343
Rotary
Potentiometers
Slide
Potentiometers
Metal
Shaft
Insulated
Shaft
Knob
Operating
Through
Shaft Type
Ring
Type
Reference for Manual Soldering
Example of Reflow Soldering Condition
Reference for Dip Soldering
300
200
100
A
B
C
Time (s)
G max.
F max.
H max.
E max.
Room
temperature
Temperature (˚C )
Pre-heating
D
Series Tip temperature Soldering time No. of solders
RK09L, RK097 350℃ max. 3s max. 1 time
RK203 300℃ max. 3s max. 1 time
RK119 3 5 0 ±10 ℃ 3 s 1 time
RK271 350℃ max. 5s max. 1 time
RK501 3 5 0 ±10 ℃ 5 s 1 time
RK163 350℃ max. 5s max. 1 time
RK168
Potentiometer
terminal 300℃ max. 3s max. 1 time
Motor terminal 350℃ max. 2s max. 1 time
Series
Preheating Dip soldering
No. of solders
Soldering surface
temperature Heating time Soldering
temperature Soldering time
RK09L, RK097, RK203 10 0 ℃ ma x . 2 min. max. 260±5℃ 5 ±1s 2 time max.
RK501 12 0 ±10 ℃ 2 min. max. 260±5℃ 5 ±1s 2 time
+1
0
Series A B C D E F G H No. of reflows
RK119 260℃ 230℃ 18 0 ℃ 15 0 ℃ 2 min. 3s 40s 4 min. 2 time max.
1.
When using an infrared reflow oven, solder may sometimes not be applied. Be sure to use a hot air reflow oven or at type that uses
infrared rays in combination with hot air.
2. The temperatures given above are the maximum temperatures at the terminals of the potentiometer when
employing a hot air reflow method. The temperature of the PC board and the surface temperature of the
potentiometer may vary greatly depending on the PC board material, its size and thickness. Ensure that the surface
temperature of the potentiometer does not rise to 250℃ or greater.
3. Conditions vary to some extent depending on the type of reflow bath used. Be sure to give due consideration to this prior to use.
Notes
Temperature profile
+1
0
Metal Shaft Potentiometers / Soldering Conditions