3.5x3.5 mm SMD CHIP LED LAMP Part Number: KA-3535ZG25Z4S Green ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Description The Green source color devices are made with InGaN on Features Al2O3 substrate Light Emitting Diode. z White SMD package, silicone resin. Static electricity and surge damage the LEDS. z Low thermal resistance. It is recommended to use a wrist band or anti-electrostatic z Compatible with IR-reflow processes. glove when handling the LEDs. z ESD protection. All devices, equipment and machinery must be electrically z Package: 2000pcs / reel. grounded. z Moisture sensitivity level : level 2a. Applications z RoHS compliant. z Signal and symbol luminaire for orientation. z Marker lights (e.g. steps, exit ways, etc). z Decorative and entertainment lighting. z Commercial and residential lighting. z Automotive interior lighting. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAM0801 APPROVED: WYNEC REV NO: V.4B CHECKED: Allen Liu DATE: MAR/30/2013 DRAWN: F.Cui PAGE: 1 OF 6 ERP: 1201005740 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. Detailed application notes are listed on our website. http://www.kingbright.com/application_notes SPEC NO: DSAM0801 APPROVED: WYNEC REV NO: V.4B CHECKED: Allen Liu DATE: MAR/30/2013 DRAWN: F.Cui PAGE: 2 OF 6 ERP: 1201005740 Selection Guide Dice Part No. KA-3535ZG25Z4S Iv (cd) [2] @ 150mA Lens Type Green (InGaN) Water Clear v (lm) [2] @ 150mA* Viewing Angle [1] Min. Typ. Min. Typ. 2 1/2 4.2 6 14 20 120 Notes: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity/ luminous Flux: +/-15%.*LEDs are binned according to their luminous flux. 3. Luminous intensity/ luminous Flux value is traceable to the CIE127-2007 compliant national standards. Absolute Maximum Ratings at TA=25C Parameter Symbol Value Unit Power Dissipation PD 600 mW Junction Temperature [1] TJ 110 C Operating Temperature Top -40 To +85 C Storage Temperature Tstg -40 To +85 C DC Forward Current [1] IF 150 mA Reverse Voltage VR 5 V Peak Forward Current [2] IFM 300 mA Thermal Resistance [1] (Junction/ambient) Rth j-a 170 C/W Thermal Resistance [1] (Junction/solder point) Rth j-S 50 C/W 8000 V Electrostatic Discharge Threshold (HBM) Notes: 1.Results from mounting on PC board FR4(pad size 70mm 2 ), mounted on pc board-metal core PCB is recommend for lowest thermal Resistance. 2.1/10 Duty Cycle, 0.1ms Pulse Width. Electrical / Optical Characteristics at TA=25C Parameter Wavelength at peak emission Dominant Wavelength IF=150mA IF=150mA [Typ.] [Typ.] Symbol Value Unit peak 515 nm dom [1] 525 nm 30 nm Spectral Line Half-width IF=150mA [Typ.] Forward Voltage IF=150mA [Min.] Forward Voltage IF=150mA [Typ.] 2.9 VF [2] Forward Voltage IF=150mA [Max.] 3.5 V 4.0 Allowable Reverse Current [Max.] IR 85 mA Temperature coefficient of peak IF=150mA, -10 C T100 C [Typ.] TC peak 0.09 nm/ C Temperature coefficient of dom IF=150mA, -10 C T100 C [Typ.] TC dom 0.03 nm/ C Temperature coefficient of VF IF=150mA, -10 C T100 C [Typ.] TCV -2.7 mV/ C Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. 3.Wavelength value is traceable to the CIE127-2007 compliant national standards. SPEC NO: DSAM0801 APPROVED: WYNEC REV NO: V.4B CHECKED: Allen Liu DATE: MAR/30/2013 DRAWN: F.Cui PAGE: 3 OF 6 ERP: 1201005740 Green SPEC NO: DSAM0801 APPROVED: WYNEC KA-3535ZG25Z4S REV NO: V.4B CHECKED: Allen Liu DATE: MAR/30/2013 DRAWN: F.Cui PAGE: 4 OF 6 ERP: 1201005740 KA-3535ZG25Z4S Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Reel Dimension Recommended Soldering Pattern (Units : mm; Tolerance: 0.1) Tape Specifications (Units : mm) SPEC NO: DSAM0801 APPROVED: WYNEC REV NO: V.4B CHECKED: Allen Liu DATE: MAR/30/2013 DRAWN: F.Cui PAGE: 5 OF 6 ERP: 1201005740 PACKING & LABEL SPECIFICATIONS SPEC NO: DSAM0801 APPROVED: WYNEC REV NO: V.4B CHECKED: Allen Liu KA-3535ZG25Z4S DATE: MAR/30/2013 DRAWN: F.Cui PAGE: 6 OF 6 ERP: 1201005740