3M™Scotch-Weld™
Epo xy Adhesives
DP110 T ranslucent and Gray
- 5 -
Handling/Curing
Information Directions for Use
1. For high strength structural bonds, paint, oxide f ilms, oils, dust, mold release
agents and all other surface contaminants must be completely remo v ed from
substrates to be bonded. Ho wever, the amount of surface preparation necessary
directly depends on the user’s required bond strength, environmental aging
resistance and economic practicalities. For specific surface preparations on
common substrates, see the section on surface preparation.
2. These products consist of two parts.
Mixing
F or Duo-P ak Cartridges
3M™ Scotch-Weld™ Epoxy Adhesi ve DP110 Translucent and Gray are
supplied in a dual syringe plastic duo-pak cartridge as part of the 3M™ EPX™
Applicator system. To use, simply insert the duo-pak cartridge into the EPX
applicator and start the plunger into the cylinders using light pressure on the
trigger. Next, remove the duo-pak cartridge cap and expel a small amount of
adhesi ve to be sure both sides of the duo-pak cartridge are flowing evenly and
freely. If automatic mixing of Part A and Part B is desired, attach the EPX
mixing nozzle to the duo-pak cartridge and begin dispensing the adhesive. For
hand mixing, expel the desired amount of adhesive and mix thoroughly. Mix
approximately 15 seconds after a uniform color is obtained.
F or Bulk Containers
Mix thoroughly by weight or volume in the proportions specified on the product
label or in the uncured properties section. Mix approximately 15 seconds after a
uniform color is obtained.
3. For maximum bond strength apply product e v enly to both surf aces to be joined.
4. Application to the substrates should be made within 8 minutes. Larger quantities
and/or higher temperatures will reduce this working time.
5. Join the adhesiv e coated surf aces and allow to cure at 60°F (16°C) or above until
completely firm. Heat up to 200°F (93°C), will speed curing. These products will
fully cure in 48 hours @ 75°F (24°C).
6. Keep parts from mo ving during cure. Contact pressure necessary. Maximum shear
strength is obtained with a 3-5 mil bond line.
7. Excess uncured adhesiv e can be cleaned up with k etone type solv ents.*
*Note: When using solvents, e xtinguish all ignition sources, including pilot lights,
and follo w the manuf acturer’s precautions and directions for use.
Adhesive Co v erage: A 0.005 in. thick bondline will typically yield a cov erage of
320 sq. ft./gallon.