NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Based on DDR3-1066/1333 256Mx8 (2GB/4GB) / 512Mx4 (4GB/8GB) SDRAM B-Die Based on DDR3-1066 1Gx4 (DDP) (16GB) SDRAM B-Die Features *Performance: Speed Sort DIMM CAS Latency fck - Clock Frequency PC3-8500 PC3-10600 -BE -CG 7 9 Unit 533 667 tck - Clock Cycle 1.875 1.5 MHz ns fDQ - DQ Burst Frequency 1066 1333 Mbps * 240-Pin Registered Dual In-Line Memory Module (RDIMM) * 2GB/4GB: 256Mx72/512Mx72 DDR3 Registered DIMM based on 256Mx8 DDR3 SDRAM B-Die devices * 4GB/8GB: 512Mx72/1024Mx72 DDR3 Registered DIMM based on 512Mx4 DDR3 SDRAM B-Die devices * 16GB: 2Gx72 DDR3 Registered DIMM based on 1024Mx4 (DDP) DDR3 SDRAM B-Die devices * Intended for 533MHz/667MHz applications * Inputs and outputs are SSTL-15 compatible *VDD = VDDQ = 1.5V 0.075V (for DDR3) *VDD = VDDQ = 1.35V+0.0675/-0.1V (for DDR3L) * SDRAMs have 8 internal banks for concurrent operation * Differential clock inputs * Data is read or written on both clock edges * DRAM DLL aligns DQ and DQS transitions with clock transitions. * Address and control signals are fully synchronous to positive clock edge * Nominal and Dynamic On-Die Termination support * Programmable Operation: - DIMM Latency: 6,7,8,9 - Burst Type: Sequential or Interleave - Burst Length: BC4, BL8 - Operation: Burst Read and Write * Two different termination values (Rtt_Nom & Rtt_WR) * 15/10/1 (row/column/rank) Addressing for 2GB * 15/11/1 (row/column/rank) Addressing for 4GB (512Mx4 Device) * 15/10/2 (row/column/rank) Addressing for 4GB (256Mx8 Device) * 15/11/2 (row/column/rank) Addressing for 8GB * 15/11/4 (row/column/rank) Addressing for 16GB * Extended operating temperature rage * Auto Self-Refresh option * Serial Presence Detect * Gold contacts * SDRAMs are in 78-ball BGA Package * RoHS compliance * Halogen free product Description All memory modules are 240-Pin Double Data Rate 3 (DDR3) Synchronous DRAM Registered Dual In-Line Memory Module, organized as one rank of 256Mx72 (2GB), one rank or two ranks of 512Mx72 (4GB), two ranks of 1Gx72 (8GB) and four ranks of 2Gx72 (16GB) high-speed memory array. Modules use nine 256Mx8 (2GB) 78-ball BGA packaged devices, eighteen 256Mx8 (4GB) 78-ball BGA packaged devices, thirty-six 512Mx4 (8GB) 78-ball BGA packaged devices and thirty-six 1Gx4 (DDP) (16GB) 78-ball BGA packaged devices. These DIMMs are manufactured using raw cards developed for broad industry use as reference designs. The use of these common design files minimizes electrical variation between suppliers. All NANYA DDR3 SDRAM DIMMs provide a high-performance, flexible 8-byte interface in a 5.25" long space-saving footprint. The DIMM is intended for use in applications operating of 533MHz/667MHz clock speeds and achieves high-speed data transfer rates of 1066Mbps/1333Mbps. Prior to any access operation, the device latency and burst/length/operation type must be programmed into the DIMM by address inputs A0-A14 and I/O inputs BA0~BA2 using the mode register set cycle. The DIMM uses serial presence-detect implemented via a serial EEPROM using a standard IIC protocol. The first 128 bytes of SPD data are programmed and locked during module assembly. The remaining 128 bytes are available for use by the customer. REV 1.1 11/2010 1 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Ordering Information Part Number Speed Register NT2GC72B89B0NJ-CG DDR3-1333 PC3-10600 667MHz (1.5ns @ CL = 9) TI NT2GC72B89B0NK-CG DDR3-1333 PC3-10600 667MHz (1.5ns @ CL = 9) IDT NT4GC72B4PB0NL-CG DDR3-1333 PC3-10600 667MHz (1.5ns @ CL = 9) Inphi NT4GC72B4PB0NJ-CG DDR3-1333 PC3-10600 667MHz (1.5ns @ CL = 9) TI NT4GC72B8PB0NL-CG DDR3-1333 PC3-10600 667MHz (1.5ns @ CL = 9) Inphi NT4GC72B8PB0NJ-CG DDR3-1333 PC3-10600 667MHz (1.5ns @ CL = 9) TI NT8GC72B4NB1NJ-CG DDR3-1333 PC3-10600 667MHz (1.5ns @ CL = 9) TI NT8GC72B4NB1NK-CG DDR3-1333 PC3-10600 667MHz (1.5ns @ CL = 9) IDT NT16TC72B4NB1NL-BE DDR3-1066 PC3-8500 533MHz (1.875ns @ CL = 7) Inphi NT16TC72B4NB1NJ-BE DDR3-1066 PC3-8500 533MHz (1.875ns @ CL = 7) TI NT2GC72C89B0NJ-CG DDR3L-1333 PC3L-10600 667MHz (1.5ns @ CL = 9) TI NT2GC72C89B0NK-CG DDR3L-1333 PC3L-10600 667MHz (1.5ns @ CL = 9) IDT NT4GC72C4PB0NL-CG DDR3L-1333 PC3L-10600 667MHz (1.5ns @ CL = 9) Inphi NT4GC72C4PB0NJ-CG DDR3L-1333 PC3L-10600 667MHz (1.5ns @ CL = 9) TI NT4GC72C8PB0NL-CG DDR3L-1333 PC3L-10600 667MHz (1.5ns @ CL = 9) Inphi NT4GC72C8PB0NJ-CG DDR3L-1333 PC3L-10600 667MHz (1.5ns @ CL = 9) TI NT8GC72C4NB1NJ-CG DDR3L-1333 PC3L-10600 667MHz (1.5ns @ CL = 9) TI NT8GC72C4NB1NK-CG DDR3L-1333 PC3L-10600 667MHz (1.5ns @ CL = 9) IDT Organization Power Leads Note 256Mx72 512Mx72 1.5V 1Gx72 2Gx72 Gold 256Mx72 512Mx72 1.35V 1Gx72 NT16TC72C4NB1NL-BE DDR3L-1066 PC3L-8500 533MHz (1.875ns @ CL = 7) Inphi NT16TC72C4NB1NJ-BE DDR3L-1066 PC3L-8500 533MHz (1.875ns @ CL = 7) TI 2Gx72 REV 1.1 11/2010 2 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Pin Description Pin Name Description Pin Name Description CK0, CK1 Clock Inputs, positive line ODT0, ODT1 , Clock Inputs, negative line DQ0-DQ63 CKE0, CKE1 Active termination control lines Data input/output Clock Enable DQS0-DQS17 Data strobes Row Address Strobe - Data strobes complement Column Address Strobe TDQS9-TDQS17 Termination data strobes Write Enable - Termination data strobes - Chip Selects A0-A9, A11, A13 Address Inputs A10/AP Address Input/Auto-Precharge A12/ Address Input/Burst Chop BA0-BA2 SDRAM Bank Address Inputs DM0-DM8 Data Masks CB0-CB7 ECC Check Bits Temperature event pin Reset pin VREFDQ , VREFCA SCL Serial Presence Detect Clock Input SDA Serial Presence Detect Data input/output Par_In Parity bit for the Address and Control bus Vtt Termination voltage Parity error found on the Address and Control bus VSS Ground No Connect VDD Core and I/O power NC REV 1.1 11/2010 VDDSPD Input/Output Reference SPD and Temp sensor power SA0, SA1, SA2 Serial Presence Detect Address Inputs 3 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM DDR3 SDRAM Pin Assignment Pin Front Pin Back Pin Front Pin Back Pin Front Pin Back Pin Front Pin 1 VREFDQ 121 VSS 31 DQ25 Back 151 VSS 61 A2 181 A1 91 DQ41 211 VSS 62 VDD 182 VDD 92 VSS 212 DM5/DQS14 /TDQS14 2 VSS 122 DQ4 32 VSS 152 DM3/DQS12 /TDQS12 3 DQ0 123 DQ5 33 153 NC/ / 63 NC 183 VDD 93 213 NC/ / 4 DQ1 124 VSS 34 DQS3 154 VSS 64 NC 184 CK0 94 DQS5 214 VSS 5 VSS 125 DM0/DQS9/ TDQS9 35 VSS 155 DQ30 65 VDD 185 95 VSS 215 DQ46 6 126 NC/ / 36 DQ26 156 DQ31 66 VDD 186 VDD 96 DQ42 216 DQ47 7 DQS0 127 VSS 37 DQ27 157 VSS 67 VREFCA 187 97 DQ43 217 VSS 8 VSS 128 DQ6 38 VSS 158 CB4 68 Par_In/NC 188 A0 98 VSS 218 DQ52 9 DQ2 129 DQ7 39 CB0 159 CB5 69 VDD 189 VDD 99 DQ48 219 DQ53 10 DQ3 130 VSS 40 CB1 160 VSS 70 A10/AP 190 BA1 100 DQ49 220 VSS 11 VSS 131 DQ12 41 VSS 161 DM8/DQS17 /TDQS17 71 BA0 191 VDD 101 VSS 221 DM6/DQS15 /TDQS15 12 DQ8 132 DQ13 42 162 NC/ / 72 VDD 192 102 222 NC/ / 13 DQ9 133 VSS 43 DQS8 163 VSS 73 193 103 DQS6 223 VSS 14 VSS 134 DM1/DQS10 /TDQS10 44 VSS 164 CB6 74 194 VDD 104 VSS 224 DQ54 45 CB2 165 CB7 75 VDD 195 ODT0 105 DQ50 225 DQ55 /NC 196 A13 106 DQ51 226 VSS ODT1/NC 197 VDD 107 VSS 227 DQ60 DQ61 15 135 NC/ / 16 DQS1 136 VSS 46 CB3 166 VSS 76 17 VSS 137 DQ14 47 VSS 167 NC 77 18 DQ10 138 DQ15 48 VTT/NC 168 78 VDD 198 /NC 108 DQ56 228 19 DQ11 139 VSS 49 VTT/NC 169 CKE1/NC 79 /NC 199 VSS 109 DQ57 229 VSS 20 VSS 140 DQ20 50 CKE0 170 VDD 80 VSS 200 DQ36 110 VSS 230 DM7/DQS16 /TDQS16 21 DQ16 141 DQ21 51 VDD 171 NC 81 DQ32 201 DQ37 111 231 NC/ / 22 DQ17 142 VSS 52 BA2 172 NC 82 DQ33 202 VSS 112 DQS7 232 VSS 53 /NC 173 VDD 83 VSS 203 DM4/DQS13 /TDQS13 113 VSS 233 DQ62 23 VSS 143 DM2/DQS11 /TDQS11 24 144 NC/ / 54 VDD 174 A12/ 84 204 NC/ / 114 DQ58 234 DQ63 25 DQS2 145 VSS 55 A11 175 A9 85 DQS4 205 VSS 115 DQ59 235 VSS 26 VSS 146 DQ22 56 A7 176 VDD 86 VSS 206 DQ38 116 VSS 236 VDDSPD 27 DQ18 147 DQ23 57 VDD 177 A8 87 DQ34 207 DQ39 117 SA0 237 SA1 28 DQ19 148 VSS 58 A5 178 A6 88 DQ35 208 VSS 118 SCL 238 SDA 29 VSS 149 DQ28 59 A4 179 VDD 89 VSS 209 DQ44 119 SA2 239 VSS 30 DQ24 150 DQ29 60 VDD 180 A3 90 DQ40 210 DQ45 120 VTT 240 VTT Note: 1. CKE1, and ODT1 are for 2GB/4GB/8GB only. 2. and are for 8GB only. 3. TDQS9-TDQS17 and - are for 1GB/2GB only. REV 1.1 11/2010 4 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Input/Output Functional Description Symbol Type Polarity Function CK0, CK1 , Input Cross point The system clock inputs. All address and command lines are sampled on the cross point of the rising edge of CK and falling edge of . A Delay Locked Loop (DLL) circuit is driven from the clock inputs and output timing for read operations is synchronized to the input clock. However, CK1 and are terminated but not used on RDIMMs. CKE0, CKE1 Input Active High Activates the DDR3 SDRAM CK signal when high and deactivates the CK signal when low. By deactivating the clocks, CKE low initiates the Power Down mode or the Self Refresh mode. - Input Active Low Enable the command decoders for the associated rank of SDRAM when low and disables decoders when high. When decoders are disabled, new commands are ignored and previous operations continue. Other combinations of these input signals perform unique functions, including disabling all outputs (except CKE and ODT) of the register(s) on the DIMM or accessing internal control words in the register device(s). For modules with two registers, and operate similarly to and for the second set of register outputs or register control words. , , Input Active Low When sampled at the positive rising edge of CK and falling edge of , signals , , define the operation to be executed by the SDRAM. ODT0, ODT1 Input Active High Asserts on-die termination for DQ, DM, DQS, and signals if enabled via the DDR3 SDRAM mode register. DM0 - DM8 Input Active High The data write masks, associated with one data byte. In Write mode, DM operates as a byte mask by allowing input data to be written if it is low but blocks the write operation if it is high. In Read mode, DM lines have no effect. Cross point The data strobes, associated with one data byte, sourced with data transfers. In Write mode, the data strobe is sourced by the controller and is centered in the data window. In Read mode, the data strobe is sourced by the DDR3 SDRAM and is sent at the leading edge of the data window. signals are complements, and timing is relative to the cross point of respective DQS and . If the module is to be operated in single ended strobe mode, all signals must be tied on the system board to VSS and DDR3 SDRAM mode registers programmed appropriately. DQS0 - DQS17 - I/O TDQS9 - TDQS17 - Output BA0, BA1, BA2 Input TDQS/ is applicable for x8 DRAMs only. When enabled via mode register A11=1 in MR1, DRAM will enable the same termination resistance function on TDQS/ that is applied to DQS/. When disabled via mode register A11=0 in MR1, DM/TDQS will provide the data mask function is not used. X4/x16 DRAMs must disable the TDQS function via mode register A11=0 in MR1. - Selects which DDR3 SDRAM internal bank of four or eight is activated. A0 - A9 A10/AP A11 A12/ A13 Input - During a Bank Activate command cycle, defines the row address when sampled at the cross point of the rising edge of CK and falling edge of . During a Read or Write command cycle, defines the column address when sampled at the cross point of the rising edge of CK and falling edge of . In addition to the column address, AP is used to invoke autoprecharge operation at the end of the burst read or write cycle. If AP is high, autoprecharge is selected and BA0-BAn defines the bank to be precharged. If AP is low, autoprecharge is disabled. During a Precharge command cycle, AP is used in conjunction with BA0-BAn to control which bank(s) to precharge. If AP is high, all banks will be precharged regardless of the state of BA0-BAn inputs. If AP is low, then BA0-BAn are used to define which bank to precharge. DQ0 - DQ63 Input - Data Input/Output pins. CB0 - CB7 I/O - Check bits are used for ECC. VDD, VDDSPD, VSS Supply - Power supplies for core, I/O, Serial Presence Detect, Temp sensor, and ground for the module. VREFDQ, VREFCA Supply - Reference voltage for SSTL15 inputs. SDA I/O - This is a bidirectional pin used to transfer data into or out of the SPD EEPROM and temp sensor. A resistor must be connected from the SDA bus line to VDDSPD on the system planar to act as a pull up. SCL Input - This signal is used to clock data into and out of the SPD EEPROM and Temp sensor. SA0 - SA2 Input - Address pins used to select the Serial Presence Detect and Temp sensor base address. Output - The pin is reserved for use to flag critical module temperature. Input - This signal resets the DDR3 SDRAM. Par_In Input - Parity bit for the Address and Control bus. Output - Parity error detected on the Address and Control bus. A resistor may be connected from bus line to VDD on the system planar to act as a pull up. REV 1.1 11/2010 5 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM DQS3 DM3/DQS12 DQ[31:24] DQS TDQS DQ[7:0] DQS2 DM2/DQS11 DQ[23:16] DQS TDQS DQ[7:0] DQS1 DM1/DQS10 DQ[15:8] DQS TDQS DQ[7:0] DQS0 DM0/DQS9 DQS TDQS DQ[7:0] ZQ D8 DQS4 DM4/DQS13 DQ[39:32] DQS TDQS DQ[7:0] DQS5 DM5/DQS14 DQ[47:40] DQS TDQS DQ[7:0] DQS6 DM6/DQS15 DQ[55:48] DQS TDQS DQ[7:0] DQS7 DM7/DQS16 DQ[63:56] DQS TDQS DQ[7:0] ZQ D4 ZQ D5 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] D3 ZQ ZQ D6 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] D2 ZQ ZQ D7 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] D1 Vtt ZQ VDDSPD VDD VTT VREFCA VREFDQ VSS D0 CK CKE ODT A[14:0] BA[2:0] DQ[7:0] ZQ CK CKE ODT A[14:0] BA[2:0] DQS TDQS DQ[7:0] CK CKE ODT A[14:0] BA[2:0] DQS8 DM8/DQS17 CB[7:0] PCK0A RCKE0B RODT0B A[14:0]B/ BA[2:0]B PCK0A RCKE0A RODT0A A[14:0]A/ BA[2:0]A Functional Block Diagram (Part 1 of 2) [2GB - 1 Rank, 256Mx8 DDR3 SDRAMs] Vtt SPD D0-D8 D0-D8 D0-D8 D0-D8 D0-D8 SPD w/ Integrated Thermal Sensor SCL SA0 SA1 SA2 SCL A0 A1 A2 SDA Notes : 1. DQ-to-I/O wiring is shown as recommended but may be changed. 2. ZQ resistors are 240 1%. For all other resistor values refer to the appropriate wiring diagram. REV 1.1 11/2010 6 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Functional Block Diagram (Part 2 of 2) [2GB - 1 Rank, 256Mx8 DDR3 SDRAMs] : SDRAMs D[3:0], D8 : SDRAMs D[7:4] BA[2:0] A[14:0] CKE0 ODT0 CK0 120 1% Register / PLL RBA[2:0]A BA[2:0]: SDRAMs D[3:0], D8 RBA[2:0]B BA[2:0]: SDRAMs D[7:4] RA[14:0]A A[14:0]: SDRAMs D[3:0], D8 RA[14:0]B A[14:0]: SDRAMs D[7:4] : SDRAMs D[3:0], D8 : SDRAMs D[7:4] : SDRAMs D[3:0], D8 : SDRAMs D[7:4] : SDRAMs D[3:0], D8 : SDRAMs D[7:4] RCKE0A CKE0: SDRAMs D[3:0], D8 RCKE0B CKE0: SDRAMs D[7:4] RODT0A ODT0: SDRAMs D[3:0], D8 RODT0B ODT0: SDRAMs D[7:4] PCK0A CK: SDRAMs D[3:0], D8 PCK0B CK: SDRAMs D[7:4] : SDRAMs D[3:0], D8 : SDRAMs D[7:4] CK1 120 5% PAR_IN : SDRAMs D[8:0] Note: S[3:2], CKE1, ODT1 are NC (Unused register inputs ODT1 and CKE1 have a 330 resistor to ground) REV 1.1 11/2010 7 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM ZQ DQS TDQS DQ[7:0] ZQ DQS7 DM7/DQS16 DQ[63:56] DQS TDQS DQ[7:0] ZQ DQS TDQS DQ[7:0] D11 D10 PCK1B RCKE1B RODT1B CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] DQS TDQS DQ[7:0] ZQ D6 D15 DQS TDQS DQ[7:0] ZQ D7 D16 D9 VDDSPD VDD VTT VREFCA VREFDQ VSS ZQ SPD D0-D17 D0-D17 D0-D17 D0-D17 D0-D17 SPD w/ Integrated Thermal Sensor SCL Notes : 1. DQ-to-I/O wiring is shown as recommended but may be changed. 2. ZQ resistors are 240 1%. For all other resistor values refer to the appropriate wiring diagram. 3. Unless otherwise noted, resistor values are 15 5%. 4. See the wiring diagrams for all resistors associated with the command, address and control bus. 11/2010 D14 Vtt Vtt REV 1.1 PCK0B RCKE0B RODT0B A[14:0]B/ BA[2:0]B PCK1A RCKE1A RODT1A DQS TDQS DQ[7:0] ZQ D5 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] D0 DQS TDQS DQ[7:0] ZQ D13 CK CKE ODT A[14:0] BA[2:0] DQS TDQS DQ[7:0] DQS6 DM6/DQS15 DQ[55:48] CK CKE ODT A[14:0] BA[2:0] DQS0 DM0/DQS9 DQ[7:0] D1 D12 DQS TDQS DQ[7:0] ZQ CK CKE ODT A[14:0] BA[2:0] DQS TDQS DQ[7:0] ZQ DQS TDQS DQ[7:0] ZQ D4 CK CKE ODT A[14:0] BA[2:0] DQS1 DM1/DQS10 DQ[15:8] D2 DQS TDQS DQ[7:0] ZQ DQS TDQS DQ[7:0] ZQ CK CKE ODT A[14:0] BA[2:0] DQS TDQS DQ[7:0] ZQ DQS5 DM5/DQS14 DQ[47:40] CK CKE ODT A[14:0] BA[2:0] DQS2 DM2/DQS11 DQ[23:16] D3 DQS TDQS DQ[7:0] ZQ CK CKE ODT A[14:0] BA[2:0] DQS TDQS DQ[7:0] ZQ D17 DQS4 DM4/DQS13 DQ[39:32] CK CKE ODT A[14:0] BA[2:0] DQS3 DM3/DQS12 DQ[31:24] D8 DQS TDQS DQ[7:0] ZQ CK CKE ODT A[14:0] BA[2:0] DQS TDQS DQ[7:0] ZQ CK CKE ODT A[14:0] BA[2:0] DQS8 DM8/DQS17 CB[7:0] CK CKE ODT A[14:0] BA[2:0] PCK0A RCKE0A RODT0A A[14:0]A/ BA[2:0]A Functional Block Diagram (Part 1 of 2) [4GB - 2 Ranks, 256Mx8 DDR3 SDRAMs] SA0 SA1 SA2 SCL A0 A1 A2 SDA 8 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Functional Block Diagram (Part 2 of 2) [4GB - 2 Ranks, 256Mx8 DDR3 SDRAMs] : SDRAMs D[3:0], D8 : SDRAMs D[7:4] : SDRAMs D[12:9], D17 : SDRAMs D[16:13] BA[2:0] RBA[2:0]A BA[2:0]: SDRAMs D[3:0], D[12:8], D17 RBA[2:0]B BA[2:0]: SDRAMs D[7:4], D[16:13] RA[14:0]A A[14:0]: SDRAMs D[3:0], D[12:8], D17 RA[14:0]B A[14:0]: SDRAMs D[7:4], D[16:13] A[14:0] : SDRAMs D[7:4], D[16:13] : SDRAMs D[3:0], D[12:8], D17 : SDRAMs D[7:4], D[16:13] : SDRAMs D[3:0], D[12:8], D17 : SDRAMs D[7:4], D[16:13] Register / PLL CKE0 CKE1 ODT0 ODT1 CK0 120 1% : SDRAMs D[3:0], D[12:8], D17 RCKE0A CKE0: SDRAMs D[3:0], D8 RCKE0B CKE0: SDRAMs D[7:4] RCKE1A CKE1: SDRAMs D[12:9], D17 RCKE1B CKE1: SDRAMs D[16:13] RODT0A ODT0: SDRAMs D[3:0], D8 RODT0B ODT0: SDRAMs D[7:4] RODT1A ODT1: SDRAMs D[12:9], D17 RODT1B ODT1: SDRAMs D[16:13] PCK0A CK: SDRAMs D[3:0], D8 PCK0B CK: SDRAMs D[7:4] PCK1A CK: SDRAMs D[12:9], D17 PCK1B CK: SDRAMs D[16:13] : SDRAMs D[3:0], D8 : SDRAMs D[7:4] : SDRAMs D[12:9], D17 : SDRAMs D[16:13] CK1 120 5% PAR_IN : SDRAMs D[17:0] REV 1.1 11/2010 9 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM PCK0A RCKE0A RODT0A A[14:0]A BA[2:0]A PCK0A RCKE0A RODT0A A[14:0]A BA[2:0]A Functional Block Diagram (Part 1 of 3) [4GB - 1 Rank, 512Mx4 DDR3 SDRAMs] DQS8 CB[3:0] VSS DQS DQ[4:0] DM ZQ DQS17 CB[7:4] VSS DQS DQ[4:0] DM DQS3 DQ[27:24] VSS DQS DQ[4:0] DM CK CKE ODT A[14:0] BA[2:0] D17 CK CKE ODT A[14:0] BA[2:0] D8 ZQ DQS12 DQ[31:28] VSS DQS DQ[4:0] DM DQS DQ[4:0] DM ZQ CK CKE ODT A[14:0] BA[2:0] D12 CK CKE ODT A[14:0] BA[2:0] D3 DQS2 DQ[19:16] VSS ZQ ZQ DQS11 DQ[23:20] VSS D2 DQS DQ[4:0] DM ZQ DQS1 DQ[11:8] VSS DQS DQ[4:0] DM CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] D11 ZQ DQS10 DQ[15:12] VSS D1 DQS DQ[4:0] DM ZQ DQS0 DQ[3:0] VSS DQS DQ[4:0] DM CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] D10 ZQ DQS9 DQ[7:4] VSS D0 DQS DQ[4:0] DM ZQ CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] D9 Vtt REV 1.1 11/2010 10 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM PCK0B RCKE0B RODT0B A[14:0]B BA[2:0]B PCK0B RCKE0B RODT0B A[14:0]B BA[2:0]B Functional Block Diagram (Part 2 of 3) [4GB - 1 Rank, 512Mx4 DDR3 SDRAMs] DQS4 DQ[35:32] VSS DQS DQ[4:0] DM ZQ DQS13 DQ[39:36] VSS DQS DQ[4:0] DM D13 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] D4 DQS5 DQ[43:40] VSS DQS DQ[4:0] DM ZQ DQS14 DQ[47:44] VSS DQS DQ[4:0] DM D14 CK CKE ODT A[14:0] BA[2:0] DQS DQ[4:0] DM ZQ DQS15 DQ[55:52] VSS DQS DQ[4:0] DM D6 DQS DQ[4:0] DM ZQ D15 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] DQS7 DQ[59:56] VSS ZQ CK CKE ODT A[14:0] BA[2:0] D5 DQS6 DQ[51:48] VSS ZQ ZQ DQS16 DQ[63:60] VSS DQS DQ[4:0] DM ZQ D16 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] D7 Vtt VDDSPD SPD SPD w/ Integrated Thermal Sensor VDD D0-D17 SCL SCL VTT D0-D17 A0 SA0 VREFCA D0-D17 A1 SA1 VREFDQ D0-D17 A2 SA2 VSS D0-D17 Notes : 1. DQ-to-I/O wiring is shown as recommended but may be changed. 2. ZQ resistors are 240 1%. For all other resistor values refer to the appropriate wiring diagram. 3. Unless otherwise noted, resistor values are 15 5%. 4. See the wiring diagrams for all resistors associated with the command, address and control bus. REV 1.1 11/2010 SDA 11 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Functional Block Diagram (Part 3 of 3) [4GB - 1 Rank, 512Mx4 DDR3 SDRAMs] CS0_A: SDRAMs D[3:0], D[12:8], D17 CS0_B: SDRAMs D[7:4], D[16:13] BA[2:0] A[14:0] Register / PLL CKE0 CKE1 ODT0 ODT1 BA[2:0]A BA[2:0]: SDRAMs D[3:0], D[12:8],D17 BA[2:0]B BA[2:0]: SDRAMs D[7:4], D[16:13] A[14:0]A A[14:0]: SDRAMs D[3:0], D[12:8], D17 A[14:0]B A[14:0]: SDRAMs D[7:4], D[16:13] RAS: SDRAMs D[3:0], D[12:8], D17 RAS: SDRAMs D[7:4], D[16:13] CAS: SDRAMs D[3:0], D[12:8], D17 CAS: SDRAMs D[7:4], D[16:13] WE: SDRAMs D[3:0], D[12:8], D17 WE: SDRAMs D[7:4], D[16:13] RCKE0A CKE0: SDRAMs D[3:0], D[12:8], D17 RCKE0B CKE0: SDRAMs D[7:4], D[16:13] RODT0A ODT0: SDRAMs D[3:0], D[12:8], D17 RODT0B ODT0: SDRAMs D[7:4], D[16:13] PCK0A CK: SDRAMs D[3:0], D[12:8], D17 PCK0B CK: SDRAMs D[7:4], D[16:13] CK0 120 1% CK: SDRAMs D[3:0], D[12:8], D17 CK: SDRAMs D[7:4], D[16:13] CK1 120 5% PAR_IN : SDRAMs D[17:0] REV 1.1 11/2010 12 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM DQS DM DQ[3:0] DQS DM DQ[3:0] D9 D27 CK CKE ODT A[14:0] BA[2:0] D18 DQS DM DQ[3:0] D19 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] DQS9 VSS DQ[7:4] PCK1A RCKE1A RODT1A CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] D20 D1 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] 11/2010 DQS DM DQ[3:0] DQS DM DQ[3:0] D28 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] DQS1 VSS DQ[11:8] Vtt REV 1.1 D21 D2 DQS DM DQ[3:0] D0 DQS DM DQ[3:0] DQS DM DQ[3:0] D29 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] DQS2 VSS DQ[19:16] DQS DM DQ[3:0] DQS DM DQ[3:0] D26 D3 DQS DM DQ[3:0] DQS DM DQ[3:0] DQS DM DQ[3:0] D30 D10 DQS0 VSS DQ[3:0] DQS3 VSS DQ[27:24] CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] DQS DM DQ[3:0] DQS DM DQ[3:0] D8 DQS DM DQ[3:0] D11 DQS10 VSS DQ[15:12] PCK0A RCKE0A RODT0A A[14:0]A/ BA[2:0]A D35 D12 DQS11 VSS DQ[23:20] DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] DQS DM DQ[3:0] DQS8 VSS CB[3:0] CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] D17 DQS12 VSS DQ[31:28] PCK1A RCKE1A RODT1A DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] DQS17 VSS CB[7:4] PCK0A RCKE0A RODT0A A[14:0]A/ BA[2:0]A Functional Block Diagram (Part 1 of 3) [8GB - 2 Ranks, 512Mx4 DDR3 SDRAMs] Vtt 13 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] D23 DQS DM DQ[3:0] DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] D33 CK CKE ODT A[14:0] BA[2:0] DQS6 VSS DQ[51:48] PCK1B RCKE1B RODT1B CK CKE ODT A[14:0] BA[2:0] DQS DM DQ[3:0] D15 DQS DM DQ[3:0] D6 D24 CK CKE ODT A[14:0] BA[2:0] D25 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] DQS DM DQ[3:0] D34 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] DQS15 VSS DQ[55:52] DQS DM DQ[3:0] D7 PCK0B RCKE0B RODT0B A[14:0]B/ BA[2:0]B DQS DM DQ[3:0] DQS DM DQ[3:0] D31 D5 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] DQS5 VSS DQ[43:40] D22 D16 DQS7 VSS DQ[59:56] D13 DQS DM DQ[3:0] DQS DM DQ[3:0] DQS DM DQ[3:0] D22 D4 DQS16 VSS DQ[63:60] DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] DQS DM DQ[3:0] DQS13 VSS DQ[39:36] CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] D14 DQS4 VSS DQ[35:32] PCK1B RCKE1B RODT1B DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] DQS14 VSS DQ[47:44] PCK0B RCKE0B RODT0B A[14:0]B/ BA[2:0]B Functional Block Diagram (Part 2 of 3) [8GB - 2 Ranks, 512Mx4 DDR3 SDRAMs] Vtt Vtt VDDSPD VDD VTT VREFCA VREFDQ VSS Notes : 1. DQ-to-I/O wiring is shown as recommended but may be changed. 2. ZQ pins of each SDRAM are connected to individual RZQ resistors (240 1%). 3. See the wiring diagrams for resistor values. SPD D0-D35 D0-D35 D0-D35 D0-D35 D0-D35 SPD w/ Integrated Thermal Sensor SCL SA0 SA1 SA2 SCL A0 A1 A2 SDA REV 1.1 11/2010 14 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Functional Block Diagram (Part 3 of 3) [8GB - 2 Ranks, 512Mx4 DDR3 SDRAMs] BA[2:0] A[14:0] : SDRAMs D[3:0], D[12:8], D17 : SDRAMs D[25:21], D[34:31] : SDRAMs D[21:18]B, D[30:26], D35 : SDRAMs D[7:4], D[16:13] RBA[2:0]A BA[2:0]: SDRAMs D[3:0], D[12:8], D[21:17], D[30:26], D35 RBA[2:0]B BA[2:0]: SDRAMs D[7:4], D[16:13], D[25:22], D[34:31] RA[14:0]A A[14:0]: SDRAMs D[3:0], D[12:8], D[21:17], D[30:26], D35 RA[14:0]B A[14:0]: SDRAMs D[7:4], D[16:13], D[25:22], D[34:31] : SDRAMs D[7:4], D[16:13], D[25:22], D[34:31] : SDRAMs D[3:0], D[12:8], D[21:17], D[30:26], D35 : SDRAMs D[7:4], D[16:13], D[25:22], D[34:31] : SDRAMs D[3:0], D[12:8], D[21:17], D[30:26], D35 : SDRAMs D[7:4], D[16:13], D[25:22], D[34:31] Register / PLL CKE0 CKE1 ODT0 ODT1 CK0 120 1% : SDRAMs D[3:0], D[12:8], D[21:17], D[30:26], D35 RCKE0A CKE0: SDRAMs D[3:0], D[12:8], D17 RCKE0B CKE0: SDRAMs D[25:22], D[34:31] RCKE1A CKE1: SDRAMs D[21:18], D[30:26], D35 RCKE1B CKE1: SDRAMs D[7:4], D[16:13] RODT0A ODT0: SDRAMs D[3:0], D[12:8], D17 RODT0B ODT0: SDRAMs D[7:4], D[34:31] RODT1A ODT1: SDRAMs D[21:18], D[30:26], D35 RODT1B ODT1: SDRAMs D[7:4], D[16:13] PCK0A CK: SDRAMs D[3:0], D[12:8], D17 PCK0B CK: SDRAMs D[25:22], D[34:31] PCK1A CK: SDRAMs D[21:18], D[30:26], D35 PCK1B CK: SDRAMs D[7:4], D[16:13] : SDRAMs D[3:0], D[12:8], D17 : SDRAMs D[25:22], D[34:31] : SDRAMs D[21:18], D[30:26], D35 : SDRAMs D[7:4], D[16:13] CK1 120 5% PAR_IN : SDRAMs D[17:0], D[35:18] REV 1.1 11/2010 15 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM VSS ZQ DQS DM DQ[3:0] ZQ DQS DM DQ[3:0] VSS ZQ DQS DM DQ[3:0] D4 ZQ DQS DM DQ[3:0] VSS D2 ZQ DQS DM DQ[3:0] VSS ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS D47 ZQ DQS DM DQ[3:0] D46 CK CKE ODT A[14:0] BA[2:0] VSS D49 VSS D51 VSS D53 BRCKE1A VDD BPCK0A BRCKE0A BRODT1A BRA[14:0]A /BRBA[2:0]A CK CKE ODT A[14:0] BA[2:0] VSS D0 ZQ DQS DM DQ[3:0] D44 ZQ DQS DM DQ[3:0] D48 CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] D3 D1 ARCKE1A VDD CK CKE ODT A[14:0] BA[2:0] VSS CK CKE ODT A[14:0] BA[2:0] DQS0 VSS DQ[3:0] D6 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] D5 CK CKE ODT A[14:0] BA[2:0] DQS1 VSS DQ[11:8] VSS ZQ DQS DM DQ[3:0] ZQ DQS DM DQ[3:0] D50 CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] VSS D45 CK CKE ODT A[14:0] BA[2:0] VSS D7 ZQ DQS DM DQ[3:0] VSS CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] VSS ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS DQS2 VSS DQ[19:16] D8 CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS DQS3 VSS DQ[27:24] VSS ZQ DQS DM DQ[3:0] D52 CK CKE ODT A[14:0] BA[2:0] D9 ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS DQS8 VSS CB[3:0] APCK0A ARCKE0A ARODT0A ARA[14:0]A /ARBA[2:0]A Functional Block Diagram (Part 1 of 5) [16GB - 4 Ranks, 1Gx4 (DDP) DDR3 SDRAMs] Vtt REV 1.1 11/2010 16 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM CK CKE ODT A[14:0] BA[2:0] VSS CK CKE ODT A[14:0] BA[2:0] VSS CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] ZQ DQS DM DQ[3:0] ZQ DQS DM DQ[3:0] D20 ZQ DQS DM DQ[3:0] VSS ZQ DQS DM DQ[3:0] ZQ DQS DM DQ[3:0] D64 CK CKE ODT A[14:0] BA[2:0] D65 VSS D67 VSS D69 VSS D71 BRCKE1A VDD CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] VSS D18 BPCK1A BRCKE0A BRODT1A BRA[14:0]A /BRBA[2:0]A ARCKE1A VDD D22 CK CKE ODT A[14:0] BA[2:0] D21 D19 VSS CK CKE ODT A[14:0] BA[2:0] D23 ZQ DQS DM DQ[3:0] VSS ZQ DQS DM DQ[3:0] D66 CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] D24 ZQ DQS DM DQ[3:0] D62 ZQ DQS DM DQ[3:0] D68 CK CKE ODT A[14:0] BA[2:0] VSS DQS9 VSS DQ[7:4] VSS ZQ DQS DM DQ[3:0] ZQ DQS DM DQ[3:0] D70 CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] VSS D63 CK CKE ODT A[14:0] BA[2:0] VSS DQS10 VSS DQ[15:12] D25 ZQ DQS DM DQ[3:0] VSS CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] VSS ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS DQS11 VSS DQ[23:20] D26 CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS DQS12 VSS DQ[31:28] VSS CK CKE ODT A[14:0] BA[2:0] D27 ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS DQS17 VSS CB[7:4] APCK1A ARCKE0A ARODT0A ARA[14:0]A /ARBA[2:0]A Functional Block Diagram (Part 2 of 5) [16GB - 4 Ranks, 1Gx4 (DDP) DDR3 SDRAMs] Vtt REV 1.1 11/2010 17 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM CK CKE ODT A[14:0] BA[2:0] VSS ZQ DQS DM DQ[3:0] D14 ZQ DQS DM DQ[3:0] VSS ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS ZQ DQS DM DQ[3:0] D40 CK CKE ODT A[14:0] BA[2:0] D41 VSS D39 VSS D37 BRCKE1B VDD BPCK0B BRCKE0B BRODT1B BRA[14:0]B /BRBA[2:0]B ARCKE1B VDD VSS D16 ZQ DQS DM DQ[3:0] D42 ZQ DQS DM DQ[3:0] D38 CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] D15 CK CKE ODT A[14:0] BA[2:0] D12 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] VSS D17 VSS ZQ DQS DM DQ[3:0] ZQ DQS DM DQ[3:0] D36 CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] D13 ZQ DQS DM DQ[3:0] D43 CK CKE ODT A[14:0] BA[2:0] VSS DQS7 VSS DQ[59:56] VSS VSS CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] D10 ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS DQS6 VSS DQ[51:48] VSS CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] D11 ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS DQS5 VSS DQ[43:40] VSS CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS DQS4 VSS DQ[35:32] APCK0B ARCKE0B ARODT0B ARA[14:0]B /ARBA[2:0]B Functional Block Diagram (Part 3 of 5) [16GB - 4 Ranks, 1Gx4 (DDP) DDR3 SDRAMs] Vtt Functional Block Diagram (Part 4 of 5) [16GB - 4 Ranks, 1Gx4 (DDP) DDR3 SDRAMs] REV 1.1 11/2010 18 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ CK CKE ODT A[14:0] BA[2:0] VSS ZQ DQS DM DQ[3:0] D32 ZQ DQS DM DQ[3:0] VSS ZQ DQS DM DQ[3:0] BRCKE1B VDD BPCK1B BRCKE0B BRODT1B BRA[14:0]B /BRBA[2:0]B CK CKE ODT A[14:0] BA[2:0] ARCKE1B VDD VSS D34 VSS D59 ZQ DQS DM DQ[3:0] D58 CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] D60 VSS D57 ZQ DQS DM DQ[3:0] D56 CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] D33 CK CKE ODT A[14:0] BA[2:0] D30 CK CKE ODT A[14:0] BA[2:0] CK CKE ODT A[14:0] BA[2:0] VSS D35 VSS ZQ DQS DM DQ[3:0] VSS D55 ZQ DQS DM DQ[3:0] D54 CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] D31 ZQ DQS DM DQ[3:0] D61 CK CKE ODT A[14:0] BA[2:0] VSS DQS16 VSS DQ[63:60] VSS VSS CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] D28 ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS DQS15 VSS DQ[55:52] VSS CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] D29 ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS DQS14 VSS DQ[47:44] VSS CK CKE ODT A[14:0] BA[2:0] ZQ DQS DM DQ[3:0] CK CKE ODT A[14:0] BA[2:0] VSS DQS13 VSS DQ[39:36] APCK1B ARCKE0B ARODT0B ARA[14:0]B /ARBA[2:0]B 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Vtt VDDSPD VDD VTT VREFCA VREFDQ VSS Notes : 1. DQ-to-I/O wiring is may be changed within a nibble. 2, Resistor values are 15 5%. 2. ZQ resistors are 240 1%. 3. See the wiring diagrams for resistor values. SPD D0-D71 D0-D71 D0-D71 D0-D71 D0-D71 SPD w/ Integrated Thermal Sensor SCL SA0 SA1 SA2 SCL A0 A1 A2 SDA Functional Block Diagram (Part 5 of 5) [16GB - 4 Ranks, 1Gx4 (DDP) DDR3 SDRAMs] REV 1.1 11/2010 19 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM BA[2:0] A[14:0] CKE0 CKE1 ODT0 CK0 120 1% CK1 Register / PLL A ARBA[2:0]A ARBA[2:0]B ARA[14:0]A ARA[14:0]B ARCKE0A ARCKE0B ARCKE1A ARCKE1B ARODT0A ARODT0B APCK0A APCK0B APCK1A APCK1B : SDRAMs D1, D3, D5, D7, D9, D19, D21, D23, D25, D27 : SDRAMs D11, D13, D15, D17, D29, D31, D33, D35 : SDRAMs D0, D2, D4, D6, D8, D18, D20, D22, D24, D26 : SDRAMs D10, D12, D14, D16, D28, D30, D32, D34 BA[2:0]: SDRAMs D[9:0], D[27:18] BA[2:0]: SDRAMs D[17:10], D[35:28] A[14:0]: SDRAMs D[9:0], D[27:18] A[14:0]: SDRAMs D[17:10], D[35:28] : SDRAMs D[9:0], D[27:18] : SDRAMs D[17:10], D[35:28] : SDRAMs D[9:0], D[27:18] : SDRAMs D[17:10], D[35:28] : SDRAMs D[9:0], D[27:18] : SDRAMs D[17:10], D[35:28] CKE1: SDRAMs D1, D3, D5, D7, D9, D19, D21, D23, D25, D27 CKE1: SDRAMs D11, D13, D15, D17, D29, D31, D33, D35 CKE0: SDRAMs D0, D2, D4, D6, D8, D18, D20, D22, D24, D26 CKE0: SDRAMs D10, D12, D14, D16, D28, D30, D32, D34 ODT1: SDRAMs D1, D3, D5, D7, D9, D19, D21, D23, D25, D27 ODT1: SDRAMs D11, D13, D15, D17, D29, D31, D33, D35 CK: SDRAMs D[9:0] CK: SDRAMs D[17:10] CK: SDRAMs D[27:18] CK: SDRAMs D[35:28] : SDRAMs D[9:0] : SDRAMs D[17:10] : SDRAMs D[27:18] : SDRAMs D[35:28] 120 5% PAR_IN : SDRAMs D[71:0] BA[2:0] A[14:0] CKE0 CKE1 ODT1 CK0 120 1% CK1 Register / PLL B BRBA[2:0]A BRBA[2:0]B BRA[14:0]A BRA[14:0]B BRCKE0A BRCKE0B BRCKE1A BRCKE1B BRODT0A BRODT0B BPCK0A BPCK0B BPCK1A BPCK1B : SDRAMs D45, D47, D49, D51, D53, D63, D65, D67, D69, D71 : SDRAMs D37, D39, D41, D43, D55, D57, D59, D61 : SDRAMs D44, D46, D48, D50, D52, D62, D64, D66, D68, D70 : SDRAMs D36, D38, D40, D42, D54, D56, D58, D60 BA[2:0]: SDRAMs D[53:44], D[71:62] BA[2:0]: SDRAMs D[43:36], D[61:54] A[14:0]: SDRAMs D[53:44], D[71:62] A[14:0]: SDRAMs D[43:36], D[61:54] : SDRAMs D[53:44], D[71:62] : SDRAMs D[43:36], D[61:54] : SDRAMs D[53:44], D[71:62] : SDRAMs D[43:36], D[61:54] : SDRAMs D[53:44], D[71:62] : SDRAMs D[43:36], D[61:54] CKE1: SDRAMs D45, D47, D49, D51, D53, D63, D65, D67, D69, D71 CKE1: SDRAMs D37, D39, D41, D43, D55, D57, D59, D61 CKE0: SDRAMs D44, D46, D48, D50, D52, D62, D64, D66, D68, D70 CKE0: SDRAMs D36, D38, D40, D42, D54, D56, D58, D60 ODT1: SDRAMs D45, D47, D49, D51, D53, D63, D65, D67, D69, D71 ODT1: SDRAMs D37, D39, D41, D43, D55, D57, D59, D61 CK: SDRAMs D[53:44] CK: SDRAMs D[43:36] CK: SDRAMs D[71:62] CK: SDRAMs D[61:54] : SDRAMs D[53:44] : SDRAMs D[43:36] : SDRAMs D[71:62] : SDRAMs D[61:54] 120 5% PAR_IN Serial Presence Detect [ 2GB - 1 Rank, 256Mx8 DDR3 SDRAMs, 1.5V] Byte 0 1 2 REV 1.1 11/2010 Serial PD Data Entry (Hex.) -BE -CG 92 92 10 10 0B 0B Description CRC range, EEPROM bytes, bytes used SPD revision DRAM device type 20 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 60 61 62 63 117 118 119-121 126 127 128-145 146 147 150-175 176-255 Module type (form factor) SDRAM Device density and banks SDRAM device row and column count Module minimum nominal voltage Module ranks and device DQ count ECC tag and module memory Bus width Fine timebase dividend/divisor (in ps) Medium timebase dividend Medium timebase divisor Minimum SDRAM cycle time (tCKmin) Reserved CAS latencies supported CAS latencies supported Minimum CAS latency time (tAAmin) Minimum write recovery time (tWRmin) Minimum -to- delay (tRCDmin) Minimum Row Active to Row Active delay (tRRDmin) Minimum row Precharge delay (tRPmin) Upper nibble for tRAS and tRC Minimum Active-to-Precharge delay (tRASmin) Minimum Active-to-Active/Refresh delay (tRCmin) Minimum refresh recovery delay (tRFCmin) LSB Minimum refresh recovery delay (tRFCmin) MSB Minimum internal Write-to-Read command delay (tWTRmin) Minimum internal Read-to-Precharge command delay (tRTPmin) Minimum four active window delay (tFAWmin) LSB Minimum four active window delay (tFAWmin) MSB SDRAM device output drivers supported SDRAM device thermal and refresh options Module Thermal Sensor SDRAM Device Type Module height (nominal) Module thickness (Max) Raw Card ID reference DRAM address mapping edge connector Module manufacture ID Module manufacture ID Module manufacturer Information CRC CRC Module part number Module die revision Module PCB revision Manufacturer reserved Customer reserved 01 03 19 00 01 0B 52 01 08 0F 00 1C 00 69 78 69 3C 69 11 2C 95 00 05 3C 3C 01 2C 83 05 80 00 0F 11 20 05 83 0B --------- 01 03 19 00 01 0B 52 01 08 0C 00 3C 00 69 78 69 30 69 11 20 89 00 05 3C 3C 00 F0 83 05 80 00 0F 11 20 05 83 0B --------- Note : Byte 65 and 66 are Register vendor code, please refer to as below rule IDT : 80B3, Inphi : 04B3 and TI : 8097 REV 1.1 11/2010 21 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Serial Presence Detect [4GB - 2 Rank, 256Mx8 DDR3 SDRAMs, 1.5V] Byte 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 60 61 62 63 117 118 119-121 126 127 128-145 146 147 150-175 176-255 Description CRC range, EEPROM bytes, bytes used SPD revision DRAM device type Module type (form factor) SDRAM Device density and banks SDRAM device row and column count Module minimum nominal voltage Module ranks and device DQ count ECC tag and module memory Bus width Fine timebase dividend/divisor (in ps) Medium timebase dividend Medium timebase divisor Minimum SDRAM cycle time (tCKmin) Reserved CAS latencies supported CAS latencies supported Minimum CAS latency time (tAAmin) Minimum write recovery time (tWRmin) Minimum -to- delay (tRCDmin) Minimum Row Active to Row Active delay (tRRDmin) Minimum row Precharge delay (tRPmin) Upper nibble for tRAS and tRC Minimum Active-to-Precharge delay (tRASmin) Minimum Active-to-Active/Refresh delay (tRCmin) Minimum refresh recovery delay (tRFCmin) LSB Minimum refresh recovery delay (tRFCmin) MSB Minimum internal Write-to-Read command delay (tWTRmin) Minimum internal Read-to-Precharge command delay (tRTPmin) Minimum four active window delay (tFAWmin) LSB Minimum four active window delay (tFAWmin) MSB SDRAM device output drivers supported SDRAM device thermal and refresh options Module Thermal Sensor SDRAM Device Type Module height (nominal) Module thickness (Max) Raw Card ID reference DRAM address mapping edge connector Module manufacture ID Module manufacture ID Module manufacturer Information CRC CRC Module part number Module die revision Module PCB revision Manufacturer reserved Customer reserved Serial PD Data Entry (Hex.) -BE -CG 92 92 10 10 0B 0B 01 01 03 03 19 19 00 00 09 09 0B 0B 52 52 01 01 08 08 0F 0C 00 00 1C 3C 00 00 69 69 78 78 69 69 3C 30 69 69 11 11 2C 20 95 89 00 00 05 05 3C 3C 3C 3C 01 00 2C F0 83 83 05 05 80 80 00 00 0F 0F 11 11 01 01 05 05 83 83 0B 0B ----------------- Note : Byte 65 and 66 are Register vendor code, please refer to as below rule IDT : 80B3, Inphi : 04B3 and TI : 8097 REV 1.1 11/2010 22 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Serial Presence Detect [4GB - 1 Rank, 512Mx4 DDR3 SDRAMs, 1.5V] Byte 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 60 61 62 63 117 118 119-121 126 127 128-145 146 147 150-175 176-255 Description CRC range, EEPROM bytes, bytes used SPD revision DRAM device type Module type (form factor) SDRAM Device density and banks SDRAM device row and column count Module minimum nominal voltage Module ranks and device DQ count ECC tag and module memory Bus width Fine timebase dividend/divisor (in ps) Medium timebase dividend Medium timebase divisor Minimum SDRAM cycle time (tCKmin) Reserved CAS latencies supported CAS latencies supported Minimum CAS latency time (tAAmin) Minimum write recovery time (tWRmin) Minimum -to- delay (tRCDmin) Minimum Row Active to Row Active delay (tRRDmin) Minimum row Precharge delay (tRPmin) Upper nibble for tRAS and tRC Minimum Active-to-Precharge delay (tRASmin) Minimum Active-to-Active/Refresh delay (tRCmin) Minimum refresh recovery delay (tRFCmin) LSB Minimum refresh recovery delay (tRFCmin) MSB Minimum internal Write-to-Read command delay (tWTRmin) Minimum internal Read-to-Precharge command delay (tRTPmin) Minimum four active window delay (tFAWmin) LSB Minimum four active window delay (tFAWmin) MSB SDRAM device output drivers supported SDRAM device thermal and refresh options Module Thermal Sensor SDRAM Device Type Module height (nominal) Module thickness (Max) Raw Card ID reference DRAM address mapping edge connector Module manufacture ID Module manufacture ID Module manufacturer Information CRC CRC Module part number Module die revision Module PCB revision Manufacturer reserved Customer reserved Serial PD Data Entry (Hex.) -BE -CG 92 92 10 10 0B 0B 01 01 03 03 1A 1A 00 00 00 00 0B 0B 52 52 01 01 08 08 0F 0C 00 00 1C 3C 00 00 69 69 78 78 69 69 3C 30 69 69 11 11 2C 20 95 89 00 00 05 05 3C 3C 3C 3C 01 00 2C F0 83 83 05 05 80 80 00 00 0F 0F 11 11 22 22 05 05 83 83 0B 0B ----------------- Note : Byte 65 and 66 are Register vendor code, please refer to as below rule IDT : 80B3, Inphi : 04B3 and TI : 8097 REV 1.1 11/2010 23 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Serial Presence Detect [8GB - 2 Rank, 512Mx4 DDR3 SDRAMs, 1.5V] Byte 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 60 61 62 63 117 118 119-121 126 127 128-145 146 147 150-175 176-255 Description CRC range, EEPROM bytes, bytes used SPD revision DRAM device type Module type (form factor) SDRAM Device density and banks SDRAM device row and column count Module minimum nominal voltage Module ranks and device DQ count ECC tag and module memory Bus width Fine timebase dividend/divisor (in ps) Medium timebase dividend Medium timebase divisor Minimum SDRAM cycle time (tCKmin) Reserved CAS latencies supported CAS latencies supported Minimum CAS latency time (tAAmin) Minimum write recovery time (tWRmin) Minimum -to- delay (tRCDmin) Minimum Row Active to Row Active delay (tRRDmin) Minimum row Precharge delay (tRPmin) Upper nibble for tRAS and tRC Minimum Active-to-Precharge delay (tRASmin) Minimum Active-to-Active/Refresh delay (tRCmin) Minimum refresh recovery delay (tRFCmin) LSB Minimum refresh recovery delay (tRFCmin) MSB Minimum internal Write-to-Read command delay (tWTRmin) Minimum internal Read-to-Precharge command delay (tRTPmin) Minimum four active window delay (tFAWmin) LSB Minimum four active window delay (tFAWmin) MSB SDRAM device output drivers supported SDRAM device thermal and refresh options Module Thermal Sensor SDRAM Device Type Module height (nominal) Module thickness (Max) Raw Card ID reference DRAM address mapping edge connector Module manufacture ID Module manufacture ID Module manufacturer Information CRC CRC Module part number Module die revision Module PCB revision Manufacturer reserved Customer reserved Serial PD Data Entry (Hex.) -BE -CG 92 92 10 10 0B 0B 01 01 03 03 1A 1A 00 00 08 08 0B 0B 52 52 01 01 08 08 0F 0C 00 00 1C 3C 00 00 69 69 78 78 69 69 3C 30 69 69 11 11 2C 20 95 89 00 00 05 05 3C 3C 3C 3C 01 00 2C F0 83 83 05 05 80 80 00 00 0F 0F 33 33 24 24 09 09 83 83 0B 0B ----------------- Note : Byte 65 and 66 are Register vendor code, please refer to as below rule IDT : 80B3, Inphi : 04B3 and TI : 8097 REV 1.1 11/2010 24 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Serial Presence Detect [16GB - 4 Rank, 1024Mx4 DDR3 SDRAMs, 1.5V] Byte 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 60 61 62 63 117 118 119-121 126 127 128-145 146 147 150-175 176-255 Description CRC range, EEPROM bytes, bytes used SPD revision DRAM device type Module type (form factor) SDRAM Device density and banks SDRAM device row and column count Module minimum nominal voltage Module ranks and device DQ count ECC tag and module memory Bus width Fine timebase dividend/divisor (in ps) Medium timebase dividend Medium timebase divisor Minimum SDRAM cycle time (tCKmin) Reserved CAS latencies supported CAS latencies supported Minimum CAS latency time (tAAmin) Minimum write recovery time (tWRmin) Minimum -to- delay (tRCDmin) Minimum Row Active to Row Active delay (tRRDmin) Minimum row Precharge delay (tRPmin) Upper nibble for tRAS and tRC Minimum Active-to-Precharge delay (tRASmin) Minimum Active-to-Active/Refresh delay (tRCmin) Minimum refresh recovery delay (tRFCmin) LSB Minimum refresh recovery delay (tRFCmin) MSB Minimum internal Write-to-Read command delay (tWTRmin) Minimum internal Read-to-Precharge command delay (tRTPmin) Minimum four active window delay (tFAWmin) LSB Minimum four active window delay (tFAWmin) MSB SDRAM device output drivers supported SDRAM device thermal and refresh options Module Thermal Sensor SDRAM Device Type Module height (nominal) Module thickness (Max) Raw Card ID reference DRAM address mapping edge connector Module manufacture ID Module manufacture ID Module manufacturer Information CRC CRC Module part number Module die revision Module PCB revision Manufacturer reserved Customer reserved Serial PD Data Entry (Hex.) -BE -CG 92 -10 -0B -01 -03 -1A -00 -18 -0B -52 -01 -08 -0F -00 -1C -00 -69 -78 -69 -3C -69 -11 -2C -95 -00 -05 -3C -3C -01 -2C -83 -05 -80 -80 -0F -33 -05 -0A -83 -0B ------------------ Note : Byte 65 and 66 are Register vendor code, please refer to as below rule IDT : 80B3, Inphi : 04B3 and TI : 8097 REV 1.1 11/2010 25 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Serial Presence Detect [2GB - 1 Rank, 256Mx8 DDR3 SDRAMs, 1.35V] Byte 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 60 61 62 63 117 118 119-121 126 127 128-145 146 147 150-175 176-255 Description CRC range, EEPROM bytes, bytes used SPD revision DRAM device type Module type (form factor) SDRAM Device density and banks SDRAM device row and column count Module minimum nominal voltage Module ranks and device DQ count ECC tag and module memory Bus width Fine timebase dividend/divisor (in ps) Medium timebase dividend Medium timebase divisor Minimum SDRAM cycle time (tCKmin) Reserved CAS latencies supported CAS latencies supported Minimum CAS latency time (tAAmin) Minimum write recovery time (tWRmin) Minimum -to- delay (tRCDmin) Minimum Row Active to Row Active delay (tRRDmin) Minimum row Precharge delay (tRPmin) Upper nibble for tRAS and tRC Minimum Active-to-Precharge delay (tRASmin) Minimum Active-to-Active/Refresh delay (tRCmin) Minimum refresh recovery delay (tRFCmin) LSB Minimum refresh recovery delay (tRFCmin) MSB Minimum internal Write-to-Read command delay (tWTRmin) Minimum internal Read-to-Precharge command delay (tRTPmin) Minimum four active window delay (tFAWmin) LSB Minimum four active window delay (tFAWmin) MSB SDRAM device output drivers supported SDRAM device thermal and refresh options Module Thermal Sensor SDRAM Device Type Module height (nominal) Module thickness (Max) Raw Card ID reference DRAM address mapping edge connector Module manufacture ID Module manufacture ID Module manufacturer Information CRC CRC Module part number Module die revision Module PCB revision Manufacturer reserved Customer reserved Serial PD Data Entry (Hex.) -BE -CG 92 92 10 10 0B 0B 01 01 03 03 19 19 02 02 01 01 0B 0B 52 52 01 01 08 08 0F 0C 00 00 1C 3C 00 00 69 69 78 78 69 69 3C 30 69 69 11 11 2C 20 95 89 00 00 05 05 3C 3C 3C 3C 01 00 2C F0 83 83 05 05 80 80 00 00 0F 0F 11 11 20 20 05 05 83 83 0B 0B ----------------- Note : Byte 65 and 66 are Register vendor code, please refer to as below rule IDT : 80B3, Inphi : 04B3 and TI : 8097 REV 1.1 11/2010 26 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Serial Presence Detect [4GB - 2 Rank, 256Mx8 DDR3 SDRAMs, 1.35V] Byte 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 60 61 62 63 117 118 119-121 126 127 128-145 146 147 150-175 176-255 Description CRC range, EEPROM bytes, bytes used SPD revision DRAM device type Module type (form factor) SDRAM Device density and banks SDRAM device row and column count Module minimum nominal voltage Module ranks and device DQ count ECC tag and module memory Bus width Fine timebase dividend/divisor (in ps) Medium timebase dividend Medium timebase divisor Minimum SDRAM cycle time (tCKmin) Reserved CAS latencies supported CAS latencies supported Minimum CAS latency time (tAAmin) Minimum write recovery time (tWRmin) Minimum -to- delay (tRCDmin) Minimum Row Active to Row Active delay (tRRDmin) Minimum row Precharge delay (tRPmin) Upper nibble for tRAS and tRC Minimum Active-to-Precharge delay (tRASmin) Minimum Active-to-Active/Refresh delay (tRCmin) Minimum refresh recovery delay (tRFCmin) LSB Minimum refresh recovery delay (tRFCmin) MSB Minimum internal Write-to-Read command delay (tWTRmin) Minimum internal Read-to-Precharge command delay (tRTPmin) Minimum four active window delay (tFAWmin) LSB Minimum four active window delay (tFAWmin) MSB SDRAM device output drivers supported SDRAM device thermal and refresh options Module Thermal Sensor SDRAM Device Type Module height (nominal) Module thickness (Max) Raw Card ID reference DRAM address mapping edge connector Module manufacture ID Module manufacture ID Module manufacturer Information CRC CRC Module part number Module die revision Module PCB revision Manufacturer reserved Customer reserved Serial PD Data Entry (Hex.) -BE -CG 92 92 10 10 0B 0B 01 01 03 03 19 19 02 02 09 09 0B 0B 52 52 01 01 08 08 0F 0C 00 00 1C 3C 00 00 69 69 78 78 69 69 3C 30 69 69 11 11 2C 20 95 89 00 00 05 05 3C 3C 3C 3C 01 00 2C F0 83 83 05 05 80 80 00 00 0F 0F 11 11 01 01 05 05 83 83 0B 0B ----------------- Note : Byte 65 and 66 are Register vendor code, please refer to as below rule IDT : 80B3, Inphi : 04B3 and TI : 8097 REV 1.1 11/2010 27 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Serial Presence Detect [4GB - 1 Rank, 512Mx4 DDR3 SDRAMs, 1.35V] Byte 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 60 61 62 63 117 118 119-121 126 127 128-145 146 147 150-175 176-255 Description CRC range, EEPROM bytes, bytes used SPD revision DRAM device type Module type (form factor) SDRAM Device density and banks SDRAM device row and column count Module minimum nominal voltage Module ranks and device DQ count ECC tag and module memory Bus width Fine timebase dividend/divisor (in ps) Medium timebase dividend Medium timebase divisor Minimum SDRAM cycle time (tCKmin) Reserved CAS latencies supported CAS latencies supported Minimum CAS latency time (tAAmin) Minimum write recovery time (tWRmin) Minimum -to- delay (tRCDmin) Minimum Row Active to Row Active delay (tRRDmin) Minimum row Precharge delay (tRPmin) Upper nibble for tRAS and tRC Minimum Active-to-Precharge delay (tRASmin) Minimum Active-to-Active/Refresh delay (tRCmin) Minimum refresh recovery delay (tRFCmin) LSB Minimum refresh recovery delay (tRFCmin) MSB Minimum internal Write-to-Read command delay (tWTRmin) Minimum internal Read-to-Precharge command delay (tRTPmin) Minimum four active window delay (tFAWmin) LSB Minimum four active window delay (tFAWmin) MSB SDRAM device output drivers supported SDRAM device thermal and refresh options Module Thermal Sensor SDRAM Device Type Module height (nominal) Module thickness (Max) Raw Card ID reference DRAM address mapping edge connector Module manufacture ID Module manufacture ID Module manufacturer Information CRC CRC Module part number Module die revision Module PCB revision Manufacturer reserved Customer reserved Serial PD Data Entry (Hex.) -BE -CG 92 92 10 10 0B 0B 01 01 03 03 1A 1A 02 02 00 00 0B 0B 52 52 01 01 08 08 0F 0C 00 00 1C 3C 00 00 69 69 78 78 69 69 3C 30 69 69 11 11 2C 20 95 89 00 00 05 05 3C 3C 3C 3C 01 00 2C F0 83 83 05 05 80 80 00 00 0F 0F 11 11 22 22 05 05 83 83 0B 0B ----------------- Note : Byte 65 and 66 are Register vendor code, please refer to as below rule IDT : 80B3, Inphi : 04B3 and TI : 8097 REV 1.1 11/2010 28 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Serial Presence Detect [8GB - 2 Rank, 512Mx4 DDR3 SDRAMs, 1.35V] Byte 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 60 61 62 63 117 118 119-121 126 127 128-145 146 147 150-175 176-255 Description CRC range, EEPROM bytes, bytes used SPD revision DRAM device type Module type (form factor) SDRAM Device density and banks SDRAM device row and column count Module minimum nominal voltage Module ranks and device DQ count ECC tag and module memory Bus width Fine timebase dividend/divisor (in ps) Medium timebase dividend Medium timebase divisor Minimum SDRAM cycle time (tCKmin) Reserved CAS latencies supported CAS latencies supported Minimum CAS latency time (tAAmin) Minimum write recovery time (tWRmin) Minimum -to- delay (tRCDmin) Minimum Row Active to Row Active delay (tRRDmin) Minimum row Precharge delay (tRPmin) Upper nibble for tRAS and tRC Minimum Active-to-Precharge delay (tRASmin) Minimum Active-to-Active/Refresh delay (tRCmin) Minimum refresh recovery delay (tRFCmin) LSB Minimum refresh recovery delay (tRFCmin) MSB Minimum internal Write-to-Read command delay (tWTRmin) Minimum internal Read-to-Precharge command delay (tRTPmin) Minimum four active window delay (tFAWmin) LSB Minimum four active window delay (tFAWmin) MSB SDRAM device output drivers supported SDRAM device thermal and refresh options Module Thermal Sensor SDRAM Device Type Module height (nominal) Module thickness (Max) Raw Card ID reference DRAM address mapping edge connector Module manufacture ID Module manufacture ID Module manufacturer Information CRC CRC Module part number Module die revision Module PCB revision Manufacturer reserved Customer reserved Serial PD Data Entry (Hex.) -BE -CG 92 92 10 10 0B 0B 01 01 03 03 1A 1A 02 02 08 08 0B 0B 52 52 01 01 08 08 0F 0C 00 00 1C 3C 00 00 69 69 78 78 69 69 3C 30 69 69 11 11 2C 20 95 89 00 00 05 05 3C 3C 3C 3C 01 00 2C F0 83 83 05 05 80 80 00 00 0F 0F 33 33 24 24 09 09 83 83 0B 0B ----------------- Note : Byte 65 and 66 are Register vendor code, please refer to as below rule IDT : 80B3, Inphi : 04B3 and TI : 8097 REV 1.1 11/2010 29 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Serial Presence Detect [16GB - 4 Rank, 1024Mx4 DDR3 SDRAMs, 1.35V] Byte 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 60 61 62 63 117 118 119-121 126 127 128-145 146 147 150-175 176-255 Description CRC range, EEPROM bytes, bytes used SPD revision DRAM device type Module type (form factor) SDRAM Device density and banks SDRAM device row and column count Module minimum nominal voltage Module ranks and device DQ count ECC tag and module memory Bus width Fine timebase dividend/divisor (in ps) Medium timebase dividend Medium timebase divisor Minimum SDRAM cycle time (tCKmin) Reserved CAS latencies supported CAS latencies supported Minimum CAS latency time (tAAmin) Minimum write recovery time (tWRmin) Minimum -to- delay (tRCDmin) Minimum Row Active to Row Active delay (tRRDmin) Minimum row Precharge delay (tRPmin) Upper nibble for tRAS and tRC Minimum Active-to-Precharge delay (tRASmin) Minimum Active-to-Active/Refresh delay (tRCmin) Minimum refresh recovery delay (tRFCmin) LSB Minimum refresh recovery delay (tRFCmin) MSB Minimum internal Write-to-Read command delay (tWTRmin) Minimum internal Read-to-Precharge command delay (tRTPmin) Minimum four active window delay (tFAWmin) LSB Minimum four active window delay (tFAWmin) MSB SDRAM device output drivers supported SDRAM device thermal and refresh options Module Thermal Sensor SDRAM Device Type Module height (nominal) Module thickness (Max) Raw Card ID reference DRAM address mapping edge connector Module manufacture ID Module manufacture ID Module manufacturer Information CRC CRC Module part number Module die revision Module PCB revision Manufacturer reserved Customer reserved Serial PD Data Entry (Hex.) -BE -CG 92 -10 -0B -01 -03 -1A -02 -18 -0B -52 -01 -08 -0F -00 -1C -00 -69 -78 -69 -3C -69 -11 -2C -95 -00 -05 -3C -3C -01 -2C -83 -05 -80 -80 -0F -33 -05 -0A -83 -0B ------------------ Note : Byte 65 and 66 are Register vendor code, please refer to as below rule IDT : 80B3, Inphi : 04B3 and TI : 8097 REV 1.1 11/2010 30 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Environmental Requirements Symbol Parameter Rating Units Note TOPR Module Operating Temperature Range (ambient) 0 to 55 C 3 HOPR Operating Humidity (relative) 10 to 90 % 1 TSTG Storage Temperature (Plastic) -55 to 100 C 1 HSTG Storage Humidity (without condensation) 5 to 95 % 1 PBAR Barometric Pressure (operating & storage) 105 to 69 K Pascal 1, 2 Note: 1. Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only and device functional operation at or above the conditions indicated is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. Up to 9850 ft. 3. The component maximum case temperature shall not exceed the value specified in the component spec. Absolute Maximum DC Ratings Symbol VDD VDDQ VIN, VOUT TSTG Parameter Rating Units Note Voltage on VDD pins relative to Vss -0.4 V ~ 1.975 V V 1, 3 Voltage on VDDQ pins relative to Vss -0.4 V ~ 1.975 V V 1, 3 Voltage on I/O pins relative to Vss -0.4 V ~ 1.975 V V 1 -55 to +100 C 1, 2 Storage Temperature Note: 1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability 2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. 3. VDD and VDDQ must be within 300 mV of each other at all times;and VREF must be not greater Operating temperature Conditions Symbol TOPER Parameter Rating Units Note Normal Operating Temperature Range 0 to 85 C 1, 2 Extended Temperature Range (Optional) 85 to 95 C 1, 3 Note: 1. Operating Temperature TOPER is the case surface temperature on the center / top side of the DRAM. 2. The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. During operation, the DRAM case temperature must be maintained between 0 to 85 C under all operating conditions 3. Some applications require operation of the DRAM in the Extended Temperature Range between 85 C and 95 C case temperature. Full specifications are supported in this range, but the following additional conditions apply: a) Refresh commands must be doubled in frequency, therefore reducing the Refresh interval tREFI to 3.9 s. It is also possible to specify a component with 1X refresh (tREFI to 7.8s) in the Extended Temperature Range. Please refer to supplier data sheet and/or the DIMM SPD for option availability. b) If Self-Refresh operation is required in the Extended Temperature Range, then it is mandatory to either use the Manual Self-Refresh mode with Extended Temperature Range capability (MR2 A6 = 0b and MR2 A7 = 1b) or enable the optional Auto Self-Refresh mode (MR2 A6 = 1b and MR2 A7 = 0b). Please refer to the supplier data sheet and/or the DIMM SPD for Auto Self-Refresh option availability, Extended Temperature Range support and tREFI requirements in the Extended Temperature Range. REV 1.1 11/2010 31 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM DC Electrical Characteristics and Operating Conditions Symbol VDD VDDQ VDD VDDQ Parameter Min Type Max Units Notes Supply Voltage 1.425 1.5 1.575 V 1,2 Output Supply Voltage 1.425 1.5 1.575 V 1,2 Supply Voltage 1.25 1.35 1.4175 V DDR3L Output Supply Voltage 1.25 1.35 1.4175 V DDR3L Note: 1. Under all conditions VDDQ must be less than or equal to VDD. 2. VDDQ tracks with VDD. AC parameters are measured with VDD and VDDQ tied together. Single-Ended AC and DC Input Levels for Command and Address Symbol Parameter DDR3-1066 (-BE) Min. DDR3-1333 (-CG) Max. Min. Max. Units Note 1 VIH.CA(DC) DC Input Logic High Vref + 0.100 VDD Vref + 0.100 VDD V VIL.CA(DC) DC Input Logic Low VSS Vref - 0.100 VSS Vref - 0.100 V 1 VIH.CA(AC) AC Input Logic High Vref + 0.175 Note 2 Vref + 0.175 Note 2 V 1, 2 VIL.CA(AC) AC Input Logic Low Note 2 Vref - 0.175 Note 2 Vref - 0.175 V 1, 2 VIH.CA(AC150) AC Input Logic High - - Vref + 0.15 Note 2 V 1, 2 VIL.CA(AC150) AC Input Logic Low - - Note 2 Vref - 0.15 V 1, 2 0.49 x VDD 0.51 x VDD 0.49 x VDD 0.51 x VDD V 3, 4 VRefCA(DC) Reference Voltage for ADD, CMD Inputs Note: 1. For input only pins except . Vref = VrefCA(DC). 2. See "Overshoot and Undershoot Specifications" in the device datasheet. 3. The ac peak noise on VRef may not allow VRef to deviate from VRefDQ(DC) by more than +/-1% VDD (for reference: approx. +/- 15 mV). 4. For reference: approx. VDD/2 +/- 15 mV. Single-Ended AC and DC Input Levels for DQ and DM Symbol Parameter DDR3-1066 (-BE) Min. DDR3-1333 (-CG) Max. Min. Max. Units Note 1 VIH.DQ(DC) DC Input Logic High Vref + 0.100 VDD Vref + 0.100 VDD V VIL.DQ(DC) DC Input Logic Low VSS Vref - 0.100 VSS Vref - 0.100 V 1 VIH.DQ(AC) AC Input Logic High Vref + 0.175 Note 2 Vref + 0.15 Note 2 V 1, 2, 5 VIL.DQ(AC) AC Input Logic Low Note 2 Vref - 0.175 Note 2 Vref - 0.15 V 1, 2, 5 0.49 x VDD 0.51 x VDD 0.49 x VDD 0.51 x VDD V 3, 4 VRefDQ(DC) Reference Voltage for DQ, DM Inputs Note: 1. For input only pins except . Vref = VrefDQ(DC). 2. See "Overshoot and Undershoot Specifications" in the device datasheet. 3. The ac peak noise on VRef may not allow VRef to deviate from VRefDQ(DC) by more than +/-1% VDD (for reference: approx. +/- 15 mV). 4. For reference: approx. VDD/2 +/- 15 mV. 5. Single-ended swing requirement for DQS, DQS# is 350 mV (peak to peak). Differential swing requirement for DQS - DQS# is 700 mV (peak to peak). REV 1.1 11/2010 32 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Operating, Standby, and Refresh Currents TCASE = 0 C ~ 85 C; VDDQ = VDD = 1.5V 0.075V [2GB - 1 Rank, 256Mx8 DDR3 SDRAMs] Symbol IDD0 IDD1 IDD2P1 IDD2Q IDD2N IDD3P IDD3N IDD4R IDD4W IDD5B IDD6 IDD7 Parameter/Condition Operating One Bank Active-Precharge Current Operating One Bank Active-Read-Precharge Current Precharge Power-Down Current Fast Exit Precharge Quiet Standby Current Precharge Standby Current Active Power-Down Current Active Standby Current Operating Burst Read Current Operating Burst Write Current Burst Refresh Current Self Refresh Current: Normal Temperature Range Operating Bank Interleave Read Current PC3-8500 (-BE) 649 816 117 187 205 128 265 1137 1156 1723 94 2914 PC3-10600 (-CG) 697 879 135 214 238 145 265 1370 1378 1733 94 3552 PC3-8500 (-BE) 634 780 103 157 172 111 228 1119 1139 1663 74 2822 PC3-10600 (-CG) 673 836 117 177 193 125 228 1346 1356 1673 74 3406 Unit mA mA mA mA mA mA mA mA mA mA mA mA TCASE = 0 C ~ 85 C; VDDQ = VDD = 1.35V+0.0675/-0.1V [2GB - 1 Rank, 256Mx8 DDR3 SDRAMs] Symbol IDD0 IDD1 IDD2P1 IDD2Q IDD2N IDD3P IDD3N IDD4R IDD4W IDD5B IDD6 IDD7 REV 1.1 11/2010 Parameter/Condition Operating One Bank Active-Precharge Current Operating One Bank Active-Read-Precharge Current Precharge Power-Down Current Fast Exit Precharge Quiet Standby Current Precharge Standby Current Active Power-Down Current Active Standby Current Operating Burst Read Current Operating Burst Write Current Burst Refresh Current Self Refresh Current: Normal Temperature Range Operating Bank Interleave Read Current Unit mA mA mA mA mA mA mA mA mA mA mA mA 33 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM TCASE = 0 C ~ 85 C; VDDQ = VDD = 1.5V 0.075V [4GB - 2 Rank, 256Mx8 DDR3 SDRAMs] Symbol IDD0 IDD1 IDD2P1 IDD2Q IDD2N IDD3P IDD3N IDD4R IDD4W IDD5B IDD6 IDD7 Parameter/Condition Operating One Bank Active-Precharge Current Operating One Bank Active-Read-Precharge Current Precharge Power-Down Current Fast Exit Precharge Quiet Standby Current Precharge Standby Current Active Power-Down Current Active Standby Current Operating Burst Read Current Operating Burst Write Current Burst Refresh Current Self Refresh Current: Normal Temperature Range Operating Bank Interleave Read Current PC3-8500 (-BE) 915 1081 235 375 409 256 531 1402 1422 1988 187 3179 PC3-10600 (-CG) 962 1144 269 428 475 290 531 1635 1643 1998 187 3817 PC3-8500 (-BE) 863 1010 206 314 343 222 457 1348 1368 1893 148 3051 PC3-10600 (-CG) 902 1064 235 354 385 251 457 1575 1585 1901 148 3634 Unit mA mA mA mA mA mA mA mA mA mA mA mA TCASE = 0 C ~ 85 C; VDDQ = VDD = 1.35V+0.0675/-0.1V [4GB - 2 Rank, 256Mx8 DDR3 SDRAMs] Symbol IDD0 IDD1 IDD2P1 IDD2Q IDD2N IDD3P IDD3N IDD4R IDD4W IDD5B IDD6 IDD7 REV 1.1 11/2010 Parameter/Condition Operating One Bank Active-Precharge Current Operating One Bank Active-Read-Precharge Current Precharge Power-Down Current Fast Exit Precharge Quiet Standby Current Precharge Standby Current Active Power-Down Current Active Standby Current Operating Burst Read Current Operating Burst Write Current Burst Refresh Current Self Refresh Current: Normal Temperature Range Operating Bank Interleave Read Current Unit mA mA mA mA mA mA mA mA mA mA mA mA 34 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM TCASE = 0 C ~ 85 C; VDDQ = VDD = 1.5V 0.075V [4GB - 1 Rank, 512Mx4 DDR3 SDRAMs] Symbol IDD0 IDD1 IDD2P1 IDD2Q IDD2N IDD3P IDD3N IDD4R IDD4W IDD5B IDD6 IDD7 Parameter/Condition Operating One Bank Active-Precharge Current Operating One Bank Active-Read-Precharge Current Precharge Power-Down Current Fast Exit Precharge Quiet Standby Current Precharge Standby Current Active Power-Down Current Active Standby Current Operating Burst Read Current Operating Burst Write Current Burst Refresh Current Self Refresh Current: Normal Temperature Range Operating Bank Interleave Read Current PC3-8500 (-BE) 1307 1624 285 428 467 317 491 2202 2154 3366 135 5655 PC3-10600 (-CG) 1402 1734 325 483 523 356 554 2645 2574 3445 135 6930 PC3-8500 (-BE) 1283 1600 285 420 459 309 483 2075 2123 3263 135 5536 PC3-10600 (-CG) 1378 1711 317 475 515 348 546 2487 2534 3334 135 6780 Unit mA mA mA mA mA mA mA mA mA mA mA mA TCASE = 0 C ~ 85 C; VDDQ = VDD = 1.35V+0.0675/-0.1V [4GB - 1 Rank, 512Mx4 DDR3 SDRAMs] Symbol IDD0 IDD1 IDD2P1 IDD2Q IDD2N IDD3P IDD3N IDD4R IDD4W IDD5B IDD6 IDD7 REV 1.1 11/2010 Parameter/Condition Operating One Bank Active-Precharge Current Operating One Bank Active-Read-Precharge Current Precharge Power-Down Current Fast Exit Precharge Quiet Standby Current Precharge Standby Current Active Power-Down Current Active Standby Current Operating Burst Read Current Operating Burst Write Current Burst Refresh Current Self Refresh Current: Normal Temperature Range Operating Bank Interleave Read Current Unit mA mA mA mA mA mA mA mA mA mA mA mA 35 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM TCASE = 0 C ~ 85 C; VDDQ = VDD = 1.5V 0.075V [8GB - 2 Rank, 512Mx4 DDR3 SDRAMs] Symbol IDD0 IDD1 IDD2P1 IDD2Q IDD2N IDD3P IDD3N IDD4R IDD4W IDD5B IDD6 IDD7 Parameter/Condition Operating One Bank Active-Precharge Current Operating One Bank Active-Read-Precharge Current Precharge Power-Down Current Fast Exit Precharge Quiet Standby Current Precharge Standby Current Active Power-Down Current Active Standby Current Operating Burst Read Current Operating Burst Write Current Burst Refresh Current Self Refresh Current: Normal Temperature Range Operating Bank Interleave Read Current PC3-8500 (-BE) 1798 2115 570 855 935 634 982 2693 2645 3857 269 6146 PC3-10600 (-CG) 1956 2289 649 966 1045 713 1109 3200 3128 4000 269 7484 PC3-8500 (-BE) 1766 2083 570 840 919 618 966 2558 2606 3746 269 6019 PC3-10600 (-CG) 1925 2257 634 950 1030 697 1093 3033 3081 3881 269 7326 Unit mA mA mA mA mA mA mA mA mA mA mA mA TCASE = 0 C ~ 85 C; VDDQ = VDD = 1.35V+0.0675/-0.1V [8GB - 2 Rank, 512Mx4 DDR3 SDRAMs] Symbol IDD0 IDD1 IDD2P1 IDD2Q IDD2N IDD3P IDD3N IDD4R IDD4W IDD5B IDD6 IDD7 REV 1.1 11/2010 Parameter/Condition Operating One Bank Active-Precharge Current Operating One Bank Active-Read-Precharge Current Precharge Power-Down Current Fast Exit Precharge Quiet Standby Current Precharge Standby Current Active Power-Down Current Active Standby Current Operating Burst Read Current Operating Burst Write Current Burst Refresh Current Self Refresh Current: Normal Temperature Range Operating Bank Interleave Read Current Unit mA mA mA mA mA mA mA mA mA mA mA mA 36 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM TCASE = 0 C ~ 85 C; VDDQ = VDD = 1.5V 0.075V [16GB - 4 Rank, 1024Mx4 DDR3 SDRAMs] Symbol IDD0 IDD1 IDD2P1 IDD2Q IDD2N IDD3P IDD3N IDD4R IDD4W IDD5B IDD6 IDD7 PC3-8500 (-BE) 2780 3097 1140 1711 1869 1267 1964 3675 3627 4839 539 7128 Parameter/Condition Operating One Bank Active-Precharge Current Operating One Bank Active-Read-Precharge Current Precharge Power-Down Current Fast Exit Precharge Quiet Standby Current Precharge Standby Current Active Power-Down Current Active Standby Current Operating Burst Read Current Operating Burst Write Current Burst Refresh Current Self Refresh Current: Normal Temperature Range Operating Bank Interleave Read Current PC3-10600 (-CG) 3065 3398 1299 1932 2091 1426 2218 4308 4237 5108 539 8593 Unit mA mA mA mA mA mA mA mA mA mA mA mA TCASE = 0 C ~ 85 C; VDDQ = VDD = 1.35V+0.0675/-0.1V [16GB - 4 Rank, 1024Mx4 DDR3 SDRAMs] Symbol IDD0 IDD1 IDD2P1 IDD2Q IDD2N IDD3P IDD3N IDD4R IDD4W IDD5B IDD6 IDD7 REV 1.1 11/2010 PC3-8500 (-BE) 2732 3049 1140 1679 1837 1236 1932 3524 3572 4712 539 6985 Parameter/Condition Operating One Bank Active-Precharge Current Operating One Bank Active-Read-Precharge Current Precharge Power-Down Current Fast Exit Precharge Quiet Standby Current Precharge Standby Current Active Power-Down Current Active Standby Current Operating Burst Read Current Operating Burst Write Current Burst Refresh Current Self Refresh Current: Normal Temperature Range Operating Bank Interleave Read Current PC3-10600 (-CG) 3018 3350 1267 1901 2059 1394 2186 4126 4174 4974 539 8419 Unit mA mA mA mA mA mA mA mA mA mA mA mA 37 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Standard Speed Bins DDR3-1066MHz Speed Bin CL-nRCD-nRP Parameter Internal read command to first data ACT to internal read or write delay time PRE command period ACT to ACT or REF command period ACT to PRE command period CWL=5 CL=5 CWL=6 CWL=5 CL=6 CWL=6 CWL=5 CL=7 CWL=6 CWL=5 CL=8 CWL=6 Supported CL Settings Supported CWL Settings Symbol tAA tRCD tRP tRC tRAS tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) DDR3-1066 7-7-7 (-BE) Min 13.125 13.125 13.125 50.625 37.500 3.000 Reserved 2.500 Reserved Reserved 1.875 Reserved 1.875 6,7,8 5,6 Max 20.000 9*tREFI 3.300 3.300 <2.5 <2.5 8-8-8 (-BF) Min 15.000 15.000 15.000 52.500 37.500 3.000 Reserved 2.500 Reserved Reserved Reserved Reserved 1.875 6,8 5,6 Unit Max. 20.000 9*tREFI 3.300 3.300 <2.5 ns ns ns ns ns ns ns ns ns ns ns ns ns nCK nCK DDR3-1333MHz Speed Bin CL-nRCD-nRP Parameter Symbol DDR3-1333 8-8-8 (-CF) Min Max Internal read command to first data tAA 12.000 20.000 ACT to internal read or write delay time tRCD 12.000 - PRE command period tRP 12.000 - ACT to ACT or REF command period tRC 48.000 - ACT to PRE command period CWL=5 CL=5 CWL=6 CWL=7 CWL=5 CL=6 CWL=6 CWL=7 CWL=5 CL=7 CWL=6 CWL=7 CWL=5 CL=8 CWL=6 CWL=7 CWL=5 CL=9 CWL=6 CWL=7 CWL=5 CL=10 CWL=6 CWL=7 Supported CL Settings Supported CWL Settings *: Optional tRAS tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) 36.000 2.500 Reserved Reserved 2.500 Reserved Reserved Reserved 1.875 Reserved Reserved 1.875 1.500 Reserved Reserved 1.500 Reserved Reserved 1.500* 5,6,7,8,9 5,6,7 9*tREFI 3.300 Reserved Reserved 3.300 Reserved Reserved Reserved <2.5 Reserved Reserved <2.5 <1.875 Reserved Reserved <1.875 Reserved Reserved <1.875* REV 1.1 11/2010 9-9-9 (-CG) Min 13.125 (13.125)5,11 13.125 (13.125)5,11 13.125 (13.125)5,11 49.125 (49.125)5,11 36.000 Reserved Reserved Reserved 2.500 Reserved Reserved Reserved 1.875* Reserved Reserved 1.875 Reserved Reserved Reserved 1.500 Reserved Reserved 1.500* 6,7,8,9 5,6,7 Unit Max 20.000 ns - ns - ns - ns 9*tREFI Reserved Reserved Reserved 3.300 Reserved Reserved Reserved <2.5* Reserved Reserved <2.5 Reserved Reserved Reserved <1.875 Reserved Reserved <1.875* ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns nCK nCK 38 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM AC Timing Specifications for DDR3 SDRAM Devices Used on Module (1066MHz) Parameter DDR3-1066 Symbol Min. Max. 8 - Units Notes Clock Timing Minimum Clock Cycle Time (DLL off mode) tCK (DLL_OFF) Average Clock Period tCK(avg) Average high pulse width tCH(avg) 0.47 0.53 tCK(avg) Average low pulse width tCL(avg) 0.47 0.53 tCK(avg) Refer to "Standard Speed Bins) ns ps Min.: tCK(avg)min + tJIT(per)min Absolute Clock Period tCK(abs) Absolute clock HIGH pulse width tCH(abs) 0.43 - tCK(avg) Absolute clock LOW pulse width tCL(abs) 0.43 - tCK(avg) Clock Period Jitter JIT(per) -90 90 ps Clock Period Jitter during DLL locking period JIT(per, lck) -80 80 ps Cycle to Cycle Period Jitter tJIT(cc) 180 180 ps Cycle to Cycle Period Jitter during DLL locking period JIT(cc, lck) 160 160 ps Duty Cycle Jitter tJIT(duty) - - ps Cumulative error across 2 cycles tERR(2per) -132 132 ps Cumulative error across 3 cycles tERR(3per) -157 157 ps Cumulative error across 4 cycles tERR(4per) -175 175 ps Cumulative error across 5 cycles tERR(5per) -188 188 ps Cumulative error across 6 cycles tERR(6per) -200 200 ps Cumulative error across 7 cycles tERR(7per) -209 209 ps Cumulative error across 8 cycles tERR(8per) -217 217 ps Cumulative error across 9 cycles tERR(9per) -224 224 ps Cumulative error across 10 cycles tERR(10per) -231 231 ps Cumulative error across 11 cycles tERR(11per) -237 237 ps Cumulative error across 12 cycles tERR(12per) -242 242 ps Cumulative error across n = 13, 14 . . . 49, 50 cycles Max.: tCK(avg)max + tJIT(per)max tERR(nper)min = (1 + 0.68ln(n)) * tJIT(per)min tERR(nper) tERR(nper)max = (1 + 0.68ln(n)) * tJIT(per)max ps ps Data Timing DQS, DQS# to DQ skew, per group, per access tDQSQ - 150 DQ output hold time from DQS, DQS# tQH 0.38 - DQ low-impedance time from CK, CK# tLZ(DQ) -600 300 ps DQ high impedance time from CK, CK# tHZ(DQ) - 300 ps Data setup time to DQS, DQS# referenced to Vih(ac) / Vil(ac) levels tDS(base) ps tCK(avg) 25 ps 75 ps 100 ps tDIPW 490 ps DQS,DQS# differential READ Preamble tRPRE 0.9 Note 19 tCK(avg) DQS, DQS# differential READ Postamble tRPST 0.3 Note 11 tCK(avg) DQS, DQS# differential output high time tQSH 0.38 - tCK(avg) DQS, DQS# differential output low time tQSL 0.38 - tCK(avg) DQS, DQS# differential WRITE Preamble tWPRE 0.9 - tCK(avg) DQS, DQS# differential WRITE Postamble tWPST 0.3 - tCK(avg) DQS, DQS# rising edge output access time from rising CK, CK# tDQSCK -300 300 tCK(avg) tLZ(DQS) -600 300 tCK(avg) tHZ(DQS) - 300 tCK(avg) Data setup time to DQS, DQS# referenced to Vih(ac) / Vil(ac) levels Data hold time from DQS, DQS# referenced to Vih(dc) / Vil(dc) levels DQ and DM Input pulse width for each input AC175 tDS(base) AC150 tDH(base) DC100 Data Strobe Timing DQS and DQS# low-impedance time (Referenced from RL - 1) DQS and DQS# high-impedance time (Referenced from RL + BL/2) DQS, DQS# differential input low pulse width tDQSL 0.45 0.55 tCK(avg) DQS, DQS# differential input high pulse width tDQSH 0.45 0.55 tCK(avg) DQS, DQS# rising edge to CK, CK# rising edge tDQSS -0.25 0.25 tCK(avg) DQS, DQS# falling edge setup time to CK, CK# rising edge tDSS 0.2 - tCK(avg) DQS, DQS# falling edge hold time from CK, CK# rising edge tDSH 0.2 - tCK(avg) Command and Address Timing REV 1.1 11/2010 39 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM DLL locking time Internal READ Command to PRECHARGE Command delay Delay from start of internal write transaction to internal read command tDLLK 512 - nCK tRTPmin.: max(4nCK, 7.5ns) tRTP tRTPmax.: tWTRmin.: max(4nCK, 7.5ns) tWTR tWTRmax.: WRITE recovery time tWR 15 - ns Mode Register Set command cycle time tMRD 4 - nCK - nCK Mode Register Set command update delay tMOD ACT to internal read or write delay time tRCD PRE command period tRP ACT to ACT or REF command period tRC CAS# to CAS# command delay tCCD Auto precharge write recovery + precharge time tDAL(min) Multi-Purpose Register Recovery Time tMPRR ACTIVE to PRECHARGE command period tRAS ACTIVE to ACTIVE command period for 1KB page size tRRD tMODmin.: max(12nCK, 15ns) tMODmax.: 4 WR + roundup(tRP / tCK(avg)) nCK 1 - nCK Standard Speed Bins max(4nCK, 7.5ns) - tRRDmin.: max(4nCK, 10ns) ACTIVE to ACTIVE command period for 2KB page size tRRD Four activate window for 1KB page size tFAW 37.5 - ns Four activate window for 2KB page size tFAW 50 - ns tIS(base) 125 - ps tIH(base) 200 - ps 125+150 - ps tIPW 780 - ps Power-up and RESET calibration time tZQinit 512 - nCK Normal operation Full calibration time tZQoper 256 - nCK Normal operation Short calibration time tZQCS 64 - nCK Command and Address setup time to CK, CK# referenced to Vih(ac) / Vil(ac) levels Command and Address hold time from CK, CK# referenced to Vih(dc) / Vil(dc) levels Command and Address setup time to CK, CK# referenced to Vih(ac) / Vil(ac) levels Control and Address Input pulse width for each input tRRDmax.: tIS(base) AC150 Calibration Timing Reset Timing Exit Reset from CKE HIGH to a valid command tXPRmin.: max(5nCK, tRFC(min) + 10ns) tXPR tXPRmax.: - Self Refresh Timings Exit Self Refresh to commands not requiring a locked DLL Exit Self Refresh to commands requiring a locked DLL tXSDLL Minimum CKE low width for Self Refresh entry to exit timing tCKESR Valid Clock Requirement after Self Refresh Entry (SRE) or Power-Down Entry (PDE) Valid Clock Requirement before Self Refresh Exit (SRX) or Power-Down Exit (PDX) or Reset Exit tXSmin.: max(5nCK, tRFC(min) + 10ns) tXS tXSmax.: tXSDLLmin.: tDLLK(min) nCK tXSDLLmax.: tCKESRmin.: tCKE(min) + 1 nCK tCKESRmax.: tCKSREmin.: max(5 nCK, 10 ns) tCKSRE tCKSREmax.: tCKSRXmin.: max(5 nCK, 10 ns) tCKSRX tCKSRXmax.: - Power Down Timings Exit Power Down with DLL on to any valid command; Exit Precharge Power Down with DLL frozen to commands tXPmin.: max(3nCK, 7.5ns) tXP tXPmax.: - not requiring a locked DLL Exit Precharge Power Down with DLL frozen to commands requiring a locked DLL CKE minimum pulse width tCPDED Power Down Entry to Exit Timing tPD Timing of ACT command to Power Down entry tACTPDEN Timing of PRE or PREA command to Power Down entry tPRPDEN Timing of RD/RDA command to Power Down entry tRDPDEN 11/2010 tXPDLLmax.: tCKEmin.: max(3nCK 5.625ns) tCKE Command pass disable delay REV 1.1 tXPDLLmin.: max(10nCK, 24ns) tXPDLL tCKEmax.: tCPDEDmin.: 1 tCPDEDmin.: - nCK tPDmin.: tCKE(min) tPDmax.: 9*tREFI tACTPDENmin.: 1 tACTPDENmax.: tPRPDENmin.: 1 tPRPDENmax.: tRDPDENmin.: RL+4+1 nCK nCK nCK 40 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM tRDPDENmax.: Timing of WR command to Power Down entry (BL8OTF, BL8MRS, BC4OTF) Timing of WRA command to Power Down entry (BL8OTF, BL8MRS, BC4OTF) Timing of WR command to Power Down entry (BC4MRS) Timing of WRA command to Power Down entry (BC4MRS) tWRPDENmin.: WL + 4 + (tWR / tCK(avg)) tWRPDEN tWRPDENmax.: tWRAPDENmin.: WL+4+WR+1 tWRAPDEN tWRPDEN Timing of REF command to Power Down entry tREFPDEN Timing of MRS command to Power Down entry tMRSPDEN nCK tWRAPDENmax.: tWRPDENmin.: WL + 2 + (tWR / tCK(avg))tWRPDENmax.: tWRAPDENmin.: WL + 2 +WR + 1 tWRAPDEN nCK tWRAPDENmax.: tREFPDENmin.: 1 nCK nCK nCK tREFPDENmax.: tMRSPDENmin.: tMOD(min) tMRSPDENmax.: - ODT Timings ODT high time without write command or with write command and BC4 ODT high time with Write command and BL8 Asynchronous RTT turn-on delay ODTH4min.: 4 ODTH4 nCK ODTH4max.: ODTH8min.: 6 ODTH8 nCK ODTH8max.: - tAONPD 2 8.5 ns tAOFPD 2 8.5 ns tAON -300 300 ps tAOF 0.3 0.7 tCK(avg) tADC 0.3 0.7 tCK(avg) tWLMRD 40 - nCK tWLDQSEN 25 - nCK tWLS 245 - ps tWLH 245 - ps Write leveling output delay tWLO 0 9 ns Write leveling output error tWLOE 0 2 ns (Power-Down with DLL frozen) Asynchronous RTT turn-off delay (Power-Down with DLL frozen) RTT turn-on RTT_Nom and RTT_WR turn-off time from ODTLoff reference RTT dynamic change skew Write Leveling Timings First DQS/DQS# rising edge after write leveling mode is programmed DQS/DQS# delay after write leveling mode is programmed Write leveling setup time from rising CK, CK# crossing to rising DQS, DQS# crossing Write leveling hold time from rising DQS, DQS# crossing to rising CK, CK# crossing REV 1.1 11/2010 41 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM AC Timing Specifications for DDR3 SDRAM Devices Used on Module (1333MHz) Parameter DDR3-1333 Symbol Min. Max. 8 - Units Notes Clock Timing Minimum Clock Cycle Time (DLL off mode) tCK (DLL_OFF) Average Clock Period tCK(avg) Average high pulse width tCH(avg) 0.47 0.53 tCK(avg) Average low pulse width tCL(avg) 0.47 0.53 tCK(avg) Refer to "Standard Speed Bins) ns ps Min.: tCK(avg)min + tJIT(per)min Absolute Clock Period tCK(abs) Absolute clock HIGH pulse width tCH(abs) 0.43 - tCK(avg) Absolute clock LOW pulse width tCL(abs) 0.43 - tCK(avg) Clock Period Jitter JIT(per) -80 80 ps Clock Period Jitter during DLL locking period JIT(per, lck) -70 70 ps Cycle to Cycle Period Jitter tJIT(cc) 160 160 ps Cycle to Cycle Period Jitter during DLL locking period JIT(cc, lck) 140 140 ps Duty Cycle Jitter tJIT(duty) - - ps Cumulative error across 2 cycles tERR(2per) -118 118 ps Cumulative error across 3 cycles tERR(3per) -140 140 ps Cumulative error across 4 cycles tERR(4per) -155 155 ps Cumulative error across 5 cycles tERR(5per) -168 168 ps Cumulative error across 6 cycles tERR(6per) -177 177 ps Cumulative error across 7 cycles tERR(7per) -186 186 ps Cumulative error across 8 cycles tERR(8per) -193 193 ps Cumulative error across 9 cycles tERR(9per) -200 200 ps Cumulative error across 10 cycles tERR(10per) -205 205 ps Cumulative error across 11 cycles tERR(11per) -210 210 ps Cumulative error across 12 cycles tERR(12per) -215 215 ps Cumulative error across n = 13, 14 . . . 49, 50 cycles Max.: tCK(avg)max + tJIT(per)max tERR(nper)min = (1 + 0.68ln(n)) * tJIT(per)min tERR(nper) tERR(nper)max = (1 + 0.68ln(n)) * tJIT(per)max ps ps Data Timing DQS, DQS# to DQ skew, per group, per access tDQSQ - 125 DQ output hold time from DQS, DQS# tQH 0.38 - DQ low-impedance time from CK, CK# tLZ(DQ) -500 250 ps DQ high impedance time from CK, CK# tHZ(DQ) - 250 ps Data setup time to DQS, DQS# referenced to Vih(ac) / Vil(ac) levels Data setup time to DQS, DQS# referenced to Vih(ac) / Vil(ac) levels Data hold time from DQS, DQS# referenced to Vih(dc) / Vil(dc) levels DQ and DM Input pulse width for each input tDS(base) AC175 tDS(base) AC150 tDH(base) DC100 ps tCK(avg) - ps 30 ps 65 ps tDIPW 400 - ps DQS,DQS# differential READ Preamble tRPRE 0.9 Note 19 tCK(avg) DQS, DQS# differential READ Postamble tRPST 0.3 Note 11 tCK(avg) DQS, DQS# differential output high time tQSH 0.4 - tCK(avg) DQS, DQS# differential output low time tQSL 0.4 - tCK(avg) DQS, DQS# differential WRITE Preamble tWPRE 0.9 - tCK(avg) DQS, DQS# differential WRITE Postamble tWPST 0.3 - tCK(avg) DQS, DQS# rising edge output access time from rising CK, CK# tDQSCK -255 255 tCK(avg) tLZ(DQS) -500 250 tCK(avg) tHZ(DQS) - 250 tCK(avg) Data Strobe Timing DQS and DQS# low-impedance time (Referenced from RL - 1) DQS and DQS# high-impedance time (Referenced from RL + BL/2) DQS, DQS# differential input low pulse width tDQSL 0.45 0.55 tCK(avg) DQS, DQS# differential input high pulse width tDQSH 0.45 0.55 tCK(avg) DQS, DQS# rising edge to CK, CK# rising edge tDQSS -0.25 0.25 tCK(avg) DQS, DQS# falling edge setup time to CK, CK# rising edge tDSS 0.2 - tCK(avg) DQS, DQS# falling edge hold time from CK, CK# rising edge tDSH 0.2 - tCK(avg) Command and Address Timing REV 1.1 11/2010 42 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM DLL locking time Internal READ Command to PRECHARGE Command delay Delay from start of internal write transaction to internal read command tDLLK 512 - nCK tRTPmin.: max(4nCK, 7.5ns) tRTP tRTPmax.: tWTRmin.: max(4nCK, 7.5ns) tWTR tWTRmax.: WRITE recovery time tWR 15 - ns Mode Register Set command cycle time tMRD 4 - nCK Mode Register Set command update delay tMOD ACT to internal read or write delay time tRCD PRE command period tRP ACT to ACT or REF command period tRC CAS# to CAS# command delay tCCD Auto precharge write recovery + precharge time tDAL(min) Multi-Purpose Register Recovery Time tMPRR ACTIVE to PRECHARGE command period tRAS ACTIVE to ACTIVE command period for 1KB page size tRRD tMODmin.: max(12nCK, 15ns) tMODmax.: 4 nCK WR + roundup(tRP / tCK(avg)) nCK 1 - nCK Standard Speed Bins tRRDmin.: max(4nCK, 6ns) tRRDmax.: tRRDmin.: max(4nCK, 7.5ns) ACTIVE to ACTIVE command period for 2KB page size tRRD Four activate window for 1KB page size tFAW 30 0 ns Four activate window for 2KB page size tFAW 45 0 ns tIS(base) 65 - ps tIH(base) 140 - ps 65+125 - ps tIPW 620 - ps Power-up and RESET calibration time tZQinit 512 - nCK Normal operation Full calibration time tZQoper 256 - nCK Normal operation Short calibration time tZQCS 64 - nCK Command and Address setup time to CK, CK# referenced to Vih(ac) / Vil(ac) levels Command and Address hold time from CK, CK# referenced to Vih(dc) / Vil(dc) levels Command and Address setup time to CK, CK# referenced to Vih(ac) / Vil(ac) levels Control and Address Input pulse width for each input tRRDmax.: tIS(base) AC150 Calibration Timing Reset Timing Exit Reset from CKE HIGH to a valid command tXPRmin.: max(5nCK, tRFC(min) + 10ns) tXPR tXPRmax.: - Self Refresh Timings Exit Self Refresh to commands not requiring a locked DLL Exit Self Refresh to commands requiring a locked DLL tXSDLL Minimum CKE low width for Self Refresh entry to exit timing tCKESR Valid Clock Requirement after Self Refresh Entry (SRE) or Power-Down Entry (PDE) Valid Clock Requirement before Self Refresh Exit (SRX) or Power-Down Exit (PDX) or Reset Exit tXSmin.: max(5nCK, tRFC(min) + 10ns) tXS tXSmax.: tXSDLLmin.: tDLLK(min) nCK tXSDLLmax.: tCKESRmin.: tCKE(min) + 1 nCK tCKESRmax.: tCKSREmin.: max(5 nCK, 10 ns) tCKSRE tCKSREmax.: tCKSRXmin.: max(5 nCK, 10 ns) tCKSRX tCKSRXmax.: - Power Down Timings Exit Power Down with DLL on to any valid command; tXPmin.: max(3nCK, 6ns) Exit Precharge Power Down with DLL frozen to commands tXP tXPmax.: - not requiring a locked DLL Exit Precharge Power Down with DLL frozen to commands requiring a locked DLL CKE minimum pulse width tCKE Command pass disable delay tCPDED Power Down Entry to Exit Timing tPD Timing of ACT command to Power Down entry tACTPDEN Timing of PRE or PREA command to Power Down entry tPRPDEN REV 1.1 11/2010 tXPDLLmin.: max(10nCK, 24ns) tXPDLL tXPDLLmax.: tCKEmin.: max(3nCK ,5.625ns) tCKEmax.: tCPDEDmin.: 1 tCPDEDmin.: - nCK tPDmin.: tCKE(min) tPDmax.: 9*tREFI tACTPDENmin.: 1 tACTPDENmax.: tPRPDENmin.: 1 tPRPDENmax.: - nCK nCK 43 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Timing of RD/RDA command to Power Down entry Timing of WR command to Power Down entry (BL8OTF, BL8MRS, BC4OTF) Timing of WRA command to Power Down entry (BL8OTF, BL8MRS, BC4OTF) Timing of WR command to Power Down entry (BC4MRS) Timing of WRA command to Power Down entry (BC4MRS) tRDPDENmin.: RL+4+1 tRDPDEN tWRPDENmin.: WL + 4 + (tWR / tCK(avg)) tWRPDEN tWRPDENmax.: tWRAPDENmin.: WL+4+WR+1 tWRAPDEN tWRPDEN tREFPDEN Timing of MRS command to Power Down entry tMRSPDEN nCK nCK tWRAPDENmax.: tWRPDENmin.: WL + 2 + (tWR / tCK(avg))tWRPDENmax.: tWRAPDENmin.: WL + 2 +WR + 1 tWRAPDEN Timing of REF command to Power Down entry nCK tRDPDENmax.: - tWRAPDENmax.: tREFPDENmin.: 1 nCK nCK nCK tREFPDENmax.: tMRSPDENmin.: tMOD(min) tMRSPDENmax.: - ODT Timings ODT high time without write command or with write command and BC4 ODT high time with Write command and BL8 Asynchronous RTT turn-on delay ODTH4min.: 4 ODTH4 nCK ODTH4max.: ODTH8min.: 6 ODTH8 nCK ODTH8max.: - tAONPD 2 8.5 ns tAOFPD 2 8.5 ns tAON -250 250 ps tAOF 0.3 0.7 tCK(avg) tADC 0.3 0.7 tCK(avg) tWLMRD 40 - nCK tWLDQSEN 25 - nCK tWLS 195 - ps tWLH 195 - ps Write leveling output delay tWLO 0 9 ns Write leveling output error tWLOE 0 2 ns (Power-Down with DLL frozen) Asynchronous RTT turn-off delay (Power-Down with DLL frozen) RTT turn-on RTT_Nom and RTT_WR turn-off time from ODTLoff reference RTT dynamic change skew Write Leveling Timings First DQS/DQS# rising edge after write leveling mode is programmed DQS/DQS# delay after write leveling mode is programmed Write leveling setup time from rising CK, CK# crossing to rising DQS, DQS# crossing Write leveling hold time from rising DQS, DQS# crossing to rising CK, CK# crossing REV 1.1 11/2010 44 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Package Dimensions [2GB - 1 Rank, 256Mx8 DDR3 SDRAMs] FRONT 133.35 +/- 0.15 3.0 (x4) Registering Clock Driver 9.50 17.30 SPD/TS 4.00 Max. Detail B Detail A 5.175 30.00 +0.5/-0.15 SIDE 47.00 71.00 5.00 1.27 +0.07/-0.10 BACK 2.50 Detail B 4.00 3.80 Detail A 0.80 +/- 0.05 1.00 Pitch 1.50 +/- 0.10 Units: Millimeters Note: Device position and scale are only for reference. REV 1.1 11/2010 45 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Package Dimensions [4GB - 2 Ranks, 256Mx8 DDR3 SDRAMs] FRONT 133.35 +/- 0.15 3.0 (x4) Registering Clock Driver 9.50 17.30 SPD/TS 4.00 Max. Detail B Detail A 5.175 30.00 +0.5/-0.15 SIDE 47.00 71.00 5.00 1.27 +0.07/-0.10 BACK 2.50 Detail B 4.00 3.80 Detail A 0.80 +/- 0.05 1.00 Pitch 1.50 +/- 0.10 Units: Millimeters Note: Device position and scale are only for reference. REV 1.1 11/2010 46 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Package Dimensions [4GB - 1 Rank, 512Mx4 DDR3 SDRAMs] FRONT 133.35 +/- 0.15 3.0 (x4) Registering Clock Driver 9.50 17.30 SPD/TS 4.00 Max. Detail B Detail A 5.175 30.00 +0.5/-0.15 SIDE 47.00 71.00 5.00 1.27 +0.07/-0.10 BACK 2.50 Detail B 4.00 3.80 Detail A 0.80 +/- 0.05 1.00 Pitch 1.50 +/- 0.10 Units: Millimeters Note: Device position and scale are only for reference. REV 1.1 11/2010 47 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Package Dimensions [8GB - 2 Ranks, 512Mx4 DDR3 SDRAMs] FRONT 133.75 +/- 0.25 Max 8.5 Detail B Detail A 5.175 30.60 +/- 0.15 17.30 9.50 3.0 (x4) SIDE 47.00 71.00 5.00 1.27 +0.07/-0.10 REAR 2.50 Detail B 4.00 3.80 Detail A 0.80 +/- 0.05 1.00 Pitch 1.50 +/- 0.10 Units: Millimeters Note: Device position and scale are only for reference. REV 1.1 11/2010 48 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Package Dimensions [16GB - 4 Ranks, 1Gx4 (DDP) DDR3 SDRAMs] FRONT 133.75 +/- 0.25 Max 8.5 Detail B Detail A 5.175 30.60 +/- 0.15 17.30 9.50 3.0 (x4) SIDE 47.00 71.00 5.00 1.27 +0.07/-0.10 REAR 2.50 Detail B 4.00 3.80 Detail A 0.80 +/- 0.05 1.00 Pitch 1.50 +/- 0.10 Units: Millimeters Note: Device position and scale are only for reference. REV 1.1 11/2010 49 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice. NT2GC72B89B0NJ/NT2GC72C89B0NJ/NT2GC72B89B0NK/NT2GC72C89B0NK/NT4GC72B4PB0NL/NT4GC72C4PB0NL/NT4GC72B8PB0NL NT4GC72C8PB0NL/NT4GC72B4PB0NJ/NT4GC72C4PB0NJ/NT4GC72B8PB0NJ/NT4GC72C8PB0NJ/NT8GC72B4NB1NJ/NT8GC72C4NB1NJ NT8GC72B4NB1NK/NT8GC72C4NB1NK/NT16TC72B4NB1NL/NT16TC72C4NB1NL/NT16TC72B4NB1NJ/NT16TC72C4NB1NJ 2GB: 256M x 72 / 4GB: 512M x 72 / 8GB: 1G x 72 / 16GB: 2G x 72 PC3-8500 / PC3-10600 Registered DDR3 SDRAM DIMM Revision Log Rev Date 0.1 02/2010 Preliminary Release Modification 0.5 05/2010 Preliminary Release 2 1.0 08/2010 Official Release 1.1 11/2010 Added 1.35V Spec. and modify Functional Block Diagram of 1Rx4. Nanya Technology Corporation Hwa Ya Technology Park 669 Fu Hsing 3rd Rd., Kueishan, Taoyuan, 333, Taiwan, R.O.C. Tel: +886-3-328-1688 Please visit our home page for more information: www.nanya.com Printed in Taiwan (c) 2010 REV 1.1 11/2010 50 (c) NANYA TECHNOLOGY CORPORATION NANYA reserves the right to change products and specifications without notice.