CM1450-08CP - California Micro Devices

01/27/05 430 N. McCarthy Blvd., Milpitas, CA 95035-51 12 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 1

CM1450

PRELIMINARY

LCD & Camera EMI Filter Array with ESD Protection

Features

• Six and eight channels of EMI filtering

• Utilizes Praetorian™ inductor-based design tech-

nology for true L-C filter implementation

•OptiGuard™ coating for improved reliability

•±15kV ESD protection on each channel

(IEC 61000-4-2 Level 4, contact discharge)

•±30kV ESD protection on each channel (HBM)

• Better than 40dB of attenuation at 1GHz

• Chip Scale Package features extremely low

lead inductance for optimum filter and ESD

performance

• 15-bump, 2.960mm x 1.330mm footprint

Chip Scale Package (CM1450-06CS/CP)

• 20-bump, 4.000mm x 1.458mm footprint

Chip Scale Package (CM1450-08CS/CP)

• Lead-free version available

Applications

• LCD and Camera data lines in mobile handsets

• I/O port protection for mobile handsets, notebook

computers, PDAs, etc.

• EMI filtering for data phones in cell phones, PDAs

or notebook computersWireless handsets / cell

phones

• Wireless Handsets

• Handheld PCs/PDAs

• LCD and camera modules

Product Description

The CM1450 comprises a family of inductor-capacitor

(L-C) based EMI filter arrays with integrated ESD pro-

tection in CSP form factor. The CM1450-06 and

CM1450-08 are configured in 6 and 8 channel formats

respectively. Each EMI filter channel of the CM1450 is

implemented as a 5-pole L-C filter where the compo-

nent values are 15pF-17nH-15pF-17nF-15pF. The

CM1450's roll-off frequency at -10dB attenuation is

300MHz and can be used in applications where the

data rates are as high as 120Mbps while providing

greater than 35dB over the 800MHz to 2.7GHz fre-

quency range. The parts integrate ESD protection

diodes on every pin, which provide a very high level of

protection for sensitive electronic components that may

be subjected to electrostatic discharge (ESD). The

ESD protection diodes connected to the filter ports are

designed and characterized to safely dissipate ESD

strikes of ±15kV, beyond the Level 4 requirement of

the IEC61000-4-2 international standard. Using the

MIL-STD-883 (Method 3015) specification for Human

Body Model (HBM) ESD, the pins are protected for

contact discharges at greater than ±30kV.

This device is particularly well suited for portable elec-

tronics (e.g. wireless handsets, PDAs) because of its

small package format and easy-to-use pin assign-

ments. In particular, the CM1450 is ideal for EMI filter-

ing and protecting data and control lines for the LCD

display and camera interface in wireless handsets.

The CM1450 incorporates OptiGuard™ which results in

improved reliability at assembly. The CM1450 is avail-

able in a space saving, low profile Chip Scale Package

with optional lead-free finishing.

Electrical Schematic

* See Package/Pinout Diagram

1 of n EMI Filtering + ESD Channels

(n = 6 for CM1450-06, 8 for CM1450-08)

for expanded pin information.

FILTERn*

GND

FILTERn*

(Pins B1-Bn)

2430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 01/27/05

CM1450

PRELIMINARY

Ordering Information

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.

Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.

FILTER5 FILTER6

GND

FILTER5 FILTER6

A6A5

Orientation

Marking

C6C5

FILTER7 FILTER8

GND

FILTER7 FILTER8

A8A7

C8C7

FILTER3 FILTER4

GND

FILTER3 FILTER4

A4A3

C4C3

FILTER1 FILTER2

GND

FILTER1 FILTER2

A2A1

C2C1

N508

43267851

Orientation

Marking

(see note 2)

N506

432651

Orientation

Marking

(see note 2)

FILTER5 FILTER6

GND

FILTER5 FILTER6

A6A5

Orientation

Marking

C6C5

FILTER3 FILTER4

GND

FILTER3 FILTER4

A4A3

C4C3

FILTER1 FILTER2

GND

FILTER1 FILTER2

A2A1

C2C1

PACKAGE / PINOUT DIAGRAMS

Notes:

BOTTOM VIEW

CM1450-06CS/CP 15-Bump CSP Package

(Bumps Up View)

TOP VIEW

(Bumps Down View)

CM1450 -08CS/CP 20-Bump CSP Package

1) These drawings are not to scale.

Lead-free devices are specified by using a "+" character for the top side orientation mark.

PIN DESCRIPTIONS

CM1450 CM1450 NAME DESCRIPTION CM1450 CM1450 NAME DESCRIPTION

PIN(s) PIN(s) NAME DESCRIPTION PIN(s) PIN(s) NAME DESCRIPTION

A1 A1 FILTER1 Filter Channel 1 C1 C1 FILTER1 Filter Channel 1

A2 A2 FILTER2 Filter Channel 2 C2 C2 FILTER2 Filter Channel 2

A3 A3 FILTER3 Filter Channel 3 C3 C3 FILTER3 Filter Channel 3

A4 A4 FILTER4 Filter Channel 4 C4 C4 FILTER4 Filter Channel 4

A5 A5 FILTER5 Filter Channel 5 C5 C5 FILTER5 Filter Channel 5

A6 A6 FILTER6 Filter Channel 6 C6 C6 FILTER6 Filter Channel 6

- A7 FILTER7 Filter Channel 7 - C7 FILTER7 Filter Channel 7

- A8 FILTER8 Filter Channel 8 - C8 FILTER8 Filter Channel 8

B1-B3 B1-B4 GND Device Ground

PART NUMBERING INFORMATION

Bumps Package

Standard Finish Lead-free Finish2

Ordering Part

Number1Part Marking

Ordering Part

Number1Part Marking

15 CSP CM1450-06CS N506 CM1450-06CP N506

20 CSP CM1450-08CS N508 CM1450-08CP N508

01/27/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 3

CM1450

PRELIMINARY

Specifications

Note 1: TA=25°C unless otherwise specified.

Note 2: ESD applied to input and output pins with respect to GND, one at a time.

Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,

then clamping voltage is measured at Pin C1.

Note 4: Unused pins are left open

Note 5: These parameters are guaranteed by design and characterization.

ABSOLUTE MAXIMUM RATINGS

PARAMETER RATING UNITS

Storage Temperature Range -65 to +150 °C

DC Power per Resistor 100 mW

DC Package Power Rating 500 mW

STANDARD OPERATING CONDITIONS

PARAMETER RATING UNITS

Operating Temperature Range -40 to +85 °C

ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS

LTOT Total Channel Inductance (L1 + L2)34nH

L1, L2Inductance 17 nH

CTOT Total Channel Capcitance (C1⏐⏐C2 ⏐⏐ C3 )At 2.5V DC, 1MHz,

30mV AC

36 45 54 pF

C1, C2, C3Capacitance At 2.5V DC, 1MHz,

30mV AC

12 15 18 pF

fCCut-off Frequency

ZSOURCE=50Ω, ZLOAD=50Ω137 MHz

fCRoll-off Frequency at -10dB Attenuation

ZSOURCE=50Ω, ZLOAD=50Ω300 MHz

VDIODE Diode Standoff Voltage IDIODE=10µA5.5 V

ILEAK Diode Leakage Current (reverse bias) VDIODE=+3.3V 100 nA

VSIG Signal Voltage

Positive Clamp

Negative Clamp

ILOAD = 10mA

5.6

-1.5

6.8

-0.8

9.0

-0.4

VESD In-system ESD Withstand Voltage

a) Human Body Model, MIL-STD-883,

Method 3015

b) Contact Discharge per IEC 61000-4-2

Level 4

Notes 2,4 and 5 ±30

±15

VCL Clamping Voltage during ESD Discharge

MIL-STD-883 (Method 3015), 8kV

Positive Transients

Negative Transients

Notes 2,3,4 and 5

+12

-7

4430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 01/27/05

CM1450

PRELIMINARY

Performance Information

Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)

Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1)

Figure 2. Filter Capacitance vs. Input Voltage over Temperature

(normalized to capacitance at 2.5VDC and 25°C)

01/27/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 5

CM1450

PRELIMINARY

Application Information

Refer to Application Note AP-217, "The Chip Scale

Package", for a detailed description of Chip Scale

Packages offered by California Micro Devices.

Figure 3. Recommended Non-Solder Mask Defined Pad Illustration

Figure 4. Eutectic (SnPb) Solder

Ball Reflow Profile

Figure 5. Lead-free (SnAgCu) Solder

Ball Reflow Profile

PRINTED CIRCUIT BOARD RECOMMENDATIONS

PARAMETER VALUE

Pad Size on PCB 0.275mm

Pad Shape Round

Pad Definition Non-Solder Mask defined pads

Solder Mask Opening 0.325mm Round

Solder Stencil Thickness 0.125mm - 0.150mm

Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round

Solder Flux Ratio 50/50 by volume

Solder Paste Type No Clean

Pad Protective Finish OSP (Entek Cu Plus 106A)

Tolerance — Edge To Corner Ball +50µm

Solder Ball Side Coplanarity +20µm

Maximum Dwell Time Above Liquidous (183°C) 60 seconds

Soldering Maximum Temperature 260°C

Solder Mask Opening

0.325mm DIA.

Non-Solder Mask Defined Pad

0.275mm DIA.

Solder Stencil Opening

0.330mm DIA.

200

250

150

100

0 1:00.0 2:00.0 3:00.0 4:00.0

Time (minutes)

Temperature (°C)

6430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 01/27/05

CM1450

PRELIMINARY

Mechanical Details

CM1450 devices are supplied in custom Chip Scale

Packages (CSP). Dimensions for each of these

devices are presented in the following pages.

CM1450-06CS/CP Mechanical Specifications

The package dimensions for the CM1450-06CS/CP

are presented below.

Package Dimensions for

CM1450-06CS/CP Chip Scale Package

PACKAGE DIMENSIONS

Package Custom CSP

Bumps 15

Dim Millimeters Inches

Min Nom Max Min Nom Max

A1 2.915 2.960 3.005 0.1148 0.1165 0.1183

A2 1.285 1.330 1.375 0.0506 0.0524 0.0541

B1 0.495 0.500 0.505 0.0195 0.0197 0.0199

B2 0.245 0.250 0.255 0.0096 0.0098 0.0100

B3 0.430 0.435 0.440 0.0169 0.0171 0.0173

B4 0.430 0.435 0.440 0.0169 0.0171 0.0173

C1 0.180 0.230 0.280 0.0071 0.0091 0.0110

C2 0.180 0.230 0.280 0.0071 0.0091 0.0110

D1 0.561 0.605 0.649 0.0221 0.0238 0.0255

D2 0.355 0.380 0.405 0.0140 0.0150 0.0159

# per tape and

reel

3500 pieces

Controlling dimension: millimeters

Mechanical Package Diagrams

3456

C1 B1

DIMENSIONS IN MILLIMETERS

BOTTOM VIEW

SIDE

VIEW

0.30 DIA.

63/37 Sn/Pb (Eutectic) or

SOLDER BUMPS

96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)

01/27/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 7

CM1450

PRELIMINARY

Mechanical Details (cont’d)

CM1450-08CS/CP Mechanical Specifications

The package dimensions for the CM1450-08CS/CP

are presented below.

Package Dimensions for

CM1450-08CS/CP Chip Scale Package

PACKAGE DIMENSIONS

Package Custom CSP

Bumps 20

Dim Millimeters Inches

Min Nom Max Min Nom Max

A1 3.955 4.000 4.045 0.1557 0.1575 0.1593

A2 1.413 1.458 1.503 0.0556 0.0574 0.0592

B1 0.495 0.500 0.505 0.0195 0.0197 0.0199

B2 0.245 0.250 0.255 0.0096 0.0098 0.0100

B3 0.430 0.435 0.440 0.0169 0.0171 0.0173

B4 0.430 0.435 0.440 0.0169 0.0171 0.0173

C1 0.200 0.250 0.300 0.0079 0.0098 0.0118

C2 0.244 0.294 0.344 0.0096 0.0116 0.0135

D1 0.561 0.605 0.649 0.0221 0.0238 0.0255

D2 0.355 0.380 0.405 0.0140 0.0150 0.0159

# per tape and

reel

3500 pieces

Controlling dimension: millimeters

Mechanical Package Diagrams

3456

C1 B1

DIMENSIONS IN MILLIMETERS

BOTTOM VIEW

SIDE

VIEW

0.30 DIA.

63/37 Sn/Pb (Eutectic) or

SOLDER BUMPS

96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)

8430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ●Tel: 408.263.3214 ●Fax: 408.263.7846 ●www.calmicro.com 01/27/05

CM1450

PRELIMINARY

Mechanical Details (cont’d)

CSP Tape and Reel Specifications

Figure 6. Tape and Reel Mechanical Data

PART NUMBER CHIP SIZE (mm)

POCKET SIZE (mm)

B0 X A0 X K0

TAPE WIDTH

REEL

DIAMETER

QTY PER

REEL P0P1

CM1450-06 2.96 X 1.33 X 0.6 3.10 X 1.45 X 0.74 8mm 178mm (7") 3500 4mm 4mm

CM1450-08 4.00 X 1.46 X 0.6 4.11 X 1.57 X 0.76 8mm 178mm (7") 3500 4mm 4mm

Top

For Tape Feeder Reference

Cover

Tape

Only including Draft.

Concentric Around B.

Embossment

User Direction of Feed

0.2 mm

Center Lines

of Cavity

10 Pitches Cumulative

Tolerance On Tape