MRF24WG0MBR-I/RM10C - MICROCHIP TECHNOLOGY

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 1

MRF24WG0MA/MB

Features:

• IEEE 802.11-compliant RF transceiver

• Serialized unique MAC address

• Data rate: 1 to 11 Mbps for 802.11b / 6 to 54 Mbps

for 802.11g

• Compatible with IEEE 802.11b/g/n networks

• Smal l size: 21 mm x 31 mm 36 -pin Surface M ount

module

• Integrated PCB antenna (MRF24WG0MA)

• External antenna option (MRF24WG0MB) with

ultra-miniature coaxi al (U.FL) connector

• Easy integration into final product – accelerates

product development, provides quicker time to

market

• Radio regulation certification for United States

(FCC), Canada (IC), and Europe (ETSI)

• Designed for use with Microchip microcontroller

familie s (PIC18, PIC24, dsPIC33, and PIC32) with

downloadable Microchip TCP/IP Stack

Operational:

• Single operating voltage: 2.8V to 3.6V (3.3V typical)

• Temperature range: -40°C to +85°C

• Simple, four-wire SPI interface with interrupt

• Low-current consumption:

- RX mode – 156 mA (typical)

- TX mode – 240 mA (+18 dBm typical)

- PS mode – 4 mA (typical)

- Hibernate mode – 0.1 mA (typical)

RF/Analog Features:

• ISM Band 2.400 to 2.484 GHz operation

• Channels 1-11

• DSSS/OFDM modulation

• Application throughput: 4500 kbps

• -95 dBm Typical sensitivity at 1 Mbps

• +18 dBm Typical 802.11b TX pow er wit h control

• +16 dBm Typical 802.11g TX pow er wit h control

• Integrated low phase noise VCO, RF frequency

synthesizer, PLL loop filter and PA

• Integrated RSSI ADC and I/Q DACs, RSSI

readings available to host

MAC/Baseband Features:

• Hardware CSMA/CA access control, automatic

ACK, and FCS creation and checking

• Aut omat ic MAC packet re transmit

• Hardware Security Engine for AES and

RC4-bas ed cip he r s

• Supports 802.1x, 802.1i security: WEP,

WPA-PSK, and WPA-2-PSK.

• Supports Infrastructure, Adhoc, Wi-Fi® Direct

Client

• Implements Wi-Fi Protected Setup (WPS), and

SoftAP for easy product commissioning

Applications:

• Utility and Smart Energy:

- Thermostats

- Smart Meters

- White Goods

-HVAC

• Consumer Electron ics:

- Remote Control

- Internet Radio

- Home Security

-Toys

• Industrial Controls:

- Chemical Sensors

-HVAC

- Security Systems

- M2M Communication

• Remote Device Management:

- Loc ation and Asset Tracking

- Automotive

- Code Update

• Retail:

-POS Terminals

- Wireless Price Tags

- Digital Remote

• Medical, Fitness, and Health Care:

-Glucose Meters

- Fitness Equipment

- Patient As set Tracking

MRF24WG0MA/MB Data Sheet

2.4 GHz IEEE 802.11b/g™

MRF24WG0MA/MB

DS70686B-page 2 Preliminary Information  2012 Microchip Technology Inc.

Pin Diagram

Note: Antenna connector on MRF24WG0MB only.

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 3

MRF24WG0MA/MB

Table of Contents

1.0 Device Overview .......................................................................................................................................................................... 5

2.0 Circuit Desc r i p tion................. ............... ............... .......... ............... ............... .............. ................................................................. 11

3.0 Regulatory Approval...................................................... ......... .... .... .... ......... .... .... .... .. ................................................................. 21

4.0 Electrical Characteristics............................................................................................................................................................ 27

Appendix A: Revision History . .............................................................................................................................................................. 31

The Micro chip Web Site........ ................... ................... ................... ....................... ............................................................................... 33

Customer Change Notification Service................................................................................................................................................ 33

Customer Support................................................ ................. ................. ...... ................. ....................................................................... 33

Reader Response................................................................................................................................................................................ 34

Product Identification System .............................................................................................................................................................. 35

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Most Current Data Sheet

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An errata sheet, describing minor operational differences from the dat a sheet and recommended workarounds, may exist for current

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To determine if an errata sheet exists for a particular device, please check with one of the following:

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Customer No tific atio n Syst em

MRF24WG0MA/MB

DS70686B-page 4 Preliminary Information  2012 Microchip Technology Inc.

NOTES:

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 5

MRF24WG0MA/MB

1.0 DEVICE OVERVIEW

The MRF24WG0MA and MRF24WG0MB are low-

power, 2.4 GHz, IEEE 802.11-compliant, surface

mount modules with all associated RF components –

crystal oscillator, bypass and bias passives with inte-

grated MAC, baseband, RF and power amplifier, and

built-in hardware support for AES, and TKIP (WEP,

WPA, WPA2 security). The modules also provide

acceleration for hosts running WPA-EAP application

security. The integrated module design frees the

designer from RF and antenna design tasks and regu-

latory compliance testing, ultimately providing quicker

time to market.

The MRF24WG0MA module is approved for use with

the integrated PCB meander antenna.

The MRF24WG0MB module comes with an ultra-

miniature coaxial connector (U.FL) and is approved

for use with a list of antenna types that are certified

with the module. See Section 2.7 “External

Antenna” for specific recommendations.

The MRF24WG0MA/MB modules are designed to be

used with Microchip’s TCP/IP software stack. The soft-

ware stack has an integrated driver that implements the

API that is used in the modules for command and control,

and for management and data packet traffic.

The Mic rochip T CP/IP soft ware st ack i s availabl e in the

free Microchip Application Libraries download

(includ ing ex ample applic ation s and sourc e cod e) from

the Microchip web site, http://www.microchip.com/

wireless.

The combination of the module and a PIC running the

TCP/IP stack results in support for IEEE Standard

802.11 and IP services. For example, this allows the

immediate implementation of a wireless web server

and e-mail clients.

The MRF24WG0MA/MB modules have received regu-

latory approvals for modular devices in the United

States (FCC), Canada (IC), and Europe (ETSI). The

modular approval removes the need for expensive RF

and antenna design, and allows the end user to place

the modules inside a finished product and not require

regulatory testing for an intentional radiator (RF trans-

mitter). See Section 3.0 “Regulatory Approval”, for

the specific requirements that should be adhered to by

the integrator.

1.1 Interface Description

The block diagram in Figure 1-1 represents a

MRF24WG0MA/MB module. It interfaces to Microchip

PIC18, PIC24, dsPIC33, or PIC32 microcontrollers

through a four-wire serial slave SPI interface –

interrupt, hibernate, reset, power and ground signals.

The module runs on a single supply voltage of

nominally 3.3V. The serial trace port operates at 3.3V

and requires a level shifter for operation with RS-232

devices. This port provides a serial output of module

status messages and is helpful for debugging

purposes. Figure 1-2 shows a simplified example

connection between a Microchip PIC® MCU and the

module. Table 1-1 lists the pin descriptions.

Dat a com munic ations with the MRF 24WG0 MA/ MB are

through the SPI in terface th at is de tailed in Section 2.0

“Circuit Description”. The Microchip PIC microcon-

troller communicates with the module through a com-

mand API from with in th e M ic roch ip TC P/IP stac k. Th e

comma nd API is detailed in the Microch ip TCP/IP st ack

online Help that is included in the free Microchip

Application Libraries download.

MRF24WG0MA/MB

DS70686B-page 6 Preliminary Information  2012 Microchip Technology Inc.

FIGURE 1-1: MRF24WG0MA/MB BLOCK DIAGRAM

FIGURE 1-2: MICROCONTROLLER TO MRF24WG0MA/MB INTERFACE

Slave SPI

Power

Encryption Interface

802.1x (EAP)

Accelerator

RAM

ROM

SPI Flash

Interrupt

Trace

Reset

Hibernate

Matching

Circuitry

Antenna

PHY

IEEE 802.11b/g

WPA Engine

AES, TKIP

MRF24WG0MA/MB 2.4 GHz IEEE 802.11b/g Module

MRF24WG0MA

PCB

Internal

MAC/LLC

IEEE 802.11b/g

2.4 GHz

Transceiver/PA Regulators

PIC® Mi crocontrollerMRF24WG0Mx

GND

VDD

External Antenna

(MRF24WG0MB) I/OCS

SDO

SDI

SCK

SDI

SDO

SCK

INTx

INT

I/O

HIBERNATE

I/O

RESET

+3.3V (Typ)

GND

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 7

MRF24WG0MA/MB

TABLE 1-1: Pin Descript ion

Pin Symbol Type Description

1GND PGround

2 NC* NC* No connect(3)

3 NC* NC* No connect(3)

4 NC* NC* No connect(4)

5 NC* NC* No connect(3)

6 NC* NC* No connect(3)

7 RESET I: C o nstan t(1) Module Reset input

8 NC NC Do not connect

9 NC* NC* No connect(3)

10 GND P Ground

11 NC NC Do not connect

12 NC NC Do not connect

13 NC NC Do not connect

14 NC NC Do not connect

15 NC NC Do not connect

16 WP(2) I Write protec t (thi s pi n is used to enable FLASH update)

17 VDD P Power

18 GND P Ground

19 GND P Ground

20 HIBERNATE I Hibernate mode enable (high input will disable the module)

21 NC* NC* No connect(3)

22 NC NC Do not connect

23 CS I: Constant(1) SPI Chip Select input, constant drive or pull-up required

24 NC NC Do not connect

25 GND P Ground

26 DEBUGRX I S erial debug por t input (s ee Se ction 2.0 “Circuit Description”)

27 DEBUGTX O Seria l debug port output (see S ection 2.0 “Circuit Description”)

28 GND P Ground

29 VDD P Power

30 GND P Ground

31 NC NC Do not connect

32 SDO O SPI data out

33 INT O I nt er r upt out put (open drai n – requires a pu ll- up)

34 SCK I SPI clock input

35 SDI I SPI data in

36 GND P Ground

Legend: Pin type abbreviation: P = Power Input, I = Input, O = Output, NC = Do Not Connect, NC* = No Connect

Note 1: Signals of T ype “I: C onstant” m ust either be c onstan tly driven by the host or have a pu ll-up or pull- down (in

case the host is likely to tri-state the signal during power down modes). The constant drive is used to

ensure defined operation of the part and to minimize leakage current during low power modes.

2: WP is used as write-protect for the internal module SPI Flash. For production use, this pin should be

pulled low. This pin can be controlled by the host microcontroller to enable in field Flash updates.

3: Signals of T ype “NC*” w ere JTAG function pin s on previou s family devic es. Signals on these pins wil l have

no functional affect and will not impact the operation of this device.

4: This signal should be left floating or pulled high only to support lowest 802.11PS power mode.

MRF24WG0MA/MB

DS70686B-page 8 Preliminary Information  2012 Microchip Technology Inc.

1.2 Mounting Detai ls

The MRF24WG0MA/MB is a surface mountable mod-

ule. Module dimensions are shown in Figure 1-3. The

modul e P rin t ed C irc ui t Boa r d (P CB ) is 1 mm th ic k wit h

castellated mounting points on two sides.

FIGURE 1-3: MRF24WG 0 MA/M B MODULE PHYSICAL DIMENSIONS

Note: Antenna connector on MRF24WG0MB only.

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 9

MRF24WG0MA/MB

Figure 1-4 shows th e recommended host PCB footprint

for the module.

The MRF24WG0MA has an integrated PCB antenna.

For best performance, follow the mounting details

shown in Figure 1-4.

For best performance, mount the module on the PCB

without metal obstructions in the keep out area of

Figure 1-4. The antenna is tuned to have FR4 PCB

material underneath the module. Do not “cut-out” host

PCB material under the antenna.

FIGURE 1-4: RECOMMENDED HOST PCB FOOTPRINT

Note 1: The “Note 1” demarcation specifies the host PCB copper plane keep-out area on underlying

board layers. It is permis sible to route surface escape traces in this area.

MRF24WG0MA/MB

DS70686B-page 10 Preliminary Information  2012 Microchip Technology Inc.

Figure 1-5 illustrates the module reflow profile that is

recommended for mounting the device onto the host

PCB.

FIGURE 1-5: PRELIMINARY MODULE REFLOW PROFILE AND SETPOINTS

300

250

200

150

100

Temperatur e ( °C)

Time (S ec onds)

0 50 100

150 200 250 300

34 5 6 7 8

Zones

TABLE 1-2: MODULE REFLOW PROFILE(1)

Zone 12345678

Temperature (°C) 180° 180° 200° 200° 200° 220° 265° 270°

Note 1: Conveyor Speed: 90 cm/min

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 11

MRF24WG0MA/MB

2.0 CIRCUIT DESCRIPTION

The MRF24WG0MA/MB interfaces to Microchip PIC18, PIC24, dsPIC33, and

PIC32 microprocessors with a minimal of external components through digital-

only connections. This section details use of the module, starting with an

example host connection as shown in Figure 2-1.

2.1 Schematic

FIGURE 2-1: MRF24WG 0 MA/M B EXAMPLE APPLICATION SCHEMATIC

+3.3V

10µF

4.7 K

MRF24WG0MA

GND

NC*

RESET

NC*

GND

VDD

GND GND

HIBERNATE

NC*

GND

DEBUG_RX

DEBUG_TX

GND

VDD

GND

SDO

INT

SCK

SDI

GND

18 19

NC NC

NC To H o s t

Microcontroller

To Host

To System

Reset Co n trolle r

Microcontroller NC*

NC*

4.7 K

+3.3V

Note: The e xample appl ication s chemati c is for sugge sted desi gn purp oses. Plea se refer to Table 1-1 in Section 1.0 “Device Overview” for the m odule pin

descriptions.

MRF24WG0MA/MB

DS70686B-page 12 Preliminary Information  2012 Microchip Technology Inc.

2.2 Power-On Sequence

The internal regulators for the digital and analog core

power supplies are disabled by driving the

HIBERNATE pin high. Figure 2-2 shows the p ower up

sequence for the MRF24WG0MA/MB.

There is an internal Power-on-Reset (POR) circuit

which keeps the module in reset until VDD is within

specification. The Hibernate and Reset signals are also

used to control startup. In Figure 2-2, section A is

controlled by the internal POR and section B is an

allow ance for th e SPI bus to s tab ilize when th e modul e

supplies are enabled. Once Hibernate is disabled, the

host software provides 1mS of startup to allow the SPI

to stabilize. This time is pre-programmed into the host

driver, and may need to be increased if sufficient initial

drive current is not provided to the MR F24WG0 MA/MB

module. Section C is the driver controlled release from

Reset period. This takes approximately 300 mS and is

monitore d by the st ack dri ver . N o additio nal time need s

to be provided by user software for startup.

FIGURE 2-2: MRF24WG0MA/MB POWER-ON SEQUENCE TIMING

2.7V

VDD

AB C

Ready

Time

POR Host driver auto-timed boot,

approximately 50-300 ms after Reset

1 ms SPI

Stabilize

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 13

MRF24WG0MA/MB

2.3 Power States

The MRF24WG0MA/MB has several power states.

These are Hibernate, Sleep and Active (two sub-

stat es) , as s how n in Figure 2-3. The selection of power

state directly affects system behavior, and overall

power consumption or battery life. There is also a

“Stand-by” state that is not user-controlled.

2.3.1 HIBERNATE STATE

An “Off” state is defined as no power applied to the

device . The Hib ernate mod e is the clos est to co ntrolled

off that the module can approach. It is controlled

through the HIBERNATE pin (high input puts the

module into Hibernate). When in Hibernate, the module

only consumes leakage current, but does not maintain

state. Hibernate has to be fully controlled by the PIC

MCU.

The module contains about 70 µF of internal bulk

capacitance. Supplies should be provisioned to supply

sufficient charge on release of hibernate for desired

start time or sufficient delay must be provided in

software after hibernate release and before releasing

reset.

This state provides the best battery life for embedded

produ cts. Entering Hi bernate fo r interval s of les s than 1

minute is not likely to save power.

2.3.2 POWER SAVE (PS) MODE

The PS mode is a low-power dynamic state that

automatically implements the 802.11 Power Save

feature. In this mode, if enabled, the module will enter

PS mode when all activity is complete.

The module will wake autonomously to any PIC

intervention so it can check DTIM beacons from the

Access Point. If any traffic is listed as queued for the

module, then it will awake and get the data from the

Access Point on the next possible opportunity. When

data is acquired, the module will interrupt the PIC

microcontroller on a normal “data available” indication.

If no data is available on a DTIM check, the module

reenter s the Power Sa ve st ate until th e next DTIM . The

DTIM inte rva l is pr ogra mm ed at th e Acces s Point. Thi s

state can prov id e “as if on” beh av ior of the rad io with a

significant power savings versus “always on”. The

batt ery life ex pecta tion of thi s mo de is sev era l da ys t o

several weeks. This mode is characterized by a very

low latency (as low as 200 ms) to begin data transfer

from the sta t e.

2.3.3 ACTIVE STATE

The A ctive st ate is iden tified as one of two st ates wher e

the radio circuitry is fully on. The two active states are

the Receive state (RX ON) and the Transmit state (TX

ON).

2.3.4 STAND-BY STATE

The Stand-by state is not user-controlled but is noted

as it helps identify and track certain operations of the

module during power tracing.

TABLE 2-1: MRF24WG0MA/MB POWER STATE DEFINITIONS

State VDD CS Description

Off 0V 0V Power is completely disconnected

Hibernate 3.3V 3.3V All internal power regulators are OFF – enabled by HIBERNATE pin

Power Save 3.3V 0V Enabled by TCP/IP driver

RX ON 3.3V 0V Receive circuits are on and receiving

TX ON 3.3V 0V Tran sm it ci rcui t s are on and transm itting

Stand-by 3.3V 0V State machine transition state only – not user controlled

MRF24WG0MA/MB

DS70686B-page 14 Preliminary Information  2012 Microchip Technology Inc.

FIGURE 2-3: MRF24WG0MA/MB POWER-STATE DIAGRAM

Note 1: See Section 2.2 “Power-On Sequence”.

Off

Hibernate Stand-by

RX On TX On

Power Save

200 µs

10 µs

Note 1

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 15

MRF24WG0MA/MB

2.4 Serial Trace Port Interface

The MRF24WG0MA/MB incorporates a Transmit Data

pin (D EBU G TX) an d a Rec ei ve Da ta pin (D EB UG RX) for

serial debugging purposes. These pins can be con-

nected to commercially available RS-232 line drivers/

receivers with appropriate external level shifters. The

serial interface operates at 19200 (baud rate), 8 (data), N

(parity), 1 (s top b it) , N (flo w c on tro l) .

2.5 SPI Interface

The slave Serial Peripheral Interface (SPI) is used to

interface with the host PIC microcontroller. The slave

SPI interface works with the Interrupt line (INT). When

data is available for the PIC microcontroller during

operation, the INT line is asserted (logic low) by the

MRF24WG0MA/MB module. The INT line is de-

asserted (logic high) by the MRF24WG0MA/MB after

the data is transferred to the host PIC microcontroller.

The SPI SCK frequency can be up to 25 MHz.

The slave SPI interface implements the [CPOL = 0;

CPHA = 0] and [C POL = 1; CP HA = 1] mo des (0 and 3)

of operation. That is, data is clocked in on the first risin g

edge of the clock after Chip Select (CS) is asserted.

Data is placed on the bus with most significant bit

(MSb) first.

The CS pin must be toggled with transfer blocks and

cannot b e held low p ermanently. The fal ling edge of CS

is used to indicate the start of a transfer. The rising

edge of CS is used to indicate the completion of a

transfer.

Figure 4-1 in Section 4.0 “Electrical Characteris-

tics” shows the SPI timing diagram. Table 4-7 details

the SPI timing AC characteristics.

2.6 PCB Antenna

For the MRF2 4WG0MA, the PCB antenn a is fabricated

on the top copper layer and covered in solder mask.

The layers below the antenna have no copper trace.

It is recommended that the module be mounted on the

edge of the host PCB. It is permitted for PCB material

to be bel ow the antenna structure of t he module as long

as no copper traces or planes are on the host PCB in

that area. For best performance, place the module on

the host PCB according to the details shown in

Figure 1-4 in Sec tion 1.0 “Device Overv iew ”.

The antenna patterns shown in the following plots are

simulated results of the PCB antenna. Figure 2-4 illus-

trates the simulation drawing and Figure 2-5 and

Figure 2-6 illustrate the two-dimensional (2D) and

three- dimen sio na l (3D) radi ati on p at tern s.

The cal culated a verage of the radiat ed field i s show n in

Figure 2-5, highlighted in yellow. The radiation pattern

for the XZ plane is shown in red, and the YZ plane is

shown in black. As shown, the most pow erful radiation

occurs in the XY plane (the red pattern).

Figure 2-6 shows the relative position of the 3D radia-

tion “donut” with reference to the module orientation.

This is a v ery usef ul guide for place ment of th e modul e

to obtain the maximum range.

Figure 2-7 shows the 3D radiatio n pattern with t he col-

ored d istribution o f the radiation magnitude. T he values

range from -9 dB to +0.3 dB. This is very useful in

interpreting the 2D radiation pattern.

MRF24WG0MA/MB

DS70686B-page 16 Preliminary Information  2012 Microchip Technology Inc.

FIGURE 2-4: PCB ANTENNA SIMULATION DRAWING

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 17

MRF24WG0MA/MB

FIGURE 2-5: SIMULATED TWO-DIMENSIONAL RADIATION PATTERN

Two-dimensional (2D) pattern, including the average on main radiation planes (Phi = 0 and 90 degrees).

Radiation Pattern 1

Name Theta Angle Mag.

m1 -60.0000 -60.0000 0.6323

m2 -20.0000 -20.0000 0.3962

m3 30.0000 30.0000 -0.1038

m4 100.0000 100.0000 -0.9490

m5 170.0000 170.0000 -0.1414

Cur ve Information Average

db(GainTotal)

Setup 1: LastAdaptive

Freq. = “2.44 GHz” Phi = “0 deg”

0.0097

dB(GainTotal)

Setup 2: LastAdaptive

Freq. = “2.44 GHz” Phi = “0 deg”

-3.2020

MRF24WG0MA/MB

DS70686B-page 18 Preliminary Information  2012 Microchip Technology Inc.

FIGURE 2-6: SIMULATED THREE-DIMENSIONAL RADIATION PATTERN

Radiation pattern against the module dimensions

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 19

MRF24WG0MA/MB

FIGURE 2-7: SIMULATED THREE-DIMENSIONAL RADIATION PATTERN

Three-dimensional (3D) pattern and magnitude distribution

MRF24WG0MA/MB

DS70686B-page 20 Preliminary Information  2012 Microchip Technology Inc.

2.7 External Antenna

The MR F24WG0 MB module has a 50 ult ra-mini atur e

coaxial (U.FL) connector to connect to an external

2.4 GHz antenna.

The choice of antenna is limited to the antenna types

the module has been tested with. Refer to the respec-

tive c ountry in Section 3.0 “Regulat ory Appr oval” for

a list of tested and app roved antenna types that may be

used with the MRF24WG0MB module.

A list of antennas approved for use with the module is

provided in Table 2-2.

Caution: The U .FL con nector is fra gile and can onl y

tolerate a very limited number of

insertions.

TABLE 2-2: APPROVED EXTERNAL

ANTENNA TYPES

Type Manufact urer Part Number Gai n

Dipole Aristotle RFA-02-C2M2-D034 2 dBi

PCB Aristotle RFA-02-P33-D034 1 dBi

PCB Aristotle RFA-02-P05-D034 2 dBi

PIFA Aristotle RFA-02-G03-D034 0 dBi

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 21

MRF24WG0MA/MB

3.0 REGULATORY APPROVAL

The MRF24WG0MA/MB module has received

regulatory approvals for modular devices in the United

States and Canada. Modular approval allows the end

user to place the MRF24WG0MA/MB module inside a

finished product and not require regulatory testing for

an intentional radiator (RF transmitter), provided no

changes or modifications are made to the module

circuitry. Changes or modifications could void the

user’s authority to operate the equipment. The end

user must comply with all of the instructions provided

by the Grantee, which indicate installation and/or

operating conditions necessary for compliance.

The MRF24WG0MA/MB module has been tested and

conforms to EN 300 328 V1.7.1 (2006-10), European

Standards. The module tests can be applied toward

final p roduct certificat ion and Declaratio n of Con formity

(DoC). Additional testing may be required depending

on the end application.

The integrator may still be responsible for testing the

end product for any additional compliance

requirements that become necessary with this module

installed (for example, digital device emission, PC

peripheral requirements, etc.) in the specific country

that the end device will be marketed.

For more info rmation on regulatory compliance, refer to

the specific country radio regulations in the following

sections.

3.1 United States

The MRF24WG0MA/MB has received Federal

Communications Commission (FCC) CFR47

Telecommunications, Part 15 Subpart C “Intentional

Radiators” 15.247 and modular approval in accordance

with Part 15.212 Modular Transmitter approval. The

MRF24WG0MA/MB module can be integrated into a

finished product without obtaining subsequent and

separate FCC approvals for intentional radiation.

The MR F24WG0MA/MB mod ule has been labeled wi th

its o wn FC C ID n umber, and if th e FCC ID is not v isibl e

when the module is installed inside another device,

then the outside of the finished product into which the

module is instal led must also displa y a label referri ng to

the enclosed module. This exterior label can use

wording as follows:

A user’s manual for the product should include the

following statement:

Contains Transmitter Mo dul e FCC ID:

W7OMRF24WG0MAMB

orContains FCC ID:

W7OMRF24WG0MAMB

This device complies with Part 15 of the FCC

Rules. Operation is subject to the following two

conditions:

(1) this device may not cause harmful interference,

and (2) this device must accept any interference

received, including interference that may cause

undesi red operation.

This equipment has been tested and found to

comply with the limits for a Class B digital device,

pursuan t to part 15 of the FCC R ules. These limits

are designed to provide reasonable protection

against harmful interference in a residential

installation. This equipment generates, uses and

can radiate radio frequency energy, and if not

installed and used in accordance with the

instructions, may cause harmful interference to

radio communications. However, there is no

guarantee that interference will not occur in a

partic ular i nst allati on. If th is eq uipment do es cause

harmful interference to radio or television

recept ion, w hich can be determi ned by tur ni ng the

equipment off and on, the user is encouraged to try

to correct the interference by one or more of the

following measures:

• Reorient or r elocate the re ce iv in g antenna.

• Increase the separation between the equipment

and receiver.

• Connect the equipment into an outlet on a circuit

different from th at to wh ic h t he r eceiver is

connected.

• Consult the de al er or an experienced radio/TV

technician for help.

MRF24WG0MA/MB

DS70686B-page 22 Preliminary Information  2012 Microchip Technology Inc.

3.1. 1 RF EXPOSURE

All transm itters regulated by FCC must comply with RF

exposure requirements. OET Bulletin 65, Evaluating

Compliance with FCC Guidelines for Human Exposure

to Radio Frequency Electromagnetic Fields, provides

assistance in determining wheth er proposed or existing

transmitting facilities, operations or devices comply

with limits for human exposure to Radio Frequency

(RF) fields adopted by the Federal Communications

Commission (FCC). The bulletin offers guidelines and

suggestions for evaluating compliance.

If app ropriate , comp lianc e with ex posure guide lines for

mobile and unlicensed devices can be accomplished

by the use of warning labels and by providing users

with information concerning minimum separation

distances from transmitting structures and proper

inst all ation of antenna s.

The following statement must be included as a

CAUTION statement in manuals and OEM products to

alert users of FCC RF exposure compliance:

If the MR F24 WG 0M A/MB module is use d in a portabl e

application (i.e., the antenna is less than 20 cm from

persons during operat ion), the integ rator is respo nsible

for performing Specific Absorption Rate (SAR) testing

in accordance with FCC rules 2.1091.

3.1.2 APPROVED EXTERNAL ANTENNA

TYPES

To maint ain modular a pproval in the United S tate s, only

the ante nna type s that have been test ed sh all b e use d.

It is per miss ibl e to use differ ent ante nna manu fac ture r

provided the same antenna type and antenna gain

(equal to or less than) is used.

Test ing of the MRF24 WG0MB module was perf ormed

with the antenna types listed in Table 2-2 in

Section 2.0 “Circuit Description”.

3.1. 3 HELPFUL WEB SITES

Federal Communications Commission (FCC):

http://www.fcc.gov.

3.2 Canada

The MRF24WG0MA/MB module has been certified for

use in Canada under Industry Canada (IC) Radio

Standards Specification (RSS) RSS-210 and RSS-

Gen. Modular approval permits the installation of a

module in a host device without the need to recertify

the device.

Labeling Requirements for the Host Device (from

Section 3.2.1, RSS-Gen, Issue 3, December 2010):

The hos t devi ce shall be proper ly label ed to i dentify th e

module within the host device.

The Industry Canada certification label of a module

shall be clearly visible at all times when installed in the

host device, o the rwise th e host d evic e mus t be lab eled

to display the Industry Canada certification number of

the module, preceded by the words “Contains

transmitter module”, or the word “Contains”, or similar

wording expressing the same meaning, as follows:

User Manual Notice for License-Exempt Radio

Apparatus (from Section 7.1.3 RSS-Gen, Issue 3,

December 2010):

User ma nuals for lice nse-ex empt rad io app aratu s shal l

contain the following or equivalent notice in a

conspicuous location in the user manual or

alternatively on the device or both:

To satisfy FCC RF Exposure requirements for

mobile and base station transmission devices, a

separation distance of 20 cm or more should be

maintained between the antenna of this device and

persons during operation. To ensure compliance,

operation at closer than this distance is not

recommended.

The antenna(s) used for this transmitter must not

be co-loca ted or op erating in c onjunct ion with a ny

other an tenna or transm itt er. This device complies with Industry Canada

license-exempt RSS standard(s). Operation is

subject to the following two conditions: (1) this

device may not cause interference, and (2) this

device must accept any interference, including

interference that may cause undesired operation of

the device.

Le présent appareil est conforme aux CNR

d'Industrie Canada applicables aux appareils radio

exempts de licence. L'exploitation est autorisée

aux deux conditions suivantes: (1) l'appareil ne doit

pas produire de brouillage, et (2) l'utilisateur de

l'appareil doit accepter tout brouillage

radioélectrique subi, même si le brouillage est

suscept i bl e d' en compromettre le fonct i onnement .

Contains transmitter m odule IC: 7693A-24WG 0M AMB

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 23

MRF24WG0MA/MB

3.2.1 APPROVED EXTERNAL ANTENNA

TYPES

Transmitter Antenna (from Section 7.1.2 RSS-Gen,

Issue 3, December 2010):

The MRF24WG0MB module can only be sold or

operated with antennas with which it was approved.

Transmitter may be approved with multiple antenna

types. An antenna type comprises antennas having

similar in-band and out-of-band radiation patterns.

Testing shall be performed using the highest gain

antenna of each combination of transmitter and

antenna type for which approval is being sought, with

the transm itte r outp ut powe r set at the maxim um le ve l.

Any antenna of the same type having equal or lesser

gain as an antenna that had been successfully tested

with the transmitter, will also be considered approved

with the transmitter, and may be used and marketed

with the transmitter.

When a measurement at the antenna connector is

used to determine RF output power, the effective gain

of the device's antenna shall be stated, based on

measurement or on data from the antenna

manufacturer. For transmitters of output power greater

than 10 milliwatt s, the total antenna gain shall be added

to the measured RF output power to demonstrate

compli ance to the speci fied radi ated pow er limi ts . User

manuals for transmitters shall display the following

notice in a conspicuous location:

The above notice may be affixed to the device instead

of displayed in the user manual.

User manuals for transmitters equipped with detach-

able antennas shal l als o con t ai n the fol low i ng no tic e in

a consp ic uou s loc ati on:

Immediately following the above notice, the

manufacturer shall provide a list of all antenna types

approved for use with the transmitter, indicating the

maximum permissible antenna gain (in dBi) and

required impedance for each.

Approved external antenna types for the

MRF24WG0MA/MB module are listed in Table 2-2 in

Section 2.0 “Circuit Description”.

3.2. 2 HELPFUL WEB SITES

Industry Canada: http://www.ic.gc.ca/

Under Industry Canada regulations, this radio

transmitter may only operate using an antenna of a

type and maximum (or lesser) gain approved for

the transmitter by Industry Canada. To reduce

potential radio interference to other users, the

antenna type and its gain should be so chosen that

the equ i val en t i s ot ro pic al ly ra di at ed pow er (e .i . r.p.)

is not more than that necessary for successful

communication.

Conformément à la réglementation d'Industrie

Canada, le présent émetteur radio peut

fonctionner avec une antenne d'un type et d'un

gain maximal (ou inférieur) approuvé pour

l'émetteur par Industrie Canada. Dans le but de

réduire les risques de brouillage radioélectr ique à

l'intention des autres utilisateurs, il faut choisir le

type d'antenne et son gain de sorte que la

puissance isotrope rayonnée équivalente (p.i.r.e.)

ne dépasse pas l'intensité nécessaire à

l'établissement d'une communication satisfaisante.

This radio transmitter (identify the device by certifi-

cat ion num ber , or model number if Cat egor y II) ha s

been approved by Industry Canada to operate with

the antenn a types listed below with the maxim um

permiss ib l e gain and required antenna i m pedance

for each antenna type indicated. Antenna types not

included in this l ist, having a gain grea ter th an t he

maximum gain indicated for that type, are strictly

prohibited for use wi th this devi ce.

Conformément à la réglementation d'Industrie

Canada, le présent émetteur radio peut

fonctionner avec une antenne d'un type et d'un

gain maximal (ou inférieur) approuvé pour

l'émetteur par Industrie Canada. Dans le but de

réduire les risques de brouillage r adioélectrique à

l'intention des autres utilisateurs, il faut choisir le

type d'antenne et son gain de sorte que la

puissance isotrope rayonnée équivalente (p.i.r.e.)

ne dépasse pas l'intensité nécessaire à

l'ét abli ssement d'u ne communica tion satisfais ante.

MRF24WG0MA/MB

DS70686B-page 24 Preliminary Information  2012 Microchip Technology Inc.

3.3 Europe

The MRF24WG0MA/MB module conforms to the

emission standards summarized in Table 3-1. The

module tests can be applied toward product

certification and Declaration of Conformity (DoC).

The European Standards do not provide a modular

approval similar to the USA (FCC) and Canada (IC).

However, the completed compliance testing can be

used as part of the customer’s application for product

compli ance approva ls. The mo dule test repor t data can

be used as part of the customer’s product test plan and

can significantly lower customer’s compliance burden.

Depending on the end application, additional testing

may be required. The integrator is responsible for test-

ing the end product for any additional compliance

requirements that become necessary with this module

installed (for example, digital device emission, PC

peripheral requirements and so on) in the specific

country where end device is marketed).

3.3.1 EXTERNAL ANTENNA

REQUIREMENTS

European conformance testing was performed using

the antenna types listed in Table 2-2 in Section 2.0

“Circuit Description ”.

3.3.2 HELPFUL WEB SITES

A document that can be used as a starting point in

understanding the use of Short Range Devices (SRD)

in Europe is the European Radio Communications

Committee (ERC) Recommendation 70-03 E, which

can be downloaded from the European Radio

Communi ca tio ns Office (ERO) at: http://www.ero.dk/.

Additional helpful web sites are:

• Radio and Telecommunications Terminal

Equipment (R&TTE):

http://ec.europa.eu/enterprise/rtte/index_en.htm

• Europe an Conferen ce of Post a l and

Telecommunications Administrations (CEPT):

http://www.cept.org

• European Telecommunications Standards Institute

(ETSI):

http://www.etsi.org

• Europe an Ra di o Comm unicatio ns Office (ERO):

http://www.ero.dk

Note: To maintain conformance tested ETSI

standards, the module shall not be

modified.

TABLE 3-1: EMISSIONS STANDARDS TESTED

Specification Test Method

Emission Standards

EN 300 328 V1.7.1 (2006-10) 4.3.1 Maximum Transmit Power 5.7.2

EN 300 328 V1.7.1 (2006-10) 4.3.2 Maximum EIRP Spectral Density 5.7.3

EN 300 328 V1.7.1 (2006-10) 4.3.3 Frequency Range 5.7.4

EN 300 328 V1.7.1 (2006-10) 4.3.6 Transmitter Spurious Emissions 5.7.5

EN 300 328 V1.7.1 (2006-10) 4.3.7 Receiver Spurious Emissions 5.7.6

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 25

MRF24WG0MA/MB

3.4 Other Regulatory Jurisdictions

Should other regulatory jurisdiction certification be

required by the customer, or the customer need to

recertify the module for other reasons, a certification

utility is available. The utility runs on a Window's PC

and utilizes a USB to SPI converter to interface to the

MRF24WG0MA/MB module. In order to use the utility,

the MRF24WG0MA/MB module must be out of reset

and not accessed by the system host. That is, the SPI

signals to the MRF24WG0MA/MB module must be tri-

state, with Reset and Hibernate deasserted. The fol-

lowing signals will need to be brought from the

MRF24WG0MA/MB module for connection to the PC

(through the USB adapter):

•SDO

•SDI

•CS

•SCK

•INT

•GND

For further regulatory Certification Utility and

documentation, contact your local Microchip

salesperson.

3.5 Wi-Fi® Alliance

Wi-Fi Alliance Certification focuses on interoperability

testing of devices based on 802.11 standards.

Historically, when the certification process and

programs were developed by Wi-Fi Alliance members,

the vast m ajo rity of the 802. 11 clients were PC-cen tric ,

and certification testing adequately addressed those

types of devices. In subsequent years, the number of

Wi-Fi devices that are not PC-centric has grown

significantly.

These non-standard devices, as a class of products,

have been dubbed Application Specific Devices

(ASDs) by the Wi-Fi Alliance. ASDs are 802.11

devices, for example clients or access points (APs),

which cannot be tested under a standard Alliance test

plan bec ause the y do not c omply wit h the st andard tes t

configuration and/or because they are designed to

perform a specific application. Examples include, but

are n ot limited to : bar code scanners, p agers, reco rding

devices, monitoring equipment, and cable modems.

The APs or clients that are used to validate ASD

compli ance (fro m the st anda rd test be d) will meet all of

the requirements specified in the applicable System

Interopera bility Test Plans (referred to as the “sta ndard

test plan”), unless specifically exempted. The

MRF24WG0MA/MB modules are in the ASD category.

The mod ules are certified u nder Wi-Fi 802.11 with ASD

Model Test Plan wit h Test Engine For IEEE 802.11a, b,

and g Devices (Version 1. 0).

MRF24WG0MA/MB

DS70686B-page 26 Preliminary Information  2012 Microchip Technology Inc.

NOTES:

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 27

MRF24WG0MA/MB

4.0 ELECTRICAL CHARACTERISTICS

Note 1: The listed Absolute Maximum Ratings are not meant for functional operation. Operation exceeding these

levels is not guaranteed, and may reduce the operating life of the component.

Note 1: Current Consumption values represent Typical Peak currents, and the measured current conditions were

done with 85% duty cycle modulated signal. Wi-Fi applications typically operate at less than 85% TX duty

cycle. TX current is dependent on such criteria as transmit power setting, and transmit data rate and

bandwidth being used. RX current is affected by connection distance.

2: Power Sa ve c urren t i s current co ns um ed dur ing periods of “stand-by ” be tw een D TI M bea co ns. The m od ule

will awake 2 ms before a DTIM and turn on its receiver, and possibly its transmitter (if data is available).

TABLE 4-1: DIGITAL ELECTRICAL CHARACTERISTICS (NOMINAL CONDITIONS: 25ºC, VDD =3.3V)

Parameters Min Typ Max Units

VIL (Input low voltage) -0.3 — 0.8 V

VIH (Input high voltage) 2 — 5.5 V

VOL (Output low voltage) — — 0.4 V

VOH (Output high voltage) 2.4 — — V

IOL (Output low level current at VOL Max) — 8.5 — mA

IOH (Output high level current at VOH Min) — 15.4 — mA

TABLE 4-2: ABSOLUTE MAXIMUM RATINGS(1)

Parameters Min Max Notes

Storage Temperature -40ºC +125ºC —

VDD 0V 3.60V —

VIN on SDI, CS, SC K -0.3V 3.60V —

TABLE 4-3: RECOMMENDED OPERATING CONDITIONS

Parameters Min Typ Max Units

Ambient Temp eratu r e -40 — +85 Degrees Celsius

VDD – fo r FCC and IC 2.80 3.3 3.60 Volts

VDD – for ETSI 3.0 3.3 3.60 Volts

TABLE 4-4: CURRENT CONSUMPTION(1) (NOMINAL CONDITIONS: 25ºC, VDD = 3.3V)

Parameters Min Typ Max Units Conditions

IDD, Hibernate = 3.3V — 0.1 — mA —

IDD, Power Save (software enabled) — 4(2) —mA —

IDD, RX on, Receive @ -91 dBm with 1 Mbp s

modulated signal at antenna port —156—mA —

IDD, TX on, 802.11b, +18 dBm — 237 — mA Measured at 11 Mbps

IDD, TX on, 802.11g, +16 dBm — 226 — mA Measured at 6 Mbps

MRF24WG0MA/MB

DS70686B-page 28 Preliminary Information  2012 Microchip Technology Inc.

Note 1: Nominal conditions: 25ºC, VDD = 3.3V, Flo = 2437 MHz, measurements at antenna port.

Note 1: Nominal conditions: 25ºC, VDD = 3.3V, Flo = 2437 MHz, 2 Mbps. modulated signal measured at antenna

port.

2: Gain step control is not calibrated. Steps are shown for planning purposes only.

TABLE 4-5: RECEIVER AC CHARACTERISTICS(1)

Parameters Min Typ Max Units

Flo 2412 — 2484 MHz

RX Min Input Level Sensitivity, 1 Mbps, 8% PER — -95 — dB m

RX Min Input Level Sensitivity, 2 Mbps, 8% PER — -88 — dB m

RX Max Input Level (Power), 1 Mbps, 8% PER — -4 — dBm

RX Max Input Level (Power), 2 Mbps, 8% PER — -4 — dBm

TABLE 4-6: TRANSMITTER AC CHARACTERISTICS(1)

Parameters Min Typ Max Units

Flo 2412 — 2484 MHz

Average POUT (transmit spectrum mask compliant) — +18 — dBm

Average POUT gain step resolution from +5 to +10 dBm(2) —0.5—dB

Average POUT gain step resolution from -5 to Max.(2) —1.0—dB

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 29

MRF24WG0MA/MB

FIGURE 4-1: SPI INPUT TIMING

FIGURE 4-2: SPI OUTPUT TIMING

CS(1)

SCK

TCSS

THDTSU

TCSD

LSb InMSb In

High-Impedance

TCSH

TSCK

Note 1: CS must be toggled for each SPI block transfer.

SCK

SO MSb Out LSb Out

TDIS

Don’t Care

TVTV

LSb In

TSCK

TABLE 4-7: SPI INTERFACE AC CHARACTERISTICS

Symbol Parameters Min Max Units

TSCK SCK Period 40 — ns

TCSD CS High time 50 — ns

TCSS CS Setup time 50 — ns

TCSH CS Hold time 50 — ns

TSU SDI Setup time 10 — ns

THD SDI Hold time 10 — ns

TVSDO Valid time — 15 ns

MRF24WG0MA/MB

DS70686B-page 30 Preliminary Information  2012 Microchip Technology Inc.

NOTES:

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 31

MRF24WG0MA/MB

APPENDIX A: REVISION HISTORY

Revision A (August 2012)

This is the initial released version of the document.

Revision B (October 2012)

This revision includes the following updates:

•TABLE 1-1: “Pin Description” is updated and

new note added

•FIGURE 2-1: “MRF24WG0MA/MB Example

Application Sche matic” is update d

• Updated the section 2.3.1 “Hibernate State”

MRF24WG0MA/MB

DS70686B-page 32 Preliminary Information  2012 Microchip Technology Inc.

NOTES:

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 33

MRF24WG0MA/MB

THE MICROCHIP WEB SITE

Microc hip pro vides onl ine s upport v ia our W WW site at

www.microchip.com. This w eb si te i s us ed as a m ean s

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

•Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

documents, latest software releases and archived

software

•General Technical Support – Frequently Asked

Questions (FAQs), technical support requests,

online dis cu ss io n gr oups, Mi cro chi p con sul t an t

program member listing

•Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,

listing of seminars and events, listin gs of

Microchip sales offices, distributors and factory

representatives

CUSTOMER CHANGE NOTIFICATION

SERVICE

Microchip’s customer notification service helps keep

customers current on Microchip products. Subscribers

will receive e-mail notification whenever there are

changes, updates, revisions or errata related to a

specif ied produ ct family or develo pment tool of interes t.

To register, access the Microchip web site at

www.microchip.com. Under “Support”, click on

“Customer Change Notification” and follow the

registration instructions.

CUSTOMER SUPP ORT

Users of Microchip products can receive assistance

through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor,

representative or field application engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

Technical s upport is a vailable through the web si te

at: http://microchip.com/support

MRF24WG0MA/MB

DS70686B-page 34 Preliminary Information  2012 Microchip Technology Inc.

READER RESP ONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip

product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our

documentation can better serve you, please FAX your comments to the Technical Publications Manager at

(480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

TO: Technical Publications Manager

RE: Reader Response Total Pages Sent ________

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Telephone: (_______) _________ - _________

Application (optional):

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Questions:

FAX: (______) _________ - _________

DS70686BMRF24WG0MA/MB

1. What are the best features of this docu ment?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 35

MRF24WG0MA/MB

PRODUCT IDENTIFICATION SYSTEM

To order parts, including industrial, or obtain information, for e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. -XX T

Tape andModule Temperature

Range

Device

Device MRF24WG0MA/MB;

VDD range 2.8V to 3.60V

Temperatu re Range I = -40 Cto+85C (Industrial Temperature)

Examples:

a) MRF24WG0MA-I/RM = Industrial Temp

Module Type Reel

MRF24WG0MA/MB

DS70686B-page 36 Preliminary Information  2012 Microchip Technology Inc.

NOTES:

 2012 Microchip Technology Inc. Preliminary Information DS70686B-page 37

Information contained in this publication regarding device

applications a nd t he like is pro vid ed only f or yo ur c onvenien ce

and may be su persed ed by updates . I t is y o u r r es ponsibil it y to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

PICSTART, PI C 32 logo, rfPIC, SST, SST Logo, SuperFlash

and UNI/O are registered trademarks of Microchip T echnology

Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MTP, SEEVAL and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of

Microchip Technology Inc. in other countries.

Analog-for-the-Digital Age, Application Maestro, BodyCom,

chipKIT, chipKIT logo, CodeGuard, dsPICDEM ,

dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONIT OR, FanSense, HI-TIDE, In-Circuit Serial

Programm ing, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB

Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code

Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,

PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,

Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA

and Z-Scale are trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip T echnology Incorporated

in the U.S.A.

GestIC and ULPP are registered trademarks of Microchip

Tec hnolo gy Germany II Gm bH & Co. & KG, a subsidiary of

Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 978-1-62076-629-3

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that it s family of products is one of the most secure families of it s kind on the market t oday, when used in t he

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our

products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Mill ennium Copyright Act. If such act s

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microperiph erals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

QUALITY MANAGEMENT S

YSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

DS70686B-page 38 Preliminary Information  2012 Microchip Technology Inc.

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Worldwide Sales and Service

11/29/11