CSPEMI204FCTAG - ON SEMICONDUCTOR

August, 2015 − Rev. 0 1Publication Order Number:

CSPEMI204/D

CSPEMI204

EMI Filter with ESD

Protection

Product Description

The CSPEMI204 is an L−R−C EMI filter array with ESD protection

that integrates two Pi−filters (C−L−R−C) to suppress EMI/RFI Noise.

CSPEMI204 includes ESD protection diodes on all input/output pins,

and provides a very high level of protection for sensitive electronic

components against possible electrostatic discharge (ESD). The ESD

diodes connected to the filter ports safely dissipate ESD strikes of

±30 kV, which is beyond the maximum requirement of the

IEC61000−4−2 international standard.

Features

•Two Channels of EMI Filtering

•±30 kV ESD Protection (IEC 61000−4−2, Contact Discharge)

•±30 kV ESD Protection (IEC 61000−4−2, Air Discharge)

•Greater than 45 dB of Attenuation at 900 MHz

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Applications

•Mobile Phones

MAXIMUM RATINGS (TA = 25°C)

Rating Symbol Value Unit

ESD Discharge IEC61000−4−2

Contact Discharge

Air Discharge

Vpp 30

RMS Current per Line ILine 350 mA

Operating Temperature Range TJ−40 to +125 °C

Storage Temperature Range Tstg −55 to +150 °C

Lead Solder Temperature

(10 second duration) TL260 °C

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be af fected.

MARKING DIAGRAM

Device Package Shipping†

ORDERING INFORMATION

www.onsemi.com

CSPEMI204FCTAG WLCSP5

(Pb−Free) 5000 / Tape &

Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

WLCSP5

FC SUFFIX

CASE 567MA

BLOCK DIAGRAM

AT = Specific Device Code

M = Date Code

ATM

A1 C1

GND B1

A3 C3

GND B1

Filter#1 Filter#2

CSPEMI204

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Table 1. PIN DESCRIPTIONS

Pin Name Description

A1 Filter #1 Filter #1 Input/Output

C1 Filter #1 Filter #1 Input/Output

A3 Filter #2 Filter #2 Input/Output

C3 Filter #2 Filter #2 Input/Output

B2 GND Device Ground

PACKAGE/PINOUT DIAGRAMS

Top View

(Bumps Down View)

Bottom View

(Bumps Up View)

Orientation

Marking

WLCSP5 Package

A3 C3

AT A1 C1

B+

Table 2. ELECTRICAL OPERATING CHARACTERISTICS (TA = 25°C unless otherwise noted)

Symbol Parameter Test Conditions Min Typ Max Unit

VRWM Working Voltage 3.0 V

VBR Breakdown Voltage IT = 1 mA; (Note 4) 6.0 V

ILEAK Channel Leakage Current VIN = 3.0 V, GND = 0 V 400 nA

RCH Channel Resistance

(Pins A1 – A3, C1 – C3) 3.0 W

Ct Line Capacitance VR = 0 V, f = 1 MHz 185 250 315 pF

f3dB Cutoff Frequency 450 W Source and

10 kW Load Termination 2.0 MHz

f3dB Cutoff Frequency 50 W Termination 25 MHz

Fatten Stop Band Attenuation @ 700 MHz

@ 900 MHz 40

47 dB

VESD Insystem ESD Withstand Voltage

a) Contact discharge per IEC 6100042 standard, Level 4

(External Pins)

b) Contact discharge per IEC 6100042 standard, Level 1

(Internal Pins)

(Notes 1 and 2)

±30

VCL TLP Clamping Voltage Forward IPP = 8 A

Forward IPP = 16 A

Forward IPP = ±8 A

Forward IPP = ±16 A

9.8

11.5

−9.7

−11.7

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

1. Standard IEC61000−4−2 with CDischarge = 150 pF, RDischarge = 330, GND grounded.

2. These measurements performed with no external capacitor.

3. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DC

or continuous peak operating voltage level.

4. VBR is measured at pulse test current IT.

CSPEMI204

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PERFORMANCE INFORMATION

Typical Filter Performance

Figure 1. Typical Insertion Loss (50 W

Termination)

1.E+07 1.E+08 1.E+09 1.E+10

−60

−50

−40

−30

−20

−10

FREQUENCY (Hz)

S21 (dB)

Figure 2. Typical THD+N at 1.8 V

20 200 2000 20000

−120

−115

−110

−105

−100

−95

−90

FREQUENCY (Hz)

THD+N (dB)

1.E+05 1.E+06

Figure 3. Typical Insertion Loss (450 W Source

and 10 kW Load Termination)

1.E+07 1.E+08 1.E+09 1.E+

−60

−50

−40

−30

−20

−10

FREQUENCY (Hz)

S21 (dB)

1.E+05 1.E+06 1.E+10

−100

−90

−80

−70

−85

−80

CSPEMI204

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IEC 61000−4−2 Spec.

Level Test Volt-

age (kV)

First Peak

Current

(A) Current at

30 ns (A) Current at

60 ns (A)

1 2 7.5 4 2

2 4 15 8 4

3 6 22.5 12 6

4 8 30 16 8

Ipeak

90%

10%

IEC61000−4−2 W aveform

100%

I @ 30 ns

I @ 60 ns

tP = 0.7 ns to 1 ns

Figure 4. IEC61000−4−2 Spec

Figure 5. Diagram of ESD Clamping Voltage Test Setup

50 W

Cable

TVS Oscilloscope

ESD Gun

The following is taken from Application Note

AND8308/D − Interpretation of Datasheet Parameters

for ESD Devices.

ESD Voltage Clamping

For sensitive circuit elements it is important to limit the

voltage that an IC will be exposed to during an ESD event

to as low a voltage as possible. The ESD clamping voltage

is the voltage drop across the ESD protection diode during

an ESD event per the IEC61000−4−2 waveform. Since the

IEC61000−4−2 was written as a pass/fail spec for larger

systems such as cell phones or laptop computers it is not

clearly defined in the spec how to specify a clamping voltage

at the device level. ON Semiconductor has developed a way

to examine the entire voltage waveform across the ESD

protection diode over the time domain of an ESD pulse in the

form of an oscilloscope screenshot, which can be found on

the datasheets for all ESD protection diodes. For more

information on how ON Semiconductor creates these

screenshots and how to interpret them please refer to

AND8307/D.

CSPEMI204

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Figure 6. Positive TLP I−V Curve (Preliminary) Figure 7. Negative TLP I−V Curve (Preliminary)

TLP CURRENT (A)

VC, VOLTAGE (V)

01412246 108

TLP CURRENT (A)

VC, VOLTAGE (V)

−25

0 −14−12−10−2 −4 −6 −8

NOTE: TLP parameter: Z0 = 50 W, tp = 100 ns, tr = 300 ps, averaging window: t1 = 30 ns to t2 = 60 ns. VIEC is the equivalent voltage

stress level calculated at the secondary peak of the IEC 61000−4−2 waveform at t = 30 ns with 2 A/kV. See TLP description

below for more information.

−20

−15

−10

−5

Transmission Line Pulse (TLP) Measurement

Transmission Line Pulse (TLP) provides current versus

voltage (I−V) curves in which each data point is obtained

from a 100 ns long rectangular pulse from a charged

transmission line. A simplified schematic of a typical TLP

system is shown in Figure 8. TLP I−V curves of ESD

protection devices accurately demonstrate the product’s

ESD capability because the 10s of amps current levels and

under 100 ns time scale match those of an ESD event. This

is illustrated in Figure 9 where an 8 kV IEC 61000−4−2

current waveform is compared with TLP current pulses at

8 A and 16 A. A TLP I−V curve shows the voltage at which

the device turns on as well as how well the device clamps

voltage over a range of current levels.

Figure 8. Simplified Schematic of a Typical TLP

System

DUT

Oscilloscope

Attenuator

10 MW

50 W Coax

Cable

50 W Coax

Cable

Figure 9. Comparison Between 8 kV IEC 61000−4−2 and 8 A and 16 A TLP Waveforms

CSPEMI204

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PACKAGE DIMENSIONS

WLCSP5, 1.26x0.89

CASE 567MA

ISSUE O

SEATING

PLANE

0.10 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

4. DIMENSION b IS MEASURED AT THE MAXIMUM

BALL DIAMETER PARALLEL TO DATUM C.

2X DIM

AMIN MAX

−−−

MILLIMETERS

D1.26 BSC

b0.235 0.295

e0.50 BSC

0.50

PIN A1

REFERENCE

A0.10 BC

0.05 C

5X b

123

0.10 C

0.18 0.22

0.89 BSC

e1 0.435 BSC

0.50

0.27

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.87

0.10 C

2X TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

A2 0.255 REF

RECOMMENDED

A1 PACKAGE

OUTLINE

e/2

PITCH

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USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

CSPEMI204/D

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19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your loc

Sales Representative