July 31, 2008
ADC101S101
Single Channel, 0.5 to 1 Msps, 10-Bit A/D Converter
General Description
The ADC101S101 is a low-power, single channel, CMOS 10-
bit analog-to-digital converter with a high-speed serial inter-
face. Unlike the conventional practice of specifying perfor-
mance at a single sample rate only, the ADC101S101 is fully
specified over a sample rate range of 500 ksps to 1 Msps. The
converter is based upon a successive-approximation register
architecture with an internal track-and-hold circuit.
The output serial data is straight binary, and is compatible with
several standards, such as SPI™, QSPI™, MICROWIRE,
and many common DSP serial interfaces.
The ADC101S101 operates with a single supply that can
range from +2.7V to +5.25V. Normal power consumption us-
ing a +3V or +5V supply is 2.0 mW and 10 mW, respectively.
The power-down feature reduces the power consumption to
as low as 2.5 µW using a +5V supply.
The ADC101S101 is packaged in 6-lead LLP and SOT-23
packages. Operation over the industrial temperature range of
−40°C to +85°C is guaranteed.
Features
Specified over a range of sample rates.
6-lead LLP and SOT-23 packages
Variable power management
Single power supply with 2.7V - 5.25V range
SPI™/QSPI™/MICROWIRE/DSP compatible
Key Specifications
DNL +0.3 / −0.2 LSB (typ)
INL ± 0.2 LSB (typ)
SNR 62 dB (typ)
Power Consumption
3V Supply 2.0 mW (typ)
5V Supply 10 mW (typ)
Applications
Portable Systems
Remote Data Aquisitions
Instrumentation and Control Systems
Pin-Compatible Alternatives by Resolution and Speed
All devices are fully pin and function compatible.
Resolution Specified for Sample Rate Range of:
50 to 200 ksps 200 to 500 ksps 500 ksps to 1 Msps
12-bit ADC121S021 ADC121S051 ADC121S101
10-bit ADC101S021 ADC101S051 ADC101S101
8-bit ADC081S021 ADC081S051 ADC081S101
Connection Diagram
20145205
Ordering Information
Order Code Temperature Range Description Top Mark
ADC101S101CISD −40°C to +85°C 6-Lead LLP Package X2C
ADC101S101CISDX −40°C to +85°C 6-Lead LLP Package, Tape & Reel X2C
ADC101S101CIMF −40°C to +85°C 6-Lead SOT-23 Package X02C
ADC101S101CIMFX −40°C to +85°C 6-Lead SOT-23 Package, Tape & Reel X02C
ADC101S101EVAL SOT-23 Evaluation Board
TRI-STATE® is a registered trademark of National Semiconductor Corporation.
© 2008 National Semiconductor Corporation 201452 www.national.com
ADC101S101 Single Channel, 0.5 to 1 Msps, 10-Bit A/D Converter
Block Diagram
20145207
Pin Descriptions and Equivalent Circuits
Pin No. Symbol Description
ANALOG I/O
3VIN Analog input. This signal can range from 0V to VA.
DIGITAL I/O
4 SCLK Digital clock input. This clock directly controls the conversion and readout processes.
5 SDATA Digital data output. The output samples are clocked out of this pin on falling edges of the SCLK pin.
6 CS Chip select. On the falling edge of CS, a conversion process begins.
POWER SUPPLY
1VA
Positive supply pin. This pin should be connected to a quiet +2.7V to +5.25V source and bypassed to
GND with a 1 µF capacitor and a 0.1 µF monolithic capacitor located within 1 cm of the power pin.
2 GND The ground return for the supply and signals.
PAD GND For package suffix CISD(X) only, it is recommended that the center pad should be connected to ground.
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ADC101S101
Absolute Maximum Ratings (Notes 1, 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Analog Supply Voltage VA−0.3V to 6.5V
Voltage on Any Pin to GND −0.3V to (VA +0.3)V
Input Current at Any Pin (Note 3) ±10 mA
Package Input Current (Note 3) ±20 mA
Power Consumption at TA = 25°C See (Note 4)
ESD Susceptibility (Note 5)
Human Body Model
Machine Model
3500V
300V
Junction Temperature +150°C
Storage Temperature −65°C to +150°C
Operating Ratings (Notes 1, 2)
Operating Temperature Range −40°C TA +85°C
VA Supply Voltage +2.7V to +5.25V
Digital Input Pins Voltage Range
(regardless of supply voltage) −0.3V to +5.25V
Clock Frequency 1 MHz to 20 MHz
Sample Rate up to 1 Msps
Analog Input Voltage 0V to VA
Package Thermal Resistance
Package θJA
6-lead LLP 94°C / W
6-lead SOT-23 265°C / W
Soldering process must comply with National
Semiconductor's Reflow Temperature Profile specifications.
Refer to www.national.com/packaging. (Note 6)
ADC101S101 Converter Electrical Characteristics (Notes 7, 9)
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, fSCLK = 10 MHz to 20 MHz, CL = 15 pF,
fSAMPLE = 500 ksps to 1 Msps, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25°C.
Symbol Parameter Conditions Typical Limits
(Note 9) Units
STATIC CONVERTER CHARACTERISTICS
Resolution with No Missing Codes 10 Bits
INL Integral Non-Linearity VA = +2.7V to +5.25V ±0.2 ±0.7 LSB (max)
DNL Differential Non-Linearity VA = +2.7V to +5.25V +0.3 ±0.7 LSB (max)
−0.2 LSB (min)
VOFF Offset Error VA = +2.7V to +5.25V ±0.1 ±0.7 LSB (max)
GE Gain Error VA = +2.7V to +5.25V ±0.2 ±1.0 LSB (min)
DYNAMIC CONVERTER CHARACTERISTICS
SINAD Signal-to-Noise Plus Distortion Ratio VA = +2.7 to 5.25V
fIN = 100 kHz, −0.02 dBFS 61.7 61 dB (min)
SNR Signal-to-Noise Ratio VA = +2.7 to 5.25V
fIN = 100 kHz, −0.02 dBFS 62 61.2 dB (min)
THD Total Harmonic Distortion VA = +2.7 to 5.25V
fIN = 100 kHz, −0.02 dBFS −77 −73 dB (max)
SFDR Spurious-Free Dynamic Range VA = +2.7 to 5.25V
fIN = 100 kHz, −0.02 dBFS 78 74 dB (min)
ENOB Effective Number of Bits VA = +2.7 to 5.25V
fIN = 100 kHz, −0.02 dBFS 9.9 9.8 Bits (min)
IMD
Intermodulation Distortion, Second
Order Terms
VA = +5.25V
fa = 103.5 kHz, fb = 113.5 kHz −78 dB
Intermodulation Distortion, Third Order
Terms
VA = +5.25V
fa = 103.5 kHz, fb = 113.5 kHz −78 dB
FPBW -3 dB Full Power Bandwidth VA = +5V 11 MHz
VA = +3V 8 MHz
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ADC101S101
Symbol Parameter Conditions Typical Limits
(Note 9) Units
ANALOG INPUT CHARACTERISTICS
VIN Input Range 0 to VAV
IDCL DC Leakage Current ±1 µA (max)
CINA Input Capacitance Track Mode 30 pF
Hold Mode 4 pF
DIGITAL INPUT CHARACTERISTICS
VIH Input High Voltage VA = +5.25V 2.4 V (min)
VA = +3.6V 2.1 V (min)
VIL Input Low Voltage VA = +5V 0.8 V (max)
VA = +3V 0.4 V (max)
IIN Input Current VIN = 0V or VA±0.1 ±1 µA (max)
CIND Digital Input Capacitance 2 4pF (max)
DIGITAL OUTPUT CHARACTERISTICS
VOH Output High Voltage ISOURCE = 200 µA VA − 0.07 VA − 0.2 V (min)
ISOURCE = 1 mA VA − 0.1 V
VOL Output Low Voltage ISINK = 200 µA 0.03 0.4 V (max)
ISINK = 1 mA 0.1 V
IOZH, IOZL TRI-STATE® Leakage Current ±0.1 ±10 µA (max)
COUT TRI-STATE® Output Capacitance 2 4pF (max)
Output Coding Straight (Natural) Binary
POWER SUPPLY CHARACTERISTICS
VASupply Voltage 2.7 V (min)
5.25 V (max)
IA
Supply Current, Normal Mode
(Operational, CS low)
VA = +5.25V,
fSAMPLE = 1 Msps
SOT-23 2.0 3.2 mA (max)
LLP 2.8
VA = +3.6V,
fSAMPLE = 1 Msps
SOT-23 0.6 1.5 mA (max)
LLP 1.3
Supply Current, Shutdown (CS high)
fSCLK = 0 MHz, VA = +5V
fSAMPLE = 0 ksps 500 nA
VA = +5V, fSCLK = 20 MHz,
fSAMPLE = 0 ksps 60 µA
PD
Power Consumption, Normal Mode
(Operational, CS low)
VA = +5V SOT-23 10.0 16 mW (max)
LLP 14
VA = +3V SOT-23 2.0 4.5 mW (max)
LLP 3.9
Power Consumption, Shutdown (CS
high)
fSCLK = 0 MHz, VA = +5V
fSAMPLE = 0 ksps 2.5 µW
fSCLK = 20 MHz, VA = +5V,
fSAMPLE = 0 ksps 300 µW
AC ELECTRICAL CHARACTERISTICS
fSCLK Clock Frequency (Note 8) 10 MHz (min)
20 MHz (max)
fSSample Rate (Note 8) 500 ksps (min)
1Msps (max)
tCONV Conversion Time 16 SCLK cycles
DC SCLK Duty Cycle fSCLK = 20 MHz 50 40 % (min)
60 % (max)
tACQ Track/Hold Acquisition Time 400 ns (max)
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ADC101S101
Symbol Parameter Conditions Typical Limits
(Note 9) Units
Throughput Time Acquisition Time + Conversion Time 20 SCLK cycles
tQUIET (Note 10) 50 ns (min)
tAD Aperture Delay 3 ns
tAJ Aperture Jitter 30 ps
ADC101S101 Timing Specifications
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, fSCLK = 10.0 MHz to 20.0 MHz, CL = 25 pF,
fSAMPLE = 500 ksps to 1 Msps, Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25°C.
Symbol Parameter Conditions Typical Limits Units
tCS Minimum CS Pulse Width 10 ns (min)
tSU CS to SCLK Setup Time 10 ns (min)
tEN
Delay from CS Until SDATA TRI-STATE® Disabled
(Note 11) 20 ns (max)
tACC Data Access Time after SCLK Falling Edge (Note 12) VA = +2.7 to +3.6 40 ns (max)
VA = +4.75 to +5.25 20 ns (max)
tCL SCLK Low Pulse Width 0.4 x tSCLK ns (min)
tCH SCLK High Pulse Width 0.4 x tSCLK ns (min)
tHSCLK to Data Valid Hold Time VA = +2.7 to +3.6 7ns (min)
VA = +4.75 to +5.25 5ns (min)
tDIS
SCLK Falling Edge to SDATA High Impedance (Note
13)
VA = +2.7 to +3.6 25 ns (max)
6ns (min)
VA = +4.75 to +5.25 25 ns (max)
5ns (min)
tPOWER-UP Power-Up Time from Full Power-Down 1 µs
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: All voltages are measured with respect to GND = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds the power supply (that is, VIN < GND or VIN > VA), the current at that pin should be limited to 10 mA. The 20
mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two. The Absolute
Maximum Rating specification does not apply to the VA pin. The current into the VA pin is limited by the Analog Supply Voltage specification.
Note 4: The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the
junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDmax = (TJmax − TA) / θJA. The values
for maximum power dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven
beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.
Note 5: Human body model is 100 pF capacitor discharged through a 1.5 k resistor. Machine model is 220 pF discharged through zero ohms.
Note 6: Reflow temperature profiles are different for lead-free and non-lead-free packages.
Note 7: Tested limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Note 8: This is the frequency range over which the electrical performance is guaranteed. The device is functional over a wider range which is specified under
Operating Ratings.
Note 9: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.
Note 10: Minimum Quiet Time required by bus relinquish and the start of the next conversion.
Note 11: Measured with the timing test circuit shown in Figure 1 and defined as the time taken by the output signal to cross 1.0V.
Note 12: Measured with the timing test circuit shown in Figure 1 and defined as the time taken by the output signal to cross 1.0V or 2.0V.
Note 13: tDIS is derived from the time taken by the outputs to change by 0.5V with the timing test circuit shown in Figure 1. The measured number is then adjusted
to remove the effects of charging or discharging the output capacitance. This means that tDIS is the true bus relinquish time, independent of the bus loading.
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ADC101S101
Timing Diagrams
20145208
FIGURE 1. Timing Test Circuit
20145206
FIGURE 2. ADC101S101 Serial Timing Diagram
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ADC101S101
Specification Definitions
ACQUISITION TIME is the time required to acquire the input
voltage. That is, it is time required for the hold capacitor to
charge up to the input voltage.
APERTURE DELAY is the time between the fourth falling
SCLK edge of a conversion and the time when the input signal
is acquired or held for conversion.
APERTURE JITTER (APERTURE UNCERTAINTY) is the
variation in aperture delay from sample to sample. Aperture
jitter manifests itself as noise in the output.
CONVERSION TIME is the time required, after the input volt-
age is acquired, for the ADC to convert the input voltage to a
digital word.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of
the maximum deviation from the ideal step size of 1 LSB.
DUTY CYCLE is the ratio of the time that a repetitive digital
waveform is high to the total time of one period. The specifi-
cation here refers to the SCLK.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE
BITS) is another method of specifying Signal-to-Noise and
Distortion or SINAD. ENOB is defined as
(SINAD − 1.76) / 6.02 and says that the converter is equiva-
lent to a perfect ADC of this (ENOB) number of bits.
FULL POWER BANDWIDTH is a measure of the frequency
at which the reconstructed output fundamental drops 3 dB
below its low frequency value for a full scale input.
GAIN ERROR is the deviation of the last code transition
(111...110) to (111...111) from the ideal (VREF − 1.5 LSB), af-
ter adjusting for offset error.
INTEGRAL NON-LINEARITY (INL) is a measure of the de-
viation of each individual code from a line drawn from negative
full scale (½ LSB below the first code transition) through pos-
itive full scale (½ LSB above the last code transition). The
deviation of any given code from this straight line is measured
from the center of that code value.
INTERMODULATION DISTORTION (IMD) is the creation of
additional spectral components as a result of two sinusoidal
frequencies being applied to the ADC input at the same time.
It is defined as the ratio of the power in the second and third
order intermodulation products to the sum of the power in both
of the original frequencies. IMD is usually expressed in dB.
MISSING CODES are those output codes that will never ap-
pear at the ADC outputs. The ADC101S101 is guaranteed not
to have any missing codes.
OFFSET ERROR is the deviation of the first code transition
(000...000) to (000...001) from the ideal (i.e. GND + 0.5 LSB).
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in
dB, of the rms value of the input signal to the rms value of the
sum of all other spectral components below one-half the sam-
pling frequency, not including harmonics or d.c.
SIGNAL TO NOISE PLUS DISTORTION (S/N+D or
SINAD) Is the ratio, expressed in dB, of the rms value of the
input signal to the rms value of all of the other spectral com-
ponents below half the clock frequency, including harmonics
but excluding d.c.
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the differ-
ence, expressed in dB, between the desired signal amplitude
to the amplitude of the peak spurious spectral component,
where a spurious spectral component is any signal present in
the output spectrum that is not present at the input and may
or may not be a harmonic.
TOTAL HARMONIC DISTORTION (THD) is the ratio, ex-
pressed in dB or dBc, of the rms total of the first five harmonic
components at the output to the rms level of the input signal
frequency as seen at the output. THD is calculated as
where Af1 is the RMS power of the input frequency at the out-
put and Af2 through Af6 are the RMS power in the first 5
harmonic frequencies.
THROUGHPUT TIME is the minimum time required between
the start of two successive conversion. It is the acquisition
time plus the conversion time.
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ADC101S101
Typical Performance Characteristics TA = +25°C, fSAMPLE = 500 ksps to 1 Msps,
fSCLK = 10 MHz to 20 MHz, fIN = 100 kHz unless otherwise stated.
DNL
fSCLK = 10 MHz
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INL
fSCLK = 10 MHz
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DNL
fSCLK = 20 MHz
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INL
fSCLK = 20 MHz
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DNL vs Clock Frequency
20145265
INL vs Clock Frequency
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ADC101S101
SNR vs Clock Frequency
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SINAD vs. Clock Frequency
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SFDR vs. Clock Frequency
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THD vs. Clock Frequency
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Spectral Response, VA = 5.25V
fSCLK = 10 MHz
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Spectral Response, VA = 5.25V
fSCLK = 20 MHz
20145270
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ADC101S101
Power Consumption vs. Throughput,
fSCLK = 20 MHz
20145255
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ADC101S101
Applications Information
1.0 ADC101S101 OPERATION
The ADC101S101 is a successive-approximation analog-to-
digital converter designed around a charge-redistribution dig-
ital-to-analog converter core. Simplified schematics of the
ADC101S101 in both track and hold operation are shown in
Figures 3 and 4, respectively. In Figure 3, the device is in track
mode: switch SW1 connects the sampling capacitor to the in-
put, and SW2 balances the comparator inputs. The device is
in this state until CS is brought low, at which point the device
moves to the hold mode.
Figure 4 shows the device in hold mode: switch SW1 con-
nects the sampling capacitor to ground, maintaining the sam-
pled voltage, and switch SW2 unbalances the comparator.
The control logic then instructs the charge-redistribution DAC
to add or subtract fixed amounts of charge from the sampling
capacitor until the comparator is balanced. When the com-
parator is balanced, the digital word supplied to the DAC is
the digital representation of the analog input voltage. The de-
vice moves from hold mode to track mode on the 13th rising
edge of SCLK.
20145209
FIGURE 3. ADC101S101 in Track Mode
20145210
FIGURE 4. ADC101S101 in Hold Mode
2.0 USING THE ADC101S101
The serial interface timing diagram for the ADC101S101 is
shown in Figure 2. CS is chip select, which initiates conver-
sions on the ADC101S101 and frames the serial data trans-
fers. SCLK (serial clock) controls both the conversion process
and the timing of serial data. SDATA is the serial data out pin,
where a conversion result is found as a serial data stream.
Basic operation of the ADC101S101 begins with CS going
low, which initiates a conversion process and data transfer.
Subsequent rising and falling edges of SCLK will be labelled
with reference to the falling edge of CS; for example, "the third
falling edge of SCLK" shall refer to the third falling edge of
SCLK after CS goes low.
At the fall of CS, the SDATA pin comes out of TRI-STATE,
and the converter moves from track mode to hold mode. The
input signal is sampled and held for conversion on the falling
edge of CS. The converter moves from hold mode to track
mode on the 13th rising edge of SCLK (see Figure 2). The
SDATA pin will be placed back into TRI-STATE after the 16th
falling edge of SCLK, or at the rising edge of CS, whichever
occurs first. After a conversion is completed, the quiet time
tQUIET must be satisfied before bringing CS low again to begin
another conversion.
Sixteen SCLK cycles are required to read a complete sample
from the ADC101S101. The sample bits (including leading or
trailing zeroes) are clocked out on falling edges of SCLK, and
are intended to be clocked in by a receiver on subsequent
falling edges of SCLK. The ADC101S101 will produce three
leading zero bits on SDATA, followed by ten data bits, most
significant first. After the data bits, the ADC101S101 will clock
out two trailing zeros.
If CS goes low before the rising edge of SCLK, an additional
(fourth) zero bit may be captured by the next falling edge of
SCLK.
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ADC101S101
3.0 ADC101S101 TRANSFER FUNCTION
The output format of the ADC101S101 is straight binary.
Code transitions occur midway between successive integer
LSB values. The LSB width for the ADC101S101 is VA/1024.
The ideal transfer characteristic is shown in Figure 5. The
transition from an output code of 00 0000 0000 to a code of
00 0000 0001 is at 1/2 LSB, or a voltage of VA/2048. Other
code transitions occur at steps of one LSB.
20145211
FIGURE 5. Ideal Transfer Characteristic
4.0 TYPICAL APPLICATION CIRCUIT
A typical application of the ADC101S101 is shown in
Figure 6. Power is provided in this example by the National
Semiconductor LP2950 low-dropout voltage regulator, avail-
able in a variety of fixed and adjustable output voltages. The
power supply pin is bypassed with a capacitor network locat-
ed close to the ADC101S101. Because the reference for the
ADC101S101 is the supply voltage, any noise on the supply
will degrade device noise performance. To keep noise off the
supply, use a dedicated linear regulator for this device, or
provide sufficient decoupling from other circuitry to keep noise
off the ADC101S101 supply pin. Because of the
ADC101S101's low power requirements, it is also possible to
use a precision reference as a power supply to maximize per-
formance. The three-wire interface is shown connected to a
microprocessor or DSP.
20145213
FIGURE 6. Typical Application Circuit
5.0 ANALOG INPUTS
An equivalent circuit for one of the ADC101S101's input chan-
nels is shown in Figure 7. Diodes D1 and D2 provide ESD
protection for the analog inputs. At no time should any input
go beyond (VA + 300 mV) or (GND − 300 mV), as these ESD
diodes will begin conducting, which could result in erratic op-
eration. For this reason, the ESD diodes should not be used
to clamp the input signal.
The capacitor C1 in Figure 7 has a typical value of 4 pF, and
is mainly the package pin capacitance. Resistor R1 is the on
resistance of the multiplexer and track / hold switch, and is
typically 500 ohms. Capacitor C2 is the ADC101S101 sam-
pling capacitor and is typically 26 pF. The ADC101S101 will
deliver best performance when driven by a low-impedance
source to eliminate distortion caused by the charging of the
sampling capacitance. This is especially important when us-
ing the ADC101S101 to sample AC signals. Also important
when sampling dynamic signals is an anti-aliasing filter.
20145214
FIGURE 7. Equivalent Input Circuit
6.0 DIGITAL INPUTS AND OUTPUTS
The ADC101S101 digital inputs (SCLK and CS) are not lim-
ited by the same absolute maximum ratings as the analog
inputs. The digital input pins are instead limited to +5.25V with
respect to GND, regardless of VA, the supply voltage. This
allows the ADC101S101 to be interfaced with a wide range of
logic levels, independent of the supply voltage.
7.0 MODES OF OPERATION
The ADC101S101 has two possible modes of operation: nor-
mal mode, and shutdown mode. The ADC101S101 enters
normal mode (and a conversion process is begun) when CS
is pulled low. The device will enter shutdown mode if CS is
pulled high before the tenth falling edge of SCLK after CS is
pulled low, or will stay in normal mode if CS remains low.
Once in shutdown mode, the device will stay there until CS is
brought low again. By varying the ratio of time spent in the
normal and shutdown modes, a system may trade-off
throughput for power consumption, with a sample rate as low
as zero.
7.1 Normal Mode
The fastest possible throughput is obtained by leaving the
ADC101S101 in normal mode at all times, so there are no
power-up delays. To keep the device in normal mode contin-
uously, CS must be kept low until after the 10th falling edge
of SCLK after the start of a conversion (remember that a con-
version is initiated by bringing CS low).
If CS is brought high after the 10th falling edge, but before the
16th falling edge, the device will remain in normal mode, but
the current conversion will be aborted, and SDATA will return
to TRI-STATE (truncating the output word).
Sixteen SCLK cycles are required to read all of a conversion
word from the device. After sixteen SCLK cycles have
elapsed, CS may be idled either high or low until the next
conversion. If CS is idled low, it must be brought high again
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ADC101S101
before the start of the next conversion, which begins when
CS is again brought low.
After sixteen SCLK cycles, SDATA returns to TRI-STATE.
Another conversion may be started, after tQUIET has elapsed,
by bringing CS low again.
7.2 Shutdown Mode
Shutdown mode is appropriate for applications that either do
not sample continuously, or it is acceptable to trade through-
put for power consumption. When the ADC101S101 is in
shutdown mode, all of the analog circuitry is turned off.
To enter shutdown mode, a conversion must be interrupted
by bringing CS back high anytime between the second and
tenth falling edges of SCLK, as shown in Figure 8. Once CS
has been brought high in this manner, the device will enter
shutdown mode; the current conversion will be aborted and
SDATA will enter TRI-STATE. If CS is brought high before the
second falling edge of SCLK, the device will not change
mode; this is to avoid accidentally changing mode as a result
of noise on the CS line.
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FIGURE 8. Entering Shutdown Mode
20145217
FIGURE 9. Entering Normal Mode
To exit shutdown mode, bring CS back low. Upon bringing
CS low, the ADC101S101 will begin powering up (power-up
time is specified in the Timing Specifications table). This pow-
er-up delay results in the first conversion result being unus-
able. The second conversion performed after power-up,
however, is valid, as shown in Figure 9.
If CS is brought back high before the 10th falling edge of
SCLK, the device will return to shutdown mode. This is done
to avoid accidentally entering normal mode as a result of
noise on the CS line. To exit shutdown mode and remain in
normal mode, CS must be kept low until after the 10th falling
edge of SCLK. The ADC101S101 will be fully powered-up af-
ter 16 SCLK cycles.
8.0 POWER MANAGEMENT
The ADC101S101 takes time to power-up, either after first
applying VA, or after returning to normal mode from shutdown
mode. This corresponds to one "dummy" conversion for any
SCLK frequency within the specifications in this document.
After this first dummy conversion, the ADC101S101 will per-
form conversions properly. Note that the tQUIET time must still
be included between the first dummy conversion and the sec-
ond valid conversion.
When the VA supply is first applied, the ADC101S101 may
power up in either of the two modes: normal or shutdown. As
such, one dummy conversion should be performed after start-
up, as described in the previous paragraph. The part may then
be placed into either normal mode or the shutdown mode, as
described in Sections 7.1 and 7.2.
When the ADC101S101 is operated continuously in normal
mode, the maximum throughput is fSCLK / 20. Throughput may
be traded for power consumption by running fSCLK at its max-
imum specified rate and performing fewer conversions per
unit time, raising the ADC101S101 CS line after the 10th and
before the 15th fall of SCLK of each conversion. A plot of typ-
ical power consumption versus throughput is shown in the
Typical Performance Curves section. To calculate the power
consumption for a given throughput, multiply the fraction of
time spent in the normal mode by the normal mode power
consumption and add the fraction of time spent in shutdown
mode multiplied by the shutdown mode power consumption.
Note that the curve of power consumption vs. throughput is
essentially linear. This is because the power consumption in
the shutdown mode is so small that it can be ignored for all
practical purposes.
9.0 POWER SUPPLY NOISE CONSIDERATIONS
The charging of any output load capacitance requires current
from the power supply, VA. The current pulses required from
the supply to charge the output capacitance will cause voltage
variations on the supply. If these variations are large enough,
they could degrade SNR and SINAD performance of the ADC.
Furthermore, discharging the output capacitance when the
digital output goes from a logic high to a logic low will dump
13 www.national.com
ADC101S101
current into the die substrate, which is resistive. Load dis-
charge currents will cause "ground bounce" noise in the sub-
strate that will degrade noise performance if that current is
large enough. The larger the output capacitance, the more
current flows through the die substrate and the greater is the
noise coupled into the analog channel, degrading noise per-
formance.
To keep noise out of the power supply, keep the output load
capacitance as small as practical. It is good practice to use a
100 series resistor at the ADC output, located as close to
the ADC output pin as practical. This will limit the charge and
discharge current of the output capacitance and improve
noise performance.
www.national.com 14
ADC101S101
Physical Dimensions inches (millimeters) unless otherwise noted
6-Lead LLP
Order Number ADC101S101CISD or ADC101S101CISDX
NS Package Number SDB06A
6-Lead SOT-23
Order Number ADC101S101CIMF, ADC101S101CIMFX
NS Package Number MF06A
15 www.national.com
ADC101S101
Notes
ADC101S101 Single Channel, 0.5 to 1 Msps, 10-Bit A/D Converter
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