TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 www.ti.com SLVS087M - DECEMBER 1994 - REVISED MARCH 2012 Micropower Supply Voltage Supervisors Check for Samples: TLC7701, TLC7725, TLC7703 , TLC7733, TLC7705 FEATURES 1 * * * * * * * * * * * DRB PACKAGE Power-On Reset Generator Automatic Reset Generation After Voltage Drop Precision Voltage Sensor Temperature-Compensated Voltage Reference Programmable Delay Time by External Capacitor Supply Voltage Range . . . 2 V to 6 V Defined RESET Output from VDD 1 V Power-Down Control Support for Static RAM With Battery Backup Maximum Supply Current of 16 A Power Saving Totem-Pole Outputs Temperature Range . . . Up to -55C to 125C APPLICATIONS * Medical Imaging DESCRIPTION The TLC77xx family of micropower supply voltage supervisors provide reset control, primarily in microcomputer and microprocessor systems. During power-on, RESET is asserted when VDD reaches 1 V. After minimum VDD (2 V) is established, the circuit monitors SENSE voltage and keeps the reset outputs active as long as SENSE voltage (VI(SENSE)) remains below the threshold voltage. An internal timer delays return of the output to the inactive state to ensure proper system reset. The delay time, td, is determined by an external capacitor: td = 2.1 x 104 x CT Where CT is in farads td is in seconds SPACER Except for the TLC7701, which can be customized with two external resistors, each supervisor has a fixed sense threshold voltage set by an internal voltage divider. When SENSE voltage drops below the threshold voltage, the outputs become active and stay in that state until SENSE voltage returns above threshold voltage and the delay time, td, has expired. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1994-2012, Texas Instruments Incorporated TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 SLVS087M - DECEMBER 1994 - REVISED MARCH 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION (CONTINUED) In addition to the power-on-reset and undervoltage-supervisor function, the TLC77xx adds power-down control support for static RAM. When CONTROL is tied to GND, RESET will act as active high. The voltage monitor contains additional logic intended for control of static memories with battery backup during power failure. By driving the chip select (CS) of the memory circuit with the RESET output of the TLC77xx and with the CONTROL driven by the memory bank select signal (CSH1) of the microprocessor (see Figure 10), the memory circuit is automatically disabled during a power loss. (In this application the TLC77xx power has to be supplied by the battery.) The TLC77xxI is characterized for operation over a temperature range of -40C to 85C; the TLC77xxQ is characterized for operation over a temperature range of -40C to 125C; and the TLC77xxM is characterized for operation over the full Military temperature range of -55C to 125C. The 3x3 mm DRB package is also available as a non-magnetic package for medical imaging application. AVAILABLE OPTIONS PACKAGED DEVICES TA THRESHOLD VOLTAGE (V) -40C to 85C -40C to 125C -55C to 125C (1) (2) SMALL OUTLINE (D) (1) CHIP CARRIER (FK) CERAMIC DIP (JG) CERAMIC PLASTIC DIP DUAL (P) FLATPACK (U) THIN SHRINK SMALL OUTLINE (PW) (2) SMALL OUTLINE NO LEAD (DRB) 1.1 TCLC7701ID -- -- -- TCLC7701IP TCLC7701IPWR -- 2.25 TLC7725ID -- -- -- TLC7725IP TLC7725IPWR -- 2.63 TLC7703ID -- -- -- TLC7703IP TLC7703IPWR -- 2.93 TLC7733ID -- -- -- TLC7733IP TLC7733IPWR -- 4.55 TLC7705ID -- -- -- TLC7705IP TLC7705IPWR -- 1.1 TLC7701IDBR -- -- -- -- -- TLC7701IDRBT-NM 1.1 TLC7701QD -- -- -- TLC7701QP TLC7701QPWR -- 2.25 TLC7725QD -- -- -- TLC7725QP TLC7725QPWR -- 2.63 TLC7703QD -- -- -- TLC7703QP TLC7703QPWR -- 2.93 TLC7733QD -- -- -- TLC7733QP TLC7733QPWR -- 4.55 TLC7705QD -- -- -- TLC7705QP TLC7705QPWR -- 2.93 -- -- -- -- -- -- -- 4.55 -- -- -- -- -- -- -- The D package is available taped and reeled. Add the suffix R to the device type when ordering (e.g., TLC7705QDR). The PW package is only available left-end taped and reeled (indicated by the R suffix on the device type; e.g., TLC7705QPWR). Table 1. FUNCTION TABLE CONT ROL RESIN VI(SENSE)>VIT+ RESE T RESET L L L L H H H H L L H H L L H H False True False True False True False True H H H L (1) H H H H L L L H (1) L L L H (1) (1) 2 RESET and RESET states shown are valid for t > td. Submit Documentation Feedback Copyright (c) 1994-2012, Texas Instruments Incorporated Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 www.ti.com SLVS087M - DECEMBER 1994 - REVISED MARCH 2012 LOGIC SYMBOL (1) This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. Copyright (c) 1994-2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 3 TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 SLVS087M - DECEMBER 1994 - REVISED MARCH 2012 www.ti.com FUNCTIONAL BLOCK DIAGRAM TIMING DIAGRAM 4 Submit Documentation Feedback Copyright (c) 1994-2012, Texas Instruments Incorporated Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 www.ti.com SLVS087M - DECEMBER 1994 - REVISED MARCH 2012 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VDD Supply voltage (2) Input voltage range, CONTROL, RESIN, SENSE (2) VALUE UNIT 7 V -0.3 to 7 V IOL Maximum low output current 10 mA IOH Maximum high output current, -10 mA IIK Input clamp current, (VI < 0 or VI > VDD) 10 mA IOK Output clamp current, (VO 0 or VO > VDD) 10 mA Continuous total power dissipation Operating free-air temperature range TA Tstg (1) See Dissipation Rating Table TL77xxI -40 to 84 C TL77xxQ -40 to 125 C TL77xxM -55 to 125 C -65 to 150 C Storage temperature range Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to GND. (2) DISSIPATION RATINGS PACKAGE TA 25C POWER RATING DERATING FACTOR ABOVE TA = 25C TA = 85C POWER RATING TA = 125C POWER RATING D 725 mW 5.8 mW/C 377 mW 145 mW FK 1375 mW 11.0 mW/C 715 mW 275 mW JG 1050 mW 8.4 mW/C 546 mW 210 mW DRB P 1000 mW 8.0 mW/C 520 mW 200 mW PW 525 mW 4.2 mW/C 273 mW 105 mW U 700 mW 5.5 mW/C 370 mW 150 mW RECOMMENDED OPERATING CONDITIONS at specified temperature range MIN MAX VDD Supply voltage 2 6 V VI Input voltage 0 VDD V (1) VIH High-level input voltage at RESIN and CONTROL VIL Low-level input voltage at RESIN and CONTROL (1) IOH High-level output current IOL Low-level output current t/V input transition rise and fall rate at RESIN and CONTROL TA Operating free-air temperature range (1) 0.7xVDD UNIT V 0.2xVDD -2 2 100 TLC77xxI -40 85 TLC77xxQ -40 125 TLC77xxM -55 125 V mA mA ns/ V C To ensure a low supply current, VIL should be kept <0.3 V and VIH > VDD -0.3 V. Copyright (c) 1994-2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 5 TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 SLVS087M - DECEMBER 1994 - REVISED MARCH 2012 www.ti.com ELECTRICAL CHARACTERISTICS over recommended operating conditions (1) (unless otherwise noted) PARAMETER High-level output voltage VOH TEST CONDITIONS IOH = -20 A IOH = 2 -mA Low-Level output voltage VOL IOL = 20 A IOL = 2 mA VDD = 2 V 1.8 VDD = 2.7 V 2.5 VDD = 4.5 V 4.3 VDD = 4.5 V 3.7 MAX 0.2 0.2 VDD = 4.5 V 0.2 VDD = 4.5 V V 0.5 1.04 1.1 1.16 2.18 2.25 2.32 2.56 2.63 2.70 TLC7733 2.86 2.93 3 TLC7705 4.47 4.55 4.63 TLC7703 UNIT V VDD = 2.7 V TLC7725 Negative-going input threshold voltage, SENSE (2) TYP VDD = 2 V TCLC7701 VIT- TLC77xx MIN VDD = 2 V to 6 V TCLC7701 mV 30 TLC7725 Vhus Hysteresis voltage, SENSE TLC7703 VDD = 2 V to 6 V mV 70 TLC7733 TLC7705 Power-up reset voltage (3) Vres II Input current IOL = 20 A 1 RESIN VI = 0 V to VDD 2 CONTROL VI = VDD 7 15 SENSE VI = 5 V 5 10 SENSE, TLC7701 only VI = 5 V IDD Supply current IDD(d) Supply current during td VDD = 5 V, VCT = 0, RESIN = VDD, SENSE = VDD, CONTROL = 0 V, Outputs open CI Input capacitance, SENSE VI = 0 V to VDD 6 A 2 RESIN = VDD, SENSE = VDD VITmax + 0.2 V, CONTROL = 0 V, Outputs open (1) (2) (3) V 9 16 A 120 150 A 50 pF All characteristics are measured with CT = 0.1 F. To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 mF) should be connected near the supply terminals. The lowest supply voltage at which RESET becomes active. The symbol Vres is not currently listed within EIA or JEDEC standards for semiconductor symbology. Rise time of VDD 15 s/V. Submit Documentation Feedback Copyright (c) 1994-2012, Texas Instruments Incorporated Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 www.ti.com SLVS087M - DECEMBER 1994 - REVISED MARCH 2012 ELECTRICAL CHARACTERISTICS over recommended operating conditions (1) (unless otherwise noted) PARAMETER VDD = 2 V IOH = -20 A VOH VDD = 2.7 V High-level output voltage VDD = 4.5 V IOH = -2 A VDD = 4.5 V VDD = 2 V IOL = -20 A VOL VDD = 2.7 V Low-level output voltage VDD = 4.5 V IOL = 2 mA VIT- Negative-going input threshold voltage, SENSE (3) Vhys Hysteresis voltage, SENSE Vres II IDD Power-up reset voltage Input current VDD = 4.5 V TLC7733 TLC7705 TA = 25C 1.8 TA = -55C to 125C 1.7 TA = 25C 2.5 TA = -55C to 125C 2.3 TA = 25C 4.3 TA = -55C to 125C 4.2 TA = 25C 3.7 TA = -55C to 125C 3.6 V V V TA = 25C 0.2 TA = -55C to 125C 0.2 TA = 25C 0.2 TA = -55C to 125C 0.2 TA = 25C 0.2 TA = -55C to 125C 0.2 TA = 25C 0.5 TA = -55C to 125C 0.5 VDD = 2 V to 6 V 2.86 2.93 3.1 4.3 4.5 4.8 70 1 VI = 0 V to VDD 2 CONTROL VI = VDD 7 15 SENSE VI = 5 V 5 10 SENSE, TLC7701 only VI = 5 V TLC7705 Input capacitance, SENSE V V V V V A 2 RESIN = VDD, SENSE = VDD VITmax + 0.2 V CONTROL = 0 V, Outputs open VCT = 0 , RESIN = VDD, CONTROL = 0 V, SENSE = VDD, Outputs open V mV IOL = 20 A Supply current UNIT V RESIN IDD(d) Supply current during td (1) (2) (3) MIN TYP (2) MAX VDD = 2 V to 6 V (2) TLC7733 CI TLC77xxM TEST CONDITIONS 9 VDD = 3.3 V 16 A 250 120 150 VDD = 5 V VI = 0 V to VDD 50 A pF All characteristics are measured with CT = 0.1 F. Typical values apply at TA = 25C. To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 mF) should be connected near the supply terminals. Copyright (c) 1994-2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 7 TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 SLVS087M - DECEMBER 1994 - REVISED MARCH 2012 www.ti.com SWITCHING CHARACTERISTICS at VDD = 5 V, RL = 2 k, CL = 50 pF, TA = 25C (unless otherwise noted) MEASURED PARAMETER td Delay time tPLH Propagation delay time, lowto-high-level output tPHL Propagation delay time, highto-low-level output tPLH Propagation delay time, lowto-high-level output tPHL Propagation delay time, highto-low-level output tPLH Propagation delay time, lowto-high-level output tPHL Propagation delay time, highto-low-level output tPLH Propagation delay time, lowto-high-level output tPHL Propagation delay time, highto-low-level output tPLH Propagation delay time, lowto-high-level output tPHL Propagation delay time, highto-low-level output Low-level minimum pulse duration to switch RESET and RESET tr Rise time tf Fall time (1) 8 FROM (INPUT) TO (OUTPUT) VI(SENSE) VIT+ RESET and RESET TLC77xx TEST CONDITIONS RESIN = 0.7 x VDD, CONTROL = 0.2 x VDD, CT = 100 nF, TA = Full range, See timing diagram MIN TYP MAX 1.1 2.1 4.2 UNIT ms 20 RESET VIH = VIT+max + 0.2 V, VIL = VIT-min - 0.2 V, RESIN = 0.7 x VDD, CONTROL = 0.2 x VDD, CT = NC (1) SENSE 5 s 5 RESET 20 20 RESET RESIN RESET CONTROL RESET VIH = 0.7 x VDD, VIL = 0.2 x VDD, SENSE = VIT+max + 0.2 V, CONTROL = 0.2 x VDD, CT = NC (1) VIH = 0.7 x VDD, VIL = 0.2 x VDD, SENSE = VIT+max + 0.2 V, RESIN = 0.7 x VDD, CT = NC (1) SENSE VIH = VIT+max + 0.2 V, VIL = VIT-min -0.2 V, RESIN VIL = 0.2 x VDD, VIH = 0.7 x VDD RESET and RESET s 40 ns 45 20 s 38 ns 38 ns 10% to 90% 90% to 10% NC = No capacitor, and includes up to 100-pF probe and jig capacitance. Submit Documentation Feedback Copyright (c) 1994-2012, Texas Instruments Incorporated Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 www.ti.com SLVS087M - DECEMBER 1994 - REVISED MARCH 2012 SWITCHING CHARACTERISTICS at VDD = 5 V, RL = 2 k, CL = 50 pF, TA = 25C (unless otherwise noted) MEASURED PARAMETER td Delay time tPLH Propagation delay time, low-to-high-level output tPHL tPLH tPHL tPLH tPHL Propagation delay time, high-to-low-level output Propagation delay time, low-to-high-level output Propagation delay time, high-to-low-level output Propagation delay time, low-to-high-level output Propagation delay time, high-to-low-level output Low-level minimum pulse duration tr tf (1) Rise time Fall time FROM (INPUT) TO (OUTPUT) VI(SENSE) VIT+ RESET and RESET RESET SENSE RESET RESET SENSE RESET RESET RESIN RESET RESET RESIN RESET CONTROL RESET TLC77xxM TEST CONDITIONS RESIN = 2.7 V, CONTROL = 0.4 V, CT = 100 nF, See timing diagram VIH = VIT+max + 0.2 V, VIL = VIT-min - 0.2 V, RESIN = 2.7 V, CONTROL = 0.4 V, CT = NC (1) VIH = VIT+max + 0.2 V, VIL = VIT-min - 0.2 V, RESIN = 2.7 V, CONTROL = 0.4 V, CT = NC (1) VIH = 2.7 V, VIL = 0.4 V, SENSE = VIT+max + 0.2 V, CONTROL = 0.4 V, CT = NC (1) VIH = 2.7 V, VIL = 0.4 V, SENSE = VIT+max + 0.2 V, CONTROL = 0.4 V, CT = NC (1) VIH = 2.7 V, VIL = 0.4 V, SENSE = VIT+max + 0.2 V, RESIN = 2.7 V, CT = NC (1) SENSE VIH = VIT+max + 0.2 V, VIL = VIT-min - 0.2 V RESIN VIL = 0.4 V, VIH = 2.7 V RESET and RESET TA Full range TYP MAX 1.1 2.1 4.2 25C 20 Full range 24 25C 5 Full range 7 25C 5 Full range 7 25C 20 Full range 24 25C 20 Full range 24 25C 45 Full range 65 25C 40 Full range 60 25C 20 Full range 24 25C 38 Full range 58 25C 38 Full Range 58 Full range 3 UNIT ms s s s s s ns ns s ns ns s 1 10% to 90% 90% to 10% MIN 8 Full range 4 ns/V NC = No capacitor, and includes up to 100-pF probe and jig capacitance. Copyright (c) 1994-2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 9 TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 SLVS087M - DECEMBER 1994 - REVISED MARCH 2012 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure 1. RESET and RESET Output Configurations Figure 2. Input Pulse Definition Waveforms 10 Submit Documentation Feedback Copyright (c) 1994-2012, Texas Instruments Incorporated Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 www.ti.com SLVS087M - DECEMBER 1994 - REVISED MARCH 2012 TYPICAL CHARACTERISTICS NORMALIZED INPUT THRESHOLD VOLTAGE vs TEMPERATURE SUPPLY CURRENT vs SUPPLY VOLTAGE Figure 3. Figure 4. HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT Figure 5. Figure 6. Copyright (c) 1994-2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 11 TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 SLVS087M - DECEMBER 1994 - REVISED MARCH 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) 12 INPUT CURRENT vs INPUT VOLTAGE AT SENSE MINIMUM PULSE DURATION AT SENSE vs SENSE THRESHOLD OVERDRIVE Figure 7. Figure 8. Submit Documentation Feedback Copyright (c) 1994-2012, Texas Instruments Incorporated Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 www.ti.com SLVS087M - DECEMBER 1994 - REVISED MARCH 2012 APPLICATION INFORMATION Figure 9. Reset Controller in a Microcomputer System Figure 10. Data Retention During Power Down Using Static CMOS RAMs Copyright (c) 1994-2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 13 TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 SLVS087M - DECEMBER 1994 - REVISED MARCH 2012 www.ti.com Changes from Revision L (February 2003) to Revision M * 14 Page Updated the DRB package Pin Out dimensions and Ordering Information. ........................................................................ 1 Submit Documentation Feedback Copyright (c) 1994-2012, Texas Instruments Incorporated Product Folder Link(s): TLC7701, TLC7725, TLC7703 TLC7733, TLC7705 PACKAGE OPTION ADDENDUM www.ti.com 29-Mar-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-9750901QPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI 5962-9751301Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-9751301QHA ACTIVE CFP U 10 1 TBD Call TI Call TI 5962-9751301QPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI TLC7701ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7701IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7701IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7701IDRBT-NM ACTIVE SON DRB 8 250 Green (RoHS & no Sb/Br) TLC7701IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) TLC7701IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7701IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7701IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7701IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7701IPWLE OBSOLETE TSSOP PW 8 TLC7701IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7701IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7701QD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7701QDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7701QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Addendum-Page 1 Level-2-260C-1 YEAR CU NIPDAU Level-1-260C-UNLIM Call TI Samples (Requires Login) 5962-9750901Q2A CU SN (3) Call TI PACKAGE OPTION ADDENDUM www.ti.com 29-Mar-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) TLC7701QP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7701QPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7701QPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7701QPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7701QPWLE PREVIEW TSSOP PW 8 TLC7701QPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7701QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7703ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7703IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7703IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7703IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7703IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7703IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7703IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7703IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7703IPWLE OBSOLETE TSSOP PW 8 TLC7703IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7703IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7703QD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Addendum-Page 2 CU NIPDAU Level-1-260C-UNLIM Call TI Call TI Samples (Requires Login) TLC7701QDRG4 TBD (3) Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 29-Mar-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) TLC7703QP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7703QPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7703QPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7703QPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7705ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7705IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7705IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7705IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7705IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7705IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7705IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7705IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7705IPWLE OBSOLETE TSSOP PW 8 TLC7705IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7705IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7705MFKB ACTIVE LCCC FK 20 1 TBD TLC7705MJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type TLC7705MJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type TLC7705MUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type TLC7705QD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7705QDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 3 CU NIPDAU Level-1-260C-UNLIM Call TI Samples (Requires Login) TLC7703QDG4 TBD (3) Call TI POST-PLATE N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 29-Mar-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7705QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7705QP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7705QPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7705QPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7705QPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7705QPWLE OBSOLETE TSSOP PW 8 TLC7705QPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7705QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7725ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7725IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7725IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7725IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7725IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7725IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7725IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7725IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7725IPWLE OBSOLETE TSSOP PW 8 TLC7725IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7725IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Addendum-Page 4 Call TI Call TI Samples (Requires Login) TLC7705QDR TBD (3) Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 29-Mar-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7725QDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7725QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7725QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7725QP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7725QPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7725QPWLE OBSOLETE TSSOP PW 8 TLC7725QPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7725QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7733IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7733IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733MFKB ACTIVE LCCC FK 20 1 TBD TLC7733MJG ACTIVE CDIP JG 8 1 TBD Addendum-Page 5 Call TI Call TI POST-PLATE N / A for Pkg Type A42 Samples (Requires Login) TLC7725QD TBD (3) N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 29-Mar-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish A42 MSL Peak Temp (3) Samples (Requires Login) TLC7733MJGB ACTIVE CDIP JG 8 1 TBD N / A for Pkg Type TLC7733QD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733QDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733QP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7733QPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLC7733QPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733QPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733QPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLC7733QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 6 PACKAGE OPTION ADDENDUM www.ti.com (3) 29-Mar-2012 MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLC7701, TLC7705, TLC7705M, TLC7733, TLC7733M : * Catalog: TLC7705, TLC7733 * Automotive: TLC7701-Q1, TLC7705-Q1, TLC7705-Q1, TLC7733-Q1, TLC7733-Q1 * Enhanced Product: TLC7701-EP, TLC7705-EP, TLC7705-EP, TLC7733-EP, TLC7733-EP * Military: TLC7705M, TLC7733M NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Enhanced Product - Supports Defense, Aerospace and Medical Applications * Military - QML certified for Military and Defense Applications Addendum-Page 7 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TLC7701IDR Package Package Pins Type Drawing SOIC D 8 TLC7701IDRBT-NM SON DRB TLC7701IPWR TSSOP PW TLC7701QDR SOIC TLC7701QPWR TSSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TLC7703IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC7703IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TLC7705IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC7705IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TLC7705QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC7705QPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TLC7725IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC7725IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TLC7725QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC7725QPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TLC7733IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC7733IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC7733IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TLC7733QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC7733QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLC7733QPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLC7701IDR SOIC D 8 2500 367.0 367.0 35.0 TLC7701IDRBT-NM SON DRB 8 250 210.0 185.0 35.0 TLC7701IPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7701QDR SOIC D 8 2500 367.0 367.0 35.0 TLC7701QPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7703IDR SOIC D 8 2500 367.0 367.0 35.0 TLC7703IPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7705IDR SOIC D 8 2500 367.0 367.0 35.0 TLC7705IPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7705QDR SOIC D 8 2500 367.0 367.0 35.0 TLC7705QPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7725IDR SOIC D 8 2500 367.0 367.0 35.0 TLC7725IPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7725QDR SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLC7725QPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7733IDR SOIC D 8 2500 367.0 367.0 35.0 TLC7733IDR SOIC D 8 2500 367.0 367.0 35.0 TLC7733IPWR TSSOP PW 8 2000 367.0 367.0 35.0 TLC7733QDR SOIC D 8 2500 367.0 367.0 35.0 TLC7733QDR SOIC D 8 2500 367.0 367.0 35.0 TLC7733QPWR TSSOP PW 8 2000 367.0 367.0 35.0 Pack Materials-Page 3 MECHANICAL DATA MCER001A - JANUARY 1995 - REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0-15 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. 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