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SMD22PL
THRU
Schottky Barrier
Diodes
20 to 100 Volts
Features
• Low Profile Packa
e
SymbolParameter RatingUnit
VRMS
Maximum RMS Voltage SMD22PL
SMD24PL
14
28 V
VRRM
Repetitive Peak Reverse Voltage SMD22PL
SMD24PL
20
40V
IF(AV)
Rectified Current (Average) Half Wave
Rectification with Resist. Load at TL=90 2.0 A
IFSM Surge Forward Current,halfsine wave 8.3ms 50 A
TJJunction Temperature -65 to +125 O
C
TSTG Storage Temperature -65 to +125 O
C
Electrical Characteristics @ 25OC Unless Otherwise Specified
Symbol Parameter Min Typ Max Units
VFForward Voltag SMD22PL~24PL
SMD26PL
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0.50
0.70V
Cj Typical--Junction--Capacitance
@f=1.0MHz,Vr=4V --- 210 --- pF
omponents
20736 Marilla Street Chatsworth
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MCC
www.mccsemi.com
TM
Micro Commercial Components
0.036”
0.093”
0.048”
SUGGESTED SOLDER
PAD LAYOUT
DIMENSIONS
INCHES MMDIM
MIN MAX MIN MAX
NOTE
E
C
D
G
SOD-123FL
SMD210PL
Revision: C 2013/01/01
1of 3
OC
Maximum Ratings
Mechanical Data
• Packaging: SOD-123FL
• Marking Code: SMD22PL---M2; SMD24PL---M4; SMD26PL---M6
SMD28PL---M8; SMD210PL---M10;
SMD26PL
SMD28PL
SMD210PL
SMD26PL
SMD28PL
SMD210PL
60
80
100
42
56
70
2. Thermal Resistance:PC Board Mounted on 0.2*0.2''(5*5mm) copper pad area.
(@2A dc)
RthJA
RthJC
RthJL
Typical Thermal Resistance(Note2)
OC/W60
30
21
PDPower Dissipation
OC/W
OC/W
1.68
W
SMD28PL~210PL 0.85
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Maximum DC Reverse Current 0.5 mA
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Notes: 1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7.
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
A .140 .152 3.55 3.85
B.100.122 2.553.10
C.055.075 1.401.90
D.035 .0530.90 1.35
E.020.041 0.50 1.05
G .010 ----- 0.25 -----
H-----.010 ----.25
• Halogen free available upon request by adding suffix "-HF"
• High-Surge-Capability
• Low Forward Voltage