Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8179TK
3 V SILICON MMIC LOW CURRENT AMPLIFIER
FOR MOBILE COMMUNICATIONS
Document No. PU10059EJ02V0DS (2nd edition)
Date Published April 2005 CP(K)
DATA SHEET
The mark shows major revised points.
DESCRIPTION
The
PC8179TK is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This
IC can realize low current consumption with external chip inductor which can not be realized on internal 50
wide band matched IC.
PC8179TK adopts 6-pin lead-less minimold package using same chip as the conventional
PC8179TB in 6-pin super minimold.
TK suffix IC which is smaller package than TB suffix IC contributes to reduce mounting space by 50%.
This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process.
FEATURES
•Low current consumption : ICC = 4.0 mA TYP. @ VCC = 3.0 V
•Supply voltage : VCC = 2.4 to 3.3 V
•Excellent isolation : ISL = 43.0 dB TYP. @ f = 1.0 GHz
ISL = 42.0 dB TYP. @ f = 1.9 GHz
ISL = 42.0 dB TYP. @ f = 2.4 GHz
•Power gain : GP = 13.5 dB TYP. @ f = 1.0 GHz
GP = 15.5 dB TYP. @ f = 1.9 GHz
GP = 16.0 dB TYP. @ f = 2.4 GHz
•Gain 1 dB compression output power : PO (1 dB) = +2.0 dBm TYP. @ f = 1.0 GHz
PO (1 dB) = +0.5 dBm TYP. @ f = 1.9 GHz
PO (1 dB) = +0.5 dBm TYP. @ f = 2.4 GHz
•Operating frequency : 0.1 to 2.4 GHz (Output port LC matching)
•High-density surface mounting : 6-pin lead-less minimold package (1.5 1.3 0.55 mm)
•Light weight : 3 mg (Standard value)
APPLICATION
•Buffer amplifiers on 0.1 to 2.4 GHz mobile communications system
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Data Sheet PU10059EJ02V0DS
2
PC8179TK
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
Supplying Form
PC8179TK-E2
PC8179TK-E2-A
6-pin lead-less minimold
(1511) (Pb-Free) Note
6C
• Embossed tape 8 mm wide
• Pin 1, 6 face the perforation side of the tape
• Qty 5 kpcs/reel
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact
your nearby sales office.
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order:
PC8179TK-A
PRODUCT LINE-UP (TA = +25C, VCC = Vout = 3.0 V, ZS = ZL = 50 )
Parameter
ICC
(mA)
1.0 GHz output port
matching frequency
1.66 GHz output port
matching frequency
1.9 GHz output port
matching frequency
2.4 GHz output port
matching frequency
Marking
Part No.
GP
(dB)
ISL
(dB)
PO (1dB)
(dBm)
GP
(dB)
ISL
(dB)
PO (1dB)
(dBm)
GP
(dB)
ISL
(dB)
PO (1dB)
(dBm)
GP
(dB)
ISL
(dB)
PO (1dB)
(dBm)
PC8178TB
1.9
11.0
39.0
4.0
11.5
40.0
7.0
11.5
38.0
7.5
C3B
PC8178TK
1.9
11.0
40.0
5.5
11.0
41.0
8.0
11.0
42.0
8.0
6B
PC8179TB
4.0
13.5
44.0
+3.0
15.5
42.0
+1.5
15.5
41.0
+1.0
C3C
PC8179TK
4.0
13.5
43.0
+2.0
15.5
42.0
+0.5
16.0
42.0
+0.5
6C
PC8128TB
2.8
12.5
39.0
4.0
13.0
39.0
4.0
13.0
37.0
4.0
C2P
PC8151TB
4.2
12.5
38.0
+2.5
15.0
36.0
+1.5
15.0
34.0
+0.5
C2U
PC8152TB
5.6
23.0
40.0
4.5
19.5
38.0
8.5
17.5
35.0
8.5
C2V
Remarks 1. Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
2. To know the associated product, please refer to each latest data sheet.
DISCONTINUED
Data Sheet PU10059EJ02V0DS
3
PC8179TK
SYSTEM APPLICATION EXAMPLE
Location examples in digital cellular
These ICs can be added to your system around parts, when you need more isolation or gain. The application
herein, however, shows only examples, therefore the application can depend on your kit evaluation.
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Data Sheet PU10059EJ02V0DS
4
PC8179TK
PIN CONNECTIONS
Pin No.
Pin Name
1
INPUT
2
GND
3
GND
4
OUTPUT
5
GND
6
VCC
PIN EXPLANATION
Pin
No.
Pin
Name
Applied
Voltage
(V)
Pin
Voltage
(V)Note
Function and Applications
Internal Equivalent Circuit
1
INPUT
0.90
Signal input pin. A internal
matching circuit, configured with
resisters, enables 50 connection
over a wide band. This pin must be
coupled to signal source with
capacitor for DC cut.
2
3
5
GND
0
Ground pin. This pin should be
connected to system ground with
minimum inductance. Ground
pattern on the board should be
formed as wide as possible.
All the ground pins must be con-
nected together with wide ground
pattern to decrease impedance
defference.
4
OUTPUT
Voltage
as same
as VCC
through
external
inductor
Signal output pin. This pin is de-
signed as collector output. Due to
the high impedance output, this pin
should be externally equipped with
LC matching circuit to next stage.
For L, a size 1 005 chip inductor can
be chosen.
6
VCC
2.4 to 3.3
Power supply pin. This pin should
be externally equipped with bypass
capacitor to minimize its impedance.
Note Pin voltage is measured at VCC = 3.0 V.
DISCONTINUED
Data Sheet PU10059EJ02V0DS
5
PC8179TK
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Test Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25°C, Pin 4, Pin 6
3.6
V
Circuit Current
ICC
TA = +25°C
15
mA
Power Dissipation
PD
TA = +85°C Note
232
mW
Operating Ambient Temperature
TA
40 to +85
C
Storage Temperature
Tstg
55 to +150
C
Input Power
Pin
TA = +25°C
+5
dBm
Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Remarks
Supply Voltage
VCC
2.4
3.0
3.3
V
The same voltage should be applied to
pin 4 and pin 6.
Operating Ambient Temperature
TA
40
+25
+85
C
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, TA = +25C, VCC = Vout = 3.0 V, ZS = ZL = 50 , at LC matched
frequency)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Circuit Current
ICC
No signal
2.9
4.0
5.4
mA
Power Gain
GP
f = 1.0 GHz, Pin = 30 dBm
f = 1.9 GHz, Pin = 30 dBm
f = 2.4 GHz, Pin = 30 dBm
11.0
13.0
14.0
13.5
15.5
16.0
15.5
17.5
18.5
dB
Isolation
ISL
f = 1.0 GHz, Pin = 30 dBm
f = 1.9 GHz, Pin = 30 dBm
f = 2.4 GHz, Pin = 30 dBm
39.0
37.0
37.0
43.0
42.0
42.0
dB
Gain 1 dB Compression Output
Power
PO (1 dB)
f = 1.0 GHz
f = 1.9 GHz
f = 2.4 GHz
0.5
2.0
3.0
+2.0
+0.5
+0.5
dBm
Noise Figure
NF
f = 1.0 GHz
f = 1.9 GHz
f = 2.4 GHz
5.0
5.0
5.0
6.5
6.5
6.5
dB
Input Return Loss
RLin
f = 1.0 GHz, Pin = 30 dBm
f = 1.9 GHz, Pin = 30 dBm
f = 2.4 GHz, Pin = 30 dBm
4.0
4.0
6.0
7.0
7.0
9.0
dB
DISCONTINUED
Data Sheet PU10059EJ02V0DS
6
PC8179TK
TEST CIRCUITS
<1> f = 1.0 GHz
<2> f = 1.9 GHz
<3> f = 2.4 GHz
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Data Sheet PU10059EJ02V0DS
7
PC8179TK
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
<1> f = 1.0 GHz
Remarks 1. 42 35 0.4 mm double-sided copper-clad polyimide board
2. Back side: GND pattern
3. Gold plated on pattern
4. :Through holes
COMPONENT LIST
Form
Symbol
Value
Type code
Maker
Chip capacitor
C1, C3
1 000 pF
GRM40CH102J50PT
murata
C2
0.75 pF
GRM39CKR75C50PT
murata
C4
5 pF
GRM39CH050C50PT
murata
C5
8 pF
GRM39CH080D50PT
murata
Feed-though Capacitor
C6
1 000 pF
DFT301-801 7R102S50
murata
Chip inductor
L1
12 nH
LL1608-FH12N
TOKO
DISCONTINUED
Data Sheet PU10059EJ02V0DS
8
PC8179TK
<2> f = 1.9 GHz
Remarks 1. 42 35 0.4 mm double-sided copper-clad polyimide board
2. Back side: GND pattern
3. Gold plated on pattern
4. :Through holes
COMPONENT LIST
Form
Symbol
Value
Type code
Maker
Chip capacitor
C1, C3, C5, C6
1 000 pF
GRM40CH102J50PT
murata
C2
0.5 pF
GRM39CKR5C50PT
murata
C4
8 pF
GRM39CH080D50PT
murata
Feed-though Capacitor
C7
1 000 pF
DFT301-801 7R102S50
murata
Chip inductor
L1
2.7 nH
LL1608-FH2N7S
TOKO
DISCONTINUED
Data Sheet PU10059EJ02V0DS
9
PC8179TK
<3> f = 2.4 GHz
Remarks 1. 42 35 0.4 mm double-sided copper-clad polyimide board
2. Back side: GND pattern
3. Gold plated on pattern
4. :Through holes
COMPONENT LIST
Form
Symbol
Value
Type code
Maker
Chip capacitor
C1, C2, C4, C5
1 000 pF
GRM40CH102J50PT
murata
C3
10 pF
GRM39CH100D50PT
murata
Feed-though Capacitor
C6
1 000 pF
DFT301-801 7R102S50
murata
Chip inductor
L1
2.7 nH
LL1608-FH2N7S
TOKO
L2
1.8 nH
LL1608-FH1N8S
TOKO
DISCONTINUED
Data Sheet PU10059EJ02V0DS
10
PC8179TK
TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified)
Remark The graph indicates nominal characteristics.
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Data Sheet PU10059EJ02V0DS
11
PC8179TK
f = 1.0 GHz MATCHING
Remark The graphs indicate nominal characteristics.
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Data Sheet PU10059EJ02V0DS
12
PC8179TK
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10059EJ02V0DS
13
PC8179TK
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10059EJ02V0DS
14
PC8179TK
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10059EJ02V0DS
15
PC8179TK
f = 1.9 GHz MATCHING
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10059EJ02V0DS
16
PC8179TK
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10059EJ02V0DS
17
PC8179TK
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10059EJ02V0DS
18
PC8179TK
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10059EJ02V0DS
19
PC8179TK
f = 2.4 GHz MATCHING
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10059EJ02V0DS
20
PC8179TK
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10059EJ02V0DS
21
PC8179TK
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10059EJ02V0DS
22
PC8179TK
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10059EJ02V0DS
23
PC8179TK
f = 3.0 GHz MATCHING
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10059EJ02V0DS
24
PC8179TK
PACKAGE DIMENSIONS
6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm)
DISCONTINUED
Data Sheet PU10059EJ02V0DS 25
PC8179TK
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired
oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance
difference.
(3) The bypass capacitor should be attached to VCC line.
(4) The inductor (L) should be attached between output and VCC pins. The L and series capacitor (C) values
should be adjusted for applied frequency to match impedance to next stage.
(5) The DC capacitor must be attached to input pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220C or higher : 60 seconds or less
Preheating time at 120 to 180C : 12030 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (terminal temperature) : 350C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
DISCONTINUED
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