MOBILE PENTIUM® II PROCESSOR IN MINI-CARTRIDGE PACKAGE
AT 400 MHZ, 366 MHZ, 333 MHZ, 300P E MHZ, AND 266PE MHZ DATASHEET
INTEL CORPORATION 39
5. MECHANICAL SPECIFICATIONS
5.1 Connector Mechanical
Specifications
The mobil e P entium II m i ni -cartridge processor
board-to-board stacking c onnec tor consists of a
plug and a receptacle. A plug surface mounts to the
process or and mates t o the receptac l e, which
surfac e mounts to the m otherboard. Each hal f of the
connect or us es ball grid array (BGA) technology for
surfac e mount. The processor c onnector has 240
pins in an 8 x 30 array. A s ol der bal l i s attac hed t o
the tail of each contac t for surf ac e mount and t he
center-to-center distance between solder ball s
(pitch) i s 1.27 m m.
The plug mounted on the proces s or i s available in
one height. The rec eptacle mounted on the
mot herboard i s avai l abl e from an out side vendor in
two heights to al l ow for c omponent placement
flexibility within the package k eep-out line on the
system electronics. The board-to-board spac i ng i s
defined as t he spacing between the proc essor
subst rat e and the system electronics substrat e af ter
both halves of the connect or are reflowed onto their
respect i ve boards and mated. The board-to-board
spacing i s not to be c onf used with the bott om
clearance, which is the space below the cart ri dge.
For the m obi l e P entium II m i ni -cartridge proces sor
the available board-to-board spacings are 3.4 and 4
mm. These spacings are dependent on the height of
the receptacle, which is a functi on of the system
manuf ac turer’s mounting technique. The sys tem
manuf ac turer chooses the board-to-board spac i ng
to use for a particular s ystem design.
5.2 Mini-cartridge Assembly
Mechanical Specifications
The mobil e P entium II m i ni -cartridge processor is
enclosed by stainles s steel (300-series) covers;
however, the connect or and the process or di e are
exposed in order to accomm odate instal l ation into a
system. A s shown in Figure 5.5, the overall footpri nt
of the area reserved for the proces sor is 56.0 mm
by 60.0 mm. Note that the bottom cover is metallic,
so caut i on s houl d be taken to prevent shorting when
placing c omponents under t he processor.
Component s pl aced within the package keep-out
line should not contac t the process or. The
receptac l e and cover outline is shown in Figure 5.5
so that i t can be sil k screened ont o the system
electroni c s subst rate, to as s i st in manual placement
of the receptacle. The actual shape of the
receptac l e and c ap assem bl y i s more c omplic ated
than a rectangl e, but a rect angl e i s suff i c i ent for the
purpose of manual placement. Fi gure 5.4 and
Figure 5.5 show the location of t he l arge key of the
connector.
The process or should be securel y mounted to the
system board to prevent pot ential dam age due to
shock and vi brat i on. Four mount i ng hol es are
provided in order to facilitate mount ing f asteners
(M2 screws are recommended) t hrough the
process or and i nt o the standof fs on the s ys tem
board. Due to EMI concerns, i t is recomm ended that
a mount i ng s ystem t hat provides a low impedance
ground between the process or and the syst em
board be used.
As noted previ ously, the proc essor die is exposed in
order to acc omm odat e system therm al i nterface.
Table 5.2 cont ai ns the spec i ficati on for bond-line
thickness, which i s the dist ance between the top
surfac e of the die and the top surface of t he
processor. To facilitate this solution, the top cover is
recess ed around t he di e. More inform at i on about
EMI, mounting, standoff s, and thermal solut i on
attachment is provided in the
Mobile Pentium
II
Mini-cartridge Mechani cal and Thermal User Guide.
It is i mportant that the proc es sor not be
disassembled or permanently al t ered i n any way
(e.g., adding extra holes) in order t o f acilitate
system thermal solution attachment . Functionality of
a process or i s not guaranteed if i ts cover has been
removed. The addi t i on of adhesives and greases to
the exterior surfaces of t he product is not
considered to be permanent .
Figure 5.1 shows a c ros s-sect i on vi ew of t he
processor. Figure 5.2 and Figure 5.3 illustrate the
process or assem bl y t op and bottom c over
dimensions. Figure 5.4 illustrates the standoff and
connector locations and Figure 5. 5 illustrates t he
process or assem bl y keep-out areas. Table 5.1 and