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006-02 / 20061022 / e9415_mmz_c.fm
• All specifications are subject to change without notice.
Chip Beads(SMD)
For Signal Line
MMZ Series MMZ1608-C Type
FEATURES
• Two sizes: 1.6×0.8×0.6 and 1.6×0.8×0.8mm. Chip
bead(impeder) built using 5-materials construction.
• Layout of the interior electrode structure has been optimized,
thereby improving high frequency characteristics, decreasing
Rdc, and lowering height.
• Size standardized for use by automatic assembly equipment.
No preferred orientation.
• Either flow or reflow soldering method can be used due to
electroplating of the terminal electrodes.
• High reliability due to an entirely monolithic structure.
• Closed magnetic circuit structure allows high-density installation
while preventing crosstalk between circuits.
• Low DC resistance structure of electrode prevents wasteful
electric power consumption.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Personal computers,CRTs, liquid crystal display panels, printers,
hard disk drives, game machines, cellular phones, etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Material code
(4) Nominal impedance
121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
MATERIAL CHARACTERISTICS
B material: This type is perfectly suited for fast digital signals. By
equalizing R components and X components that
beads possess at a frequency of 5MHz, it is able to
suppress overshooting, undershooting and ringing of
fast digital signals.
R material: For wide frequency applications calling for broad
impedance characteristics.
For digital signal line applications calling requiring
good waveform integrity. Impedance values selected
for effectiveness at 10 to 200MHz.
S material: Standard type that features impedance characteristics
similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for effec-
tiveness at 40 to 300MHz.
Y material: High frequency range type intended for the 100MHz
region and above.
For signal line applications in which the signal fre-
quency is far from the cutoff frequency. Impedance val-
ues selected for effectiveness at 80 to 400MHz.
D material: For applications calling for low insertion loss at low fre-
quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre-
quencies (200 to 500MHz) for signal line applications.
TYPICAL MATERIAL CHARACTERISTICS
Conformity to RoHS Directive
MMZ 1608 R 121 C T
(1) (2) (3) (4) (5) (6)
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
110
Frequency(MHz)
100 1000
10000
1000
100
10
1
Impedance(Ω)
B
R
S
YD
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.