LM95231 www.ti.com SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 LM95231 Precision Dual Remote Diode Temperature Sensor with SMBus Interface and TruThermTM Technology Check for Samples: LM95231 FEATURES KEY SPECIFICATIONS * * * * * 1 2 * * * * * * * * * * * * * * Accurately Senses Die Temperature of Remote ICs or Diode Junctions Uses TruTherm Technology for Precision "Thermal Diode" Temperature Measurement Thermal Diode Input Stage with Analog Filtering Thermal Diode Digital Filtering Intel Pentium 4 Processor on 90nm Process or 2N3904 Non-ideality Selection Remote Diode Fault Detection On-board Local Temperature Sensing Remote Temperature Readings Without Digital Filtering: - 0.125C LSb - 10-bits Plus Sign or 11-bits Programmable Resolution - 11-bits Resolves Temperatures Above 127 C Remote Temperature Readings with Digital Filtering: - 0.03125C LSb with Filtering - 12-bits Plus Sign or 13-bits Programmable Resolution - 13-bits Resolves Temperatures Above 127C Local Temperature Readings: - 0.25C - 9-bits Plus Sign Status Register Support Programmable Conversion Rate Allows User Optimization of Power Consumption Shutdown Mode One-shot Conversion Control SMBus 2.0 Compatible Interface, Supports TIMEOUT 8-pin VSSOP Package Remote Temperature Accuracy 0.75C (max) Local Temperature Accuracy 3.0C (max) Supply Voltage 3.0V to 3.6V Supply Current 402A (typ) APPLICATIONS * * * Processor/Computer System Thermal Management - e.g. Laptop, Desktop, Workstations, Server) Electronic Test Equipment Office Electronics DESCRIPTION The LM95231 is a precision dual remote diode temperature sensor (RDTS) that uses Texas Instruments' TruTherm technology. The 2-wire serial interface of the LM95231 is compatible with SMBus 2.0. The LM95231 can sense three temperature zones, it can measure the temperature of its own die as well as two diode connected transistors. The LM95231 includes digital filtering and an advanced input stage that includes analog filtering and TruTherm technology that reduces processor-toprocessor non-ideality spread. The diode connected transistors can be a "thermal diode" as found in Intel and AMD processors or can simply be a diode connected MMBT3904 transistor. TruTherm technology allows accurate measurement of "thermal diodes" found on small geometry processes, 90nm and below. The LM95231 supports user selectable thermal diode non-ideality of either a Pentium 4 processor on 90nm process or 2N3904. The LM95231 resolution format for remote temperature readings can be programmed to be 11bits signed or unsigned with the digital filtering disabled. When the filtering is enabled the resolution increases to 13-bits signed or unsigned. In the unsigned mode the LM95231 remote diode readings can resolve temperatures above 127C. Local temperature readings have a resolution of 9-bits plus sign. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2005-2013, Texas Instruments Incorporated LM95231 SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 www.ti.com Connection Diagram D1+ 1 D1- 2 8 SMBCLK 7 D2+ 3 6 SMBDAT VDD D2- 4 5 GND LM95231 Figure 1. VSSOP-8 TOP VIEW Typical Application +3.3V Standby Pentium(R) 4 PROCESSOR C4** 100 pF 1 2 3 C5** 100 pF 4 D1+ SMBCLK D1- SMBDAT D2+ VDD D2- GND SMBCLK 7 SMBDAT 6 5 LM95231 Q1 MMBT3904 R2 1.3k R1 1.3k 8 C1* 100 pF C2 0.1 PF C3 10 PF + SMBus Master * Place close to LM95231 pins. ** Optional may be required in noisy systems; place close to LM95231 pins. PIN DESCRIPTIONS 2 Label Pin # Function D1+ 1 Diode Current Source To Diode Anode. Connected to remote discrete diodeconnected transistor junction or to the diode-connected transistor junction on a remote IC whose die temperature is being sensed. A capacitor is not required between D1+ and D1-. A 100 pF capacitor between D1+ and D1- can be added and may improve performance in noisy systems. Typical Connection D1- 2 Diode Return Current Sink To Diode Cathode. A capacitor is not required between D1+ and D1-. A 100 pF capacitor between D1+ and D1- can be added and may improve performance in noisy systems. D2+ 3 Diode Current Source To Diode Anode. Connected to remote discrete diodeconnected transistor junction or to the diode-connected transistor junction on a remote IC whose die temperature is being sensed. A capacitor is not required between D2+ and D2-. A 100 pF capacitor between D2+ and D2- can be added and may improve performance in noisy systems. D2- 4 Diode Return Current Sink To Diode Cathode. A capacitor is not required between D2+ and D2-. A 100 pF capacitor between D2+ and D2- can be added and may improve performance in noisy systems. GND 5 Power Supply Ground System low noise ground VDD 6 Positive Supply Voltage Input DC Voltage from 3.0 V to 3.6 V. VDD should be bypassed with a 0.1 F capacitor in parallel with 100 pF. The 100 pF capacitor should be placed as close as possible to the power supply pin. Noise should be kept below 200 mVp-p, a 10 F capacitor may be required to achieve this. SMBDAT 7 SMBus Bi-Directional Data Line, From and to Controller; may require an external pull-up resistor Open-Drain Output SMBCLK 8 SMBus Clock Input From Controller; may require an external pull-up resistor Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 LM95231 www.ti.com SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 Simplified Block Diagram 3.0V-3.6V LM95231 Local Diode Selector D+ D- Remote Diode1 Selector D+ D- Remote Diode2 Selector Control Logic Local Temperature Registers '-6 Converter 11-Bit or 10-Bit Plus Sign Remote 9-bit Plus Sign Local TruThermTM Temperature Sensor Circuitry Remote 1 Temperature Registers Remote 2 Temperature Registers Diode Type Selection Register Diode TruTherm Control Register Diode Filter Control Registers SMBus Two Wire Serial Interface Config and Status Registrer Revision & Manufacturer ID Registers SMBDAT SMBCLK These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) Supply Voltage -0.3 V to 6.0 V-0.5V to 6.0V Voltage at SMBDAT, SMBCLK -0.3 V to (VDD + 0.3 V) Voltage at Other Pins Input Current at All Pins (2) Package Input Current 5 mA (2) 30 mA SMBDAT Output Sink Current 10 mA Junction Tempeature (3) 125C -65C to +150C Storage Temperature ESD Susceptibility (4) Human Body Model 2000 V Machine Model 200 V Soldering process must comply with Texas Instruments' reflow temperature profile specifications. Refer to http://www.ti.com/packaging/. (5) (1) (2) (3) (4) (5) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is ensured to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test condition listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the Maximum Operating Ratings is not recommended. When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD), the current at that pin should be limited to 5 mA. Parasitic components and or ESD protection circuitry are shown in Figure 2 and Table 1 for the LM95231's pins. Care should be taken not to forward bias the parasitic diode, D1, present on pins: D1+, D2+, D1-, D2-. Doing so by more than 50 mV may corrupt the temperature measurements. Thermal resistance junction-to-ambient when attached to a printed circuit board with 1oz. foil and no airflow: -- VSSOP-8 = 210C/W Human body model, 100pF discharged through a 1.5k resistor. Machine model, 200pF discharged directly into each pin. Reflow temperature profiles are different for packages containing lead (Pb) than for those that do not. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 3 LM95231 SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 www.ti.com Operating Ratings (1) (2) Operating Temperature Range 0C to +125C Electrical Characteristics Temperature Range TMINTATMAX LM95231BIMM, LM95231CIMM 0CTA+85C Supply Voltage Range (VDD) +3.0V to +3.6V (1) (2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is ensured to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test condition listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the Maximum Operating Ratings is not recommended. Thermal resistance junction-to-ambient when attached to a printed circuit board with 1oz. foil and no airflow: -- VSSOP-8 = 210C/W Temperature-to-Digital Converter Characteristics Unless otherwise noted, these specifications apply for VDD=+3.0Vdc to 3.6Vdc. Boldface limits apply for TA = TJ = TMINTATMAX; all other limits TA= TJ=+25C, unless otherwise noted. TJ is the junction temperature of the LM95231. TD is the junction temperature of the remote thermal diode. PARAMETER 1) TA = 0C to +85C (3) (4) Accuracy Using Local Diode Accuracy Using Remote Diode, see for Thermal Diode Processor Type. Typical ( TEST CONDITIONS (5) 1 LM9523 LM9523 1 1 BIMM CIMM (2) Limits Limits (2) 3 3 UNIT C (max) TA = +20C to +40C; TD = +45C to +85C Intel 90nm Thermal Diode 0.75 C (max) TA = +20C to +40C; TD = +45C to +85C MMBT3904 Thermal Diode 1.25 C (max) TA = +20C to +40C; TD = +45C to +85C Intel 90nm and MMBT3904 Thermal Diodes TA = +0C to +85C; TD = +25C to +140C Intel 90nm and MMBT3904 Thermal Diodes 2.5 1.25 C (max) 2.5 C (max) Remote Diode Measurement Resolution with filtering turned off 10+sign/ 11 0.125 C Remote Diode Measurement Resolution with digital filtering turned on 12+sign/ 13 Bits Local Diode Measurement Resolution Conversion Time of All Temperatures at the Fastest Setting Average Quiescent Current (7) See (6) TruTherm Mode Disabled (2) (3) (4) (5) (6) (7) 4 0.03125 C 9+sign Bits 0.25 C 75.8 83.9 83.9 ms (max) TruTherm Mode enabled 79.2 87.7 87.7 ms (max) SMBus Inactive, 1 Hz conversion rate 402 545 545 A (max) Shutdown 272 A 0.4 V D- Source Voltage (1) Bits Typicals are at TA = 25C and represent most likely parametric norm at time of product characterization. The typical specifications are not ensured. Limits are specified to AOQL (Average Outgoing Quality Level). Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the internal power dissipation of the LM95231 and the thermal resistance. See Note 2 of the Operating Ratings table for the thermal resistance to be used in the self-heating calculation. Thermal resistance junction-to-ambient when attached to a printed circuit board with 1oz. foil and no airflow: -- VSSOP-8 = 210C/W The accuracy of the LM95231 is ensured when using the thermal diode of Pentium 4 processor on 90nm process or an MMBT3904 type transistor, as selected in the Remote Diode Model Select register. This specification is provided only to indicate how often temperature data is updated. The LM95231 can be read at any time without regard to conversion state (and will yield last conversion result). Quiescent current will not increase substantially when the SMBus is active. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 LM95231 www.ti.com SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 Temperature-to-Digital Converter Characteristics (continued) Unless otherwise noted, these specifications apply for VDD=+3.0Vdc to 3.6Vdc. Boldface limits apply for TA = TJ = TMINTATMAX; all other limits TA= TJ=+25C, unless otherwise noted. TJ is the junction temperature of the LM95231. TD is the junction temperature of the remote thermal diode. PARAMETER Typical ( TEST CONDITIONS 1) Diode Source Current Ratio LM9523 LM9523 1 1 BIMM CIMM Limits (2) Limits (2) UNIT 16 Diode Source Current Power-On Reset Threshold (VD+ - VD-) = + 0.65V; high-level 176 Low-level 11 Measure on VDD input, falling edge 300 300 A (max) 100 100 A (min) 2.7 1.8 2.7 1.8 V (max) V (min) A Logic Electrical Characteristics Digital DC Characteristics Unless otherwise noted, these specifications apply for VDD=+3.0 to 3.6 Vdc. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA= TJ=+25C, unless otherwise noted. Symbol Parameter Conditions Typical (1) Limits (2) Units (Limit) SMBDAT, SMBCLK INPUTS VIN(1) Logical "1" Input Voltage 2.1 V (min) VIN(0) Logical "0"Input Voltage 0.8 V (max) VIN(HYST) SMBDAT and SMBCLK Digital Input Hysteresis IIN(1) Logical "1" Input Current VIN = VDD 0.005 10 A (max) IIN(0) Logical "0" Input Current VIN = 0 V -0.005 10 A (max) CIN Input Capacitance 400 mV 5 pF SMBDAT OUTPUT IOH High Level Output Current VOH = VDD 10 A (max) VOL SMBus Low Level Output Voltage IOL = 4mA IOL = 6mA 0.4 0.6 V (max) (1) (2) Typicals are at TA = 25C and represent most likely parametric norm at time of product characterization. The typical specifications are not ensured. Limits are specified to AOQL (Average Outgoing Quality Level). Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 5 LM95231 SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 www.ti.com Logic Electrical Characteristics SMBus Digital Switching Characteristics Unless otherwise noted, these specifications apply for VDD=+3.0 Vdc to +3.6 Vdc, CL (load capacitance) on output lines = 80 pF. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25C, unless otherwise noted. The switching characteristics of the LM95231 fully meet or exceed the published specifications of the SMBus version 2.0. The following parameters are the timing relationships between SMBCLK and SMBDAT signals related to the LM95231. They adhere to but are not necessarily the SMBus bus specifications. Symbol SMBus Clock Frequency tLOW SMBus Clock Low Time from VIN(0)max to VIN(0)max Limits (2) Units (Limit) 100 10 kHz (max) kHz (min) 4.7 25 s (min) ms (max) tHIGH SMBus Clock High Time from VIN(1)min to VIN(1)min tR,SMB SMBus Rise Time See (3) 1 s (max) tF,SMB SMBus Fall Time See (4) 0.3 s (max) tOF Output Fall Time CL = 400pF, IO = 3mA (4) 4.0 s (min) 250 ns (max) SMBDAT and SMBCLK Time Low for Reset of Serial Interface (5) 25 35 ms (min) ms (max) tSU;DAT Data In Setup Time to SMBCLK High 250 ns (min) tHD;DAT Data Out Stable after SMBCLK Low 300 1075 ns (min) ns (max) tHD;STA Start Condition SMBDAT Low to SMBCLK Low (Start condition hold before the first clock falling edge) 100 ns (min) tSU;STO Stop Condition SMBCLK High to SMBDAT Low (Stop Condition Setup) 100 ns (min) tSU;STA SMBus Repeated Start-Condition Setup Time, SMBCLK High to SMBDAT Low 0.6 s (min) SMBus Free Time Between Stop and Start Conditions 1.3 s (min) tBUF (2) (3) (4) (5) Typical (1) Conditions fSMB tTIMEOUT (1) Parameter Typicals are at TA = 25C and represent most likely parametric norm at time of product characterization. The typical specifications are not ensured. Limits are specified to AOQL (Average Outgoing Quality Level). The output rise time is measured from (VIN(0)max + 0.15V) to (VIN(1)min - 0.15V). The output fall time is measured from (VIN(1)min - 0.15V) to (VIN(1)min + 0.15V). Holding the SMBDAT and/or SMBCLK lines Low for a time interval greater than tTIMEOUT will reset the LM95231's SMBus state machine, therefore setting SMBDAT and SMBCLK pins to a high impedance state. tLOW tR tF VIH SMBCLK VIL tHD;STA tHD;DAT tBUF tHIGH tSU;STA tSU;DAT tSU;STO VIH SMBDAT VIL P S S P Figure 2. SMBus Communication 6 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 LM95231 www.ti.com SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 Table 1. Parasitic components and ESD protection circuitry Pin # Circuit 1 A 2 A Pin ESD Protection Structure Circuits V+ PIN D2 D1 SNP PIN 3 D3 6.5V D1 A ESD CLAMP GND GND 4 A Circuit A Circuit C V+ 5 B ESD Clamp D2 160 k D3 80 k D1 6.5V GND 6 B 7 C 8 C Circuit B Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 7 LM95231 SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics Thermal Diode Capacitor or PCB Leakage Current Effect Remote Diode Temperature Reading Remote Temperature Reading Sensitivity to Thermal Diode Filter Capacitance Figure 3. Figure 4. Conversion Rate Effect on Average Power Supply Current 2.0 VDD = +3.3V AVERAGE I DD (mA) 1.75 TA = 25oC 1.5 1.25 1.0 0.75 0.5 0.25 0.0 10 100 1000 10000 CONVERSION TIME (ms) Figure 5. 8 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 LM95231 www.ti.com SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 FUNCTIONAL DESCRIPTION The LM95231 is a digital sensor that can sense the temperature of 3 thermal zones using a sigma-delta analogto-digital converter. It can measure its local die temperature and the temperature of two external transistor junctions using a Vbe temperature sensing method. The LM95231 can support two external transistor types, a Pentium 4 processor on 90nm process thermal diode or a 2N3904 diode connected transistor. The transistor type is register programmable and does not require software intervention after initialization. The LM95231 has an advanced input stage using Texas Instruments' TruTherm technology that reduces the spread in non-ideality found in Pentium 4 processors on 90nm process. Internal analog filtering has been included in the thermal diode input stage thus minimizing the need for external thermal diode filter capacitors. In addition a digital filter has been added. These noise immunity improvements in the analog input stage along with the digital filtering will allow longer trace tracks or cabling to the thermal diode than previous thermal diode sensor devices. The 2-wire serial interface, of the LM95231, is compatible with SMBus 2.0 and I2C. Please see the SMBus 2.0 specification for a detailed description of the differences between the I2C bus and SMBus. The temperature conversion rate is programmable to allow the user to optimize the current consumption of the LM95231 to the system requirements. The LM95231 can be placed in shutdown to minimize power consumption when temperature data is not required. While in shutdown, a 1-shot conversion mode allows system control of the conversion rate for ultimate flexibility. The remote diode temperature resolution is variable and depends on whether the digital filter is activated. When the digital filter is active the resolution is thirteen bits and is programmable to 13-bits unsigned or 12-bits plus sign, with a least-significant-bit (LSb) weight for both resolutions of 0.03125C. When the digital filter is inactive the resolution is eleven bits and is programmable to 11-bits unsigned or 10-bits plus sign, with a least-significantbit (LSb) weight for both resolutions of 0.125C. The unsigned resolution allows the remote diodes to sense temperatures above 127C. Local temperature resolution is not programmable and is always 9-bits plus sign and has a 0.25C LSb. The LM95231 remote diode temperature accuracy will be trimmed for the thermal diode of a Pentium 4 processor on 90nm process or a 2N3904 transistor and the accuracy will be ensured only when using either of these diodes when selected appropriately. TruTherm mode should be enabled when measuring a Pentium 4 processor on 90nm process and disabled when measuring a 2N3904 transistor. Enabling TruTherm mode with a 2N3904 transistor connected may produce unexpected temperature readings. Diode fault detection circuitry in the LM95231 can detect the presence of a remote diode: whether D+ is shorted to VDD, D- or ground, or whether D+ is floating. The LM95231 register set has an 8-bit data structure and includes: 1. Most-Significant-Byte (MSB) Local Temperature Register 2. Least-Significant-Byte (LSB) Local Temperature Register 3. MSB Remote Temperature 1 Register 4. LSB Remote Temperature 1 Register 5. MSB Remote Temperature 2 Register 6. LSB Remote Temperature 2 Register 7. Status Register: busy, diode fault 8. Configuration Register: resolution control, conversion rate control, standby control 9. Remote Diode Filter Setting 10. Remote Diode Model Select 11. Remote Diode TruTherm Mode Control 12. 1-shot Register 13. Manufacturer ID 14. Revision ID Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 9 LM95231 SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 www.ti.com CONVERSION SEQUENCE In the power up default state the LM95231 takes maximum a 77.5 ms to convert the Local Temperature, Remote Temperature 1 and 2, and to update all of its registers. Only during the conversion process is the busy bit (D7) in the Status register (02h) high. These conversions are addressed in a round robin sequence. The conversion rate may be modified by the Conversion Rate bits found in the Configuration Register (03h). When the conversion rate is modified a delay is inserted between conversions, the actual maximum conversion time remains at 87.7 ms. Different conversion rates will cause the LM95231 to draw different amounts of supply current as shown in Figure 6. 2.0 VDD = +3.3V AVERAGE I DD (mA) 1.75 TA = 25oC 1.5 1.25 1.0 0.75 0.5 0.25 0.0 10 100 1000 10000 CONVERSION TIME (ms) Figure 6. Conversion Rate Effect on Power Supply Current POWER-ON-DEFAULT STATES LM95231 always powers up to these known default states. The LM95231 remains in these states until after the first conversion. 1. Command Register set to 00h 2. Local Temperature set to 0C until the end of the first conversion 3. Remote Diode Temperature set to 0C until the end of the first conversion 4. Remote Diode digital filters are on. 5. Remote Diode 1 model is set to Pentium 4 processor on 90nm process with TruTherm mode enabled. Remote Diode 2 model is set to 2N3904 with TruTherm mode disabled. 6. Status Register depends on state of thermal diode inputs 7. Configuration register set to 00h; continuous conversion, typical time = 85.8 ms when TruTherm Mode is enabled for Remote 1 only SMBus INTERFACE The LM95231 operates as a slave on the SMBus, so the SMBCLK line is an input and the SMBDAT line is bidirectional. The LM95231 never drives the SMBCLK line and it does not support clock stretching. According to SMBus specifications, the LM95231 has a 7-bit slave address. All bits A6 through A0 are internally programmed and can not be changed by software or hardware. The SMBus slave address is dependent on the LM95231 part number ordered: 10 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 LM95231 www.ti.com SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 Part Number A6 A5 A4 A3 A2 A1 A0 LM95231BIMM, LM95231CIMM 1 0 1 0 1 1 1 LM95231BIMM-1, LM95231CIMM-1 0 0 1 1 0 0 1 LM95231BIMM-2, LM95231CIMM-2 0 1 0 1 0 1 0 TEMPERATURE DATA FORMAT Temperature data can only be read from the Local and Remote Temperature registers . Remote temperature data with the digital filter off is represented by an 11-bit, two's complement word or unsigned binary word with an LSb (Least Significant Bit) equal to 0.125C. The data format is a left justified 16-bit word available in two 8-bit registers. Unused bits will always report "0". Table 2. 11-bit, 2's complement (10-bit plus sign) Temperature Digital Output Binary Hex +125C 0111 1101 0000 0000 7D00h +25C 0001 1001 0000 0000 1900h +1C 0000 0001 0000 0000 0100h +0.125C 0000 0000 0010 0000 0020h 0C 0000 0000 0000 0000 0000h -0.125C 1111 1111 1110 0000 FFE0h FF00h -1C 1111 1111 0000 0000 -25C 1110 0111 0000 0000 E700h -55C 1100 1001 0000 0000 C900h Table 3. 11-bit, unsigned binary Temperature Digital Output Binary Hex +255.875C 1111 1111 1110 0000 FFE0h +255C 1111 1111 0000 0000 FF00h +201C 1100 1001 0000 0000 C900h +125C 0111 1101 0000 0000 7D00h +25C 0001 1001 0000 0000 1900h +1C 0000 0001 0000 0000 0100h +0.125C 0000 0000 0010 0000 0020h 0C 0000 0000 0000 0000 0000h Remote temperature data with the digital filter on is represented by a 13-bit, two's complement word or unsigned binary word with an LSb (Least Significant Bit) equal to 0.03125C (1/32C). The data format is a left justified 16bit word available in two 8-bit registers. Unused bits will always report "0". Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 11 LM95231 SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 www.ti.com Table 4. 13-bit, 2's complement (12-bit plus sign) Temperature Digital Output Binary Hex +125C 0111 1101 0000 0000 7D00h +25C 0001 1001 0000 0000 1900h +1C 0000 0001 0000 0000 0100h +0.03125C 0000 0000 0000 1000 0008h 0C 0000 0000 0000 0000 0000h -0.03125C 1111 1111 1111 1000 FFF8h -1C 1111 1111 0000 0000 FF00h -25C 1110 0111 0000 0000 E700h -55C 1100 1001 0000 0000 C900h Table 5. 13-bit, unsigned binary Temperature Digital Output Binary Hex +255.875C 1111 1111 1110 0000 FFE0h +255C 1111 1111 0000 0000 FF00h +201C 1100 1001 0000 0000 C900h +125C 0111 1101 0000 0000 7D00h +25C 0001 1001 0000 0000 1900h +1C 0000 0001 0000 0000 0100h +0.03125C 0000 0000 0000 1000 0008h 0C 0000 0000 0000 0000 0000h Local Temperature data is represented by a 10-bit, two's complement word with an LSb (Least Significant Bit) equal to 0.25C. The data format is a left justified 16-bit word available in two 8-bit registers. Unused bits will always report "0". Local temperature readings greater than +127.875C are clamped to +127.875C, they will not roll-over to negative temperature readings. Temperature 12 Digital Output Binary Hex +125C 0111 1101 0000 0000 7D00h +25C 0001 1001 0000 0000 1900h +1C 0000 0001 0000 0000 0100h +0.25C 0000 0000 0100 0000 0040h 0C 0000 0000 0000 0000 0000h -0.25C 1111 1111 1100 0000 FFC0h -1C 1111 1111 0000 0000 FF00h -25C 1110 0111 0000 0000 E700h -55C 1100 1001 0000 0000 C900h Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 LM95231 www.ti.com SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 SMBDAT OPEN-DRAIN OUTPUT The SMBDAT output is an open-drain output and does not have internal pull-ups. A "high" level will not be observed on this pin until pull-up current is provided by some external source, typically a pull-up resistor. Choice of resistor value depends on many system factors but, in general, the pull-up resistor should be as large as possible without effecting the SMBus desired data rate. This will minimize any internal temperature reading errors due to internal heating of the LM95231. The maximum resistance of the pull-up to provide a 2.1V high level, based on LM95231 specification for High Level Output Current with the supply voltage at 3.0V, is 82k (5%) or 88.7k (1%). 1.6 DIODE FAULT DETECTION The LM95231 is equipped with operational circuitry designed to detect fault conditions concerning the remote diodes. In the event that the D+ pin is detected as shorted to GND, D-, VDD or D+ is floating, the Remote Temperature reading is -128.000 C if signed format is selected and +255.875 if unsigned format is selected. In addition, the appropriate status register bits RD1M or RD2M (D1 or D0) are set. When TruTherm mode is active the condition of diode short of D+ to D- will not be detected. Connecting a 2N3904 transistor with TruTherm mode active may cause a detection of a diode fault. 1.7 COMMUNICATING with the LM95231 The data registers in the LM95231 are selected by the Command Register. At power-up the Command Register is set to "00", the location for the Read Local Temperature Register. The Command Register latches the last location it was set to. Each data register in the LM95231 falls into one of four types of user accessibility: 1. Read only 2. Write only 3. Write/Read same address 4. Write/Read different address A Write to the LM95231 will always include the address byte and the command byte. A write to any register requires one data byte. Reading the LM95231 can take place either of two ways: 1. If the location latched in the Command Register is correct (most of the time it is expected that the Command Register will point to one of the Read Temperature Registers because that will be the data most frequently read from the LM95231), then the read can simply consist of an address byte, followed by retrieving the data byte. 2. If the Command Register needs to be set, then an address byte, command byte, repeat start, and another address byte will accomplish a read. The data byte has the most significant bit first. At the end of a read, the LM95231 can accept either acknowledge or No Acknowledge from the Master (No Acknowledge is typically used as a signal for the slave that the Master has read its last byte). When retrieving all 11 bits from a previous remote diode temperature measurement, the master must insure that all 11 bits are from the same temperature conversion. This may be achieved by reading the MSB register first. The LSB will be locked after the MSB is read. The LSB will be unlocked after being read. If the user reads MSBs consecutively, each time the MSB is read, the LSB associated with that temperature will be locked in and override the previous LSB value locked-in. 1 9 1 9 SMBCLK SMBDAT A6 A5 A4 A3 A2 A1 D7 Ack by LM95231 A0 R/W Start by Master D6 D5 Frame 1 Serial Bus Address Byte D4 D3 D2 Frame 2 Command Byte D1 D0 Ack by Stop LM95231 by Master Figure 7. Serial Bus Write to the Internal Command Register Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 13 LM95231 SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 www.ti.com 1 9 1 9 SMBCLK SMBDAT A6 A5 A4 A3 A2 D7 Ack by LM95231 A1 D6 A0 R/W Start by Master D5 D4 Frame 1 Serial Bus Address Byte D3 D2 SMBDAT (Continued) D0 Ack by LM95231 Frame 2 Command Byte 1 SMBCLK (Continued) D1 9 D7 D6 D5 D4 D3 D2 D1 D0 Ack by Stop LM95231 by Master Frame 3 Data Byte Figure 8. Serial Bus Write to the internal Command Register followed by a Data Byte 1 9 1 9 SMBCLK SMBDAT A6 A5 A4 A3 A2 A1 D7 Ack by LM95231 A0 R/W Start by Master D6 D5 D4 D3 D2 D1 D0 NoAck Stop by by Master Master Frame 1 Serial Bus Address Byte Frame 2 Data Byte from the LM95231 Figure 9. Serial Bus byte Read from a Register with the internal Command Register preset to desired value. 1 9 1 9 SMBCLK SMBDAT A6 A5 A4 A3 A2 D7 Ack by LM95231 A1 D6 A0 R/W Start by Master D5 Frame 1 Serial Bus Address Byte SMBCLK (Continued) SMBDAT (Continued) 9 A5 A4 A3 A2 A1 D3 D2 D1 D0 Ack Repeat by Start by LM95231 Master Frame 2 Command Byte 1 A6 D4 1 D7 Ack by LM95231 A0 R/W Frame 3 Serial Bus Address Byte 9 D6 D5 D4 D3 D2 D1 D0 No Ack Stop by by Master Master Frame 4 Data Byte from the LM95231 (d) Serial Bus Write followed by a Repeat Start and Immediate Read Figure 10. SMBus Timing Diagrams for Access of Data SERIAL INTERFACE RESET In the event that the SMBus Master is RESET while the LM95231 is transmitting on the SMBDAT line, the LM95231 must be returned to a known state in the communication protocol. This may be done in one of two ways: 1. When SMBDAT is LOW, the LM95231 SMBus state machine resets to the SMBus idle state if either SMBDAT or SMBCLK are held low for more than 35ms (tTIMEOUT). Note that according to SMBus specification 2.0 all devices are to timeout when either the SMBCLK or SMBDAT lines are held low for 2535ms. Therefore, to insure a timeout of all devices on the bus the SMBCLK or SMBDAT lines must be held low for at least 35ms. 14 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 LM95231 www.ti.com SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 2. When SMBDAT is HIGH, have the master initiate an SMBus start. The LM95231 will respond properly to an SMBus start condition at any point during the communication. After the start the LM95231 will expect an SMBus Address address byte. ONE-SHOT CONVERSION The One-Shot register is used to initiate a single conversion and comparison cycle when the device is in standby mode, after which the device returns to standby. This is not a data register and it is the write operation that causes the one-shot conversion. The data written to this address is irrelevant and is not stored. A zero will always be read from this register. LM95231 Registers Command register selects which registers will be read from or written to. Data for this register should be transmitted during the Command Byte of the SMBus write communication. P7 P6 P5 P4 P3 P2 P1 P0 Command P0-P7: Command Table 6. Register Summary Name Command (Hex) Power-On Default Value (Hex) Read/Write # of used bits Comments Status Register 02h - RO 5 4 status bits and 1 busy bit Configuration Register 03h 00h R/W 5 Includes conversion rate control Remote Diode Filter Control 06h 05h R/W 2 Controls thermal diode filter setting Remote Diode Model Type Select 30h 01h R/W 2 Selects the 2N3904 or Pentium 4 processor on 90nm process thermal diode model Remote Diode TruTherm Mode Control 07h 01h 8 Enables or disables TruTherm technology for Remote Diode measurements 1-shot 0Fh - WO - Activates one conversion for all 3 channels if the chip is in standby mode (i.e. RUN/STOP bit = 1). Data transmitted by the host is ignored by the LM95231. Local Temperature MSB 10h - RO 8 Remote Temperature 1 MSB 11h - RO 8 Remote Temperature 2 MSB 12h - RO 8 Local Temperature LSB 20h - RO 2 All unused bits will report zero Remote Temperature 1 LSB 21h - RO 3/5 All unused bits will report zero Remote Temperature 2 LSB 22h - RO 3/5 All unused bits will report zero Manufacturer ID FEh 01h RO Revision ID FFh A1h RO D5 D4 D3 D2 D1 D0 R2TME R1TME RD2M RD1M STATUS REGISTER D7 D6 Busy Reserved 0 0 0 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 15 LM95231 SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 www.ti.com Bits Name Description 7 Busy When set to "1" the part is converting. 6-4 Reserved Reports "0" when read. 3 Remote 2 TruTherm Mode Enabled (R2TME) When set to "1" indicates that the TruTherm Mode has been activated for Remote diode 2. After being enabled TruTherm Mode will take at most one conversion cycle to be fully active. 2 Remote 1 TruTherm Mode Enabled (R2TME) When set to "1" indicates that the TruTherm Mode has been activated for Remote diode 1. After being enabled TruTherm Mode will take at most one conversion cycle to be fully active. 1 Remote Diode 2 Missing (RD2M) When set to "1" Remote Diode 2 is missing. (i.e. D2+ shorted to VDD, Ground or D2-, or D2+ is floating). Temperature Reading is FFE0h which converts to 255.875 C if unsigned format is selected or 8000h which converts to -128.000 C if signed format is selected. Note, connecting a 2N3904 transistor to Remote 2 inputs with TruTherm mode active may also cause this bit to be set. 0 Remote Diode 1 Missing (RD1M) When set to "1" Remote Diode 1 is missing. (i.e. D1+ shorted to VDD, Ground or D1-, or D1+ is floating). Temperature Reading is FFE0h which converts to 255.875 C if unsigned format is selected or 8000h which converts to -128.000 C if signed format is selected. Note, connecting a 2N3904 transistor to Remote 1 inputs with TruTherm mode active may also cause this bit to be set. CONFIGURATION REGISTER D7 D6 D5 D4 D3 D2 D1 D0 0 RUN/STOP CR1 CR0 0 R2DF R1DF 0 Bits Name Description 7 Reserved Reports "0" when read. 6 RUN/STOP Logic 1 disables the conversion and puts the part in standby mode. Conversion can be activated by writing to one-shot register. 5-4 Conversion Rate (CR1:CR0) 00: continuous mode 75.8 ms, 13.2 Hz (typ), when diode mode is selected for both remote channels; 77.5 ms, 12.9 Hz (typ), when TruTherm Mode is enabled for one remote channel. 01: converts every 182 ms, 5.5 Hz (typ) 10: converts every 1 second, 1 Hz (typ) 11: converts every 2.7 seconds, 0.37 Hz (typ) Note: typically a remote diode conversion takes 30 ms with diode mode is selected; when the TruTherm Mode is selected a conversion takes an additional 1.7 ms; a local conversion takes 15.8 ms. 3 Reserved Reports "0" when read. 2 Remote 2 Data Format (R2DF) Logic 0: unsigned Temperature format (0 C to +255.875 C) Logic 1: signed Temperature format (-128 C to +127.875 C) 1 Remote 1 Data Format (R1DF) Logic 0: unsigned Temperature format (0 C to +255.875 C) Logic 1: signed Temperature format (-128 C to +127.875 C) 0 Reserved Reports "0" when read. Power up default is with all bits "0" (zero) 16 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 LM95231 www.ti.com SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 REMOTE DIODE FILTER CONTROL REGISTER D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 0 R2FE 0 R1FE Bits Name Description 7-3 Reserved Reports "0" when read. 2 Remote 2 Filter Enable (R2FE) 0: Filter Off 1: Noise Filter On 1 Reserved Reports "0" when read. 0 Remote 1 Filter Enable (R1FE) 0: Filter Off 1: Noise Filter On Power up default is 05h. REMOTE DIODE MODEL TYPE SELECT REGISTER D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 0 R2MS 0 R1MS Bits Name Description 7-3 Reserved Reports "0" when read. 2 Remote Diode 2 Model Select (R2MS) 0: 2N3904 model (make sure TruTherm mode is disabled) 1: Pentium 4 processor on 90nm process model (make sure TruTherm mode is enabled) Power up default is 0. 1 Reserved Reports "0" when read. 0 Remote Diode 1 Model Select (R1MS) 0: 2N3904 model (make sure TruTherm mode is disabled) 1: Pentium 4 processor on 90nm process model (make sure TruTherm mode is enabled) Power up default is 1. Power up default is 01h. REMOTE TruTherm MODE CONTROL D7 D6 D5 D4 D3 D2 D1 D0 Reserved R2M2 R2M1 R2M0 Reserved R1M2 R1M1 R1M0 Bits Description 7 Reserved Must be left at 0. 6-4 R2M2:R2M0 000: Remote 2 TruTherm Mode disabled; used when measuring MMBT3904 transistors 001: Remote 2 TruTherm Mode enabled; used when measuring Processors 111: Remote 2 TruTherm Mode enabled; used when measuring Processors Note, all other codes provide unspecified results and should not be used. 3 Reserved Must be left at 0. 2-0 R1M2:R1M0 000: Remote 1 TruTherm Mode disabled; used when measuring MMBT3904 transistors 001: Remote 1 TruTherm Mode enabled; used when measuring Processors 111: Remote 1 TruTherm Mode enabled; used when measuring Processors Note, all other codes provide unspecified results and should not be used. Power up default is 01h. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 17 LM95231 SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 www.ti.com LOCAL and REMOTE MSB and LSB TEMPERATURE REGISTERS Local Temperature MSB (Read Only Address 10h) 9-bit plus sign format: BIT D7 D6 D5 D4 D3 D2 D1 D0 Value SIGN 64 32 16 8 4 2 1 Temperature Data: LSb = 1C. Local Temperature LSB (Read Only Address 20h) 9-bit plus sign format: BIT D7 D6 D5 D4 D3 D2 D1 D0 Value 0.5 0.25 0 0 0 0 0 0 Temperature Data: LSb = 0.25C. Remote Temperature MSB (Read Only Address 11h, 12h) 10 bit plus sign format: BIT D7 D6 D5 D4 D3 D2 D1 D0 Value SIGN 64 32 16 8 4 2 1 Temperature Data: LSb = 1C. (Read Only Address 11h, 12h) 11-bit unsigned format: BIT D7 D6 D5 D4 D3 D2 D1 D0 Value 128 64 32 16 8 4 2 1 Temperature Data: LSb = 1C. Remote Temperature LSB 12-bit plus sign or 13-bit unsigned binary formats with filter on: BIT D7 D6 D5 D4 D3 D2 D1 D0 Value 0.5 0.25 0.125 0 0 0 0 0 Temperature Data: LSb = 0.125C or 1/8C. 12-bit plus sign or 13-bit unsigned binary formats with filter on: BIT D7 D6 D5 D4 D3 D2 D1 D0 Value 0.5 0.25 0.125 0.0625 0.03125 0 0 0 Temperature Data: LSb = 0.03125C or 1/32C. For data synchronization purposes, the MSB register should be read first if the user wants to read both MSB and LSB registers. The LSB will be locked after the MSB is read. The LSB will be unlocked after being read. If the user reads MSBs consecutively, each time the MSB is read, the LSB associated with that temperature will be locked in and override the previous LSB value locked-in. MANUFACTURERS ID REGISTER (Read Address FEh) The default value is 01h. 18 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 LM95231 www.ti.com SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 DIE REVISION CODE REGISTER (Read Address FFh) The default value is A1h. This register will increment by 1 every time there is a revision to the die by Texas Instruments. Applications Hints The LM95231 can be applied easily in the same way as other integrated-circuit temperature sensors, and its remote diode sensing capability allows it to be used in new ways as well. It can be soldered to a printed circuit board, and because the path of best thermal conductivity is between the die and the pins, its temperature will effectively be that of the printed circuit board lands and traces soldered to the LM95231's pins. This presumes that the ambient air temperature is almost the same as the surface temperature of the printed circuit board; if the air temperature is much higher or lower than the surface temperature, the actual temperature of the LM95231 die will be at an intermediate temperature between the surface and air temperatures. Again, the primary thermal conduction path is through the leads, so the circuit board temperature will contribute to the die temperature much more strongly than will the air temperature. To measure temperature external to the LM95231's die, use a remote diode. This diode can be located on the die of a target IC, allowing measurement of the IC's temperature, independent of the LM95231's temperature. A discrete diode can also be used to sense the temperature of external objects or ambient air. Remember that a discrete diode's temperature will be affected, and often dominated, by the temperature of its leads. Most silicon diodes do not lend themselves well to this application. It is recommended that an MMBT3904 transistor base emitter junction be used with the collector tied to the base. The LM95231's TruTherm technology allows accurate sensing of integrated thermal diodes, such as those found on processors. With TruTherm technology turned off, the LM95231 can measure a diode connected transistor such as the MMBT3904. The LM95231 has been optimized to measure the remote thermal diode integrated in a Pentium 4 processor on 90nm process or an MMBT3904 transistor. Using the Remote Diode Model Select register either pair of remote inputs can be assigned to be either a Pentium 4 processor on 90nm process or an MMBT3904. DIODE NON-IDEALITY Diode Non-Ideality Factor Effect on Accuracy When a transistor is connected as a diode, the following relationship holds for variables VBE, T and IF: IF = IS x e VBE K x Vt -1 where * * * * * * * * kT Vt = q q = 1.6x10-19 Coulombs (the electron charge), T = Absolute Temperature in Kelvin k = 1.38x10-23joules/K (Boltzmann's constant), is the non-ideality factor of the process the diode is manufactured on, IS = Saturation Current and is process dependent, If= Forward Current through the base emitter junction VBE = Base Emitter Voltage drop (1) In the active region, the -1 term is negligible and may be eliminated, yielding the following equation Vbe KV IF = IS e t (2) In Equation 2, and IS are dependant upon the process that was used in the fabrication of the particular diode. By forcing two currents with a very controlled ratio(IF2/IF1) and measuring the resulting voltage difference, it is possible to eliminate the IS term. Solving for the forward voltage difference yields the relationship: Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 19 LM95231 SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 'VBE = K x K qx T x ln www.ti.com IF2 IF1 (3) Solving Equation 3 for temperature yields: T= 'VBE x q IF2 K x k x ln IF1 (4) Equation 4 holds true when a diode connected transistor such as the MMBT3904 is used. When this "diode" equation is applied to an integrated diode such as a processor transistor with its collector tied to GND as shown in Figure 11 it will yield a wide non-ideality spread. This wide non-ideality spread is not due to true process variation but due to the fact that Equation 4 is an approximation. TruTherm technology uses the transistor equation, Equation 5, which is a more accurate representation of the topology of the thermal diode found in an FPGA or processor. T= 'VBE x q IC2 K x k x ln IC1 (5) Pentium(R) 4 PROCESSOR IE = IF 100 pF 1 2 3 IC IR 100 pF 4 D1+ D1D2+ D2- IF Q1 MMBT3904 LM95231 IR Figure 11. Thermal Diode Current Paths TruTherm should only be enabled when measuring the temperature of a transistor integrated as shown in the processor of Figure 11, because Equation 5 only applies to this topology. Calculating Total System Accuracy The voltage seen by the LM95231 also includes the IFRS voltage drop of the series resistance. The non-ideality factor, , is the only other parameter not accounted for and depends on the diode that is used for measurement. Since VBE is proportional to both and T, the variations in cannot be distinguished from variations in temperature. Since the non-ideality factor is not controlled by the temperature sensor, it will directly add to the inaccuracy of the sensor. For the Pentium 4 processor on 90nm process, Intel specifies a +1.19%/-0.27% variation in from part to part when the processor diode is measured by a circuit that assumes diode equation, Equation 4, as true. As an example, assume a temperature sensor has an accuracy specification of 0.75C at a temperature of 65 C (338 Kelvin) and the processor diode has a non-ideality variation of +1.19%/-0.27%. The resulting system accuracy of the processor temperature being sensed will be: TACC = 0.75C + (+1.19% of 338 K) = +4.76 C (6) TACC = 0.75C + (-0.27% of 338 K) = -1.65 C (7) and TrueTherm technology uses the transistor equation, Equation 5, resulting in a non-ideality spread that truly reflects the process variation which is very small. The transistor equation non-ideality spread is 0.1% for the Pentium 4 processor on 90nm process. The resulting accuracy when using TruTherm technology improves to: TACC = 0.75C + (0.1% of 338 K) = 1.08 C (8) The next error term to be discussed is that due to the series resistance of the thermal diode and printed circuit board traces. The thermal diode series resistance is specified on most processor data sheets. For the Pentium 4 processor on 90 nm process, this is specified at 3.33 typical. The LM95231 accommodates the typical series resistance of the Pentium 4 processor on 90 nm process. The error that is not accounted for is the spread of the Pentium's series resistance, that is 3.242 to 3.594 or +0.264 to -0.088. The equation to calculate the temperature error due to series resistance (TER) for the LM95231 is simply: 20 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 LM95231 www.ti.com SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 TER = RPCB x 0.62C/ : (9) Solving Equation 9 for RPCB equal to +0.264 and -0.088 results in the additional error due to the spread in the series resistance of +0.16C to -0.05C. The spread in error cannot be canceled out, as it would require measuring each individual thermal diode device. This is quite difficult and impractical in a large volume production environment. Equation 9 can also be used to calculate the additional error caused by series resistance on the printed circuit board. Since the variation of the PCB series resistance is minimal, the bulk of the error term is always positive and can simply be cancelled out by subtracting it from the output readings of the LM95231. Diode Equation D, non-ideality Processor Family Series R min typ max 1 1.0065 1.0125 Pentium III CPUID 68h/PGA370Socket/ Celeron 1.0057 1.008 1.0125 Pentium 4, 423 pin 0.9933 1.0045 1.0368 Pentium 4, 478 pin 0.9933 1.0045 1.0368 Pentium 4 on 0.13 micron process, 2-3.06GHz 1.0011 1.0021 1.0030 3.64 Pentium III CPUID 67h Pentium 4 on 90 nm process 1.0083 1.011 1.023 3.33 Pentium M Processor (Centrino) 1.00151 1.00220 1.00289 3.06 MMBT3904 1.003 AMD Athlon MP model 6 1.002 1.008 1.016 AMD Athlon 64 1.008 1.008 1.096 AMD Opteron 1.008 1.008 1.096 AMD Sempron 1.00261 0.93 Compensating for Different Non-Ideality In order to compensate for the errors introduced by non-ideality, the temperature sensor is calibrated for a particular processor. Texas Instruments temperature sensors are always calibrated to the typical non-ideality and series resistance of a given processor type. The LM95231 is calibrated for two non-ideality factors and series resistance values thus supporting the MMBT3904 transistor and the Pentium 4 processor on 90nm process without the requirement for additional trims. For most accurate measurements TruTherm mode should be turned on when measuring the Pentium 4 processor on the 90nm process to minimize the error introduced by the false non-ideality spread (see Diode Non-Ideality Factor Effect on Accuracy). When a temperature sensor calibrated for a particular processor type is used with a different processor type, additional errors are introduced. Temperature errors associated with non-ideality of different processor types may be reduced in a specific temperature range of concern through use of software calibration. Typical Non-ideality specification differences cause a gain variation of the transfer function, therefore the center of the temperature range of interest should be the target temperature for calibration purposes. The following equation can be used to calculate the temperature correction factor (TCF) required to compensate for a target non-ideality differing from that supported by the LM95231. TCF = [(S-Processor) / S] x (TCR+ 273 K) (10) where * S = LM95231 non-ideality for accuracy specification * T = target thermal diode typical non-ideality * TCR = center of the temperature range of interest in C The correction factor of Equation 10 should be directly added to the temperature reading produced by the LM95231. For example when using the LM95231, with the 3904 mode selected, to measure a AMD Athlon processor, with a typical non-ideality of 1.008, for a temperature range of 60 C to 100 C the correction factor would calculate to: TCF=[(1.003-1.008)/1.003]x(80+273) =-1.75C (11) Therefore, 1.75C should be subtracted from the temperature readings of the LM95231 to compensate for the differing typical non-ideality target. Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 21 LM95231 SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 www.ti.com PCB LAYOUT FOR MINIMIZING NOISE Figure 12. Ideal Diode Trace Layout In a noisy environment, such as a processor mother board, layout considerations are very critical. Noise induced on traces running between the remote temperature diode sensor and the LM95231 can cause temperature conversion errors. Keep in mind that the signal level the LM95231 is trying to measure is in microvolts. The following guidelines should be followed: 1. VDD should be bypassed with a 0.1F capacitor in parallel with 100pF. The 100pF capacitor should be placed as close as possible to the power supply pin. A bulk capacitance of approximately 10F needs to be in the near vicinity of the LM95231. 2. A 100pF diode bypass capacitor is recommended to filter high frequency noise but may not be necessary. Make sure the traces to the 100pF capacitor are matched. Place the filter capacitors close to the LM95231 pins. 3. Ideally, the LM95231 should be placed within 10cm of the Processor diode pins with the traces being as straight, short and identical as possible. Trace resistance of 1 can cause as much as 0.62C of error. This error can be compensated by using simple software offset compensation. 4. Diode traces should be surrounded by a GND guard ring to either side, above and below if possible. This GND guard should not be between the D+ and D- lines. In the event that noise does couple to the diode lines it would be ideal if it is coupled common mode. That is equally to the D+ and D- lines. 5. Avoid routing diode traces in close proximity to power supply switching or filtering inductors. 6. Avoid running diode traces close to or parallel to high speed digital and bus lines. Diode traces should be kept at least 2cm apart from the high speed digital traces. 7. If it is necessary to cross high speed digital traces, the diode traces and the high speed digital traces should cross at a 90 degree angle. 8. The ideal place to connect the LM95231's GND pin is as close as possible to the Processors GND associated with the sense diode. 9. Leakage current between D+ and GND and between D+ and D- should be kept to a minimum. Thirteen nano-amperes of leakage can cause as much as 0.2C of error in the diode temperature reading. Keeping the printed circuit board as clean as possible will minimize leakage current. Noise coupling into the digital lines greater than 400mVp-p (typical hysteresis) and undershoot less than 500mV below GND, may prevent successful SMBus communication with the LM95231. SMBus no acknowledge is the most common symptom, causing unnecessary traffic on the bus. Although the SMBus maximum frequency of communication is rather low (100kHz max), care still needs to be taken to ensure proper termination within a system with multiple parts on the bus and long printed circuit board traces. An RC lowpass filter with a 3db corner frequency of about 40MHz is included on the LM95231's SMBCLK input. Additional resistance can be added in series with the SMBDAT and SMBCLK lines to further help filter noise and ringing. Minimize noise coupling by keeping digital traces out of switching power supply areas as well as ensuring that digital lines containing high speed data communications cross at right angles to the SMBDAT and SMBCLK lines. 22 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 LM95231 www.ti.com SNIS139E - FEBRUARY 2005 - REVISED MARCH 2013 REVISION HISTORY Changes from Revision D (March 2013) to Revision E * Page Changed layout of National Data Sheet to TI format .......................................................................................................... 22 Submit Documentation Feedback Copyright (c) 2005-2013, Texas Instruments Incorporated Product Folder Links: LM95231 23 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM95231BIMM-1/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T25B LM95231BIMM-2/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T26B LM95231BIMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T23B LM95231BIMMX-1/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T25B LM95231BIMMX-2/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T26B LM95231BIMMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T23B LM95231CIMM-1 NRND VSSOP DGK 8 1000 TBD Call TI Call TI 0 to 85 T25C LM95231CIMM-1/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T25C LM95231CIMM-2/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T26C LM95231CIMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T23C LM95231CIMMX-1/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T25C LM95231CIMMX-2/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T26C LM95231CIMMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T23C (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM95231BIMM-1/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM95231BIMM-2/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM95231BIMM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM95231BIMMX-1/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM95231BIMMX-2/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM95231BIMMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM95231CIMM-1 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM95231CIMM-1/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM95231CIMM-2/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM95231CIMM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM95231CIMMX-1/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM95231CIMMX-2/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM95231CIMMX/NOPB VSSOP Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM95231BIMM-1/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM95231BIMM-2/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM95231BIMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM95231BIMMX-1/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM95231BIMMX-2/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM95231BIMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM95231CIMM-1 VSSOP DGK 8 1000 210.0 185.0 35.0 LM95231CIMM-1/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM95231CIMM-2/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM95231CIMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM95231CIMMX-1/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM95231CIMMX-2/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM95231CIMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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