8818A–SEEPROM–12/2012
Features
Medium-voltage and standard-voltage operation
2.5 (VCC = 2.5V to 5.5V)
Automotive temperature range –40C to 125C
Internally organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K), or 1024 x 8 (8K)
2-wire serial interface
Schmitt Trigger, filtered inputs for noise suppression
Bidirectional data transfer protocol
400kHz (2.5V) compatibility
Write Protect pin for hardware data protection
8-byte page (1K, 2K) or 16-byte page (4K, 8K) write modes
Partial page writes are allowed
Self-timed Write Cycle (5 ms max)
High reliability
Endurance: 1,000,000 write cycles
Data retention: 100 years
8-lead JEDEC SOIC and 8-lead TSSOP packages
Description
The Atmel® AT24C01C/02C/04C/08C provides 1024/2048/4096/8192 bits of Serial
Electrically Erasable and Programmable Read-Only Memory (EEPROM) organized as
128/256/512/1024 words of eight bits each. The device is optimized for use in many
automotive applications where low-power and low-voltage operation are essential.
AT24C01C/02C/04C/08C is available in space-saving 8-lead JEDEC SOIC and 8-lead
TSSOP packages and is accessed via a 2-wire serial interface. In addition, the entire
family is available in 2.5V (2.5V to 5.5V) versions.
Atmel AT24C01C, Atmel AT24C02C
Atmel AT24C04C, Atmel AT24C08C
2-wire Automotive Temperature Serial EEPROMs
1K (128 x 8), 2K (256 x 8), 4K (512 x 8), 8K (1024 x 8)
DATASHEET
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Atmel AT24C01C/02C/04C/08C Automotive [DATASHEET]
8818A–SEEPROM–12/2012
1. Pin Configurations and Pinouts
Table 1-1. Pin Configurations
Figure 1-1. Pinouts
2. Absolute Maximum Ratings*
Pin Name Function
A0Address Input (1K and 2K)
A1Address Input (1K, 2K, and 4K)
A2Address Input (1K, 2K, 4K, and 8K)
GND Ground
SDA Serial Data
SCL Serial Clock Input
WP Write Protect
VCC Device Power Supply
1
2
3
4
8
7
6
5
A0
A1
A2
GND
VCC
WP
SCL
SDA
8-lead SOIC 8-lead TSSOP
Top View
1
2
3
4
8
7
6
5
A0
A1
A2
GND
VCC
WP
SCL
SD
A
Top View
Operating Temperature . . . . . . . . . . .55C to +125C
Storage Temperature . . . . . . . . . . . .65C to +150C
Voltage on any pin
with respect to ground . . . . . . . . . . . . . .1.0V to +7.0V
Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V
DC Output Current. . . . . . . . . . . . . . . . . . . . . . .5.0mA
*Notice: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage
to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
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Atmel AT24C01C/02C/04C/08C Automotive [DATASHEET]
8818A–SEEPROM–12/2012
3. Block Diagram
Start
Stop
Logic
VCC
GND
WP
SCL
SDA
A2
A1
A0
Serial
Control
Logic
EN H.V. Pump/Timing
EEPROM
Data Recovery
Serial MUX
X DEC
DOUT/ACK
Logic
COMP
LOAD INC
Data Word
ADDR/Counter
Y DEC
R/W
DOUT
DIN
LOAD
Device
Address
Comparator
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8818A–SEEPROM–12/2012
4. Pin Description
Serial Clock (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge
clock data out of each device.
Serial Data (SDA): The SDA pin is bi-directional for serial data transfer. This pin is open-drain driven and may be
wire-ORed with any number of other open-drain or open-collector devices.
Device/Page Addresses (A2, A1, A0): The A2, A1, and A0 pins are device address inputs that are hard wired for the
AT24C01C/02C/04C/08C. As many as eight 1K/2K devices may be addressed on a single bus system (device
addressing is discussed in detail in Section 6. “Device Operation”).
The AT24C04C uses the A2 and A1 inputs for hardwire addressing and a total of four 4K devices may be addressed on a
single bus system. The A0 pin is a no connect.
The AT24C08C only uses the A2 input for hardwire addressing and a total of two 8K devices may be addressed on a
single bus system. The A0 and A1 pins are no connect.
Write Protect (WP): AT24C01C/02C/04C/08C has a Write Protect pin that provides hardware data protection. The Write
Protect pin allows normal read/write operations when connected to ground (GND). When the Write Protect pin is
connected to VCC, the write protection feature is enabled and operates as shown in the following table.
Figure 4-1. Write Protect
WP Pin
Status
Part of the Array Protected
AT24C01C/02C/04C/08C
At VCC Full Array
At GND Normal Read/Write Operations
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Atmel AT24C01C/02C/04C/08C Automotive [DATASHEET]
8818A–SEEPROM–12/2012
5. Memory Organization
AT24C01C, 1K Serial EEPROM: Internally organized with 16 pages of 8 bytes each, the 1K requires a 7-bit data word
address for random word addressing.
AT24C02C, 2K Serial EEPROM: Internally organized with 32 pages of 8 bytes each, the 2K requires an 8-bit data word
address for random word addressing.
AT24C04C, 4K Serial EEPROM: Internally organized with 32 pages of 16 bytes each, the 4K requires a 9-bit data word
address for random word addressing.
AT24C08C, 8K Serial EEPROM: Internally organized with 64 pages of 16 bytes each, the 8K requires a 10-bit data word
address for random word addressing.
Table 5-1. Pin Capacitance(1)
Note: 1. This parameter is characterized and is not 100% tested.
Table 5-2. DC Characteristics
Note: 1. VIL min and VIH max are reference only and are not tested.
Applicable over recommended operating range from TA = 25C, f = 400KHz, VCC = 2.5V.
Symbol Test Condition Max Units Conditions
CI/O Input/Output Capacitance (SDA) 8 pF VI/O = 0V
CIN Input Capacitance (A0, A1, A2, SCL) 6 pF VIN = 0V
Applicable over recommended operating range from: TA = 40C to +125C,
VCC = 2.5V to 5.5V (unless otherwise noted).
Symbol Parameter Test Condition Min Typ Max Units
VCC1 Supply Voltage 2.5 5.5 V
ICC Supply Current VCC = 5.0V Read at 100kHz 0.4 1.0 mA
ICC Supply Current VCC = 5.0V Write at 100kHz 2.0 3.0 mA
ISB1 Standby Current VCC = 2.5V VIN = VCC or VSS 1.6 4.0 μA
ISB2 Standby Current VCC = 5.0V VIN = VCC or VSS 4.0 6.0 μA
ILI Input Leakage Current VIN = VCC or VSS 0.10 3.0 μA
ILO Output Leakage Current VOUT = VCC or VSS 0.05 3.0 μA
VIL Input Low Level(1) 0.6 VCC x 0.3 V
VIH Input High Level(1) VCC x 0.7 VCC + 0.5 V
VOL Output Low Level VCC = 2.5V IOL = 3.0mA 0.4 V
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8818A–SEEPROM–12/2012
Table 5-3. AC Characteristics
Notes: 1. This parameter is characterized and is not 100% tested (TA = 25C).
2. This parameter is characterized only.
Applicable over recommended operating range from TA = 40C to 125C, VCC = 2.5V to 5.5V,
CL = 1 TTL Gate and 100pF (unless otherwise noted)
Symbol Parameter Min Max Units
fSCL Clock Frequency, SCL 400 kHz
tLOW Clock Pulse Width Low 1200 ns
tHIGH Clock Pulse Width High 600 ns
tINoise Suppression Time(1) 50 ns
tAA Clock Low to Data Out Valid 100 90 ns
tBUF
Time the bus must be free before a new transmission
can start(2) 1200 ns
tHD.STA Start Hold Time 600 ns
tSU.STA Start Set-up Time 600 ns
tHD.DAT Data In Hold Time 0 ns
tSU.DAT Data In Set-up Time 100 ns
tRInputs Rise Time(2) 300 ns
tFInputs Fall Time(2) 300 ns
tSU.STO Stop Set-up Time 600 ns
tDH Data Out Hold Time 50 ns
tWR Write Cycle Time 5 ms
Endurance(2) 5.0V, 25C, Page Mode 1,000,000 Write Cycles
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8818A–SEEPROM–12/2012
6. Device Operation
Clock and Data Transitions: The SDA pin is normally pulled high with an external device. Data on the SDA pin may
change only during SCL low time periods (see Figure 6-4 on page 9). Data changes during SCL high periods will indicate
a Start or Stop condition as defined below.
Start Condition: A high-to-low transition of SDA with SCL high is a Start condition which must precede any
other command (see Figure 6-5 on page 9).
Stop Condition: A low-to-high transition of SDA with SCL high is a Stop condition. After a read sequence, the Stop
command will place the EEPROM in a standby power mode (see Figure 6-5 on page 9).
Acknowledge: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. The
EEPROM sends a zero to acknowledge that it has received each word. When the EEPROM is reading data out, the host
will transmit an ACK after each data word to indicate that the next word can be transmitted.This happens during the ninth
clock cycle.
Standby Mode: AT24C01C/02C/04C/08C features a low-power standby mode which is enabled:
Upon power-up.
After the receipt of the Stop bit and the completion of any internal operations.
2-wire Software Reset: After an interruption in protocol, power loss, or system reset, any 2-wire part can be protocol
reset by following these steps:
1. Create a Start bit condition.
2. Clock nine cycles.
3. Create another Start bit followed by Stop bit condition as shown in the following figures.
The device is ready for next communication after above steps have been completed.
Figure 6-1. Software Reset
SCL
SDA
9
8321
Start
Bit
Start
Bit
Stop
Bit
Dummy Clock Cycles
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8818A–SEEPROM–12/2012
Figure 6-2. Bus Timing
SCL: Serial Clock, SDA: Serial Data I/O
Figure 6-3. Write Cycle Timing
SCL: Serial Clock, SDA: Serial Data I/O
Note: 1. The write cycle time tWR is the time from a valid Stop condition of a write sequence to the end of the internal
clear/write cycle.
SCL
SDA IN
SDA OUT
tF
tHIGH
tLOW tLOW
tR
tAA tDH tBUF
tSU.STO
tSU.DAT
tHD.DAT
tHD.STA
tSU.STA
twr
(1)
Stop
Condition
Start
Condition
WORDn
ACK
8th Bit
SCL
SDA
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8818A–SEEPROM–12/2012
Figure 6-4. Data Validity
Figure 6-5. Start and Stop Definition
Figure 6-6. Output Acknowledge
SDA
SCL
Data Stable Data Stable
Data
Change
SDA
SCL
Start Stop
SCL
DATA IN
DATA OUT
Start Acknowledge
9
8
1
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Atmel AT24C01C/02C/04C/08C Automotive [DATASHEET]
8818A–SEEPROM–12/2012
7. Device Addressing
The 1K/2K/4K/8K EEPROM devices require an 8-bit device address word following a Start condition to enable the device
for a read or write operation (see Figure 9-1 on page 11).
The device address word consists of a mandatory '1010' sequence for the first four Most Significant Bits (MSB) as
shown. This is common to all the Serial EEPROM devices.
For the 1K/2K EEPROM, the next three bits are the A2, A1, and A0 device address bits. These three bits must compare
to their corresponding hardwired input A2, A1, and A0 pins.
The 4K EEPROM only uses the A2 and A1 device address bits with the A0 bit being a memory address bit (P0) (see
Figure 9-1 on page 11). The two device address bits must compare to their corresponding hardwired input A2 and A1
pins. The A0 pin is not connected.
The 8K EEPROM only uses the A2 device address bit with the next two bits (P1, P0) being for memory page addressing
(See Figure 9-1 on page 11). The A2 bit must compare to its corresponding hardwired input pin. The A1 and A0 pins are
not connected.
The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and
a write operation is initiated if this bit is low.
After a valid comparison of the device address, the EEPROM will output a zero. If the comparison is invalid, the device
will return to a standby state.
8. Write Operations
Byte Write: A write operation requires an 8-bit data word address following the device address word and
acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the first
8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the addressing device, such
as a microcontroller, must terminate the write sequence with a Stop condition. At this time, the EEPROM enters an
internally timed write cycle (tWR) to the nonvolatile memory. All inputs are disabled during this write cycle, and the
EEPROM will not respond until the write is complete (see Figure 9-2 on page 11).
Page Write: The 1K/2K EEPROM are capable of an 8-byte Page Write. The 4K/8K EEPROM devices are capable of
16-byte Page Writes.
A Page Write is initiated the same as a Byte Write, but the microcontroller does not send a Stop condition after the first
data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can
transmit up to seven (1K/2K) or fifteen (4K/ 8K) more data words. The EEPROM will respond with a zero after each data
word received. The microcontroller must terminate the Page Write sequence with a Stop condition (see Figure 9-3 on
page 12).
The data word address lower three (1K/2K) or four (4K/8K) bits are internally incremented following the receipt of each
data word. The higher data word address bits are not incremented, retaining the memory page row location. When the
word address, internally generated, reaches the page boundary, the next byte sent will be written to the beginning
address on the same page. In order words, if more than eight (1K/2K) or sixteen (4K/8K) data words are transmitted to
the EEPROM, the data word address will “roll over” and the data previously sent to the device at the beginning of the
page write sequence will be altered.
Acknowledge Polling: Once the internally timed write cycle has started and the EEPROM inputs are disabled,
Acknowledge Polling can be initiated. This involves sending a start condition followed by the device address word. The
read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM
respond with a zero, allowing the read or write sequence to continue.
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8818A–SEEPROM–12/2012
9. Read Operations
Read operations are initiated the same way as write operations with the exception that the read/write select bit in the
device address word is set to one. There are three read operations: Current Address Read, Random Address Read and
Sequential Read.
Current Address Read: The internal data word address counter maintains the last address accessed during the last
read or write operation, incremented by one. This address stays valid between operations as long as the chip power is
maintained. The address “roll over” during read is from the last byte of the last memory page to the first byte of the first
page. The address “roll over” during write is from the last byte of the current page to the first byte of the same page.
Once the device address with the read/write select bit set to one is clocked in and acknowledged by the EEPROM, the
current address data word is serially clocked out. To end the command, the microcontroller does not respond with a zero
but does generate a Stop condition in the subsequent clock cycle.(see Figure 9-4 on page 12).
Random Read: A Random Read requires a dummy byte write sequence to load in the data word address. Once the
device address word and data word address are clocked in and acknowledged by the EEPROM, the microcontroller must
generate another Start condition. The microcontroller now initiates a Current Address Read by sending a device address
with the read/write select bit high. The EEPROM acknowledges the device address and serially clocks out the data word.
To end the command, the microcontroller does not respond with a zero but does generate a Stop condition in the
subsequent clock cycle. (see Figure 9-5 on page 12).
Sequential Read: Sequential Reads are initiated by either a Current Address Read or a Random Address Read. After
the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an
acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the
memory address limit is reached, the data word address will “roll over” and the Sequential Read will continue. To end the
command, the microcontroller does not respond with a zero but does generate a Stop condition in the subsequent clock
cycle. (see Figure 9-6 on page 13).
Figure 9-1. Device Address
Figure 9-2. Byte Write
MSB LSB
1K/2K
4K
8K
1 0 1 0 A2 A1 A0 R/W
1 0 1 0 A2 A1 P0 R/W
1 0 1 0 A2 P1 P0 R/W
S
T
A
R
T
W
R
I
T
E
S
T
O
P
Device
Address Word Address Data
SDA Line
M
S
B
M
S
B
A
C
K
R
/
W
A
C
K
L
S
B
L
S
B
A
C
K
* = Don’t care bit for 1K
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8818A–SEEPROM–12/2012
Figure 9-3. Page Write
Figure 9-4. Current Address Read
Figure 9-5. Random Read
SDA Line
S
T
A
R
T
W
R
I
T
E
Device
Address Word Address (n) Data (n + 1)Data (n) Data (n + x)
M
S
B
A
C
K
M
S
B
L
S
B
R
/
W
A
C
K
A
C
K
A
C
K
A
C
K
S
T
O
P
S
T
O
P
*
= Don’t care bit for 1K
SDA Line
S
T
A
R
T
Device
Address
R
E
A
D
S
T
O
P
M
S
B
A
C
K
L
S
B
R
/
W
N
O
A
C
K
Data
Word Address (n) Data (n)Device Address Device Address
S
T
A
R
T
S
T
A
R
T
R
E
A
D
W
R
I
T
E
S
T
O
P
A
C
K
N
O
A
C
K
A
C
K
R
/
W
M
S
B
M
S
B
A
C
K
SDA Line
Dummy Write
* = Don’t care bit for 1K
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8818A–SEEPROM–12/2012
Figure 9-6. Sequential Read
9.1 Power Recommendations
The device internal POR (Power-On Reset) threshold is just below the minimum device operating voltage. Power shall
rise monotonically from 0.0Vdc to full VCC in less than 1ms, and then be held at full VCC for at least 100μs before the first
operation. Power shall drop from full VCC to 0.0Vdc in less than 1ms. Power dropping to a non-zero level and then slowly
going to zero is not recommended. Power shall remain off (0.0Vdc) for 0.5s minimum. Please consult Atmel if your power
conditions do not meet the above recommendations.
SDA Line
Device
Address
R
E
A
D
A
C
K
A
C
K
A
C
K
S
T
O
P
A
C
K
R
/
W
N
O
A
C
K
Data (n) Data (n + 1) Data (n + 2) Data (n + x)
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8818A–SEEPROM–12/2012
10. Product Markings
DRAWING NO. REV. TITLE
24C01-02-04-08CAM B
11/13/12
24C01-02-04-08CAM, AT24C01C, AT24C02C, AT24C04C, and
AT24C08C Automotive Package Marking Information
Package Mark Contact:
DL-CSO-Assy_eng@atmel.com
AAAAAAAA
###D @
ATMLPYWW
8-lead SOIC 8-lead TSSOP
AAAAAAA
###D @
ATPYWW
Note 2: Package drawings are not to scale
Note 1: designates pin 1
AT24C01C, AT24C02C, AT24C04C and AT24C08C: Package Marking Information
Catalog Number Truncation
AT24C01C Truncation Code ###: 01C
AT24C02C Truncation Code ###: 02C
AT24C04C Truncation Code ###: 04C
AT24C08C Truncation Code ###: 08C
Date Codes Voltages
Y = Year WW = Work Week of Assembly % = Minimum Voltage
2: 2012 6: 2016 02: Week 2 D: 2.5V min
3: 2013 7: 2017 04: Week 4
4: 2014 8: 2018 ...
5: 2015 9: 2019 52: Week 52
Country of Assembly Lot Number Grade/Lead Finish Material
@ = Country of Assembly AAA...A = Atmel Wafer Lot Number P: Automotive/NiPdAu
Atmel Truncation
AT: Atmel
ATM: Atmel
ATML: Atmel
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11. Ordering Code Information
Note: 1. T = Tape and reel.
SOIC 4K per reel.
TSSOP 5K per reel.
Atmel Ordering Code Lead Finish Package Voltage Operation Range
AT24C01C-SSPD-T(1)
NiPdAu
(Lead-free/Halogen-free)
8S1
2.5V to 5.5V Automotive Temperature
(40C to 125C)
AT24C01C-XPD-T(1) 8X
AT24C02C-SSPD-T(1)
NiPdAu
(Lead-free/Halogen-free)
8S1
2.5V to 5.5V Automotive Temperature
(40C to 125C)
AT24C02C-XPD-T(1) 8X
AT24C04C-SSPD-T(1)
NiPdAu
(Lead-free/Halogen-free)
8S1
2.5V to 5.5V Automotive Temperature
(40C to 125C)
AT24C04C-XPD-T(1) 8X
AT24C08C-SSPD-T(1)
NiPdAu
(Lead-free/Halogen-free)
8S1
2.5V to 5.5V Automotive Temperature
(40C to 125C)
AT24C08C-XPD-T(1) 8X
Package Type
8S1 8-lead, 0.150” wide, Plastic Gull Wing Small Outline (JEDEC SOIC).
8X 8-lead, 4.4mm body, Plastic Thin Shrink Small Outline (TSSOP).
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12. Packaging Information
12.1 8S1 — 8-lead JEDEC SOIC
DRAWING NO. REV. TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A1 0.10 0.25
A 1.35 – 1.75
b 0.31 – 0.51
C 0.17 0.25
D 4.80 5.05
E1 3.81 3.99
E 5.79 – 6.20
e 1.27 BSC
L 0.40 – 1.27
Ø
Ø
Ø
E
1
N
TOP VIEW
C
E1
END VIEW
A
b
L
A1
e
D
SIDE VIEW
Package Drawing Contact:
packagedrawings@atmel.com
8S1 G
6/22/11
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC) SWB
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12.2 8X — 8-lead TSSOP
DRAWING NO. REV. TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A - - 1.20
A1 0.05 - 0.15
A2 0.80 1.00 1.05
D 2.90 3.00 3.10 2, 5
E 6.40 BSC
E1 4.30 4.40 4.50 3, 5
b 0.19 0.30 4
e 0.65 BSC
L 0.45 0.60 0.75
L1 1.00 REF
C 0.09 - 0.20
Side View
End View
Top View
A2
A
L
L1
D
1
E1
N
b
Pin 1 indicator
this corner
E
e
Notes: 1. This drawing is for general information only. Refer to JEDEC
Drawing MO-153, Variation AA, for proper dimensions,
tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion. Allowable
Dambar protrusion shall be 0.08mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
Package Drawing Contact:
packagedrawings@atmel.com
H
8X E
12/8/11
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP) TNR
C
A1
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8818A–SEEPROM–12/2012
13. Revision History
Doc. Rev. Date Comments
8819A 12/2012 Initial document release.
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131
USA
Tel: (+1) (408) 441-0311
Fax: (+1) (408) 487-2600
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