0.3 to VIN+0.3 V
PD Power Dissipation Internally Limited
TJ Maximum Junction Temperature 150 oC
TSTG Storage Temperature Range -65 to 150 oC
TSDR Maximum Lead Soldering Temperature, 10 Seconds 260 oC
Note 2: Stresses beyond the absolute maximum rating may damage the device and exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Note 1: For other voltage versions please contact ANPEC for details.
APL5601/2
Handling Code
Temperature Range
Package Code
Assembly Material
APL5601/2 D/V: XXXXX - Date Code
VV - Voltage Code
APL5601
XXXXX VV
Voltage Code
Voltage Code (Note 1)
10 : 1.0V 12 : 1.2V 15 : 1.5V 18 : 1.8V 25 : 2.5V
28 : 2.8V 30 : 3.0V 31 : 3.1V 33 : 3.3V 50 : 5.0V
Package Code
A : SOT-23-3 D : SOT-89 V : SOT-223
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APL5602
XXXXX VV
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw3
APL5601/5602
Symbol
Parameter Typical Value Unit
θJA
Junction to Air Thermal Resistance SOT-23-3
SOT-89
SOT-223
260
180
135
θJC
Junction to Case Thermal Resistance SOT-23-3
SOT-89
SOT-223
130
40
15
°C/W
Note 3: At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink
values. The junction-to-ambient thermal resistance is measured on a PC board mounting with the device soldered down to
minimum copper area. If power dissipation causes the junction temperature to exceed specified limits, the device will go into
thermal shutdown.
Note 4: The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD (max) = (TJ – TA) / θJA; TJ =
125°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature.
Thermal Characteristics (Note 3, 4)
Symbol
Parameter Range Unit
VIN VIN Supply Voltage 2.9 to 6 V
IOUT Output Current 0 to 0.6 A
CIN Input Capacitor 0.82 to 470 µF
COUT Output Capacitor 1 to 330 µF
TJ Junction Temperature -40 to 125 °C
TA Ambient Temperature -40 to 85 °C
Recommended Operating Conditions
Electrical Characteristics
Refer to the typical application circuit. VIN = VOUT+1V or (Minimum VIN=2.9V), IOUT = 1mA, TJ = -40 to 125 °C, TA = -40 to 85°C, unless
otherwise specified. Typical values are at TA = 25°C.
APL5601/APL5602
Symbol
Parameter Test Conditions Min. Typ. Max. Unit
SUPPLY CURRENT
IQ Quiescent Current VIN=5V, IOUT=0mA - 140 220 µA
UNDER-VOLTAGE-LOCKOUT
VIN UVLO Threshold VIN rising 2.1 2.5 2.9 V
VIN UVLO Hysteresis - 0.15 - V
OUTPUT VOLTAGE
TA = 25°C -1 - +1
VOUT Output Voltage TA = -40 to 85°C (TJ = -40 to 125°C) -2 - +2 %VOUT
Line Regulation VIN = VOUT + 1V to 6V - 0.03 0.19 %/V
Load Regulation IOUT = 1mA to 600mA - 0.6 1.5 %/A
VOUT=2.8V, IOUT=600mA - 240 500
VOUT=3.3V, IOUT=600mA - 220 450
VDROP
Dropout Voltage
VOUT=5V, IOUT=600mA - 200 420
mV
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw4
APL5601/5602
Electrical Characteristics (Cont.)
Refer to the typical application circuit. VIN = VOUT+1V or (Minimum VIN=2.9V), IOUT = 1mA, TJ = -40 to 125 °C, TA = -40 to 85°C, unless
otherwise specified. Typical values are at TA = 25°C.
APL5601/APL5602
Symbol
Parameter Test Conditions Min. Typ. Max. Unit
OUTPUT VOLTAGE (Cont.)
PSRR
Power Supply Ripple Rejection
VIN = VOUT + 2V, f = 1kHz - 55 - dB
SOFT-START AND PROTECTION
ILIM Output Current Limit 700 - - mA
Thermal Shutdown Temperature
- 150 - °C
Thermal Shutdown Hysteresis - 40 - °C
Short Circuit Current Limit VOUT < 0.6V - 250 - mA
TSS Soft-Start Time - 130 300 µs
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw5
APL5601/5602
Typical Operating Characteristics
VIN to VOUT Dropout vs. Junction
Temperature
Junction Temperature, TJ (oC)
Power Supply Ripple Rejection
Frequency (Hz)
Quiescent Current vs. Input Voltage
Input Voltage, VIN (V)
Quiescent Current (µA)PSRR (dB)
VIN to VOUT Dropout, VDROP (V)
-80
-70
-60
-50
-40
-30
-20
-10
0
1000 10000 100000
VIN=3.3V, VOUT=1.8V, CIN=1µF, COUT=2.2µF,
IOUT=500mA
Current-Limit vs. Junction Temperature
Current-Limit, ILIM (A)
Junction Temperature, TJ (oC)
VIN=5V, VOUT=3.3V, CIN=1µF, COUT=2.2µF, TA=25OC, unless otherwise specified.
0
50
100
150
200
250
300
350
-50 -25 025 50 75 100 125 150
VOUT=3.3V
IOUT=600mA
IOUT=400mA
IOUT=200mA
VIN to VOUT Dropout vs. Junction
Temperature
0
40
80
120
160
200
0 1 2 3 4 5 6
IOUT=0mA
0
50
100
150
200
250
300
-50 -25 025 50 75 100 125 150
IOUT=600mA
IOUT=400mA
IOUT=200mA
VOUT=5V
Junction Temperature, TJ (oC)
VIN to VOUT Dropout, VDROP (V)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
-50 -25 0 25 50 75 100 125 150
VIN=3.3V
VIN=5V
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw6
APL5601/5602
Operating Waveforms
VIN=5V, VOUT=3.3V, CIN=1µF, COUT=2.2µF, TA=25OC, unless otherwise specified.
CH1 : VOUT , 100mV/div (offset=3.3V)
CH2 : IOUT , 200mV/div
Time : 200µs/div
Load Transient
VIN=5V, VOUT=3.3V CIN=1µF, COUT=2.2µF,
IOUT rising/falling time=1µs
2
1VOUT
IOUT
Line Transient
VIN=4.5~6V, VIN rising/falling=10µs, IOUT=300mA
CH1 : VIN , 2V/div
CH2 : VOUT , 20mV/div (offset=3.3V)
Time : 200µs/div
2
1
VOUT
VIN
Power On
CH1 : VIN , 2V/div
Time : 1ms/div
2
1
CH2 : VOUT , 2V/div
CH3 : IOUT , 500mA/div
VIN
VOUT
IOUT
3
2
1
3
Power Off
CH1 : VIN , 2V/div
Time : 200ms/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 500mA/div
VIN
VSET
VOUT
IOUT
VIN
VOUT
IOUT
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw7
APL5601/5602
Operating Waveforms (Cont.)
VIN=5V, VOUT=3.3V, CIN=1µF, COUT=2.2µF, TA=25OC, unless otherwise specified.
PIN
NO.
NAME
FUNCTION
1 VIN Input Supply Pin. Supply voltage can range from 2.9V to 6V. Bypass with a 1µF capacitor to the GND
2 VOUT
Regulator Output. Sources up to 600mA. A small capacitor is needed from this pin to ground to assure stability.
3 GND
Ground.
Pin Description
Current-Limit and Short Circuit Current-Limit
VIN
VOUT
IOUT
2
1
3
CH1 : VIN , 5V/div
Time : 2ms/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 1A/div
Thermal Shutdown
CH1 : VIN , 5V/div
Time : 500ms/div
CH2 : VOUT , 2V/div
CH3 : IOUT , 500mA/div
VIN
VOUT
IOUT
2
1
3
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw8
APL5601/5602
Block Diagram
Typical Application Circuit
VIN
GND
VOUT
APL5601/5602
COUT
2.2µF
CIN
1µF
VINVOUT
UVLO and
Soft-Start
Thermal
Shutdown
VIN
GND
Current-Limit
VREF
0.8V
Short Circuit
Current-Limit
VOUT
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw9
APL5601/5602
Function Description
A thermal shutdown circuit limits the junction tempera-
ture of APL5601/5602. When the junction temperature
exceeds +150oC, the thermal shutdown circuitry disables
the output, allowing the device to cool down. The output
circuitry is enabled again after the junction temperature
cools down by 40oC, resulting in a pulsed output during
continuous thermal overload conditions. Thermal pro-
tection is designed to protect the IC in the event of over
temperature conditions. For reliable operation, the junc-
tion temperature cannot exceed TJ=+125 oC.
Under Voltage Lockout (UVLO)
The APL5601/5602 regulators have built-in under-volt-
age lock-out circuits to keep the output shuting off until
internal circuitry is operating properly. The UVLO function
initiates a soft-start process after input voltage exceeds
its rising UVLO threshold during power on. Typical UVLO
threshold is 2.5V with 0.15V hysteresis.
Soft-Start
The APL5601/5602 provide an internal soft-start circuitry
to control rise rate of the output voltage and limit the cur-
rent surge during start-up. Approximate 20µs delay time
after the VIN is over the UVLO threshold, the output voltage
starts the soft-start. The typical soft-start interval is about
130µs.
Current-Limit
The APL5601/5602 provides a current-limit circuitry, which
monitors and controls P-MOS’s gate voltage, limiting the
output current to 700mA. For reliable operation, the de-
vice should not be operated in current-limit for extended
period.
Short Circuit Current-Limit
When the output voltage drops below 0.6V, which is
caused by the over load or short circuit, the internal short
circuit current-limit circuitry limits the output current down
to 250mA. The short circuit current-limit is used to reduce
the power dissipation during short circuit condition. In
some high VIN-VOUT conditions, if the junction tempera-
ture is over the thermal shutdown temperature, the de-
vice will enter the thermal shutdown. Please refer to the
section on thermal considerations for power dissipation
calculations. The short circuit current-limit has a blank-
ing time feature after the UVLO threshold is reached, so
that it will avoid the output causing short circuit current-
limit protection during start-up; the blanking time is about
600µs.
Thermal Shutdown
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw10
APL5601/5602
Application Information
Layout Consideration
Figure 1 illustrates the layout. Below is a checklist for
your layout:
1. Please place the input capacitors close to the VIN.
2. Ceramic capacitors for load must be placed near the
load as close as possible.
3. To place APL5601/5602 and output capacitors near the
load is good for performance.
4. Large current paths, the bold lines in figure 1, must
have wide tracks.
Input Capacitor
The APL5601/5602 require proper input capacitors to
supply surge current during stepping load transients to
prevent the input rail from dropping. Because the para-
sitic inductor from the voltage sources or other bulk ca-
pacitors to the VIN limits the slew rate of the surge current,
it is necessary to place the input capacitors near VIN as
close as possible. Input capacitors should be larger than
0.82µF.
Output Capacitor
The APL5601/5602 need a proper output capacitor to
maintain circuit stability and to improve transient response
over temperature and current. In order to insure the cir-
cuit stability, the proper output capacitor value should be
larger than 1µF. With X5R and X7R dielectrics, 2.2µF is
sufficient at all operating temperatures. Maximum output
capacitor should be less than 330µF to insure the sys-
tem can be powered on successfully.
The APL5601/5602 maximum power dissipation de-
pends on the thermal resistance and temperature differ-
ence between the die junction and ambient air. The power
dissipation PD across the device is:
PD = (TJ - TA) / θJA
where (TJ-TA) is the temperature difference between the
junction and ambient air. θJA is the thermal resistance
between junction and ambient air. Assuming the TA=25oC,
maximum TJ=150oC (typical thermal limit threshold) and
θJA=260oC/W (SOT-23-3), so the maximum power dissi-
pation is calculated as:
Operation Region and Power Dissipation Figure 1.
Recommended Minimum Footprint
0.067
0.038
0.277
0.091
0.126
Unit : Inch
0.164
SOT-223
PD(max)=(150-25)/260
= 0.48(W)
For normal operation, do not exceed the maximum oper-
ating junction temperature of TJ=125 oC. The calculated
power dissipation should be less than:
The pin 3 of the SOT-23 and the tabs (and pin 2) of the
SOT-89 and SOT-223 provide an electrical connections
and channel heat away. Connect the pins and tabs to a
large area copper plane on PCBs for better heat
dissipation.
PD =(125-25)/260
= 0.38(W)
0.067
0.022
0.140
0.059
0.076
Unit : Inch
0.104
SOT-89
0.0001
0.001
0.01
0.1
1
10
100
110 100 1000
Output Capacitor(µF)
ESR (Ω)
Stable region
Instable region
Untested
VIN VOUT
GND
APL5601/5602
CIN COUT
VIN VOUT
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw11
APL5601/5602
0.057
0.024
0.102
0.037
0.074
Unit : Inch
SOT-23-3
Application Information (Cont.)
Recommended Minimum Footprint (Cont.)
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw12
APL5601/5602
Package Information
SOT-23-3
0
L
VIEW A
0.25
GAUGE PLANE
SEATING PLANE
A
A2A1
e
D
E
E1
SEE
VIEW A
bc
e1
MAX.
0.057
0.051
0.024
0.006
0.009
0.0200.012
L0.30
0
e
e1
E1
E
D
c
b
0.08
0.30
0.60 0.012
0.95 BSC
1.90 BSC
0.22
0.50
0.037 BSC
0.075 BSC
0.003
MIN.
MILLIMETERS
S
Y
M
B
O
L
A1
A2
A
0.00
0.90
SOT-23-3
MAX.
1.45
0.15
1.30
MIN.
0.000
0.035
INCHES
°
8
°
0
°
8
°
0
1.40
2.60
1.80
3.00
2.70 3.10 0.122
0.071
0.1180.102
0.055
0.106
Note : Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw13
APL5601/5602
Package Information
SOT-89
S
Y
M
B
OMIN. MAX.
MILLIMETERS
SOT-89
MIN. MAX.
INCHES
A
C
e1
e
B
B1
D
D1
H
EL
E1
1.60
0.44
0.35 0.44
4.40 4.60
1.62 1.83
0.56
2.13
A
B
C
D
D1
E
E1
e
e1
B1 0.36 0.48
3.00 BSC
3.94 4.25
2.29 2.60
2.29
0.118 BSC
0.063
0.017
0.014 0.019
0.014 0.017
0.173 0.181
0.064 0.072
0.084
0.155 0.167
0.090 0.102
0.090
0.022
L0.89 0.035
H
1.50 BSC 0.059 BSC
1.40
1.20 0.047
0.055
L
Note : Follow JEDEC TO-243 AA.
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw14
APL5601/5602
Package Information
SOT-223
A
A2
VIEW A
0.25
L
GAUGE PLANE
SEATING PLANE
A1
D
E
e1
e
b2
E1
SEE
VIEW A
c
b
°
0
S
Y
M
B
O
LMIN. MAX.
1.80
0.02
0.66 0.84
2.90 3.10
0.23 0.33
0.10
6.70
A
A1
b
b2
c
D
E
E1
e
MILLIMETERS
A2 1.50 1.70
2.30 BSC
SOT-223
3.30 3.70
6.30 6.70
7.30
0.091 BSC
MIN. MAX.
INCHES
0.071
0.001
0.059 0.067
0.026 0.033
0.114 0.122
0.009 0.013
0.264
0.130 0.146
0.248 0.264
0.287
0.004
0
L0.75 0.030
e1 4.60 BSC 0.181 BSC
°
10
°
0
°
10
°
0
Note : 1. Follow from JEDEC TO-261 AA.
2. Dimension D and E1 are determined at the outermost extremes
of the plastic exclusive of mold flash, tie bar burrs, gate burrs,
and interlead flash, but including any mismatch between the top
and bottom of the plastic body.
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw15
APL5601/5602
Application
A H T1 C d D W E1 F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
SOT-23-3
4.0±0.10
4.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
Application
A H T1 C d D W E1 F
178.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.50±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
SOT-89
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
4.80±0.20
4.50±0.20
1.80±0.20
Application
A H T1 C d D W E1 F
320.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.00±0.30
1.75±0.10
5.50±0.05
P0 P1 P2 D0 D1 T A0 B0 K0
SOT-223
4.00±0.10
8.00±0.10
2.00±0.50
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.90±0.20
7.50±0.20
2.10±0.20
(mm)
Carrier Tape & Reel Dimensions
A
E1
A
B
W
F
T
P0
OD0
BA0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
H
T1
A
d
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw16
APL5601/5602
Devices Per Unit
Package type Unit Quantity
SOT-23-3 Tape & Reel 3000
SOT-89 Tape & Reel 1000
SOT-223 Tape & Reel 2500
Taping Direction Information
SOT-23-3
SOT-89
SOT-223
USER DIRECTION OF FEED
USER DIRECTION OF FEED
USER DIRECTION OF FEED
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw17
APL5601/5602
Classification Profile
Classification Reflow Profiles
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
Average ramp-up rate
(Tsmax to TP) 3 °C/second max. 3°C/second max.
Liquidous temperature (TL)
Time at liquidous (tL) 183 °C
60-150 seconds 217 °C
60-150 seconds
Peak package body Temperature
(Tp)* See Classification Temp in table 1 See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc) 20** seconds 30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max. 6 °C/second max.
Time 25°C to peak temperature 6 minutes max. 8 minutes max.
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Copyright ANPEC Electronics Corp.
Rev. A.5 - Jul., 2010 www.anpec.com.tw18
APL5601/5602
Classification Reflow Profiles (Cont.)
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness Volume mm3
<350 Volume mm3
350-2000 Volume mm3
>2000
<1.6 mm 260 °C 260 °C 260 °C
1.6 mm – 2.5 mm 260 °C 250 °C 245 °C
≥2.5 mm 250 °C 245 °C 245 °C
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness Volume mm3
<350 Volume mm3
≥350
<2.5 mm 235 °C 220 °C
≥2.5 mm 220 °C 220 °C
Test item Method Description
SOLDERABILITY JESD-22, B102 5 Sec, 245°C
HOLT JESD-22, A108 1000 Hrs, Bias @ Tj=125°C
PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C
TCT JESD-22, A104 500 Cycles, -65°C~150°C
HBM MIL-STD-883-3015.7 VHBM≧2KV
MM JESD-22, A115 VMM≧200V
Latch-Up JESD 78 10ms, 1tr≧100mA
Reliability Test Program
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
