LMK00301SQXNOPB - NATIONAL SEMICONDUCTOR

LMH6739

LMH6739 Very Wideband, Low Distortion Triple Video Buffer

Literature Number: SNOSAD2F

December 10, 2007

LMH6739

Very Wideband, Low Distortion Triple Video Buffer

General Description

The LMH6739 is a very wideband, DC coupled monolithic se-

lectable gain buffer designed specifically for ultra high reso-

lution video systems as well as wide dynamic range systems

requiring exceptional signal fidelity. Benefiting from National's

current feedback architecture, the LMH6739 offers gains of

−1, 1 and 2. At a gain of +2 the LMH6739 supports ultra high

resolution video systems with a 400 MHz 2 VPP

3 dB Bandwidth. With 12-bit distortion level through 30 MHz

(RL = 100Ω), 2.3nV/√Hz input referred noise, the LMH6739

is the ideal driver or buffer for high speed flash A/D and D/A

converters. Wide dynamic range systems such as radar and

communication receivers requiring a wideband amplifier of-

fering exceptional signal purity will find the LMH6739’s low

input referred noise and low harmonic distortion make it an

attractive solution. The LMH6739 is offered in a space saving

SSOP package.

Features

■750 MHz −3 dB small signal bandwidth (AV = +1)

■−85 dBc 3rd harmonic distortion (20 MHz)

■2.3 nV/ input noise voltage

■3300 V/μs slew rate

■32 mA supply current (10.6 mA per op amp)

■90 mA linear output current

■0.02/0.01 Diff. Gain/ Diff. Phase (RL = 150Ω)

■2mA shutdown current

Applications

■RGB video driver

■High resolution projectors

■Flash A/D driver

■D/A transimpedance buffer

■Wide dynamic range IF amp

■Radar/communication receivers

■DDS post-amps

■Wideband inverting summer

■Line driver

Connection Diagram

16-Pin SSOP

20104110

Top View

Ordering Information

Package Part Number Package Marking Transport Media NSC Drawing

16-Pin SSOP LMH6739MQ LH6739MQ 95 Units/Rail MQA16

LMH6739MQX 2.5k Units Tape and Reel

VIP10™ is a trademark of National Semiconductor Corporation.

LMH6739 Very Wideband, Low Distortion Triple Video Buffer

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

ESD Tolerance (Note 3)

Human Body Model 2000V

Machine Model 200V

Supply Voltage (V+ - V–)13.2V

IOUT (Note 4)

Common Mode Input Voltage ±VCC

Maximum Junction Temperature +150°C

Storage Temperature Range −65°C to +150°C

Soldering Information

Infrared or Convection (20 sec.) 235°C

Wave Soldering (10 sec.) 260°C

Storage Temperature Range −65°C to +150°C

Operating Ratings (Note 1)

Temperature Range (Note 5) −40°C to +85°C

Supply Voltage (V+ - V–)8V to 12V

Thermal Resistance

Package (θJC) (θJA)

16-Pin SSOP 36°C/W 120°C/W

Electrical Characteristics (Note 2)

TA = 25°C, AV = +2, VCC = ±5V, RL = 100Ω; unless otherwise specified.

Symbol Parameter Conditions Min

(Note 7)

Typ

(Note 6)

Max

(Note 7)

Units

Frequency Domain Performance

UGBW −3 dB Bandwidth Unity Gain, VOUT = 200 mVPP 750 MHz

SSBW −3 dB Bandwidth VOUT = 200 mVPP 480 MHz

LSBW VOUT = 2 VPP 400

0.1 dB Bandwidth VOUT = 2 VPP 150 MHz

GFR2 Rolloff @ 300 MHz, VOUT = 2 VPP 1.0 dB

Time Domain Response

TRS Rise and Fall Time

(10% to 90%)

2V Step 0.9 ns

TRL 5V Step 1.7

SR Slew Rate 5V Step 3300 V/µs

tsSettling Time to 0.1% 2V Step 10 ns

teEnable Time From Disable = rising edge. 7.3 ns

tdDisable Time From Disable = falling edge. 4.5 ns

Distortion

HD2L 2nd Harmonic Distortion 2 VPP, 5 MHz −80

dBc

HD2 2 VPP, 20 MHz −71

HD2H 2 VPP, 50 MHz −55

HD3L 3rd Harmonic Distortion 2 VPP, 5 MHz −90

dBc

HD3 2 VPP, 20 MHz −85

HD3H 2 VPP, 50 MHz −65

Equivalent Input Noise

VN Non-Inverting Voltage >1 MHz 2.3 nV/

ICN Inverting Current >1 MHz 12 pA/

NCN Non-Inverting Current >1 MHz 3 pA/

Video Performance

DG Differential Gain 4.43 MHz, RL = 150Ω .02 %

DP Differential Phase 4.43 MHz, RL = 150Ω .01 degree

Static, DC Performance

VOS Input Offset Voltage (Note 8) 0.5 ±2.5

±4.5

IBN Input Bias Current (Note 8) Non-Inverting −16

−21

−8 0

µV

IBI Input Bias Current (Note 8) Inverting −2 ±30

±40

μA

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LMH6739

Symbol Parameter Conditions Min

(Note 7)

Typ

(Note 6)

Max

(Note 7)

Units

PSRR Power Supply Rejection Ratio (Note

48.5

53 dB

CMRR Common Mode Rejection Ratio

(Note 8)

50 dB

ICC Supply Current (Note 8) All three amps Enabled, No Load 32 35

Supply Current Disabled V+RL = ∞ 1.9 2.2 mA

Supply Current Disabled V−RL = ∞ 1.1 1.3 mA

Internal Feedback & Gain Set

Resistor Value

375 450 525 Ω

Gain Error RL = ∞ 0.2 ±1.1 %

Miscellaneous Performance

RIN+ Non-Inverting Input Resistance 1000 kΩ

CIN+ Non-Inverting Input Capacitance .8 pF

RIN− Inverting Input Impedance Output impedance of input buffer. 30 Ω

ROOutput Impedance DC 0.05 Ω

VOOutput Voltage Range (Note 8) RL = 100Ω ±3.25

±3.1

±3.5

RL = ∞±3.65

±3.5

±3.8

CMIR Common Mode Input Range (Note

CMRR > 40 dB ±1.9

±1.7

±2.0 V

IOLinear Output Current (Notes 4, 8) VIN = 0V, VOUT < ±30 mV 80

90 mA

ISC Short Circuit Current (Note 9) VIN = 2V Output Shorted to Ground 160 mA

IIH Disable Pin Bias Current High Disable Pin = V+ 10 μA

IIL Disable Pin Bias Current Low Disable Pin = 0V −350 μA

VDMAX Voltage for Disable Disable Pin ≤ VDMAX 0.8 V

VDMIM Voltage for Enable Disable Pin ≥ VDMIN 2.0 V

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

intended to be functional, but specific performance is not guaranteed. For guaranteed specifications, see the Electrical Characteristics tables.

Note 2: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating

of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self heating where TJ>

TA. See Applications Information for information on temperature de-rating of this device. Min/Max ratings are based on product characterization and simulation.

Individual parameters are tested as noted.

Note 3: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)

Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

Note 4: The maximum output current (IOUT) is determined by device power dissipation limitations. See the Power Dissipation section of the Application Information

for more details.

Note 5: The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

Note 6: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will

also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.

Note 7: Limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlations using the Statistical Quality

Control (SQC) method.

Note 8: Parameter 100% production tested at 25° C.

Note 9: Short circuit current should be limited in duration to no more than 10 seconds. See the Power Dissipation section of the Application Information for more

details.

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LMH6739

Typical Performance Characteristics AV = +2, VCC = ±5V, RL = 100Ω; unless otherwise specified).

Large Signal Frequency Response

20104131

Small Signal Frequency Response

20104132

Frequency Response vs. VOUT

20104101

Frequency Response vs. Supply Voltage

20104116

Gain Flatness

20104139

Gain Flatness, Dual Input Buffer

20104140

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LMH6739

Pulse Response

20104122

Frequency Response vs. Capacitive Load

20104114

Series Output Resistance vs. Capacitive Load

20104119

Open Loop Gain and Phase

20104126

Distortion vs. Frequency

20104135

10 MHz HD vs. Output Level

20104134

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LMH6739

Distortion vs. Supply Voltage

20104118

CMRR vs. Frequency

20104111

PSRR vs. Frequency

20104121

Closed Loop Output Impedance |Z|

20104104

Disable Timing

20104124

DC Errors vs. Temperature

20104112

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LMH6739

Crosstalk vs. Frequency

20104133

Disabled Channel Isolation vs. Frequency

20104141

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LMH6739

Application Information

20104105

FIGURE 1. Recommended Non-Inverting Gain Circuit,

Gain = +2

20104108

FIGURE 2. Recommended Non-Inverting Gain Circuit,

Gain +1

20104103

FIGURE 3. Recommended Inverting Gain Circuit,

Gain = –1

GENERAL INFORMATION

The LMH6739 is a high speed current feedback selectable

gain buffer (SGB), optimized for very high speed and low dis-

tortion. With its internal feedback and gain-setting resistors

the LMH6739 offers excellent AC performance while simpli-

fying board layout and minimizing the affects of layout related

parasitic components. The LMH6739 has no internal ground

reference so single or split supply configurations are both

equally useful.

SETTING THE CLOSED LOOP GAIN

The LMH6739 is a current feedback amplifier with on-chip

RF = RG = 450Ω. As such it can be configured with an

AV = +2, AV = +1, or an AV = −1 by connecting pins 3 and 4

as described in the chart below.

GAIN AVINPUT CONNECTIONS

Non-Inverting Inverting

−1 V/V Ground Input Signal

+1 V/V Input Signal NC (Open)

+2 V/V Input Signal Ground

The gain of the LMH6739 is accurate to ±1% and stable over

temperature. The internal gain setting resistors, RF and RG,

match very well. However, over process and temperature

their absolute value will change. Using external resistors in

series with RG to change the gain will result in poor gain ac-

curacy over temperature and from part to part.

20104130

FIGURE 4. Correction for Unity Gain Peaking

20104129

FIGURE 5. Frequency Response for Circuit in Figure 4

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LMH6739

UNITY GAIN COMPENSATION

With a current feedback Selectable Gain Buffer like the

LMH6739, the feedback resistor is a compromise between

the value needed for stability at unity gain and the optimized

value used at a gain of two. The result of this compromise is

substantial peaking at unity gain. If this peaking is undesirable

a simple RC filter at the input of the buffer will smooth the

frequency response shown as Figure 4. Figure 5 shows the

results of a simple filter placed on the non-inverting input. See

Figure 6 and Figure 7 for another method for reducing unity

gain peaking.

20104107

FIGURE 6. Alternate Unity Gain Compensation

20104137

FIGURE 7. Frequency Response for Circuit in Figure 6

20104138

FIGURE 8. Decoupling Capacitive Loads

DRIVING CAPACITIVE LOADS

Capacitive output loading applications will benefit from the

use of a series output resistor ROUT. Figure 8 shows the use

of a series output resistor, ROUT, to stabilize the amplifier out-

put under capacitive loading. Capacitive loads of 5 to 120 pF

are the most critical, causing ringing, frequency response

peaking and possible oscillation. The charts “Suggested

ROUT vs. Cap Load” give a recommended value for selecting

a series output resistor for mitigating capacitive loads. The

values suggested in the charts are selected for .5 dB or less

of peaking in the frequency response. This gives a good com-

promise between settling time and bandwidth. For applica-

tions where maximum frequency response is needed and

some peaking is tolerable, the value of ROUT can be reduced

slightly from the recommended values.

LAYOUT CONSIDERATIONS

Whenever questions about layout arise, use the evaluation

board as a guide. The LMH730275 is the evaluation board

supplied with samples of the LMH6739.

To reduce parasitic capacitances ground and power planes

should be removed near the input and output pins. Compo-

nents in the feedback loop should be placed as close to the

device as possible. For long signal paths controlled

impedance lines should be used, along with impedance

matching elements at both ends.

Bypass capacitors should be placed as close to the device as

possible. Bypass capacitors from each rail to ground are ap-

plied in pairs. The larger electrolytic bypass capacitors can be

located farther from the device, the smaller ceramic capaci-

tors should be placed as close to the device as possible. The

LMH6739 has multiple power and ground pins for enhanced

supply bypassing. Every pin should ideally have a separate

bypass capacitor. Sharing bypass capacitors may slightly de-

grade second order harmonic performance, especially if the

supply traces are thin and /or long. In Figure 1 and Figure 2

CSS is optional, but is recommended for best second harmon-

ic distortion. Another option to using CSS is to use pairs of .01

μF and .1 μF ceramic capacitors for each supply bypass.

VIDEO PERFORMANCE

The LMH6739 has been designed to provide excellent per-

formance with production quality video signals in a wide va-

riety of formats such as HDTV and High Resolution VGA.

NTSC and PAL performance is nearly flawless. Best perfor-

mance will be obtained with back terminated loads. The back

termination reduces reflections from the transmission line and

effectively masks transmission line and other parasitic ca-

pacitances from the amplifier output stage. Figure 4 shows a

typical configuration for driving a 75Ω Cable. The amplifier is

configured for a gain of two to make up for the 6 dB of loss in

ROUT.

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LMH6739

20104102

FIGURE 9. Maximum Power Dissipation

POWER DISSIPATION

The LMH6739 is optimized for maximum speed and perfor-

mance in the small form factor of the standard SSOP-16

package. To achieve its high level of performance, the

LMH6739 consumes an appreciable amount of quiescent

current which cannot be neglected when considering the total

package power dissipation limit. The quiescent current con-

tributes to about 40° C rise in junction temperature when no

additional heat sink is used (VS = ±5V, all 3 channels on).

Therefore, it is easy to see the need for proper precautions to

be taken in order to make sure the junction temperature’s ab-

solute maximum rating of 150°C is not violated.

To ensure maximum output drive and highest performance,

thermal shutdown is not provided. Therefore, it is of utmost

importance to make sure that the TJMAX is never exceeded

due to the overall power dissipation (all 3 channels).

With the LMH6739 used in a back-terminated 75Ω RGB ana-

log video system (with 2 VPP output voltage), the total power

dissipation is around 435 mW of which 340 mW is due to the

quiescent device dissipation (output black level at 0V). With

no additional heat sink used, that puts the junction tempera-

ture to about 140° C when operated at 85°C ambient.

To reduce the junction temperature many options are avail-

able. Forced air cooling is the easiest option. An external add-

on heat-sink can be added to the SSOP-16 package, or

alternatively, additional board metal (copper) area can be uti-

lized as heat-sink.

An effective way to reduce the junction temperature for the

SSOP-16 package (and other plastic packages) is to use the

copper board area to conduct heat. With no enhancement the

major heat flow path in this package is from the die through

the metal lead frame (inside the package) and onto the sur-

rounding copper through the interconnecting leads. Since

high frequency performance requires limited metal near the

device pins the best way to use board copper to remove heat

is through the bottom of the package. A gap filler with high

thermal conductivity can be used to conduct heat from the

bottom of the package to copper on the circuit board. Vias to

a ground or power plane on the back side of the circuit board

will provide additional heat dissipation. A combination of front

side copper and vias to the back side can be combined as

well.

Follow these steps to determine the maximum power dissi-

pation for the LMH6739:

1. Calculate the quiescent (no-load) power: PAMP = ICC*

(VS) VS = V+-V−

2. Calculate the RMS power dissipated in the output stage:

PD (rms) = rms ((VS - VOUT)*IOUT) where VOUT and IOUT

are the voltage and current across the external load and

VS is the total supply current

3. Calculate the total RMS power: PT = PAMP+PD

The maximum power that the LMH6739 package can dissi-

pate at a given temperature can be derived with the following

equation (See Figure 9):

PMAX = (150º – TAMB)/ θJA, where TAMB = Ambient temperature

(°C) and θJA = Thermal resistance, from junction to ambient,

for a given package (°C/W). For the SSOP package θJA is

120°C/W.

ESD PROTECTION

The LMH6739 is protected against electrostatic discharge

(ESD) on all pins. The LMH6739 will survive 2000V Human

Body model and 200V Machine model events.

Under closed loop operation the ESD diodes have no effect

on circuit performance. There are occasions, however, when

the ESD diodes will be evident. If the LMH6739 is driven by

a large signal while the device is powered down the ESD

diodes will conduct.

The current that flows through the ESD diodes will either exit

the chip through the supply pins or will flow through the de-

vice, hence it is possible to power up a chip with a large signal

applied to the input pins. Shorting the power pins to each other

will prevent the chip from being powered up through the input.

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LMH6739

Physical Dimensions inches (millimeters) unless otherwise noted

16-Pin SSOP

NS Package Number MQA16

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LMH6739

Notes

LMH6739 Very Wideband, Low Distortion Triple Video Buffer

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