TORX1350(F) - TOSHIBA - Product.Network

TORX1350(F)

2013-12-13

FIBER OPTIC RECEIVING MODULE

TORX1350(F)

GENERAL PURPOSE OPTICAL RECEIVING MODULE

 For JIS F05 Optical Connector

 TTL interface

 +5V Single Power supply

 ATC (Automatic Threshold Control) circuit is used for stabilized output at a wide range of optical power level.

1. Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Storage Temperature Tstg −40 to 95 °C

Operating Temperature Topr −40 to 85 °C

Supply Voltage VCC

−0.5 to 6 V

High Level Output Current IOH

−1 mA

Low Level Output Current IOL

20 mA

Soldering Temperature Tsol

260 (Note 1) °C

Note 1: Soldering time ≤ 10 s (More than 1 mm apart from the package).

Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant

change in temperature , etc) May cause this product to decrease in the reliability significantly even if the

operating conditions (i.e.operating temperature/ current/ voltage, etc.) are within the absolute maximum ratings

and the operating ranges.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“derating Concept and Methods”) and individual reliability data (i.e. reliability test report and

estimated failure rate, etc).

2. Operating Ranges

Characteristics Symbol Min Typ. Max Unit

Supply Voltage VCC

4.75 5.0 5.25 V

Data Rate － DC － 10 Mb/s

High Level Output Current IOH

－－ −150 μA

Low Level Output Current IOL

－－ 2.0 mA

TORX1350(F)

2013-12-13

3. Electrical and Optical Characteristics (Ta = 25°C, Vcc = 5 V)

Characteristics Symbol Test Condition Min Typ. Max Unit

Data Rate NRZ Code(Note 2) DC － 10 Mb / s

Transmission Distance(Note5) Using APF (Note3) and TOTX1350(F) 0.2 － 100 m

Pulse Width Distortion (Note4)(Note5) Δtw −30 － 30 ns

Maximum Receivable Power (Note 6) PMAX

Using APF(Note 3), DC to 10 Mb / s −8 －－ dBm

Minimum Receivable Power (Note 6) PMIN

Using APF(Note 3) , DC to 10 Mb / s －－ −27 dBm

Current Consumption ICC

－ 9 20 mA

High Level Output Voltage VOH

3.5 4.0 － V

Low Level Output Voltage VOL

－ 0.1 0.4 V

Note 2: High level output when optical flux is received. Low level output when it is not received.

Note 3: All Plastic Fiber (980μm core / 1000μm cladding, NA=0.5). Polished surface.

Transmission Loss is less than 0.18dB/m. (100m @ 650nm)

Note 4: Between input of driver circuit of TOTX1350(F) and output of TORX1350(F).

Note 5: A value changes with LED drive circuits.

Note 6: BER ≤ 10−9, Valued by peak.

4. Application Circuit

5. Applicable Optical Fiber with Fiber Optic Connectors

All Plastic Fiber (980μm core / 1000 μm cladding, NA=0.5) with F05 type optical connector. Polished surface.

Transmission loss is less than 0.18dB/m. (100m@650nm).

TORX1350(F)

Soldered to PC board

Less than 7mm

Vcc GND Output

(Bottom View)

0.1μF

47μH

④ ⑤

Fiber optic connector insertion side

TORX1350(F)

2013-12-13

6. Precautions during use

(1) Absolute maximum rating

The absolute maximum ratings are the limit values which must not be exceeded during operation of device.

None of these rating value must not be exceeded. If The absolute maximum rating value is exceeded, the

characteristics of devices may never be recovered properly. In extreme cases, the device may be

permanently damages.

(2) Operating Range

The operating range is the range of conditions necessary for the device to operate as specified in

individual technical datasheets and databooks. Care must be exercised in the design of the equipment. If a

device is used under conditions that do not exceed absolute maximum ratings but exceed the operating

range, the specifications related to device operation and electrical characteristics may not be met, resulting

in a decrease in reliability.

If greater reliability is required, derate the device’s operating ranges for voltage, current, power and

temperature before use.

(3) Soldering

Optical modules are comprised of internal semiconductor devices. However, in principle, optical modules

are optical components. During soldering, ensure that flux dose not contact with the emitting surface or

detecting surface. Also ensure that proper flux removal is conducted after soldering.

Some optical modules come with protective cap. The protective cap is used to avoid malfunction when the

optical module is not in use. Not that it is not dust or waterproof.

As mentioned before, optical modules are optical component. Thus, in principle, soldering where there

may be flux residue or flux removal after soldering is not recommended. Toshiba recommends that

soldering be performed without the optical module mounted on the board. Then, after the board is cleaned,

solder the optical module manually. Do not perform any further cleaning.

If the optical module cannot be soldered manually, use non−halogen (chlorine−free) flux and make sure,

without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the effects of

flux. In such a case, check the reliability.

(4) Noise resistance

It is believed that the use of optical transfer devices improve the noise resistance. In principle, optical fiber

is not affected by noise. However, especially receiving module which handle signals whose level is

extremely small, are comparatively more susceptible to noise.

When using TOSLINK, Toshiba recommends that you test using the actual device and check the noise

resistance.

Use a simple noise filter on the TOSLINK fiber optic receiving module power line. If the ripple in power

supply used is high, further reinforce the filter.

When locating the optical module in an area susceptible to radiated noise, increase shielding by covering

the optical module and the power line filter using a metallic cover.

(5) Vibration and shock

This module is resin−molded construction with wire fixed by resin. This structure is relatively sound against

vibration or shock, In actual equipment, there are some cases where vibration, shock, and stress is applied

to soldered parts or connected parts, resulting in line cut. Attention must be paid to the design of the

mechanism for applications which are subject to large amounts of vibration.

(6) Fixing fiber optical receiving module

Solder the fixed pin (pins 4 and 5) of fiber optic receiving module TORX1350(F) to the printed circuit board

to fix the module to the board.

(7) Solvent

When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to pour

solvent in the optical connector ports. If solvent is inadvertently poured there, clean with cotton tips.

(8) Protective cap

When the fiber optic receiving module TORX1350(F) is not in use, use the protective cap.

TORX1350(F)

2013-12-13

(9) Supply voltage

Use the supply voltage within the operating ranges (VCC = 5 ± 0.25 V). Make sure that supply voltage

does not exceed the absolute maximum rating value of 6 V, even instantaneously.

(10) Output

When the receiver output is at low level and connected to the power supply, or when the output is at high

level and connected to GND, the internal IC may be destroyed.

(11) Soldering condition

Solder at 260°C or less within ten seconds.

(12) An influence of flash or strong light

Do not emit a flash or a strong light to the optical module directly. They may cause an error in data

transmission.

(13) Precaution on waste

When discarding devices and packing materials, follow procedures stipulated by local regulations in order

to protect the environment against contamination.

TORX1350(F)

2013-12-13

7. Package Outline drawing

Unit: mm

Pin Connection

1.OUTPUT

2.GND

3. Vcc

4. NC

5. NC

TORX1350(F)

2013-12-13

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the

Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of

all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes

for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the

instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their

own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such

design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,

diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating

parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR

APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH

MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without

limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for

automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,

safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE

PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your

TOSHIBA sales representative.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without

limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile

technology products (mass destruction weapons). Product and related software and technology may be controlled under the

applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the

U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited

except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES

OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.