DRB PACKAGE
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
www.ti.com
SLVS087M –DECEMBER 1994–REVISED MARCH 2012
Micropower Supply Voltage Supervisors
Check for Samples: TLC7701, TLC7725, TLC7703 ,TLC7733, TLC7705
1FEATURES
• Power-On Reset Generator
• Automatic Reset Generation After Voltage
Drop
• Precision Voltage Sensor
• Temperature-Compensated Voltage Reference
• Programmable Delay Time by External
Capacitor
• Supply Voltage Range . . . 2 V to 6 V
• Defined RESET Output from VDD ≥1 V
• Power-Down Control Support for Static RAM
With Battery Backup
• Maximum Supply Current of 16 µA
• Power Saving Totem-Pole Outputs
• Temperature Range . . . Up to –55°C to 125°C
APPLICATIONS
• Medical Imaging
DESCRIPTION
The TLC77xx family of micropower supply voltage
supervisors provide reset control, primarily in
microcomputer and microprocessor systems.
During power-on, RESET is asserted when VDD
reaches 1 V. After minimum VDD (≥2 V) is
established, the circuit monitors SENSE voltage and
keeps the reset outputs active as long as SENSE
voltage (VI(SENSE)) remains below the threshold
voltage. An internal timer delays return of the output
to the inactive state to ensure proper system reset.
The delay time, td, is determined by an external
capacitor:
td= 2.1 × 104× CT
Where
CTis in farads
tdis in seconds
SPACER
Except for the TLC7701, which can be customized with two external resistors, each supervisor has a fixed sense
threshold voltage set by an internal voltage divider. When SENSE voltage drops below the threshold voltage, the
outputs become active and stay in that state until SENSE voltage returns above threshold voltage and the delay
time, td, has expired.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 1994–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
SLVS087M –DECEMBER 1994–REVISED MARCH 2012
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
In addition to the power-on-reset and undervoltage-supervisor function, the TLC77xx adds power-down control
support for static RAM. When CONTROL is tied to GND, RESET will act as active high. The voltage monitor
contains additional logic intended for control of static memories with battery backup during power failure. By
driving the chip select (CS) of the memory circuit with the RESET output of the TLC77xx and with the CONTROL
driven by the memory bank select signal (CSH1) of the microprocessor (see Figure 10), the memory circuit is
automatically disabled during a power loss. (In this application the TLC77xx power has to be supplied by the
battery.)
The TLC77xxI is characterized for operation over a temperature range of –40°C to 85°C; the TLC77xxQ is
characterized for operation over a temperature range of –40°C to 125°C; and the TLC77xxM is characterized for
operation over the full Military temperature range of –55°C to 125°C.
The 3x3 mm DRB package is also available as a non-magnetic package for medical imaging application.
AVAILABLE OPTIONS
PACKAGED DEVICES
THRESHOLD THIN SHRINK
CHIP CERAMIC CERAMIC SMALL OUTLINE
VOLTAGE
TAPLASTIC DIP
SMALL CARRIER DIP DUAL SMALL OUTLINE NO LEAD
(V) OUTLINE (D)(1) (P) (DRB)
(FK) (JG) FLATPACK (U) (PW)(2)
1.1 TCLC7701ID — — — TCLC7701IP TCLC7701IPWR —
2.25 TLC7725ID — — — TLC7725IP TLC7725IPWR —
2.63 TLC7703ID — — — TLC7703IP TLC7703IPWR —
–40°C to
85°C 2.93 TLC7733ID — — — TLC7733IP TLC7733IPWR —
4.55 TLC7705ID — — — TLC7705IP TLC7705IPWR —
1.1 TLC7701IDBR — — — — — TLC7701IDRBT-NM
1.1 TLC7701QD — — — TLC7701QP TLC7701QPWR —
2.25 TLC7725QD — — — TLC7725QP TLC7725QPWR —
–40°C to 2.63 TLC7703QD — — — TLC7703QP TLC7703QPWR —
125°C 2.93 TLC7733QD — — — TLC7733QP TLC7733QPWR —
4.55 TLC7705QD — — — TLC7705QP TLC7705QPWR —
2.93 — — — — — — —
–55°C to
125°C 4.55 — — — — — — —
(1) The D package is available taped and reeled. Add the suffix R to the device type when ordering (e.g., TLC7705QDR).
(2) The PW package is only available left-end taped and reeled (indicated by the R suffix on the device type; e.g., TLC7705QPWR).
Table 1. FUNCTION TABLE
CONT RESIN VI(SENSE)>VIT+ RESE RESET
ROL T
L L False H L
L L True H L
L H False H L
L H True L(1) H(1)
H L False H L
H L True H L
H H False H L
H H True H H(1)
(1) RESET and RESET states shown are valid for t > td.
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Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
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SLVS087M –DECEMBER 1994–REVISED MARCH 2012
LOGIC SYMBOL
(1) This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Copyright © 1994–2012, Texas Instruments Incorporated Submit Documentation Feedback 3
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TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
SLVS087M –DECEMBER 1994–REVISED MARCH 2012
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FUNCTIONAL BLOCK DIAGRAM
TIMING DIAGRAM
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TLC7733, TLC7705
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SLVS087M –DECEMBER 1994–REVISED MARCH 2012
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted) VALUE UNIT
VDD Supply voltage(2) 7 V
Input voltage range, CONTROL, RESIN, SENSE(2) –0.3 to 7 V
IOL Maximum low output current 10 mA
IOH Maximum high output current, –10 mA
IIK Input clamp current, (VI < 0 or VI > VDD) ±10 mA
IOK Output clamp current, (VO 0 or VO > VDD) ±10 mA
Continuous total power dissipation See Dissipation Rating Table
TL77xxI –40 to 84 °C
Operating free-air
TATL77xxQ –40 to 125 °C
temperature range TL77xxM –55 to 125 °C
Tstg Storage temperature range –65 to 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
DISSIPATION RATINGS
TA≤25°C DERATING FACTOR TA= 85°C TA= 125°C
PACKAGE POWER RATING ABOVE TA= 25°C POWER RATING POWER RATING
D 725 mW 5.8 mW/°C 377 mW 145 mW
DRB
FK 1375 mW 11.0 mW/°C 715 mW 275 mW
JG 1050 mW 8.4 mW/°C 546 mW 210 mW
P 1000 mW 8.0 mW/°C 520 mW 200 mW
PW 525 mW 4.2 mW/°C 273 mW 105 mW
U 700 mW 5.5 mW/°C 370 mW 150 mW
RECOMMENDED OPERATING CONDITIONS
at specified temperature range MIN MAX UNIT
VDD Supply voltage 2 6 V
VIInput voltage 0 VDD V
VIH High-level input voltage at RESIN and CONTROL(1) 0.7×VDD V
VIL Low-level input voltage at RESIN and CONTROL(1) 0.2×VDD V
IOH High-level output current –2 mA
IOL Low-level output current 2 mA
Δt/ΔV input transition rise and fall rate at RESIN and CONTROL 100 ns/ V
TLC77xxI –40 85
Operating free-air
TATLC77xxQ –40 125 °C
temperature range TLC77xxM –55 125
(1) To ensure a low supply current, VIL should be kept <0.3 V and VIH > VDD –0.3 V.
Copyright © 1994–2012, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
SLVS087M –DECEMBER 1994–REVISED MARCH 2012
www.ti.com
ELECTRICAL CHARACTERISTICS
over recommended operating conditions(1) (unless otherwise noted) TLC77xx
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX
VDD = 2 V 1.8
IOH = –20 µA VDD = 2.7 V 2.5
High-level output
VOH V
voltage VDD = 4.5 V 4.3
IOH = 2 –mA VDD = 4.5 V 3.7
VDD = 2 V 0.2
IOL = 20 µA VDD = 2.7 V 0.2
Low-Level output
VOL V
voltage VDD = 4.5 V 0.2
IOL = 2 mA VDD = 4.5 V 0.5
TCLC7701 1.04 1.1 1.16
TLC7725 2.18 2.25 2.32
Negative-going input threshold voltage,
VIT– TLC7703 VDD = 2 V to 6 V 2.56 2.63 2.70 mV
SENSE(2)
TLC7733 2.86 2.93 3
TLC7705 4.47 4.55 4.63
TCLC7701 30
TLC7725
Vhus Hysteresis voltage, SENSE TLC7703 VDD = 2 V to 6 V mV
70
TLC7733
TLC7705
Vres Power-up reset voltage(3) IOL = 20 µA 1 V
RESIN VI= 0 V to VDD 2
CONTROL VI= VDD 7 15
IIInput current µA
SENSE VI= 5 V 5 10
SENSE, TLC7701 only VI= 5 V 2
RESIN = VDD, SENSE = VDD ≥VITmax + 0.2 V,
IDD Supply current 9 16 µA
CONTROL = 0 V, Outputs open
VDD = 5 V, VCT = 0,
IDD(d) Supply current during tdRESIN = VDD, SENSE = VDD, 120 150 µA
CONTROL = 0 V, Outputs open
CIInput capacitance, SENSE VI= 0 V to VDD 50 pF
(1) All characteristics are measured with CT= 0.1 µF.
(2) To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 mF) should be connected near the supply terminals.
(3) The lowest supply voltage at which RESET becomes active. The symbol Vres is not currently listed within EIA or JEDEC standards for
semiconductor symbology. Rise time of VDD≥15 µs/V.
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TLC7733, TLC7705
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SLVS087M –DECEMBER 1994–REVISED MARCH 2012
ELECTRICAL CHARACTERISTICS
over recommended operating conditions(1) (unless otherwise noted) TLC77xxM
PARAMETER TEST CONDITIONS UNIT
MIN TYP(2) MAX
TA= 25°C 1.8
VDD = 2 V V
TA= –55°C to 125°C 1.7
TA= 25°C 2.5
IOH = –20 µA VDD = 2.7 V V
TA= –55°C to 125°C 2.3
High-level output
VOH voltage TA= 25°C 4.3
VDD = 4.5 V V
TA= –55°C to 125°C 4.2
TA= 25°C 3.7
IOH = –2 µA VDD = 4.5 V V
TA= –55°C to 125°C 3.6
TA= 25°C 0.2
VDD = 2 V V
TA= –55°C to 125°C 0.2
TA= 25°C 0.2
IOL = –20 µA VDD = 2.7 V V
TA= –55°C to 125°C 0.2
Low-level output
VOL voltage TA= 25°C 0.2
VDD = 4.5 V V
TA= –55°C to 125°C 0.2
IOL = 2 mA TA= 25°C 0.5
VDD = 4.5 V V
TA= –55°C to 125°C 0.5
TLC7733 2.86 2.93 3.1
Negative-going input threshold
VIT– VDD = 2 V to 6 V V
voltage, SENSE (3) TLC7705 4.3 4.5 4.8
Vhys Hysteresis voltage, SENSE VDD = 2 V to 6 V 70 mV
Vres Power-up reset voltage(2) IOL = 20 µA 1 V
RESIN VI= 0 V to VDD 2
CONTROL VI= VDD 7 15
IIInput current µA
SENSE VI= 5 V 5 10
SENSE, TLC7701 only VI= 5 V 2
RESIN = VDD,
SENSE = VDD ≥VITmax + 0.2 V
IDD Supply current 9 16 µA
CONTROL = 0 V,
Outputs open
TLC7733 VCT = 0 , VDD = 3.3 V 250
RESIN = VDD,120 150
IDD(d) Supply current during tdCONTROL = 0 V, µA
TLC7705 VDD = 5 V
SENSE = VDD,
Outputs open
CIInput capacitance, SENSE VI= 0 V to VDD 50 pF
(1) All characteristics are measured with CT= 0.1 µF.
(2) Typical values apply at TA= 25°C.
(3) To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 mF) should be connected near the supply terminals.
Copyright © 1994–2012, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
SLVS087M –DECEMBER 1994–REVISED MARCH 2012
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SWITCHING CHARACTERISTICS
at VDD = 5 V, RL= 2 kΩ, CL= 50 pF, TA= 25°C (unless otherwise noted)
MEASURED TLC77xx
PARAMETER TEST CONDITIONS UNIT
FROM TO MIN TYP MAX
(INPUT) (OUTPUT)
RESET RESIN = 0.7 × VDD,
tdDelay time VI(SENSE) ≥VIT+ and CONTROL = 0.2 × VDD, CT= 100 nF, 1.1 2.1 4.2 ms
RESET TA= Full range, See timing diagram
Propagation delay time, low-
tPLH 20
to-high-level output RESET
Propagation delay time, high-
tPHL 5
VIH = VIT+max + 0.2 V, VIL = VIT-min – 0.2 V,
to-low-level output SENSE RESIN = 0.7 × VDD, CONTROL = 0.2 × VDD, µs
Propagation delay time, low- CT = NC(1)
tPLH 5
to-high-level output RESET
Propagation delay time, high-
tPHL 20
to-low-level output
Propagation delay time, low-
tPLH 20 µs
to-high-level output RESET
Propagation delay time, high- VIH = 0.7 × VDD, VIL = 0.2 × VDD,
tPHL 40
to-low-level output SENSE = VIT+max + 0.2 V,
RESIN ns
CONTROL = 0.2 × VDD,
Propagation delay time, low-
tPLH 45
CT = NC(1)
to-high-level output RESET
Propagation delay time, high-
tPHL 20 µs
to-low-level output
Propagation delay time, low-
tPLH 38 ns
VIH = 0.7 × VDD, VIL = 0.2 × VDD,
to-high-level output CONTROL RESET SENSE = VIT+max + 0.2 V, RESIN = 0.7 × VDD,
Propagation delay time, high- CT = NC(1)
tPHL 38 ns
to-low-level output
Low-level minimum pulse SENSE VIH = VIT+max + 0.2 V, VIL = VIT-min –0.2 V,
duration to switch RESET RESIN VIL = 0.2 × VDD, VIH = 0.7 × VDD
and RESET
trRise time RESET 10% to 90%
and
tfFall time 90% to 10%
RESET
(1) NC = No capacitor, and includes up to 100-pF probe and jig capacitance.
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SLVS087M –DECEMBER 1994–REVISED MARCH 2012
SWITCHING CHARACTERISTICS
at VDD = 5 V, RL= 2 kΩ, CL= 50 pF, TA= 25°C (unless otherwise noted)
MEASURED TLC77xxM
PARAMETER TEST CONDITIONS TAUNIT
FROM TO MIN TYP MAX
(INPUT) (OUTPUT)
RESET RESIN = 2.7 V, CONTROL = 0.4 V,
tdDelay time VI(SENSE) ≥VIT+ and Full range 1.1 2.1 4.2 ms
CT= 100 nF, See timing diagram
RESET
25°C 20
VIH = VIT+max + 0.2 V,
RESET µs
Propagation delay Full range 24
VIL = VIT-min - 0.2 V,
tPLH time, low-to-high-level SENSE RESIN = 2.7 V, CONTROL = 0.4 V, 25°C 5
output RESET µs
CT = NC(1) Full range 7
25°C 5
VIH = VIT+max + 0.2 V,
RESET µs
Propagation delay Full range 7
VIL = VIT-min - 0.2 V,
tPHL time, high-to-low-level SENSE RESIN = 2.7 V, CONTROL = 0.4 V, 25°C 20
output RESET µs
CT = NC(1) Full range 24
25°C 20
VIH = 2.7 V, VIL = 0.4 V,
RESET µs
Propagation delay Full range 24
SENSE = VIT+max + 0.2 V,
tPLH time, low-to-high-level RESIN CONTROL = 0.4 V, 25°C 45
output RESET ns
CT = NC(1) Full range 65
25°C 40
VIH = 2.7 V, VIL = 0.4 V,
RESET ns
Propagation delay Full range 60
SENSE = VIT+max + 0.2 V,
tPHL time, high-to-low-level RESIN CONTROL = 0.4 V, 25°C 20
output RESET µs
CT = NC(1) Full range 24
Propagation delay 25°C 38
tPLH time, low-to-high-level ns
VIH = 2.7 V, VIL = 0.4 V, Full range 58
output SENSE = VIT+max + 0.2 V,
CONTROL RESET RESIN = 2.7 V,
Propagation delay 25°C 38
CT = NC(1)
tPHL time, high-to-low-level ns
Full Range 58
output
VIH = VIT+max + 0.2 V,
SENSE 3
Low-level minimum VIL = VIT-min - 0.2 V Full range µs
pulse duration RESIN VIL = 0.4 V, VIH = 2.7 V 1
trRise time RESET 10% to 90% 8
and Full range ns/V
tfFall time 90% to 10% 4
RESET
(1) NC = No capacitor, and includes up to 100-pF probe and jig capacitance.
Copyright © 1994–2012, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
SLVS087M –DECEMBER 1994–REVISED MARCH 2012
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PARAMETER MEASUREMENT INFORMATION
Figure 1. RESET and RESET Output Configurations
Figure 2. Input Pulse Definition Waveforms
10 Submit Documentation Feedback Copyright © 1994–2012, Texas Instruments Incorporated
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TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
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SLVS087M –DECEMBER 1994–REVISED MARCH 2012
TYPICAL CHARACTERISTICS
NORMALIZED INPUT THRESHOLD VOLTAGE SUPPLY CURRENT
vs vs
TEMPERATURE SUPPLY VOLTAGE
Figure 3. Figure 4.
HIGH-LEVEL OUTPUT VOLTAGE LOW-LEVEL OUTPUT VOLTAGE
vs vs
HIGH-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT CURRENT
Figure 5. Figure 6.
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SLVS087M –DECEMBER 1994–REVISED MARCH 2012
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TYPICAL CHARACTERISTICS (continued)
INPUT CURRENT MINIMUM PULSE DURATION AT SENSE
vs vs
INPUT VOLTAGE AT SENSE SENSE THRESHOLD OVERDRIVE
Figure 7. Figure 8.
12 Submit Documentation Feedback Copyright © 1994–2012, Texas Instruments Incorporated
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SLVS087M –DECEMBER 1994–REVISED MARCH 2012
APPLICATION INFORMATION
Figure 9. Reset Controller in a Microcomputer System
Figure 10. Data Retention During Power Down Using Static CMOS RAMs
Copyright © 1994–2012, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705
TLC7701, TLC7725, TLC7703
TLC7733, TLC7705
SLVS087M –DECEMBER 1994–REVISED MARCH 2012
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Changes from Revision L (February 2003) to Revision M Page
• Updated the DRB package Pin Out dimensions and Ordering Information. ........................................................................ 1
14 Submit Documentation Feedback Copyright © 1994–2012, Texas Instruments Incorporated
Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705
PACKAGE OPTION ADDENDUM
www.ti.com 29-Mar-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9750901Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9750901QPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI
5962-9751301Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9751301QHA ACTIVE CFP U 10 1 TBD Call TI Call TI
5962-9751301QPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI
TLC7701ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7701IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7701IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7701IDRBT-NM ACTIVE SON DRB 8 250 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR
TLC7701IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7701IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7701IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7701IPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7701IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7701IPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI
TLC7701IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7701IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7701QD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7701QDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7701QDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 29-Mar-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TLC7701QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7701QP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7701QPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7701QPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7701QPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7701QPWLE PREVIEW TSSOP PW 8 TBD Call TI Call TI
TLC7701QPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7701QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7703ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7703IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7703IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7703IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7703IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7703IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7703IPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7703IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7703IPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI
TLC7703IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7703IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7703QD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 29-Mar-2012
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TLC7703QDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7703QP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7703QPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7703QPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7703QPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7705IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7705IPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705IPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI
TLC7705IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
TLC7705MJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
TLC7705MJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
TLC7705MUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type
TLC7705QD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705QDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 29-Mar-2012
Addendum-Page 4
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TLC7705QDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705QP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7705QPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7705QPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705QPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705QPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI
TLC7705QPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7705QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7725ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7725IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7725IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7725IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7725IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7725IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7725IPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7725IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7725IPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI
TLC7725IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7725IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 29-Mar-2012
Addendum-Page 5
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TLC7725QD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7725QDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7725QDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7725QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7725QP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7725QPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7725QPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI
TLC7725QPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7725QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7733IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7733IPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
TLC7733MJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 29-Mar-2012
Addendum-Page 6
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TLC7733MJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
TLC7733QD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733QDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733QDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733QP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7733QPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
TLC7733QPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733QPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733QPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TLC7733QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 29-Mar-2012
Addendum-Page 7
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLC7701, TLC7705, TLC7705M, TLC7733, TLC7733M :
•Catalog: TLC7705, TLC7733
•Automotive: TLC7701-Q1, TLC7705-Q1, TLC7705-Q1, TLC7733-Q1, TLC7733-Q1
•Enhanced Product: TLC7701-EP, TLC7705-EP, TLC7705-EP, TLC7733-EP, TLC7733-EP
•Military: TLC7705M, TLC7733M
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TLC7701IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC7701IDRBT-NM SON DRB 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
TLC7701IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
TLC7701QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC7701QPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
TLC7703IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC7703IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
TLC7705IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC7705IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
TLC7705QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC7705QPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
TLC7725IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC7725IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
TLC7725QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC7725QPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
TLC7733IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC7733IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC7733IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TLC7733QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC7733QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC7733QPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLC7701IDR SOIC D 8 2500 367.0 367.0 35.0
TLC7701IDRBT-NM SON DRB 8 250 210.0 185.0 35.0
TLC7701IPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC7701QDR SOIC D 8 2500 367.0 367.0 35.0
TLC7701QPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC7703IDR SOIC D 8 2500 367.0 367.0 35.0
TLC7703IPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC7705IDR SOIC D 8 2500 367.0 367.0 35.0
TLC7705IPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC7705QDR SOIC D 8 2500 367.0 367.0 35.0
TLC7705QPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC7725IDR SOIC D 8 2500 367.0 367.0 35.0
TLC7725IPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC7725QDR SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLC7725QPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC7733IDR SOIC D 8 2500 367.0 367.0 35.0
TLC7733IDR SOIC D 8 2500 367.0 367.0 35.0
TLC7733IPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLC7733QDR SOIC D 8 2500 367.0 367.0 35.0
TLC7733QDR SOIC D 8 2500 367.0 367.0 35.0
TLC7733QPWR TSSOP PW 8 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 3
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
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