Order this document by BSP62T1/D SEMICONDUCTOR TECHNICAL DATA Motorola Preferred Device This PNP small signal darlington transistor is designed for use in switching applications, such as print hammer, relay, solenoid and lamp drivers. The device is housed in the SOT-223 package which is designed for medium power surface mount applications. * The SOT-223 Package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die * Available in 12 mm Tape and Reel Use BSP62T1 to order the 7 inch/1000 unit reel. Use BSP62T3 to order the 13 inch/4000 unit reel. * NPN Complement is BSP52T1 MEDIUM POWER PNP SILICON DARLINGTON TRANSISTOR SURFACE MOUNT 4 COLLECTOR 2,4 1 BASE 1 2 3 CASE 318E-04, STYLE 1 TO-261AA EMITTER 3 MAXIMUM RATINGS (TC = 25C unless otherwise noted) Rating Symbol Value Unit Collector-Emitter Voltage VCES 80 Vdc Collector-Base Voltage VCBO 90 Vdc Emitter-Base Voltage VEBO 5.0 Vdc Collector Current IC 500 mAdc Total Power Dissipation @ TA = 25C(1) Derate above 25C PD 1.5 12 Watts mW/C TJ, Tstg - 65 to 150 C Symbol Max Unit RJA 83.3 C/W TL 260 10 C Sec Operating and Storage Temperature Range DEVICE MARKING BS3 THERMAL CHARACTERISTICS Characteristic Thermal Resistance -- Junction-to-Ambient (surface mounted) Maximum Temperature for Soldering Purposes Time in Solder Bath 1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in. Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. REV 2 Small-Signal Motorola Motorola, Inc. 1996 Transistors, FETs and Diodes Device Data 1 BSP62T1 ELECTRICAL CHARACTERISTICS (continued) (TA = 25C unless otherwise noted) Characteristics Symbol Min Max 90 -- 5.0 -- -- 10 -- 10 1000 2000 -- -- -- 1.3 -- 1.9 Unit OFF CHARACTERISTICS Collector-Base Breakdown Voltage (IC = 100 Adc, IE = 0) V(BR)CBO Emitter-Base Breakdown Voltage (IE = 10 Adc, IC = 0) V(BR)EBO Collector-Emitter Cutoff Current (VCE = 80 Vdc, VBE = 0) ICBO Emitter-Base Cutoff Current (VEB = 4.0 Vdc, IC = 0) IEBO Vdc Vdc Adc Adc ON CHARACTERISTICS (2) DC Current Gain (IC = 150 mAdc, VCE = 10 Vdc) (IC = 500 mAdc, VCE = 10 Vdc) hFE Collector-Emitter Saturation Voltage (IC = 500 mAdc, IB = 0.5 mAdc) VCE(sat) Base-Emitter On Voltage (IC = 500 mAdc, IB = 0.5 mAdc) VBE(on) -- Vdc Vdc 2. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0% 2 Motorola Small-Signal Transistors, FETs and Diodes Device Data BSP62T1 hFE, DC CURRENT GAIN (X1.0 K) 200 100 TA = 125C 70 50 10 V 30 25C VCE = 2.0 V 20 5.0 V 10 7.0 5.0 -55C 3.0 2.0 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 IC, COLLECTOR CURRENT (mA) 30 50 70 100 200 300 Figure 1. DC Current Gain 4.0 3.0 2.0 VCE = 5.0 V f = 100 MHz TA = 25C 2.0 1.0 0.4 VBE(sat) @ IC/IB = 100 1.2 VBE(on) @ VCE = 5.0 V 0.8 VCE(sat) @ IC/IB = 1000 IC/IB = 100 0.4 0.2 2.0 5.0 10 20 50 100 200 500 1K 0 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA) Figure 2. High Frequency Current Gain Figure 3. "On" Voltage VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS) 0.1 1.0 TA = 25C 1.6 V, VOLTAGE (VOLTS) |h FE |, HIGH FREQUENCY CURRENT GAIN 10 100 200 300 2.0 TA = 25C 1.8 1.6 IC = 10 mA 50 mA 100 mA 175 mA 300 mA 1.4 1.2 1.0 0.8 0.6 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1K 2K 5K 10K IB, BASE CURRENT (A) Figure 4. Collector Saturation Region Motorola Small-Signal Transistors, FETs and Diodes Device Data 3 BSP62T1 INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE POWER DISSIPATION The power dissipation of the SOT-223 is a function of the pad size. These can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the SOT-223 package, PD can be calculated as follows. PD = TJ(max) - TA RJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 1.5 watts. PD = 150C - 25C 83.3C/W = 1.5 watts The 83.3C/W for the SOT-223 package assumes the recommended collector pad area of 965 sq. mils on a glass epoxy printed circuit board to achieve a power dissipation of 1.5 watts. If space is at a premium, a more realistic approach is to use the device at a PD of 833 mW using the footprint shown. Using a board material such as Thermal Clad, a power dissipation of 1.6 watts can be achieved using the same footprint. MOUNTING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temperature and time should not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient should be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.15 3.8 0.079 2.0 0.248 6.3 0.091 2.3 0.091 2.3 0.079 2.0 0.059 1.5 0.059 1.5 0.059 1.5 inches mm SOT-223 4 Motorola Small-Signal Transistors, FETs and Diodes Device Data BSP62T1 SOLDER STENCIL GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the SOT-223 package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration. SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temperature and time should not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient should be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 7 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the STEP 1 PREHEAT ZONE 1 "RAMP" 200C STEP 2 STEP 3 VENT HEATING "SOAK" ZONES 2 & 5 "RAMP" DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150C actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 5 STEP 6 STEP 7 STEP 4 HEATING VENT COOLING HEATING ZONES 3 & 6 ZONES 4 & 7 205 TO "SPIKE" "SOAK" 219C 170C PEAK AT SOLDER 160C JOINT 150C 100C 140C 100C SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES 50C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 5. Typical Solder Heating Profile Motorola Small-Signal Transistors, FETs and Diodes Device Data 5 BSP62T1 PACKAGE DIMENSIONS A F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4 S B 1 2 3 D L G J C 0.08 (0003) M H INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0_ 10 _ S 0.264 0.287 MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0_ 10 _ 6.70 7.30 K STYLE 1: PIN 1. 2. 3. 4. BASE COLLECTOR EMITTER COLLECTOR CASE 318E-04 ISSUE H TO-261AA Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. 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