Dimensions are in inches [mm]
SnapTac Series
3 / 111
www.hypertronics.com
Miniature Rectangular
Connectors
• HyperSpring®spring loaded contacts, self-cleaning
wiping action
• 12 or 21 contact configurations
• Combine robust environmental performance
with compact size and light weight
• Easy and fast push-pull locking mechanism
• Full line EMI shielding
• IP67 sealing when mated and unmated
• D-shape hardware coding to avoid mismatching
• 4 position key coding available on request
• Overmolding solutions
• Upgrade commercial high speed Fast Ethernet, USB,
IEEE 1394 interconnect to Mil Spec performances
General Specifications
General
Number of Contacts 12, 21
Receptacle Terminations Solder Cup, Dip Solder
Plug Termination Solder Cup
Cable Diameter Range 0.315 [8.00] max.
AWG Contact 26 - 30
HyperSpring Force 5.5 oz. max. per contact
Connector Mating Force 12 Contacts: 180.0 oz., 21 Contacts: 215.0 oz.
Connector Unmating Force 36.0 oz. (after locking system release)
Electrical and Mechanical Characteristics
EMI Shielding Yes
Current Rating 3 Amps at 25° C
Breakdown Voltage 625V
Dielectric Withstanding Voltage (between contacts) 500V
Contact Resistance (low level) < 15 milliohms
Insulation Resistance 5000 Megohms at 500VDC - EIA364.21
Vibration EIA364.28 Condition III
Shock EIA364.27 Condition G
Weight (Plug and Receptacle – with contacts – without cabling) 12 Contacts: 0.8 oz., 21 Contacts: 1.0 oz.
Materials and Plating
Housing
Material
Plating
Aluminium alloy
Zinc cobalt conductive – RoHS compliant
Plug Overmolding Thermoplastic hotmelt
Contact
Material
Plating
Brass, beryllium copper
Gold
Environmental Characteristics
Temperature Range -65° C to 80° C
Salt Spray EIA364.26 Condition A (mated connectors)
Humidity EIA364.31 Method IV
IP Level 67 mated and unmated
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