5962-8953702UA(CYPRESS) - e2v Aerospace & Defense

REVISIONS

LTR DESCRIPTION DATE (YR-MO-DA) APPROVED

A

Updated boilerplate. Added device type 03. Moved endurance and

data retention testing requirements from Section 4 of drawing to

Section 3 of drawing. Converted case outline "Y" to standard

package. Editorial changes throughout.

94-03-31

M. A. Frye

B

Boilerplate update, part of 5 year review. ksr

06-02-10

Raymond Monnin

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

REV B B B B B B B B B B B B

OF SHEETS

SHEET 1 2 3 4 5 6 7 8 9

10

11

12

PMIC N/A

PREPARED BY

Kenneth Rice

DEFENSE SUPPLY CENTER COLUMBUS

STANDARD

MICROCIRCUIT

DRAWING

CHECKED BY

Ray Monnin

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

THIS DRAWING IS

AVAILABLE

FOR USE BY All

DEPARTMENTS

APPROVED BY

D. R. Cool

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

DRAWING APPROVAL DATE

89-01-26

MICROCIRCUITS, MEMORY,

DIGITAL, 16K X 8 UV EPROM,

MONOLITHIC SILICON

AMSC N/A

REVISION LEVEL

B

SIZE

A

CAGE CODE

67268

5962-89537

SHEET

1 OF

12

DSCC FORM 2233

APR 97 5962-E225-06

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-89537

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

B

SHEET

2

DSCC FORM 2234

APR 97

1. SCOPE

1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in

accordance with MIL-PRF-38535, appendix A.

1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:

5962-89537 01 X A

| | | |

Drawing number Device type Case outline Lead finish

(see 1.2.1) (see 1.2.2) (see 1.2.3)

1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit Access time

01 (see 6.6) 16K x 8-bit UV EPROM 65 ns

02 (see 6.6) 16K x 8-bit UV EPROM 55 ns

03 (see 6.6) 16K x 8-bit UV EPROM 45 ns

1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows:

Outline letter Descriptive designator Terminals Package style 1/

Y CDIP3-T28 or GDIP4-T28 28 Dual-in-line

Z GDFP2-F28 28 Flat package

U CQCC1-N32 32 Rectangular leadless chip carrier

1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.

1.3 Absolute maximum ratings.

Supply voltage range to ground potential (VCC) ................................... -0.5 V dc to +7.0 V dc

DC voltage range applied to the outputs in the high Z state ................ -0.5 V dc to +7.0 V dc

DC input voltage ................................................................................. -3.0 V dc to +7.0 V dc

Maximum power dissipation ................................................................ 1.0 W 2/

Lead temperature (soldering, 10 seconds) .......................................... +260°C

Thermal resistance, junction-to-case (ΘJC) ....................................... See MIL-STD-1835

Junction temperature (TJ) ................................................................... +175°C

Storage temperature range (TSTG)....................................................... -65°C to +150°C

Temperature under bias ...................................................................... -55°C to +125°C

Data retention...................................................................................... 10 years, minimum

Endurance........................................................................................... 25 cycles/byte, minimum

1.4 Recommended operating conditions.

Case operating temperature range (TC).............................................. -55°C to +125°C

Input high voltage range (VIH).............................................................. +2.0 V dc

Input low voltage range (VIL)................................................................ +0.8 V dc

Supply voltage range (VCC).................................................................. +4.5 V dc to +5.5 V dc

1/ Lid shall be transparent to permit ultraviolet light erasure.

2/ Must withstand the added PD due to short circuit test; e.g. , IOS.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-89537

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

B

SHEET

3

DSCC FORM 2234

APR 97

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a

part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in

the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or

from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-

JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer

Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-

38535 may be processed as QML product in accordance with the manufacturer's approved program plan and qualifying activity

approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make

modifications to the requirements herein. These modifications shall not affect the PIN as described herein. A "Q" or "QML"

certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535, appendix A and herein.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Truth table. The truth table shall be as specified on figure 2.

3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing

shall be as specified on figure 2. When testing is required per 4.3 herein, the devices shall be programmed by the manufacturer

prior to test in a checkerboard pattern (a minimum of 50 percent of the total number of bits programmed) or to any altered item

drawing pattern which includes at least 25 percent of the total number of bits programmed.

3.2.3.2 Programmed devices. The truth table for programmed devices shall be specified by an altered item drawing.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-89537

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

B

SHEET

4

DSCC FORM 2234

APR 97

3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed

in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where the entire SMD PIN number is not

feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.

3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance

to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in

accordance with MIL-PRF-38535 to identify when the QML flow option is used.

3.6 Processing EPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the

manufacturer prior to delivery.

3.6.1 Erasure of EPROMS. When specified, devices shall be erased in accordance with the procedures and characteristics

specified in 4.4.

3.6.2 Programmability of EPROMS. When specified, devices shall be programmed to the specified pattern using the

procedures and characteristics specified in 4.5.

3.6.3 Verification of state of EPROMS. When specified, devices shall be verified as either programmed to the specified

pattern or erased. As a minimum, verification shall consist of performing a functional test (subgroup 7) to verify that all bits are

in the proper state. Any bit that does not verify to be in the proper state shall constitute a device failure and shall be removed

from the lot.

3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an

approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to

listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,

appendix A and the requirements herein.

3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided

with each lot of microcircuits delivered to this drawing.

3.9 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.

3.10 Verification and review. DSCC, DSCC's agent and the acquiring activity retain the option to review the manufacturer's

facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the

reviewer.

3.11 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This

reprogrammability test shall be done for initial characterization and after any design or process changes which may affect the

reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of

program/erase endurance cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure

shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along with

test data.

3.12 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall

be done for initial characterization and after any design or process change which may affect data retention. The methods and

procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military

temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of

the acquiring or preparing activity, along with test data.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-89537

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

B

SHEET

5

DSCC FORM 2234

APR 97

TABLE I. Electrical performance characteristics.

Limits

Test

Symbol Conditions 1/

-55°C ≤ TA ≤ +125°C

4.5 V dc ≤ VCC ≤ 5.5 V dc

unless otherwise specified

Group A

subgroups

Device

types Min Max

Unit

Output low voltage

VOL

VIN = VIH or VIL ,

IOL = 16 mA, VCC = 4.5 V

1, 2, 3 All 0.5

Output high voltage

VOH

VIN = VIH or VIL ,

IOH = -4.0 mA, VCC = 4.5 V

1, 2, 3 All 2.4

V

Input high voltage 2/

VIH

1, 2, 3 All 2.0

Input low voltage 2/

VIL

1, 2, 3 All 0.8

V

Input leakage current

IIX

VIN = GND to 5.5 V 1, 2, 3 All -10 +10 µA

Output leakage current

IOZ

VCC = 5.5 V, IOUT = 0 mA

VOUT = GND and 5.5 V

1, 2, 3 All -40 +40 µA

Output short circuit

current

IOS

3/ 4/

VCC = 5.5 V, VOUT =0.0 V 1, 2, 3 All -20 -90 mA

Power supply current

ICC

VCC = 5.5 V, IOUT = 0 mA

f = 16.7 MHz

Inputs cycling from 0 to 3 V

1, 2, 3 All 120 mA

Standby supply current

ISB

VCC = 5.5 V, IOUT = 0 mA

VIN = 2.0 V

1, 2, 3 All 35 mA

Input capacitance

CIN

4/

VIN = 0 V, VCC = 5.0 V

f = 1 Mhz, TA = +25°C

See 4.3.1c

4

All

10

pF

Output capacitance

COUT

4/

VOUT = 0 V, VCC = 5.0 V

f = 1 Mhz, TA = +25°C

See 4.3.1c

4

All

10

pF

Functional tests

See 4.3.1e 7, 8A, 8B All

01 65

02 55

Address to output valid

tAA

9, 10, 11 03 45

ns

01 35

02 30

Chip select active to

output valid 5/

tACS1

9, 10, 11 03 25

ns

01 70

02 60

Chip select active to

output valid 6/

tACS2

See figure 4

9, 10, 11 03 50

ns

See footnotes at end of table.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-89537

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

B

SHEET

6

DSCC FORM 2234

APR 97

TABLE I. Electrical performance characteristics - Continued.

Limits

Test Symbol Conditions 1/

-55°C ≤ TA ≤ +125°C

4.5 V dc ≤ VCC ≤ 5.5 V dc

unless otherwise specified

Group A

subgroups

Device

types Min Max

Unit

Chip select active to

power_up 4/ 6/ 7/

tPU 9, 10, 11 All 0 ns

01 70

02 60

Chip select inactive to

power_down 4/ 6/ 7/

tPD

9, 10, 11 03 50

ns

01 35

02 30

Chip select inactive to

high-Z 4/ 5/ 7/

tHZCS1

9, 10, 11 03 25

ns

01 70

02 60

Chip select active to

high-Z 4/ 6/ 7/

tHZCS2

See figure 4

VCC = 4.5 V

9, 10, 11 03 50

ns

1/ AC tests are performed with input rise and fall times of 5 ns or less, timing reference levels of 1.5 V, input pulse levels of

0 V to 3.0 V, and the output load in figure 3, circuit A.

2/ These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.

3/ For test purposes, not more than one output at a time may be shorted. Short circuit test duration should not exceed one

second.

4/ Tested initially and after any design or process change which may affect that parameter, and therefore shall be

guaranteed to the limits specified in table I.

5/ Parameter applies to CS 2, CS3, and CS 4.

6/ Parameter applies only to CS 1.

7/ Transition is measured at steady-state high level -500 mV or steady-state low level +500 mV on the output from 1.5 V

level on the input and the output load in figure 3, circuit B.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-89537

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

B

SHEET

7

DSCC FORM 2234

APR 97

Device types 01 - 03

Case outlines Y , Z U

Terminal number Terminal symbol

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

A9

A8

A7

A6

A5

A4

A3

A2

A1

A0

O0

O1

O2

GND

O3

O4

O5

O6

O7

CS4

CS3

CS2

CS1

A13

A12

A11

A10

VCC

---

A9

A8

A7

A6

A5

A4

A3

A2

A1

A0

NC

O0

O1

O2

NC

GND

O3

NC

O4

O5

O6

O7

NC

CS4

CS3

CS2

CS1

A13

A12

A11

A10

VCC

NC = no connection

FIGURE 1. Terminal connections.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-89537

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

B

SHEET

8

DSCC FORM 2234

APR 97

Mode

CS 4

CS3

CS 2

CS 1

A13 - A0

Power

Outputs

Read VIL VIH

VIL VIL X ICC

DOUT

Output disable X X X VIH

X ISB

High Z

Output disable X X VIH X X ICC

High Z

Output disable X VIL X X X ICC

High Z

Output disable VIH X X X X ICC

High Z

1/ X can be either VIL or VIH.

2/ For VPP see 4.5.

FIGURE 2. Truth table.

Note: Including scope and jig capacitance.

FIGURE 3. Output load circuits.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-89537

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

B

SHEET

9

DSCC FORM 2234

APR 97

Note: Power down controlled by CS 1 only.

FIGURE 4. Switching waveforms.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-89537

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

B

SHEET

10

DSCC FORM 2234

APR 97

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A.

4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices

prior to quality conformance inspection. The following additional criteria shall apply:

a. Burn-in test (method 1015 of MIL-STD-883).

(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision

level control and shall be made available to the preparing or procuring activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in

method 1015 of MIL-STD-883.

(2) TA = +125°C, minimum.

b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter

tests prior to burn-in are optional at the discretion of the manufacturer.

c. All devices processed to an altered item drawing may be programmed either before or after burn-in at the discretion of

the manufacturer. The required electrical testing shall include, as a minimum, the final electrical tests for programmed

devices as specified in table II.

4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883

including groups A, B, C, and D inspections. The following additional criteria shall apply.

4.3.1 Group A inspection.

a. Tests shall be as specified in table II herein.

b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.

c. Subgroup 4 (CIN and COUT measurements) shall be measured only for initial test and after any process or design

changes which may affect input or output capacitance. Sample size is 15 devices with no failures, and all input and

output terminals tested.

d. Devices shall be tested for programmability and ac performance compliance to the requirements of group A, subgroups

9, 10, and 11. Either of two techniques is acceptable:

(1) Testing the entire lot using additional built-in test circuitry which allows the manufacturer to verify programmability

and ac performance without programming the user array. If this is done, the resulting test patterns shall be verified

on all devices during subgroups 9, 10, and 11, group A testing in accordance with the sampling plan specified in

MIL-STD-883, method 5005.

(2) If such compliance cannot be tested on an unprogrammed device, a sample shall be selected to satisfy

programmability requirements prior to performing subgroups 9, 10, and 11. Twelve devices shall be submitted to

programming (see 3.2.3.1). If more than two devices fail to program, the lot shall be rejected. At the

manufacturer's option, the sample may be increased to 24 total devices with no more than 4 total device failures

allowable. Ten devices from the programmability sample shall be submitted to the requirements of group A,

subgroups 9, 10, and 11. If more than two devices fail, the lot shall be rejected. At the manufacturer's option, the

sample may be increased to 20 total devices with no more than 4 total device failures allowable.

e. Subgroups 7 and 8 shall include verification of the pattern specified in 4.3.1d.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-89537

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

B

SHEET

11

DSCC FORM 2234

APR 97

4.3.2 Groups C and D inspections.

a. End-point electrical parameters shall be as specified in table II herein.

b. Steady-state life test conditions, method 1005 of MIL-STD-883.

(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level

control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify

the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test

method 1005 of MIL-STD-883.

(2) TA = +125°C, minimum.

(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.

c. All devices selected for testing shall be programmed with a checkerboard pattern or equivalent. After completion of all

testing, the devices shall be erased and verified.

4.4 Erasing procedure. The recommended erasure procedure for the device is exposure to shortwave ultraviolet light which has

a wavelength of 2537 Angstroms (Å). The integrated dose (i.e., UV intensity x exposure time) for erasure should be a minimum

of 25 Ws/cm2. The erasure time with this dosage is approximately 35 minutes using an ultraviolet lamp with a 12000 µW/cm2

power rating. The device should be placed within 1 inch of the lamp tubes during erasure. The maximum integrated dose the

device can be exposed to without damage is 7258 Ws/cm2 (1 week at 12000 µW/cm2). Exposure of EPROMS to high intensity

UV light for long periods may cause permanent damage.

4.5 Programming procedures. The programming procedures shall be as specified by the device manufacturer.

TABLE II. Electrical test requirements. 1/ 2/ 3/ 4/

MIL-STD-883 test requirements Subgroups

(in accordance with 5005, table I)

Interim electrical parameters

(method 5004)

1

Final electrical test parameters

(method 5004) for unprogrammed devices

1*, 2, 3, 7*, 8A, 8B

Final electrical test parameters

(method 5004) for programmed devices

1*, 2, 3, 7*, 8A, 8B, 9

Group A test requirements

(method 5004)

1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11

Group C and D end-point electrical

parameters (method 5005)

2, 3, 7, 8A, 8B

1/ *Indicates PDA applies to subgroups 1 and 7.

2/ Any or all subgroups may be combined when using high-speed testers.

3/ **See 4.3.1c.

4/ As a minimum, subgroups 7 and 8 shall consist of verifying the data pattern.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-89537

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

B

SHEET

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DSCC FORM 2234

APR 97

5. PACKAGING

5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.

6. NOTES

6.1 Intended use. Microcircuits conforming to this drawing are intended for use for government microcircuit applications

(original equipment), design applications, and logistics purposes.

6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-

prepared specification or drawing.

6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the

individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.

6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system

application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used

for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962)

should contact DSCC-VA, telephone (614) 692-0544.

6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614)

692-0547.

6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-

103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-

VA.

STANDARD MICROCIRCUIT DRAWING BULLETIN

DATE: 06-02-10

Approved sources of supply for SMD 5962-89537 are listed below for immediate acquisition information only and shall

be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised

to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate

of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next

dated revisions of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of

supply at http://www.dscc.dla.mil/Programs/Smcr/.

Standard

microcircuit

drawing PIN 1/

Vendor

CAGE

number

Vendor

similar

PIN 2/

5962-8953701YA 0C7V7 CY7C251-65WMB

5962-8953701ZA 3/ CY7C251-65TMB

5962-8953701UA 0C7V7 CY7C251-65QMB

5962-8953702YA 0C7V7 CY7C251-55WMB

5962-8953702ZA 3/ CY7C251-55TMB

5962-8953702UA 0C7V7 CY7C251-55QMB

5962-8953703YA 0C7V7 CY7C251-45WMB

5962-8953703ZA 3/ CY7C251-45TMB

5962-8953703UA 0C7V7 CY7C251-45QMB

1/ The lead finish shown for each PIN representing a hermetic package

is the most readily available from the manufacturer listed for that part.

If the desired lead finish is not listed contact the Vendor to determine

its availability.

2/ Caution. Do not use this number for item acquisition. Items acquired

to this number may not satisfy the performance requirements of this

drawing.

3

/ No longer available from an approved source.

Vendor CAGE Vendor name

number and address

0C7V7 QP Semiconductor

2945 Oakmead Village Court

Santa Clara, CA 95051

The information contained herein is disseminated for convenience only

and the Government assumes no liability whatsoever for any

inaccuracies in the information bulletin.