ispLSI® 2096E
In-System Programmable
SuperFAST™ High Density PLD
2096e_04 1
Features
• SUPERFAST HIGH DENSITY IN-SYSTEM
PROGRAMMABLE LOGIC
—4000 PLD Gates
—96 I/O Pins, Six Dedicated Inputs
—96 Registers
—High Speed Global Interconnect
—Wide Input Gating for Fast Counters, State
Machines, Address Decoders, etc.
—Small Logic Block Size for Random Logic
—100% Functional/JEDEC Upward Compatible with
ispLSI 2096 Devices
•HIGH PERFORMANCE E2CMOS® TECHNOLOGY
—fmax = 180 MHz Maximum Operating Frequency
—tpd = 5.0 ns Propagation Delay
—TTL Compatible Inputs and Outputs
—5V Programmable Logic Core
—ispJTAG™ In-System Programmable via IEEE 1149.1
(JTAG) Test Access Port
—User-Selectable 3.3V or 5V I/O Supports Mixed-
Voltage Systems
— PCI Compatible Outputs
—Open-Drain Output Option
—Electrically Erasable and Reprogrammable
— Non-Volatile
—Unused Product Term Shutdown Saves Power
• ispLSI OFFERS THE FOLLOWING ADDED FEATURES
—Increased Manufacturing Yields, Reduced Time-to-
Market and Improved Product Quality
— Reprogram Soldered Devices for Faster Prototyping
•OFFERS THE EASE OF USE AND FAST SYSTEM
SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY
OF FIELD PROGRAMMABLE GATE ARRAYS
—Complete Programmable Device Can Combine Glue
Logic and Structured Designs
—Enhanced Pin Locking Capability
—Three Dedicated Clock Input Pins
—Synchronous and Asynchronous Clocks
—Programmable Output Slew Rate Control to
Minimize Switching Noise
—Flexible Pin Placement
—Optimized Global Routing Pool Provides Global
Interconnectivity
Functional Block Diagram
Copyright © 2002 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com January 2002
Description
The ispLSI 2096E is a High Density Programmable Logic
Device. The device contains 96 Registers, 96 Universal
I/O pins, six Dedicated Input pins, three Dedicated Clock
Input pins, two dedicated Global OE input pins and a
Global Routing Pool (GRP). The GRP provides complete
interconnectivity between all of these elements. The
ispLSI 2096E features 5V in-system programmability
and in-system diagnostic capabilities. The ispLSI 2096E
offers non-volatile reprogrammability of all logic, as well
as the interconnect to provide truly reconfigurable sys-
tems.
The basic unit of logic on the ispLSI 2096E device is the
Generic Logic Block (GLB). The GLBs are labeled A0, A1
.. C7 (see Figure 1). There are a total of 24 GLBs in the
ispLSI 2096E device. Each GLB is made up of four
macrocells. Each GLB has 18 inputs, a programmable
AND/OR/Exclusive OR array, and four outputs which can
be configured to be either combinatorial or
registered.Inputs to the GLB come from the GRP and
dedicated inputs. All of the GLB outputs are brought back
into the GRP so that they can be connected to the inputs
of any GLB on the device.
The device also has 96 I/O cells, each of which is directly
connected to an I/O pin. Each I/O cell can be individually
programmed to be a combinatorial input, output or bi-
directional I/O pin with 3-state control. The signal levels
are TTL compatible voltages and the output drivers can
source 4 mA or sink 8 mA. Each output can be pro-
grammed independently for fast or slow output slew rate
to minimize overall output switching noise. By connecting
Global Routing Pool
(GRP)
Output Routing Pool (ORP)
Output Routing Pool (ORP)
0919/2096E
C7 C4
C5
C6
A4 A7
A6
A5
GLB
Logic
Array
DQ
DQ
DQ
DQ
Output Routing Pool (ORP)
Output Routing Pool (ORP)
C3 C0
C1
C2
B0 B3
B2
B1
Output Routing Pool (ORP)
Output Routing Pool (ORP)
B7
B6
B4
B5
A0
A1
A3
A2
Specifications ispLSI 2096E
2
Functional Block Diagram
Figure 1. ispLSI 2096E Functional Block Diagram
the VCCIO pins to a common 5V or 3.3V power supply,
I/O output levels can be matched to 5V or 3.3V compat-
ible voltages. When connected to a 5V supply, the I/O
pins provide PCI-compatible output drive.
Eight GLBs, 32 I/O cells, two dedicated inputs and two
ORPs are connected together to make a Megablock (see
Figure 1). The outputs of the eight GLBs are connected
to a set of 32 universal I/O cells by the two ORPs. Each
ispLSI 2096E device contains three Megablocks.
The GRP has as its inputs, the outputs from all of the
GLBs and all of the inputs from the bi-directional I/O cells.
All of these signals are made available to the inputs of the
GLBs. Delays through the GRP have been equalized to
minimize timing skew.
Clocks in the ispLSI 2096E device are selected using the
dedicated clock pins. Three dedicated clock pins (Y0, Y1,
Y2) or an asynchronous clock can be selected on a GLB
basis. The asynchronous or Product Term clock can be
generated in any GLB for its own clock.
Programmable Open-Drain Outputs
In addition to the standard output configuration, the
outputs of the ispLSI 2096E are individually program-
mable, either as a standard totem-pole output or an
open-drain output. The totem-pole output drives the
specified Voh and Vol levels, whereas the open-drain
output drives only the specified Vol. The Voh level on the
open-drain output depends on the external loading and
pull-up. This output configuration is controlled by a pro-
grammable fuse. The default configuration when the
device is in bulk erased state is totem-pole configuration.
The open-drain/totem-pole option is selectable through
the Lattice software tools.
A0
A3
A1
A2
B7
B4
B6
B5
Output Routing Pool (ORP)
Output Routing Pool (ORP)
Input Bus
Input Bus
Global
Routing
Pool
(GRP)
CLK 0
CLK 1
CLK 2
I/O 95
I/O 94
I/O 93
I/O 92
I/O 16
I/O 17
I/O 18
I/O 19
I/O 20
I/O 21
I/O 22
I/O 23
I/O 24
I/O 25
I/O 26
I/O 27
I/O 28
I/O 29
I/O 30
I/O 31
I/O 32
I/O 33
I/O 34
I/O 35
IN 2
TCK/IN 3
I/O 36
I/O 37
I/O 38
I/O 39
I/O 40
I/O 41
I/O 42
I/O 43
I/O 44
I/O 45
I/O 46
I/O 47
Y0
Y1
Y2
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
I/O 8
I/O 9
I/O 10
I/O 11
I/O 12
I/O 13
I/O 14
I/O 15
I/O 63
I/O 62
I/O 61
I/O 60
I/O 59
I/O 58
I/O 57
I/O 56
I/O 55
I/O 54
I/O 53
I/O 52
I/O 51
I/O 50
I/O 49
I/O 48
TDI/IN 0
TMS/IN 1
TDO
RESET
BSCAN
GOE 1
GOE 0
I/O 91
I/O 90
I/O 89
I/O 88
I/O 87
I/O 86
I/O 85
I/O 84
I/O 83
I/O 82
I/O 81
I/O 80
Input Bus
0917/2096E
Megablock
C7 C6 C5 C4
A4 A5 A6 A7
Output Routing Pool (ORP)
Output Routing Pool (ORP)
Input Bus
Input Bus
B0 B1 B2 B3
Output Routing Pool (ORP)
C3 C2 C1 C0
Output Routing Pool (ORP)
Input Bus
I/O 79
I/O 78
I/O 77
I/O 76
I/O 75
I/O 74
I/O 73
I/O 72
I/O 71
I/O 70
I/O 69
I/O 68
I/O 67
I/O 66
I/O 65
I/O 64
IN 5
IN 4
Generic Logic
Blocks (GLBs)
Specifications ispLSI 2096E
3
Absolute Maximum Ratings 1
Supply Voltage Vcc .................................. -0.5 to +7.0V
Input Voltage Applied........................-2.5 to VCC +1.0V
Off-State Output Voltage Applied .....-2.5 to VCC +1.0V
Storage Temperature................................ -65 to 150°C
Case Temp. with Power Applied .............. -55 to 125°C
Max. Junction Temp. (TJ) with Power Applied ... 150°C
1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation of the device at these or at any other conditions above those indicated in the operational sections of this specification
is not implied (while programming, follow the programming specifications).
DC Recommended Operating Condition
Capacitance (TA=25°C, f=1.0 MHz)
Erase/Reprogram Specification
TA = 0°C to +70°C
SYMBOL
Table 2-0005/2096E
VCC
VIH
VIL
PARAMETER
Supply Voltage: Logic Core, Input Buffers
Input High Voltage
Input Low Voltage
MIN. MAX. UNITS
4.75
2.0
0
5.25
Vcc+1
0.8
V
VCCIO Supply Voltage: Output Drivers 4.75
5.25 V
3.3V
5V 3.0
3.6 V
V
V
CSYMBOL
Table 2-0006/2096E
C
PARAMETER
I/O Capacitance
UNITS TEST CONDITIONS
1
2
Dedicated Input Capacitance pf
pf V = 5.0V, V = 2.0V
V = 5.0V, V = 2.0V
CC
CC I/O
IN
CClock Capacitance
8
TYP
8
10
3
pf V = 5.0V, V = 2.0V
CC Y
Table 2-0008/2096E
PARAMETER MINIMUM MAXIMUM UNITS
Erase/Reprogram Cycles 10,000 – Cycles
Specifications ispLSI 2096E
4
Switching Test Conditions
Figure 2. Test Load
+ 5V
R1
R2CL
*
Device
Output Test
Point
*
CL includes Test Fixture and Probe Capacitance.
0213A
TEST CONDITION R1 R2 CL
A 470Ω390Ω35pF
B∞390Ω35pF
470Ω390Ω35pF
Active High
Active Low
C470Ω390Ω5pF
∞390Ω5pF
Active Low to Z
at V +0.5V
OL
Active High to Z
at V -0.5V
OH
Table 2 - 0004A/2000
Output Load Conditions (see Figure 2)
Input Pulse Levels
Table 2-0003/2128E
Input Rise and Fall Time 10% to 90%
Input Timing Reference Levels
Output Timing Reference Levels
Output Load
GND to 3.0V
1.5V
1.5V
See Figure 2
3-state levels are measured 0.5V from
steady-state active level.
1.5 ns
VOL
SYMBOL
1. One output at a time for a maximum duration of one second. V
OUT
= 0.5V was selected to avoid test
problems by tester ground degradation. Characterized but not 100% tested.
2. Meaured using six 16-bit counters.
3. Typical values are at V
CC
= 5V and T
A
= 25°C.
4. Unused inputs held at 0.0V.
5. Maximum I
CC
varies widely with specific device configuration and operating frequency. Refer to the
Power Consumption section of this data sheet and the Thermal Management section of the Lattice Semiconductor
Data Book or CD-ROM to estimate maximum I
CC
.
Table 2-0007/2096E
VOH
IIH
IIL
PARAMETER
IIL-PU
IOS
1
ICC
3,4
Output Low Voltage
Output High Voltage
Input or I/O Low Leakage Current
Operating Power Supply Current
I
OL
= 8 mA
I
OH
= -4 mA
0V ≤ V
IN
≤ V
IL
(Max.)
V
IL
= 0.0V, V
IH
= 3.0V
CONDITION MIN. TYP.
3
MAX. UNITS
–
2.4
–
–
–
–
–
–
–
–
0.4
–
10
-10
10
V
V
µA
Input or I/O High Leakage Current V
CCIO
≤ V
IN
≤ 5.25V
(V
CCIO
- 0.2)V ≤ V
IN
≤ V
CCIO
µA
µA
I/O Active Pull-Up Current 0V ≤ V
IN
≤ 2.0V -10 – -250 µA
Output Short Circuit Current V
CCIO
= 5.0V or 3.3V, V
OUT
= 0.5V – – -240 mA
– 130 mA–
f
TOGGLE
= 1 MHz
DC Electrical Characteristics
Over Recommended Operating Conditions
Specifications ispLSI 2096E
5
tpd1
UNITS
-180
MIN.
TEST
COND.
1. Unless noted otherwise, all parameters use a GRP load of four GLBs, 20 PTXOR path, ORP and Y0 clock.
2. Refer to Timing Model in this data sheet for further details.
3. Standard 16-bit counter using GRP feedback.
4. Reference Switching Test Conditions section.
Table 2-0030A/2096E
1
1
tsu2 + tco1
( )
-135
MIN.MAX. MAX.
DESCRIPTION#
2
4
PARAMETER
A1Data Prop Delay, 4PT Bypass, ORP Bypass – 5.0 – 7.5 ns
tpd2 A2Data Prop Delay – – ns
fmax A3Clk Freq with Internal Feedback
3
180 – 135 – MHz
fmax (Ext.) – 4 Clk Freq with External Feedback – – MHz
fmax (Tog.) – 5 Clk Frequency, Max. Toggle – – MHz
tsu1 – 6 GLB Reg Setup Time before Clk, 4 PT Bypass – – ns
tco1 A7GLB Reg Clk to Output Delay, ORP Bypass – – ns
th1 – 8 GLB Reg Hold Time after Clk, 4 PT Bypass 0.0 – ns
tsu2 – 9 GLB Reg Setup Time before Clk 5.0 – ns
tco2 – 10 GLB Reg Clk to Output Delay – – ns
th2 – 11 GLB Reg Hold Time after Clk 0.0 – ns
tr1 A12External Reset Pin to Output Delay – – ns
trw1 – 13 External Reset Pulse Duration 4.0 – ns
tptoeen B14Input to Output Enable – – ns
tptoedis C15Input to Output Disable – – ns
tgoeen B16Global OE Output Enable – – ns
tgoedis C17Global OE Output Disable – – ns
twh – 18 External Synch Clk Pulse Duration, High 2.5 – – ns
twl – 19 External Synch Clk Pulse Duration, Low 2.5 – – ns
125
200
4.0 3.0
–
–
3.5
–
7.0
–
10.0
10.0
5.0
5.0
7.5
100
143
5.0
0.0
6.0
0.0
5.0
3.5
3.5
10.0
4.0
4.5
10.0
12.0
12.0
7.0
7.0
-100
MIN. MAX.
– 10.0
–
100 –
–
–
–
–
0.0
8.0
–
0.0
–
6.5
–
–
–
–
5.0 –
5.0 –
77
100
6.5 5.0
–
–
6.0
–
13.5
–
15.0
15.0
9.0
9.0
13.0
External Timing Parameters
Over Recommended Operating Conditions
Specifications ispLSI 2096E
6
Internal Timing Parameters1
Over Recommended Operating Conditions
tio
1. Internal Timing Parameters are not tested and are for reference only.
2. Refer to Timing Model in this data sheet for further details.
3. The XOR adjacent path can only be used by hard macros.
Table 2-0036A/2096E
Inputs
UNITS
-135
MIN. MAX.
DESCRIPTION#2
PARAMETER
20 Input Buffer Delay – 0.5 ns
tdin 21 Dedicated Input Delay – 1.7 ns
tgrp 22 GRP Delay – 1.2 ns
GLB
t1ptxor 25 1 Product Term/XOR Path Delay – 5.2 ns
t20ptxor 26 20 Product Term/XOR Path Delay – 5.2 ns
txoradj 27 XOR Adjacent Path Delay – 5.2 ns
tgbp 28 GLB Register Bypass Delay – 0.5 ns
tgsu 29 GLB Register Setup Time before Clock 0.7 – ns
tgh 30 GLB Register Hold Time after Clock 4.3 – ns
tgco 31 GLB Register Clock to Output Delay – 0.3 ns
3
tgro 32 GLB Register Reset to Output Delay – 1.1 ns
tptre 33 GLB Product Term Reset to Register Delay – 6.0 ns
tptoe 34 GLB Product Term Output Enable to I/O Cell Delay – 6.9 ns
tptck 35 GLB Product Term Clock Delay 2.5 5.5 ns
ORP
tob 38 Output Buffer Delay – 1.6 ns
tsl 39 Output Slew Limited Delay Adder – 1.5 ns
GRP
t4ptbpc 23 4 Product Term Bypass Path Delay (Combinatorial) – 3.7 ns
t4ptbpr 24 4 Product Term Bypass Path Delay (Registered) – 4.2 ns
torp 36 ORP Delay – 1.0 ns
torpbp 37 ORP Bypass Delay – 0.5 ns
Outputs
toen 40 I/O Cell OE to Output Enabled – 3.4 ns
todis 41 I/O Cell OE to Output Disabled – 3.4 ns
tgoe 42 Global Output Enable – 3.6 ns
tgy0 43 Clock Delay, Y0 to Global GLB Clock Line (Ref. clock) 1.6 1.6 ns
tgy1/2 44 Clock Delay, Y1 or Y2 to Global GLB Clock Line 1.8 1.8 ns
Clocks
tgr 45 Global Reset to GLB – 6.3 ns
Global Reset
-180
MIN. MAX.
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
0.5
1.1
0.6
–
–
3.9
3.9
3.9
0.0
1.9
2.9
0.7
3.3
0.3
0.6
4.8
5.9
1.0 4.0
–
– 0.9
0.4
1.6
1.5
–
– 3.0
3.0
– 2.0
0.7
0.9 0.7
0.9
– 4.4
-100
MIN. MAX.
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
0.5
2.2
1.7
–
–
6.8
7.3
8.0
0.5
5.8
5.8
1.2
4.0
0.3
1.3
6.1
8.6
4.1 7.1
–
– 1.4
0.4
1.6
1.0
–
– 4.2
4.2
– 4.8
2.7
2.7 2.7
2.7
– 9.2
Specifications ispLSI 2096E
7
ispLSI 2096E Timing Model
Note: Calculations are based upon timing specifications for the ispLSI 2096E-180L.
Derivations of tsu, th and tco from the Product Term Clock
=
=
=
=
t
su
Logic + Reg su - Clock (min)
(
t
io +
t
grp +
t
20ptxor) + (
t
gsu) - (
t
io +
t
grp +
t
ptck(min))
(#20 + #22 + #26) + (#29) - (#20 + #22 + #35)
(0.5 + 0.6 + 3.9) + (0.7) - (0.5 + 0.6 + 1.0)
=
=
=
=
t
h Clock (max) + Reg h - Logic
(
t
io +
t
grp +
t
ptck(max)) + (
t
gh) - (
t
io +
t
grp +
t
20ptxor)
(#20 + #22 + #35) + (#30) - (#20 + #22 + #26)
(0.5 + 0.6 + 4.0) + (3.3) - (0.5 + 0.6 + 3.9)
=
=
=
=
t
co Clock (max) + Reg co + Output
(
t
io +
t
grp +
t
ptck(max)) + (
t
gco) + (
t
orp +
t
ob)
(#20 + #22 + #35) + (#31) + (#36 + #38)
(0.5 + 0.6 + 4.0) + (0.3) + (0.9 + 1.6)
Table 2-0042/2096E
3.6
3.4
7.9
GLB Reg
Delay
I/O Pin
(Output)
ORP
Delay
Feedback
Reg 4 PT Bypass
20 PT
XOR Delays
Control
PTs
I/O Pin
(Input)
Y0,1,2
GRP GLB Reg Bypass ORP Bypass
DQ
RST
RE
OE
CK
I/O Delay
I/O CellORPGLBGRPI/O Cell
#24
#25 - 27
#33 - 35
#43, 44
#36
Reset
Ded. In #21
#20 #28
#29 - 32
GOE0, 1 #42
#40, 41
0491/2096E
#22
Comb 4 PT Bypass #23
#37
#45
#38,
#39
Specifications ispLSI 2096E
8
Power Consumption
Power consumption in the ispLSI 2096E device depends
on two primary factors: the speed at which the device is
operating and the number of Product Terms used.
Figure 3 shows the relationship between power and
operating speed.
Figure 3. Typical Device Power Consumption vs fmax
0127/2096E
ICC can be estimated for the ispLSI 2096E using the following equation:
ICC = 5.5 + (# of PTs * 0.67) + (# of nets * max freq * 0.0047)
Where:
# of PTs = Number of Product Terms used in design
# of nets = Number of Signals used in device
Max freq = Highest Clock Frequency to the device (in MHz)
The ICC estimate is based on typical conditions (VCC = 5.0V, room temperature) and an assumption of two GLB loads
on average exists. These values are for estimates only. Since the value of ICC is sensitive to operating conditions
and the program in the device, the actual ICC should be verified.
125
175
225
250
275
300
325
350
020406080100 120 140 160 180
fmax (MHz)
ICC (mA)
Notes: Configuration of six 16-bit counters
Typical current at 5V, 25° C
200
150
ispLSI 2096E
Specifications ispLSI 2096E
9
Pin Description
Input - This pin performs two functions. When BSCAN is logic low, it
functions as a pin to control the operation of the isp state machine.
When BSCAN is high, it functions as a dedicated input pin.
1. Pins have dual function capability.
Input/Output Pins - These are the general purpose I/O pins used by the
logic array.
NAME
Table 2-0002/2096E
PQFP & TQFP PIN NUMBERS DESCRIPTION
21,
27,
34,
40,
52,
58,
66,
72,
85,
91,
98,
104,
117,
123,
2,
8,
18
46
78
15
19
50
20
22,
28,
35,
41,
53,
59,
67,
73,
86,
92,
99,
105,
118,
124,
3,
9,
64, 114
23,
29,
36,
42,
54,
60,
68,
74,
87,
93,
100,
106,
119,
125,
4,
10,
110
I/O 0 - I/O 5
I/O 6 - I/O 11
I/O 12 - I/O 17
I/O 18 - I/O 23
I/O 24 - I/O 29
I/O 30 - I/O 35
I/O 36 - I/O 41
I/O 42 - I/O 47
I/O 48 - I/O 53
I/O 54 - I/O 59
I/O 60 - I/O 65
I/O 66 - I/O 71
I/O 72 - I/O 77
I/O 78 - I/O 83
I/O 84 - I/O 89
I/O 90 - I/O 95
24,
30,
37,
43,
55,
61,
69,
75,
88,
94,
101,
107,
120,
126,
5,
11,
25,
31,
38,
44,
56,
62,
70,
76,
89,
95,
102,
108,
121,
127,
6,
12,
26
32
39
45
57
63
71
77
90
96
103
109
122
128
7
13
1,
97, 17,
112, 33,
115, 49,
116
16, 48, 82, 113
65, 81,
Global Output Enables input pins.GOE 0, GOE 1
GND
V
CC
VCC
Ground (GND)
Input - This pin performs two functions. When BSCAN is logic low, it
functions as an input pin to load programming data into the device.
TDI/IN0 also is used as one of the two control pins for the isp state
machine. When BSCAN is high, it functions as a dedicated input pin.
Dedicated Clock input. This clock input is connected to one of the clock
inputs of all the GLBs on the device.
Active Low (0) Reset pin which resets all of the GLB and I/O registers in
the device.
Input - Dedicated in-system programming enable input pin. This pin is
brought low to enable the programming mode. The TMS, TDI, TDO and
TCK options become active.
RESET
Y0, Y1, Y2
TDI/IN 0
1
BSCAN
TMS/IN 1
1
51, 84,
80
83,
Dedicated input pins to the device.IN 2, IN 4, IN 5
Output - When BSCAN is logic low, it functions as an output pin to read
serial shift register data.
TDO
1
Input - This pin performs two functions. When BSCAN is logic low, it
functions as a clock pin for the Serial Shift Register. When BSCAN is
high, it functions as a dedicated input pin.
TCK/IN 3
1
14, 47, 79, 111 Supply voltage for output drivers, 5V or 3.3V. All VCCIO pins must be
connected to the same voltage level
VCCIO
Specifications ispLSI 2096E
10
Pin Configuration
ispLSI 2096E 128-pin PQFP and TQFP Pinout Diagram
I/O 84
I/O 85
I/O 86
I/O 87
I/O 88
I/O 89
I/O 90
I/O 91
I/O 92
I/O 93
I/O 94
I/O 95
VCCIO
Y0
VCC
GND
BSCAN
RESET
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
I/O 8
I/O 9
GND I/O 58
I/O 57
I/O 56
I/O 55
I/O 54
I/O 53
I/O 52
I/O 51
I/O 50
I/O 49
I/O 48
IN 4
Y1
VCC
GND
Y2
TCK/IN 31
I/O 47
I/O 46
I/O 45
I/O 44
I/O 43
I/O 42
I/O 41
I/O 40
I/O 39
I/O 38
I/O 37
I/O 36
I/O 83
I/O 82
I/O 81
I/O 80
I/O 79
I/O 78
I/O 77
I/O 76
I/O 75
I/O 74
I/O 73
I/O 72
GND
GND
VCC
VCCIO
IN 5
I/O 71
I/O 70
I/O 69
I/O 68
I/O 67
I/O 66
I/O 65
I/O 64
I/O 63
I/O 62
I/O 61
I/O 60
GND
I/O 11
I/O 12
I/O 13
I/O 14
I/O 15
I/O 16
I/O 17
I/O 18
I/O 19
I/O 20
I/O 21
I/O 22
I/O 23
1TMS/IN 1
VCC
GND
TDO
IN 2
I/O 24
I/O 25
I/O 26
I/O 27
I/O 28
I/O 29
I/O 30
I/O 31
I/O 32
I/O 33
I/O 34
I/O 35
ispLSI 2096E
Top View
I/O 10
1TDI/IN 0
I/O 59
GND
VCCIO
GND
GND
VCCIO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
128
127
126
125
124
123
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
9764
96
122
GOE 0
GOE 1
1. Pins have dual function capability.
0124/2096E
Specifications ispLSI 2096E
11
Part Number Description
ispLSI 2096E Ordering Information
Table 2-0041/2096E
FAMILY fmax (MHz)
180
135
ORDERING NUMBER PACKAGE
128-Pin TQFP
128-Pin TQFP
tpd (ns)
5.0
7.5
ispLSI
ispLSI 2096E-180LT128
180 128-Pin PQFP5.0 ispLSI 2096E-180LQ128
ispLSI 2096E-135LT128
135 128-Pin PQFP7.5 ispLSI 2096E-135LQ128
100 128-Pin TQFP10.0 ispLSI 2096E-100LT128
100 128-Pin PQFP10.0 ispLSI 2096E-100LQ128
Device Number
ispLSI 2096E XXX X XXXX
Grade
Blank = Commercial
X
Speed
180 = 180 MHz fmax
135 = 135 MHz fmax
100 = 100 MHz fmax
Power
L = Low
Package
T128 = TQFP
Q128 = PQFP
–
Device Family
0212/2096E
