SF103043MDWER Information General Information Package Information Environmental and Compliance Information Manufacturing Information Ordering Information Product/Process Change Notice (PCN) Operating Characteristics Reliability Data Lookup General Information Parameter Value Part Number SF103043MDWER Description JOHNSON ELEC, FAN CONTROL 908JL3E Product Line G9D8JKEA PTI MDNC Material Type Tested Packaged Device Life Cycle Description (code) REMOVED FROM ACTIVE PORTFOLIO Status Migration Complete. No Longer Manufactured. View PCN. Application/Qualification Tier 10-YEARS APPLICATION LIFE Package Information Parameter Value Package Type and Termination Count SOIC 20 Package Description and Mechanical Drawing SOIC 20W Device Weight(g) .51950 Package Material Plastic Mounting Style Surface Mount Package Length (nominal)(mm) 7.500 Package Width (nominal)(mm) 12.800 Package Thickness (nominal)(mm) 2.650 Tape & Reel Yes Environmental and Compliance Information Parameter Value Pb-Free RoHS Compliant Halogen Free Yes Material Composition Declaration (MCD) Download MCD Report RoHS Certificate of Analysis (CoA) Contact Us 2nd Level Interconnect e3 Moisture Sensitivity Level (MSL) 3 Floor Life 168 HOURS Peak Package Body Temperature (PPT)(C) 260 Maximum Time at Peak Temperature (s) 40 Number of Reflow Cycles 3 REACH SVHC Freescale REACH Statement UL94 (plastics flammability test) V0: Burning stops within 10 seconds on a vertical specimen; no drips allowed Download MCD Report Manufacturing Information Parameter Micron Size(?m) Value .5 Ordering Information Parameter Value Last Order Date 15 Jan 2011 Last Ship Date 31 May 2012 Exempt from Minimum Delivery Value Yes Export Control Classification Number (US) EAR99 Harmonized Tariff (US) Disclaimer 8542.31.0000 CCATS Document - ENC Status - Other Trade Compliance Documents - Budgetary Price excluding tax(US$) Change Currency - Order Product/Process Change Notice (PCN) Number Type Title Issue Date Effectivity Date 16235 Product Change Notice Copper Wire Conversion for Microcontroller and Microprocessor Devices 20 May 2014 29 Jul 2014 14725 Product Change Notice Announcement of Chandler Fab Qualification for Selected Products 17 Jun 2011 17 Jun 2011 14658 Product Change Notice Announcement of 30 day Effective Date for Chandler Transfer Qualifications 12 May 2011 12 May 2011 13657C Update Notification FREESCALE 150MM SENDAI FAB CLOSURE - 85% UDRSST TO CHD DEVICE 24 Nov 2010 24 Nov 2010 MIGRATION 13657B Update Notification FREESCALE 150MM SENDAI FAB CLOSURE - 85% UDRSST TO CHD DEVICE 10 Jun 2010 10 Jun 2010 MIGRATION 13657A Update Notification FREESCALE 150MM SENDAI FAB CLOSURE - 85% UDRSST TO CHD DEVICE 26 Feb 2010 26 Feb 2010 MIGRATION 13657 Device Migration Freescale 150mm Sendai Fab Closure - 85% UDRSST to CHD Device Migration 24 Jul 2009 13639 Product Bulletin MSG8 MC908JL(K)3E Cold & Room Test Elimination 18 Jun 2009 19 Jun 2009 13136 Product Bulletin MSG TEST SITE EXPANSION IN KESCHN 05 Feb 2008 06 Feb 2008 12731 Product Change Notice TSPG MCD KLM PROBE EXPANSION 16 Jul 2007 12593 Product Change Notice TSPG MCD ASE_CL SOIC PACKAGE CHANGES 11 Apr 2007 10 Jul 2007 Operating Characteristics Parameter Sample Exception Availability Reliability Data Lookup Value N 24 Jul 2009 14 Oct 2007