DATA SH EET
Product specification
Supersedes data of 1998 Mar 26 2000 Aug 25
DISCRETE SEMICONDUCTORS
KTY81-2 series
Silicon temperature sensors
o
ok, halfpage
M3D239
2000 Aug 25 2
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
DESCRIPTION
The temperature sensors in the KTY81-2 series have a
positive temperature coefficient of resistance and are
suitable for use in measurement and control systems. The
sensors are encapsulated in the SOD70 leaded plastic
package.
Tolerances of 0.5% or other special selections are
available on request.
PINNING
PIN DESCRIPTION
1 electrical contact
2 electrical contact
3 not to be connected to a potential
Fig.1 Simplified outline (SOD70).
handbook, halfpage
MBH739
2
3
1
MARKING
TYPE NUMBER CODE
KTY81-210 210
KTY81-220 220
KTY81-221 221
KTY81-222 222
KTY81-250 250
KTY81-251 251
KTY81-252 252
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
R25 sensor resistance Tamb =25°C; Icont =1mA
KTY81-210 1980 2020 Ω
KTY81-220 1960 2040 Ω
KTY81-221 1960 2000 Ω
KTY81-222 2000 2040 Ω
KTY81-250 1900 2100 Ω
KTY81-251 1900 2000 Ω
KTY81-252 2000 2100 Ω
Tamb ambient operating
temperature −55 +150 °C
2000 Aug 25 3
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
CHARACTERISTICS
Tamb =25°C, in liquid, unless otherwise specified.
Notes
1. The thermal time constant is the time taken for the sensor to reach 63.2% of the total temperature difference.
For example, if a sensor with a temperature of 25 °C is moved to an environment with an ambient temperature of
100 °C, the time for the sensor to reach a temperature of 72.4 °C is the thermal time constant.
2. Inert liquid, e.g. FC43 manufactured by the 3M company.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Icont continuous sensor current in free air; Tamb =25°C−10 mA
in free air; Tamb = 150 °C−2mA
T
amb ambient operating temperature −55 +150 °C
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R25 sensor resistance Icont =1mA
KTY81-210 1980 −2020 Ω
KTY81-220 1960 −2040 Ω
KTY81-221 1960 −2000 Ω
KTY81-222 2000 −2040 Ω
KTY81-250 1900 −2100 Ω
KTY81-251 1900 −2000 Ω
KTY81-252 2000 −2100 Ω
TC temperature coefficient −0.79 −%/K
R100/R25 resistance ratio Tamb = 100 °C and 25 °C 1.676 1.696 1.716
R−55/R25 resistance ratio Tamb =−55 °C and 25 °C 0.480 0.490 0.500
τthermal time constant; note 1 in still air −30 −s
in still liquid; note 2 −5−s
in flowing liquid; note 2 −3−s
rated temperature range −55 −+150 °C
2000 Aug 25 4
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
Table 1 Ambient temperature, corresponding resistance, temperature coefficient and maximum expected temperature
error for KTY81-210 and KTY81-220
Icont = 1 mA.
AMBIENT
TEMPERATURE TEMP.
COEFF. KTY81-210 KTY81-220
(°C) (°F) (%/K) RESISTANCE
(Ω)TEMP.
ERROR
(K)
RESISTANCE
(Ω)TEMP.
ERROR
(K)
MIN. TYP. MAX. MIN. TYP. MAX.
−55 −67 0.99 951 980 1009 ±3.02 941 980 1019 ±4.02
−50 −58 0.98 1000 1030 1059 ±2.92 990 1030 1070 ±3.94
−40 −40 0.96 1105 1135 1165 ±2.74 1094 1135 1176 ±3.78
−30 −22 0.93 1218 1247 1277 ±2.55 1205 1247 1289 ±3.62
−20 −4 0.91 1338 1367 1396 ±2.35 1325 1367 1410 ±3.45
−10 14 0.88 1467 1495 1523 ±2.14 1452 1495 1538 ±3.27
0 32 0.85 1603 1630 1656 ±1.91 1587 1630 1673 ±3.08
10 50 0.83 1748 1772 1797 ±1.67 1730 1772 1814 ±2.88
20 68 0.80 1901 1922 1944 ±1.41 1881 1922 1963 ±2.66
25 77 0.79 1980 2000 2020 ±1.27 1960 2000 2040 ±2.54
30 86 0.78 2057 2080 2102 ±1.39 2036 2080 2123 ±2.68
40 104 0.75 2217 2245 2272 ±1.64 2194 2245 2295 ±2.97
50 122 0.73 2383 2417 2451 ±1.91 2359 2417 2475 ±3.28
60 140 0.71 2557 2597 2637 ±2.19 2531 2597 2663 ±3.61
70 158 0.69 2737 2785 2832 ±2.49 2709 2785 2860 ±3.94
80 176 0.67 2924 2980 3035 ±2.8 2894 2980 3065 ±4.3
90 194 0.65 3118 3182 3246 ±3.12 3086 3182 3278 ±4.66
100 212 0.63 3318 3392 3466 ±3.46 3284 3392 3500 ±5.05
110 230 0.59 3523 3607 3691 ±3.93 3487 3607 3728 ±5.61
120 248 0.53 3722 3817 3912 ±4.7 3683 3817 3950 ±6.59
125 257 0.49 3815 3915 4016 ±5.26 3775 3915 4055 ±7.31
130 266 0.44 3901 4008 4114 ±6 3861 4008 4154 ±8.27
140 284 0.33 4049 4166 4283 ±8.45 4008 4166 4325 ±11.46
150 302 0.20 4153 4280 4407 ±14.63 4110 4280 4450 ±19.56
2000 Aug 25 5
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
Table 2 Ambient temperature, corresponding resistance, temperature coefficient and maximum expected temperature
error for KTY81-221 and KTY81-222
Icont = 1 mA.
AMBIENT
TEMPERATURE TEMP.
COEFF. KTY81-221 KTY81-222
(°C) (°F) (%/K) RESISTANCE
(Ω)TEMP.
ERROR
(K)
RESISTANCE
(Ω)TEMP.
ERROR
(K)
MIN. TYP. MAX. MIN. TYP. MAX.
−55 −67 0.99 941 970 999 ±3.02 960 990 1020 ±3.02
−50 −58 0.98 990 1019 1049 ±2.92 1010 1040 1070 ±2.92
−40 −40 0.96 1094 1123 1153 ±2.74 1116 1146 1176 ±2.74
−30 −22 0.93 1205 1235 1264 ±2.55 1230 1260 1290 ±2.55
−20 −4 0.91 1325 1354 1382 ±2.35 1352 1381 1410 ±2.35
−10 14 0.88 1452 1480 1508 ±2.14 1481 1510 1538 ±2.14
0 32 0.85 1587 1613 1640 ±1.91 1619 1646 1673 ±1.91
10 50 0.83 1730 1754 1779 ±1.67 1765 1790 1815 ±1.67
20 68 0.80 1882 1903 1924 ±1.41 1920 1941 1963 ±1.41
25 77 0.79 1960 1980 2000 ±1.27 2000 2020 2040 ±1.27
30 86 0.78 2037 2059 2081 ±1.39 2078 2100 2123 ±1.39
40 104 0.75 2195 2222 2250 ±1.64 2239 2267 2295 ±1.64
50 122 0.73 2360 2393 2426 ±1.91 2407 2441 2475 ±1.91
60 140 0.71 2531 2571 2611 ±2.19 2582 2623 2664 ±2.19
70 158 0.69 2710 2757 2804 ±2.49 2764 2812 2860 ±2.49
80 176 0.67 2895 2950 3005 ±2.8 2953 3009 3065 ±2.8
90 194 0.65 3086 3150 3214 ±3.12 3149 3214 3279 ±3.12
100 212 0.63 3285 3358 3431 ±3.46 3351 3426 3501 ±3.46
110 230 0.59 3488 3571 3655 ±3.93 3558 3643 3728 ±3.93
120 248 0.53 3684 3779 3873 ±4.7 3759 3855 3951 ±4.7
125 257 0.49 3776 3876 3976 ±5.26 3853 3955 4056 ±5.26
130 266 0.44 3862 3967 4073 ±6 3940 4048 4155 ±6
140 284 0.33 4009 4125 4241 ±8.45 4090 4208 4326 ±8.45
150 302 0.20 4112 4237 4363 ±14.63 4195 4323 4451 ±14.63
2000 Aug 25 6
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
Table 3 Ambient temperature, corresponding resistance, temperature coefficient and maximum expected temperature
error for KTY81-250 and KTY81-251
Icont = 1 mA.
AMBIENT
TEMPERATURE TEMP.
COEFF. KTY81-250 KTY81-251
(°C) (°F) (%/K) RESISTANCE
(Ω)TEMP.
ERROR
(K)
RESISTANCE
(Ω)TEMP.
ERROR
(K)
MIN. TYP. MAX. MIN. TYP. MAX.
−55 −67 0.99 911 980 1049 ±7.04 913 956 999 ±4.52
−50 −58 0.98 959 1030 1101 ±6.99 960 1004 1048 ±4.45
−40 −40 0.96 1060 1135 1210 ±6.91 1061 1106 1152 ±4.3
−30 −22 0.93 1168 1247 1327 ±6.84 1169 1216 1263 ±4.16
−20 −4 0.91 1283 1367 1451 ±6.77 1285 1333 1381 ±4.01
−10 14 0.88 1407 1495 1583 ±6.69 1408 1457 1507 ±3.84
0 32 0.85 1538 1630 1721 ±6.61 1539 1589 1639 ±3.67
10 50 0.83 1677 1772 1867 ±6.51 1678 1728 1778 ±3.48
20 68 0.80 1824 1922 2021 ±6.41 1825 1874 1923 ±3.28
25 77 0.79 1900 2000 2100 ±6.35 1900 1950 2000 ±3.18
30 86 0.78 1974 2080 2185 ±6.55 1975 2028 2080 ±3.33
40 104 0.75 2127 2245 2362 ±6.97 2129 2189 2248 ±3.64
50 122 0.73 2287 2417 2547 ±7.4 2289 2357 2425 ±3.97
60 140 0.71 2453 2597 2741 ±7.85 2455 2532 2609 ±4.31
70 158 0.69 2626 2785 2943 ±8.31 2628 2715 2802 ±4.67
80 176 0.67 2805 2980 3154 ±8.79 2807 2905 3003 ±5.05
90 194 0.65 2990 3182 3374 ±9.29 2993 3102 3212 ±5.43
100 212 0.63 3182 3392 3602 ±9.81 3185 3307 3429 ±5.84
110 230 0.59 3379 3607 3836 ±10.65 3382 3517 3652 ±6.45
120 248 0.53 3569 3817 4065 ±12.25 3573 3721 3870 ±7.53
125 257 0.49 3658 3915 4173 ±13.45 3662 3817 3973 ±8.33
130 266 0.44 3741 4008 4274 ±15.06 3745 3907 4070 ±9.4
140 284 0.33 3883 4166 4450 ±20.49 3887 4062 4237 ±12.96
150 302 0.20 3982 4280 4578 ±34.35 3987 4173 4359 ±22.02
2000 Aug 25 7
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
Table 4 Ambient temperature, corresponding resistance, temperature coefficient and maximum expected temperature
error for KTY81-252
Icont = 1 mA.
AMBIENT
TEMPERATURE TEMP.
COEFF. KTY81-252
(°C) (°F) (%/K) RESISTANCE
(Ω)TEMP.
ERROR
(K)
MIN. TYP. MAX.
−55 −67 0.99 959 1005 1050 ±4.52
−50 −58 0.98 1009 1055 1102 ±4.45
−40 −40 0.96 1115 1163 1211 ±4.3
−30 −22 0.93 1229 1278 1328 ±4.16
−20 −4 0.91 1351 1401 1452 ±4.01
−10 14 0.88 1480 1532 1584 ±3.84
0 32 0.85 1618 1670 1723 ±3.67
10 50 0.83 1764 1817 1869 ±3.48
20 68 0.80 1919 1970 2022 ±3.28
25 77 0.79 2000 2050 2100 ±3.18
30 86 0.78 2077 2132 2187 ±3.33
40 104 0.75 2238 2301 2364 ±3.64
50 122 0.73 2406 2478 2549 ±3.97
60 140 0.71 2581 2662 2743 ±4.31
70 158 0.69 2763 2854 2946 ±4.67
80 176 0.67 2951 3054 3157 ±5.05
90 194 0.65 3147 3262 3376 ±5.43
100 212 0.63 3349 3477 3605 ±5.84
110 230 0.59 3556 3697 3839 ±6.45
120 248 0.53 3756 3912 4068 ±7.53
125 257 0.49 3850 4013 4177 ±8.33
130 266 0.44 3937 4108 4278 ±9.4
140 284 0.33 4087 4271 4455 ±12.96
150 302 0.20 4191 4387 4583 ±22.02
2000 Aug 25 8
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
Fig.2 Maximum expected temperature error (∆T).
handbook, halfpage
−50 150
15
5
−15
−5
10
0
−10
0 50 100
MGG695
Tamb (°C)
∆T
(K) KTY81-251
-252
KTY81-220
KTY81-210
-221
-222
Fig.3 Sensor resistance as a function of ambient
temperature; average values.
Icont = 1 mA.
handbook, halfpage
4.8
0
−100 −50 0
R
(kΩ)
Tamb (°C)
50 100 150 200
MSA922
3.2
1.6
Fig.4 Sensorresistanceasafunctionofoperating
current.
To keep the temperature error low, an operating current of
Icont = 1 mA is recommended for temperatures above 100 °C.
handbook, halfpage
5
4
2
0
3
1
MGG700
110
10−1Icont (mA)
R
(kΩ)
25 °C
0 °C
−50 °C
150 °C
100 °C
50 °C
125 °C
75 °C
−25 °C
Fig.5 Maximum operating current for safe
operation.
handbook, halfpage
−50 0 50 150
12
0
4
8
100
MGG705
Tamb (°C)
Icont
(mA)
2000 Aug 25 9
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
Fig.6 Deviationof sensor resistance as afunction
of operating current in still liquid.
Tamb =25°C.
handbook, halfpage
2
30
20
10
0
−10
01
MGG703
Icont (mA)
∆R
(Ω)
APPLICATION INFORMATION
SYMBOL PARAMETER CONDITIONS TYP. UNIT
∆R25 drift of sensor resistance at 25 °C 10000 hours continuous operation;
Tamb = 150 °C3.2 Ω
2000 Aug 25 10
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
PACKAGING
Sensors in SOD70 encapsulation are delivered in bulk packaging, and also reel packaging for automatic placement on
hybrid circuits and printed-circuit boards (see Figs 7 and 8).
Note: Types in bulk packaging have a lead-to-lead distance of 2.54 millimetres. The lead-to-lead distance of types
packaged on reel is 5.08 millimetres for spread lead types and 2.54 millimetres for straight lead types.
Fig.7 Configuration of bandolier: spread leads.
handbook, full pagewidth
MBH795
(p)
A1
P
H2
A
L
H0
H1
F
F12
F
P
2
P
0
D
0
W
2
W
0
W
1
W
t
t
1
∆h∆h
T
2000 Aug 25 11
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
Fig.8 Configuration of bandolier: straight leads.
handbook, full pagewidth
MBL214
(p)
A1
P
H2
A
L
H0
H1
F
F12
F
P
2
P
0
D
0
W
2
W
0
W
1
W
t
t
1
∆h∆h
T
2000 Aug 25 12
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
Table 5 Tape specification
Note
1. Measured over 20 devices.
SYMBOL DIMENSION SPECIFICATIONS REMARKS
MIN. NOM. MAX. TOL. UNIT
A1body width 4.4 −4.8 −mm
A body height 5 −5.2 −mm
T body thickness 3.6 −4.2 −mm
P pitch of component −12.7 −±1mm
P
0feed hole pitch −12.7 −±0.3 mm
cumulative pitch error −−−±0.1 note 1
P2feed hole centre to component
centre −6.35 −±0.4 mm to be measured at bottom
of clinch
F lead-to-lead distance
spread leads −5.08 −+0.6/−0.2 mm
straight leads −2.54 −+0.6/−0.2 mm
∆h component alignment −01−mm at top of body
W tape width −18 −±0.5 mm
W0hold-down tape width −6−±0.2 mm
W1hole position −9−+0.7/−0.5 mm
W2hold-down tape position −0.5 −±0.2 mm
H0lead wire clinch height −16.5 −±0.5 mm
H1component height −−23.25 −mm
L length of snipped leads −−11 −mm
D0feed hole diameter −4−±0.2 mm
t total tape thickness −−1.2 −mm t1= 0.3 to 0.6
F1, F2lead to snipped lead distance
spread leads −2.54 −+0.4/−0.2 mm
straight leads −1.27 −+0.4/−0.2 mm
H2clinch height −2.5 −+0.5/0 mm
(p) pull-out force 6 −−− N
2000 Aug 25 13
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
PACKAGE OUTLINE
UNIT A
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 5.2
5.0
b
0.48
0.40
c
0.45
0.40
D
4.8
4.4
d
1.7
1.4
E
4.2
3.6
L
14.5
12.7 0.7
0.5
e
2.54
L2
L1(1)
max.
2.5
b1
0.66
0.56
DIMENSIONS (mm are the original dimensions)
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
SOD70 98-05-25
A L
0 2.5 5 mm
scale
b
c
D
b1
L1
L2
d
E
Plastic near cylindrical single-ended package; 2 in-line leads SOD70
1
2
e
2000 Aug 25 14
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
DATA SHEET STATUS
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DATA SHEET STATUS PRODUCT
STATUS DEFINITIONS (1)
Objective specification Development This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification Production This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseorat any other conditionsabovethosegiveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentation orwarrantythatsuchapplicationswillbe
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomers usingorselling theseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseof anyoftheseproducts, conveysnolicenceortitle
under any patent, copyright, or mask work right to these
products,andmakesnorepresentationsorwarrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
2000 Aug 25 15
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-2 series
NOTES
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
2000 70
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Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
Printed in The Netherlands 613520/04/pp16 Date of release: 2000 Aug 25 Document order number: 9397 750 07227
