HLMP-1600, HLMP-1601, HLMP-1620, HLMP-1621
HLMP-1640, HLMP-1641, HLMP-3600, HLMP-3601
HLMP-3650, HLMP-3651, HLMP-3680, HLMP-3681
T‑13/4 (5 mm), T‑1 (3 mm), 5 Volt, 12 Volt,
Integrated Resistor LED Lamps
Data Sheet
Figure A. T-1 package.
Figure B. T-13/4 package.
Features
• Integral current limiting resistor
• TTL compatible
Requires no external current Limiter with 5 volt/12 volt
supply
• Cost eective
Saves space and resistor cost
• Wide viewing angle
• Available in all colors
Red, High Eciency Red, Yellow, and High Performance
Green in T-1 and T-13/4 packages
Description
The 5 volt and 12 volt series lamps contain an integral
cur rent limiting resistor in series with the LED. This allows
the lamp to be driven from a 5 volt/12 volt source without
an external current limiter. The red LEDs are made from
GaAsP on a GaAs substrate. The High Eciency Red and
Yellow devices use GaAsP on a GaP substrate.
The green devices use GaP on a GaP substrate. The diused
lamps provide a wide o-axis viewing angle.
The T-13/4 lamps are provided with sturdy leads suitable
for wire wrap applications. The T-13/4 lamps may be front
panel mounted by using the HLMP-0103 clip and ring.
Package Dimensions
Notes:
1. All dimensions are in mm (inches).
2. An epoxy meniscus may extend about 1 mm (0.040") down the leads.
3. For PCB hole recommendations, see the Precautions section.
0.65 (0.026) max.
24.1(.95) MIN.
4.70 (.185)
4.19 (.165)
3.43 (.135)
2.92 (.115)
1.52 (.060)
1.02 (.040)
2.79 (.110)
2.29 (.090)
1.14 (.045)
0.51 (.020)
(0.022) 0.55 SQ. TYP.
(0.016) 0.40
Ø3.17 (.125)
2.67 (.105)
6.35 (.250)
5.58 (.220)
6.1 (0.240)
5.6 (0.220)
23.0
(0.90) MIN.
0.46 (0.018)
SQUARE NOMINAL
2.54 (0.100)
NOM.
CATHODE
1.27 (0.050)
NOM.
0.89 (0.035)
0.64 (0.025)
9.19 (0.362)
8.43 (0.332)
12.34 (0.486)
11.54 (0.454)
1.32 (0.052)
1.02 (0.040)
5.08 (0.200)
4.57 (0.180)
2
Selection Guide
Color Package Description
Package
Outline 2q1/2[1]
Operating
Voltage (V)
Part Number
HLMP-
Luminous Intensity
Iv (mcd)
Min. Max.
Red T-1 Tinted Diused A 60
5 1600 2.1 -
1600-D00xx 2.1 -
60
12 1601 2.1 -
1601-D00xx 2.1 -
1601-GH0xx 8.6 27.6
T-1 3/4 Tinted Diused B 60
5 3600 2.1 -
3600-D00xx 2.1 -
60
12 3601 2.1 -
3601-D00xx 2.1 -
Yellow T-1 Tinted Diused A 60
5 1620 2.2 -
1620-C00xx 2.2 -
1620-C0Bxx 2.2 -
1620-EFBxx 3.4 10.8
60
12 1621 2.2 -
1621-C00xx 2.2 -
T-1 3/4 Tinted Diused B 60
5 3650 2.2 -
3650-C00xx 2.2 -
60
12 3651 2.2 -
3651-C00xx 2.2 -
Green T-1 Tinted Diused A 60
5 1640 1.6 -
1640-B00xx 1.6 -
1640-B0Dxx 1.6 -
1640-DE0xx 4.2 13.4
60
12 1641 1.6 -
1641-B00xx 1.6
T-1 3/4 Tinted Diused B 60
5 3680 1.6 -
3680-B00xx 1.6 -
60
12 3681 1.6 -
3681-B00xx 1.6 -
Note:
1. q1/2 is the o-axis angle at which the luminous intensity is 1/2 the axial luminous intensity.
3
Absolute Maximum Ratings at TA = 25°C
Red/HER/Yellow
5 Volt Lamps
Red/HER/Yellow
12 Volt Lamps
Green
5 Volt Lamps
Green
12 Volt Lamps
DC Forward Voltage (TA = 25°C) 7.5 Volts[2] 15 Volts[3] 7.5 Volts[2] 15 Volts[3]
Reverse Voltage (IR = 100 μA) 5 Volts 5 Volts 5 Volts 5 Volts
Operating Temperature Range -40°C to 85°C -40°C to 85°C -20°C to 85°C -20°C to 85°C
Storage Temperature Range -40°C to 100°C -40°C to 100°C -40°C to 100°C -40°C to 100°C
Notes:
2. Derate from TA = 50°C at 0.071 V/°C, see Figure 3.
3. Derate from TA = 50°C at 0.086 V/°C, see Figure 4.
Part Numbering System
HLMX-X 6 X X X X X XX
Mechanical Option
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
A1,B1: Right Angle Housing, Uneven Leads
A2,B2: Right Angle Housing, Even Leads
Color Bin Options
0: Full color bin distribution
B: Color bin 2&3 only
D: Color bin 4&5 only
Maximum Iv Bin Options
0: Open (No. max. limit)
Others: Please refer to the Iv bin Table
Minimum Iv Bin Options
Please refer to the Iv bin Table
Operating Voltage
0: 5 V
1: 12 V
Color Options
0: GaP HER
2,5: GaP Yellow
4,8: GaP Green
Package Options
3: T-13/4 (5 mm)
1: T-1 (3 mm)
4
Electrical/Optical Characteristics at TA = 25°C
Symbol
Description
High Eciency Red Yellow Green
Unit Test ConditionMin. Typ. Max. Min. Typ. Max. Min. Typ. Max.
lP Peak
Wavelength
635 583 565 nm
ld Dominant
Wavelength
626 585 569 nm Note 4
Dl1/2 Spectral Line
Halfwidth
40 36 28 nm
RqJ-PIN Thermal
Resistance
290 290 290 °C/W Junction to
Cathode Lead
(Note 6)
RqJ-PIN Thermal
Resistance
210 210 210 °C/W Junction to
Cathode Lead
(Note 7)
IF Forward Current
12 V Devices
13 20 13 20 13 20 mA VF = 12 V
IF Forward Current
5 V Devices
10 15 10 15 10 15 mA VF = 5 V
hV Luminous
Ecacy
145 500 595 lumen
/Watt
Note 2
VR Reverse
Breakdown
Voltage
5.0 5.0 5.0 V IR = 100 μA
Notes:
4. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which denes the color of the
device.
5. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = lV/hV, where lV is the luminous intensity in candelas and hV is the
luminous ecacy in lumens/Watt.
6. For Figure A package type.
7. For Figure B package type.
5
Figure 6. Relative luminous intensity vs. angular displacement for T-13/4
package.
Figure 5. Relative luminous intensity vs. angular displacement for T-1
package.
Figure 1. Forward current vs. applied forward voltage. 5 volt devices. Figure 2. Forward current vs. applied forward voltage. 12 volt devices.
Figure 4. Maximum allowed applied forward voltage vs.
ambient temperature RqJA = 175°C/W. 12 volt devices.
Figure 3. Maximum allowed applied forward voltage vs.
ambient temperature RqJA = 175°C/W. 5 volt devices.
IF – FORWARD CURRENT – mA
0
0
VCC – APPLIED FORWARD VOLTAGE – V
1612
4
7.5
2 6 8 10 14
24
20
16
12
8
4
15
IF – FORWARD CURRENT – mA
0
0
VCC – APPLIED FORWARD VOLTAGE – V
1612
4
7.5
2 6 8 10 14
24
20
16
12
8
4
15
VCC – APPLIED FORWARD VOLTAGE – V
0
0
TA – AMBIENT TEMPERATURE – C
85
20 40 60 80
7.5
8
6
4
2
VCC – APPLIED FORWARD VOLTAGE – V
0
0
TA – AMBIENT TEMPERATURE – C
85
20 40 60 80
15
16
12
8
4
10 10040 7020 60 8030 50 90
0
10
20
30
40
50
60
70
80
90
1.0
0.6
0.8
0.2
0.4
10 10040 7020 6030 50
0
10
20
30
40
50
60
70
80
90
1.0
0.6
0.8
0.2
0.4
80 90
6
Figure 8. Relative luminous intensity vs. applied forward voltage. 12 volt
devices.
Figure 7. Relative luminous intensity vs. applied forward voltage. 5 volt
devices.
Intensity Bin Limit
Color Bin
Intensity Range (mcd)
Min. Max.
Red D 2.4 3.8
E 3.8 6.1
F 6.1 9.7
G 9.7 15.5
H 15.5 24.8
I 24.8 39.6
J 39.6 63.4
K 63.4 101.5
L 101.5 162.4
M 162.4 234.6
N 234.6 340.0
O 340.0 540.0
P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
Maximum tolerance for each bin limit is ±18%.
Intensity Bin Limit (Con't)
Color Bin
Intensity Range (mcd)
Min. Max.
Yellow C 2.5 4.0
D 4.0 6.5
E 6.5 10.3
F 10.3 16.6
G 16.6 26.5
H 26.5 42.3
I 42.3 67.7
J 67.7 108.2
K 108.2 173.2
L 173.2 250.0
M 250.0 360.0
N 360.0 510.0
O 510.0 800.0
P 800.0 1250.0
Q 1250.0 1800.0
R 1800.0 2900.0
S 2900.0 4700.0
T 4700.0 7200.0
U 7200.0 11700.0
V 11700.0 18000.0
W 18000.0 27000.0
Y 14800.0 21400.0
Z 21400.0 30900.0
2.5
2.0
GaAsP
0.5
00 102 4
5 VOLT DEVICES
RELATIVE IV
6 8
1.5
1.0
HIGH EFFICIENCY
RED, YELLOW, GREEN
1.5
1.0
GaAsP
0.5
00 2 204 86
12 VOLT DEVICES
RELATIVE IV
HIGH EFFICIENCY
RED, YELLOW, GREEN
10 12 14 16 18
7
Color Categories
Color Cat #
Lambda (nm)
Min. Max.
Green 6 561.5 564.5
5 564.5 567.5
4 567.5 570.5
3 570.5 573.5
2 573.5 576.5
1 582.0 584.5
3 584.5 587.0
Yellow 2 587.0 589.5
4 589.5 592.0
5 592.0 593.0
Tolerance for each bin limit is ±0.5 nm.
Mechanical Option Matrix
Mechanical Option Code Denition
00 Bulk Packaging, minimum increment 500 pcs/bag
01 Tape & Reel, crimped leads, minimum increment 1300 pcs/bag
02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag
A1 T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
A2 T-1, Right Angle Housing, even leads, minimum increment 500 pcs/bag
B1 T-13/4 Angle Housing, uneven lead, minimum increment 500 pcs/bag
B2 T-13/4 Angle Housing, even leads, minimum increment 500 pcs/bag
Note: All categories are established for classication of products. Products may not be available in all categories. Please contact your local Avago
representative for further clarication/information.
Intensity Bin Limit (Con't)
Color Bin
Intensity Range (mcd)
Min. Max.
Green B 1.8 2.9
C 2.9 4.7
D 4.7 7.6
E 7.6 12.0
F 12.0 19.1
G 19.1 30.7
H 30.7 49.1
I 49.1 78.5
J 78.5 125.7
K 125.7 201.1
L 201.1 289.0
M 289.0 417.0
N 417.0 680.0
O 680.0 1100.0
P 1100.0 1800.0
Q 1800.0 2700.0
R 2700.0 4300.0
S 4300.0 6800.0
T 6800.0 10800.0
U 10800.0 16000.0
V 16000.0 25000.0
W 25000.0 40000.0
Z 21400.0 30900.0
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005‑2015 Avago Technologies. All rights reserved.
AV02‑0379EN ‑ May 27, 2015
Figure 9. Recommended wave soldering prole.
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without stando.
• Recommended soldering conditions:
Wave
Soldering
Manual Solder
Dipping
Pre-heat Temperature 105°C Max. –
Pre-heat Time 60 sec Max. –
Peak Temperature 250°C Max. 260°C Max.
Dwell Time 3 sec Max. 5 sec Max.
Note:s
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering prole to ensure
the soldering prole used is always conforming to
recommended soldering condition.
• If necessary, use xture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size
Diagonal Plated Through-
Hole Diameter
Lead size (typ.) 0.45 × 0.45 mm
(0.018 × 0.018 in.)
0.636 mm
(0.025 in)
0.98 to 1.08 mm
(0.039 to 0.043 in)
Dambar shear-
o area (max.)
0.65 mm
(0.026 in)
0.919 mm
(0.036 in)
Lead size (typ.) 0.50 × 0.50 mm
(0.020 × 0.020 in.)
0.707 mm
(0.028 in)
1.05 to 1.15 mm
(0.041 to 0.045 in)
Dambar shear-
o area (max.)
0.70 mm
(0.028 in)
0.99 mm
(0.039 in)
Note: Refer to application note AN1027 for more information on
soldering LED components.
0 10 20 30 40 50 60 70 80 90 100
250
200
150
100
50
TIME (SECONDS)
PREHEAT
TURBULENT WAVE LAMINAR
HOT AIR KNIFE
TEMPERATURE (°C)
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead-free solder alloy)
Flux: Rosin ux
Solder bath temperature:
245 °C ± 5 °C (maximum peak temperature = 250 °C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3 sec)
Note: Allow for board to be suciently cooled to
room temperature before you exert mechanical force.
