2007-04-20
BFP183W
1
12
3
4
NPN Silicon RF Transistor*
• For low noise, high-gain broadband amplifiers at
collector currents from 2 mA to 30 mA
• fT = 8 GHz, F = 0.9 dB at 900 MHz
• Pb-free (RoHS compliant) package1)
• Qualified according AEC Q101
* Short term description
ESD (Electrostatic discharge) sensitive device, observe handling precaution!
Type Marking Pin Configuration Package
BFP183W RHs 1=E 2=C 3=E 4=B - - SOT343
Maximum Ratings
Parameter Symbol Value Unit
Collector-emitter voltage VCEO 12 V
Collector-emitter voltage VCES 20
Collector-base voltage VCBO 20
Emitter-base voltage VEBO 2
Collector current IC65 mA
Base current IB5
Total power dissipation2)
TS ≤ 58 °C Ptot 450 mW
Junction temperature T
j
150 °C
Ambient temperature T
A
-65 ... 150
Storage temperature Tst
g
-65 ... 150
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point3) RthJS ≤ 205 K/W
1Pb-containing package may be available upon special request
2TS is measured on the collector lead at the soldering point to the pcb
3For calculation of RthJA please refer to Application Note Thermal Resistance
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Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Collector-emitter breakdown voltage
IC = 1 mA, IB = 0 V(BR)CEO 12 - - V
Collector-emitter cutoff current
VCE = 20 V, VBE = 0 ICES - - 100 µA
Collector-base cutoff current
VCB = 10 V, IE = 0 ICBO - - 100 nA
Emitter-base cutoff current
VEB = 1 V, IC = 0 IEBO - - 1 µA
DC current gain-
IC = 15 mA, VCE = 8 V, pulse measured hFE 70 100 140 -
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Electrical Characteristics at T
A
= 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
AC Characteristics (verified by random sampling)
Transition frequency
IC = 25 mA, VCE = 8 V, f = 500 MHz fT6 8 - GHz
Collector-base capacitance
VCB = 10 V, f = 1 MHz, VBE = 0 ,
emitter grounded
Ccb - 0.34 0.54 pF
Collector emitter capacitance
VCE = 10 V, f = 1 MHz, VBE = 0 ,
base grounded
Cce - 0.27 -
Emitter-base capacitance
VEB = 0.5 V, f = 1 MHz, VCB = 0 ,
collector grounded
Ceb - 1.1 -
Noise figure
IC = 5 mA, VCE = 8 V, ZS = ZSopt,
f = 900 MHz
f = 1.8 GHz
F
-
-
0.9
1.4
-
-
dB
Power gain, maximum stable1)
IC = 15 mA, VCE = 8 V, ZS = ZSopt, ZL = ZLopt ,
f = 900 MHz
Gms - 22 - dB
Power gain, maximum available1)
IC = 15 mA, VCE = 8 V, ZS = ZSopt, ZL = ZLopt ,
f = 1.8 GHz
Gma - 15.5 - dB
Transducer gain
IC = 15 mA, VCE = 8 V, ZS = ZL = 50 Ω,
f = 900 MHz
f = 1.8 MHz
|S21e|2
-
-
17.5
11.5
-
-
dB
1Gma = |S21e / S12e| (k-(k²-1)1/2), Gms = |S21 / S12|
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SPICE Parameter (Gummel-Poon Model, Berkley-SPICE 2G.6 Syntax):
Transistor Chip Data:
IS = 1.0345 fA
VAF = 14.772 V
NE = 1.2149 -
VAR = 3.4276 V
NC = 0.85331 -
RBM = 1.0112 Ω
CJE = 23.077 fF
TF = 22.746 ps
ITF = 1.8773 mA
VJC = 1.1967 V
TR = 1.0553 ns
MJS = 0-
XTI = 3-
BF = 115.98 -
IKF = 0.14562 A
BR = 10.016 -
IKR = 0.013483 A
RB = 2.5426 Ω
RE = 1.3435 -
VJE = 1.0792 V
XTF = 0.36823 -
PTF = 0 deg
MJC = 0.3 -
CJS = 0 fF
XTB = 0 -
FC = 0.54852
NF = 0.80799 -
ISE = 16.818 fA
NR = 0.99543 -
ISC = 1.3559 fA
IRB = 0.43801 mA
RC = 0.20486 Ω
MJE = 0.45354 -
VTF = 0.50905 V
CJC = 460.11 fF
XCJC = 0.053823 -
VJS = 0.75 V
EG = 1.11 eV
TNOM 300 K
All parameters are ready to use, no scalling is necessary. Extracted on behalf of Infineon Technologies AG by:
Institut für Mobil- und Satellitentechnik (IMST)
Package Equivalent Circuit: LBI = 0.43 nH
LBO = 0.47 nH
LEI = 0.26 nH
LEO = 0.12 nH
LCI = 0.06 nH
LCO = 0.36 nH
CBE = 68 fF
CCB =46 fF
C
C
E = 232 fF
Valid up to 6GHz
For examples and ready to use parameters
please contact your local Infineon Technologies
distributor or sales office to obtain a Infineon
Technologies CD-ROM or see Internet:
http://www.infineon.com
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Total power dissipation Ptot = ƒ(TS)
0 20 40 60 80 100 120 °C 150
TS
0
50
100
150
200
250
300
350
400
mW
500
Ptot
Permissible Pulse Load RthJS = ƒ(tp)
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
1
10
2
10
3
10
K/W
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
-
Ptotmax/PtotDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
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Package SOT343
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
2005, June
Date code (YM)
BGA420
Type code
0.2
4
2.15
8
2.3
1.1
Pin 1
0.6
0.8
1.6
1.15
0.9
1.25
±0.1
0.1 MAX.
2.1
±0.1
0.15 +0.1
-0.05
0.3+0.1
2±0.2 ±0.1
0.9
12
34 A
+0.1
0.6 A
M
0.2
1.3
-0.05
-0.05
0.15
0.1 M
4x
0.1
0.1 MIN.
Pin 1
Manufacturer
2007-04-20
BFP183W
7
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
