2012
Application Guide
SAMSUNG ELECTRO-MECHANICS
LCR Division
MLCC(Multi-Layer Ceramic Chip Capacitor
Chip Inductor
Chip Resistor
Trantalum Capacitor
Crystal Unit
ACI Division
HDI(High Density Interconnection)
SEMBrid
Package Substrate
OMS Division
Camera Module
Linear Vibrator
HDD Motor
CDS Division
Tuner
NFC(Near Field Communication Module)
Power Module
Wi-Fi Module
Cellular Module
ESL(ESL Solution)
Bluetooth Module
LCR Division
MLCC(Multi-Layer Ceramic Chip Capacitor
Chip Inductor
Chip Resistor
Trantalum Capacitor
Crystal Unit
ACI Division
HDI(High Density Interconnection)
SEMBrid
Package Substrate
OMS Division
Camera Module
Linear Vibrator
HDD Motor
CDS Division
Tuner
NFC(Near Field Communication Module)
Power Module
Wi-Fi Module
Cellular Module
ESL(ESL Solution)
Bluetooth Module
www.samsungsem.co.kr
2012
Application Guide
SAMSUNG ELECTRO-MECHANICS
LCR Division 02
ACI Division 03
CDS Division 04
OMS Division 05
Smart Phone / Feature Phone 06
Desktop / Tablet Computer 08
LCD TV(LED TV) 10
PDP TV 11
LCD Monitor 12
Set-top Box 13
Game Console 14
Digital Still Camera 15
Digital Video Camcoder 16
Navigation 17
Portable Multimedia Player 18
MP3 Player 19
e-Book 20
Laser Printer 21
Copy Machine 22
Projector 23
Hard Disk Drive 24
Solid State Drive 25
Electronic Shelf Label 26
LED Lighting 27
Automotive 28
CONTENTS
www.samsungsem.com
LCR Division ACI Division
1. HDI (High Density Interconnection)
It refers to high-density PCBs created with fine pattern and pitch to exchange
electrical signals between electrical components mounted onto a PCB
2. SEMBrid
SEMBrid is the acronym of “SEM” + “Hybrid”, meaning multi-layer rigid-flex PCB
manufactured by Samsung Electro-Mechanics
3. Package Substrate
Package substrate is a substitution technology of lead frame in chip packages.
The sort of package substrates is UT-CSP, BOC, RF-Sip, FC-CSP and others
These products are used in Application processor, DRAM module, RF-Module,
Flash memory, Main purpose is mobile phone.
LCR division stands for Linkage of Magnetic Flux Coil, Capacitor and Resistor. Main products are
passive components such as MLCC, Chip Resistors, Chip inductors, crystal unit and Solid tantalum.
Premium MLCCs, designed to restrain the mechanical crack appearances and malfunctions, are
suitable for applications requiring high reliability such as automotive and industrial applications.
ACI division stands for Advanced Circuit Interconnection. Main products are HDI, RF-PCB, FCxGA
and BGA. PCB (printed circuit board) is a device that provides electrical interconnections and
a surface for mounting electronic components. Most PCBs are made from a flat rigid or flexible
material layered between insulating and conductive element through which electrical currents travel.
Linkage of Magnetic Flux Coil
Capacitor
Resistor
Advanced
Circuit
Interconnection
1. MLCC (Multi-Layer Ceramic Chip Capacitor)
As a major passive component, MLCC is the most prevalent type of capacitor
today which temporarily stores electrical charge and decouples the noise in
electronic circuits its main body is made up of interleaved layers of dielectric
and metal inner electrode which is usually nickel. The external electrodes or
terminations provide physical and electrical connection of MLCC to printed
circuit board or hybrid IC module
2. Chip Inductor
Chip inductor is a kind of SMD type passive component of inductance. It
is made by thick film multi-layer process. It is mainly used for impedance
matching of telecommunication devices, LC resonance circuits and elimination
electromagnetic noise of digital devices.
3. Chip Resistor
Chip resistor is general passive components which are useful for controlling
current and duration voltage in the circuit. Also it can be mounted on the
surface of the PCB.
4. Tantalum Capacitor
Tantalum capacitors are designed with excellent performance characteristics
for filtering, by-passing, coupling, blocking and R.C tuning circuit. They are
used extensively in industrial, commercial, entertainment and medical electronic
equipments.
5. Crystal Unit
Quartz crystal units are passive components used reverse-piezoelectricity.
Samsung’s crystal units are designed to be applicable for the requirement of
high precision specification such as mobile devices.
CDS Division OMS Division
1. Camera Module
Camera modules, akin to an “electronic eye,” transform images that pass
through the lens into digital signals for taking pictures and recording video.
SEM is working on exceptional camera modules for smart phones with high
resolution solution, subminiature camera, auto focus, vibration compensation
and high quality actuators/lens. The company is also expanding into camera
modules specifically for smartphones and tablet PCs as well as new areas into
the new markets, automotive electronic system and sensing applications
2. Linear Vibrator
Precision motors are built inside smartphones and game consoles to generate
vibrations that convey messages such as silent alerts of incoming calls or text
messages. With today’s popular smartphones, the use of vibration is evolving
to include haptic functions, which interface with the user through the sense
of touch. In addition, R&D resources are being focused on the development
of smaller, thinner, and more durable precision motors suitable for mobile
applications.
3. HDD Motor
Hard Disk Drive Motor revolves the disks installed in HDD of computers, while
Optical Disc Drive Motor is used in CD and DVD players at rated speed.
CDS division stands for Circuit Drive Solution. Main products are digital tuners, network modules,
power modules, and ubiquitous modules. We are continuing making an effort to boost sales of
premium products, such as power module and network module products keep developing for
customer diversification.
OMS division stands for Opto and Mechatronics Solution. Main Products are camera modules,
precision, motors and HDD Motor. We are also expanding into camera modules specifically for smart
phones and tablet PCs as well as new areas into the new markets automotive electronic system and
sensing applications.
1. Power Module
The power module converts externally supplied electricity to the required output
voltage for electronic products.
- SMPS for LED TV, LCD TV etc
- Adapter for Note PC, Tablet PC etc
- Power module for LED Lighting, Data Server
2. Tuner
The digital tuner is an essential component for the digital broadcasting industry.
This front-end component is built into LCD TVs and other broadcasting
receivers to select the right signals from broadcasters so that viewers can watch
their desired channels.
3. NFC (Near Field Communication Module)
NFC module is device that enables wireless communication for unencrypted
information exchanges in a short distance within 10 cm by using RFID
technology.
4. Wi-Fi Module
The Wi-Fi module is a sophisticated device that enables personal computers,
smart phone and other products to access the internet in real time.
Samsung Electro-Mechanics is manufacturing a various combo module such as
WLAN + BT
5. Cellular Module
The cellular module uses broadband frequencies for mobile phones to provide
smart phones, tablet PCs and other handhelds with high-speed internet
connectivity. This device is expected to be a requirement for operating in a
mobile internet environment
6. ESL (ESL Solution)
S-Label Tag is a product that displays price electronically and it can display
information customer’s needs such as price, discount rate and sale signs on the
tag. And it is capable of supporting a multi-mode which can display additional
information such as producing center, manufacturer, inventory and sales volume
for the store managers, A safety lock has been added to prevent theft of the
tag, and various colors and designs are available for displaying store logos
Circuit
Drive
Solution
Opto &
Mechatronics
Solution
Application GUIDE SAMSUNG ELECTRO-MECHANICS 6 7
Smart Phone
/ Feature Phone
1
RF Front End
Baseband
Application IC
Memory
Motor
Transceiver
Camera
Mobile TV Tuner
Bluetooth
Wireless LAN
GPS
PMIC
Display
8
4
6
RF Front End
Baseband
Application IC
Memory
Motor
Transceiver
Camera
Mobile TV Tuner
Bluetooth
Wireless LAN
GPS
PMIC
Display
8
17
2
5
4
3
6
1
5
7
3
2
In mold antenna
MLCC
Chip inductor
Chip bead
Crystal unit
RF Components
1Network
WiFi+BT combo module
Bluetooth module
NFC module (Near field communication)
2
Tantalum capacitor
Power inductor
Chip bead
MLCC
Chip resistor
Adapter
Wireless power transfer
Power Control
3
Camera module
Mobile tuner
Optical navigation module
Multimedia
5
Linear vibrator
Vibration motor
Motor
4
Rigid-flex
Display
6
HDI-flex
Hall IC
Chip bead
Power inductor
Chip inductor
MLCC
Tantalum capacitor
Chip resistor
Crystal unit
HDI
Main Board
8
FCCSP
RFSiP
CSP(Ultra thin)
Crystal unit
Chipset
7
Application GUIDE SAMSUNG ELECTRO-MECHANICS 8 9
CSP(Ultra thin) BOC
Camera module
HDD Motor
FCCSP MLCC
LED driver IC
MLCC Chip resistor
Linear vibrator
RF Front End
Baseband
Application IC
Memory
Motor
Transceiver
Camera
Mobile TV Tuner
Bluetooth
Wireless LAN
GPS
PMIC
Display
8
17
2
4
3
Bluetooth
CPU
1
Chipset
1
Keyboard Mouse
1
2
Memory
USBIEEE1394
7
Display
8
4
DVD HDD
WLAN
4
LAN
43
5
DC/DC
Converter
SMPS/
Adapter
7
6
Desktop
/ Tablet Computer
ODD Motor Adapter
WiFi+BT combo module
WiMAX module
Server Power
Cellular module
NFC (Near Field Communication)
MLCC
HDI
Tantalum capacitor
Chip inductor
Chip bead
Chip resistor
Crystal unit
2
Chipset
1Memory
2
HDD
3Network
4
DVD
5Power System
6
Display
8
Main Board
7
4
DeMUX
PDP Panel
Decorder &
Image Engine
Memory
Logic Board
Power
System
Network
tuner
3
2
1
Application GUIDE SAMSUNG ELECTRO-MECHANICS 10 11
PDP TV
SMPS
Power System
1
WiFi module
Network
3
Digital tuner (Silicon tuner)
Tuner
2
FCBGA
Chip inductor
Chip bead
Chip resistor
PBGA
MLCC
Main Board
4
LCD PanelT-CON Board
Memory
DeMUX
tuner
Decorder & Image Engine
Power system
Network
3
2
1
5
4
Super IP board
Power driver for LED TV
SMPS(LCD)
Inverter
LED Driver
Power Control
1
PBGA
FCBGA
MLCC
Chip resistor
Chip inductor
Chip bead
Main Board
4
Digital tuner (Silicon tuner)
Slim tuner for LED TV
Tuner
2
WiFi module
Network
3
LED driver IC
LCD Panel
5
LCD TV (LED TV)
3 4
Set-top Box
RF Front End
Baseband
Application IC
Memory
Motor
Transceiver
Camera
Mobile TV Tuner
Bluetooth
Wireless LAN
GPS
PMIC
Display
8
17
2
4
3
DeMUX
Decorder & Image Engine
Memory T-CON Board
Network
tuner
2
Power System
1
4
3
Application GUIDE SAMSUNG ELECTRO-MECHANICS 12 13
Tuner
1Network
2
Digital tuner(Silicon tuner) WiFi module
Main Board
3Power System
4
Chip resistorChip inductor
Chip resistor
MLCCMLCC
SMPSChip bead
LED driver IC
MLCC
Chip bead
Chip resistor
PBGA
Chip inductor
IP board Digital tuner (Silicon tuner)
LCD Monitor
Power System
1
LCD Panel
3
Tuner
2
Main Board
4
DeMUX
LCD Panel
Decorder & Image Engine
Memory T-CON Board
Network
3
tuner 2
Power System 1
4
5 6
RF Front End
Baseband
Application IC
Memory
Motor
Transceiver
Camera
Mobile TV Tuner
Bluetooth
Wireless LAN
GPS
PMIC
Display
8
17
4
3
4
USB / HDMI
GPU
1
1
Main Control Processor
1
Controller
CPU
Memory
4
Video Out
4
DVD HDD
Network
33
DC/DC
Converter
Adapter
2
4
RF Front End
Baseband
Application IC
Memory
Motor
Transceiver
Camera
Mobile TV Tuner
Bluetooth
Wireless LAN
GPS
PMIC
Display
8
17
2
4
3
2
Network
Lens
Motor
Lens
CCD
Audio
Strobe
Motor DRV
Image
Processing IC
1
Micro Controller
1
Input Device
Display
USB I/F
Memory
3
1
4
Application GUIDE SAMSUNG ELECTRO-MECHANICS 14 15
Game Console Digital Still
Camera
FCBGA CSP
PBGA FCCSP
MLCC
Chipset
1Chipset
1
HDD Motor
MLCC
PDIC
DVD · HDD
3Linear vibrator
Display
3
Vibration motor
Camera module
Controller
2WiFi+BT combo module
Network
2
HDI
BOC
MLCC
Tantalum capacitor
Chip inductor
Chip bead
Chip resistor
Crystal unit
Main Board
4
HDI
MLCC
Tantalum capacitor
Chip inductor
Power inductor
Chip bead
Chip resistor
Crystal unit
Main Board
4
7 8
RF Front End
Baseband
Application IC
Memory
Motor
Transceiver
Camera
Mobile TV Tuner
Bluetooth
Wireless LAN
GPS
PMIC
Display
8
17
2
4
3 Multi-
media
Network
1
3
Application
Processor
T-CON
Audio
PA
Memory
Display
Speaker
2
Car
Adapter
AC
Adapter
4
Application GUIDE SAMSUNG ELECTRO-MECHANICS 16 17
CSP
FCCSP
Chipset
1
HDI
MLCC
Tantalum capacitor
Power inductor
Chip inductor
Chip bead
Chip resistor
Crystal unit
Main Board
2
Mobile tuner
Multimedia
1
WiFi+BT combo module
Network
3
Linear vibrator
Display
2
HDI
CSP
FCCSP
MLCC
Tantalum capacitor
Chip inductor
Chip bead
Chip resistor
Crystal unit
Main Board
4
Digital Video
Camcoder
Navigation
910
RF Front End
Baseband
Application IC
Memory
Motor
Transceiver
Camera
Mobile TV Tuner
Bluetooth
Wireless LAN
GPS
PMIC
Display
8
17
2
5
4
3
6
FM tuner
Display
2
Stereo
Codec
Video
Codec
LCD
Driver
Network
Input
Device
Multi-
media
Battery
Adapter
HDD
Chipset /
Memory
1
3
5
4
RF Front End
Baseband
Application IC
Memory
Motor
Transceiver
Camera
Mobile TV Tuner
Bluetooth
Wireless LAN
GPS
PMIC
Display
8
17
2
5
4
3
6
FM tuner
Display
2
Stereo
Codec
LCD
Driver
Network
Input
Device
Battery
Adapter
Memory
DSP
13
Application GUIDE SAMSUNG ELECTRO-MECHANICS 18 19
CSP
CSP
FCCSP
Chipset / Memory
1
Chipset / Memory
3
Camera module
Multimedia
3
WiFi+BT combo module
Network
5
Linear vibrator
Display
2
Linear vibrator
Display
2
MLCC
Tantalum capacitor
Power inductor
Chip inductor
Chip bead
Chip resistor
Crystal unit
Main Board
HDI
MLCC
Tantalum capacitor
Power inductor
Chip inductor
Chip bead
Chip resistor
Crystal unit
Main Board
4
1
Portable
Multimedia Player
MP3 Player
11 12
2
Memory
Display
Network Device
Display Controller
(E-Ink Controller)
Battery
Controller
Input
Device
Main
Processor
1
Application GUIDE SAMSUNG ELECTRO-MECHANICS 20 21
Display
Controller
Memory
Motor
Power System
Network
1
3
2
WiFi+BT combo module
Network
1
HDI
CSP
FCCSP
MLCC
Tantalum capacitor
Chip resistor
Crystal unit
Main Board
2
WiFi module
Network
1
SMPS
Power System
2
PBGA
MLCC
Tantalum capacitor
Chip inductor
Chip bead
Chip resistor
Main Board
3
e-Book Laser Printer
13 14
RF Front End
Baseband
Application IC
Memory
Motor
Transceiver
Camera
Mobile TV Tuner
Bluetooth
Wireless LAN
GPS
PMIC
Display
8
17
2
5
4
3
6
Display Memory Controlling Circuit
Controlling IC
HVPSSMPS
Electrified Drum
Halogen Lamp
Dimmer Circuit
1
Application GUIDE SAMSUNG ELECTRO-MECHANICS 22 23
RF Front End
Baseband
Application IC
Memory
Motor
Transceiver
Camera
Mobile TV Tuner
Bluetooth
Wireless LAN
GPS
PMIC
Display
8
17
2
5
4
3
6
DMD
Video Decoder
Input Signal
Color Wheel
Lamp
SMPS
Motor Driver
Waveform Generator
ADC
Network DMD
Controller
1
2
HDI
PBGA
MLCC
Tantalum capacitor
Chip inductor
Chip bead
Chip resistor
Main Board
1
PBGA
DMD(Digital Micromirror Device) Controller
1
HDI
MLCC
Tantalum capacitor
Chip inductor
Chip bead
Chip resistor
Main Board
2
Copy Machine Projector
15 16
Motor Driver
Spindle
Motor
Media
Read / Write IC
ASIC
SVC Servo Control
DC 12V
Interface
Pre-amplifier
VCM /
Head
2
1
Application GUIDE SAMSUNG ELECTRO-MECHANICS 24 25
Data Buffer
Controller IC
Control signal
Flash memory bus
Crystal
Regulator
Interface
NAND
Flash
2
3
1
MLCC
Tantalum capacitor
Chip inductor
Chip bead
Chip resistor
Crystal unit
EMI filter
CSP
Main Board
1
CSP
MLCC
Power inductor
Chip inductor
Chip bead
Chip resistor
Crystal unit
Controller IC
1
CSP
MLCC
Chip resistor
Memory
2
HDI
MLCC
Chip resistor
Regulator
3
HDD motor
Disk Enclosure
2
Hard Disk Drive Solid State Drive
17 18
Monitor
Server
Store
Server
Print
LAN
or
W-LAN TCP/IP Network
Gateway
S-Label
1
2ESL+ Client
PAD
RF Front End
Baseband
Application IC
Memory
Motor
Transceiver
Camera
Mobile TV Tuner
Bluetooth
Wireless LAN
GPS
PMIC
Display
8
17
2
5
4
3
6
Network DALI
Memory
Power System
Dimming
(PWM/Analog)
LED
Lighting
1
Application GUIDE SAMSUNG ELECTRO-MECHANICS 26 27
EPD Type ESL Tag
TN LCD Type ESL Tag
Active Matrix Tag
S-Label
1
Gateway
Gateway
2
SMPS
Bulb
Down Light
L-Tube
Flat Panel Light
Street Light
Power System
1
Electronic Shelf
Label
LED Lighting
19 20
2-2. Camera Module
- SVM : Side View Monitoring
- NVC : Night Vision Camera
- RVC : Rear View Camera
Application GUIDE SAMSUNG ELECTRO-MECHANICS 28 29
Automotive
21
Bluetooth Module
WiFi Module
Cellular Module
On-Board Charger
Telematics System
MLCC 2-1. TPMS( Tire Pressure Monitoring System)
Safety
2Car Connectivity
3xEV Powertrain
4
Information, Comfort
1
2-1
2-1
2-1
2-2
2-2
2-2
2-2
3
14
MEMO MEMO
Production
Manufacturing Sites
Dongguan Samsung Electro-
Mechanics Co., Ltd.(DSEM)
Hengkeng Management Area,
Liaobu Town, Dongguan City, Guangdong
Province, China 523413
Tel:+86-769-8330-5000
Fax:+86-769-8330-5001
Tianjin Samsung Electro-Mechanics
Co., Ltd.(TSEM)
27, Heiniucheng-Road, Tianjin, China
300210
Tel:+86-22-2830-3333
Fax:+86-22-2830-7436, 2831-6600
Samsung High-Tech Electro-
Mechanics(Tianjin) Co., Ltd.(STEM)
Xiqing Dist. Micro-Electronics Industrial
Park, Jingang Highway, Tianjin, China
300385
Tel:+86-22-2397-9000
Fax:+86-22-2396-2532
Kunshan Samsung Electro-Mechanics
Co., Ltd.(KSEM)
8, Yaoning Rd, Kunshan City, Jiangsu, China
215300
Tel:+86-512-5790-8888(899)
Fax:+86-512-5771-1065
Samsung Electro-Mechanics
Philippines Co., Ltd. (SEMPHIL)
Block No. 5, Calamba Premiere International
Park, Barangay Batino, Calamba, Laguna,
The Philippines
Tel:+63-49-508-8311
Fax:+63-49-508-8450
Samsung Electro-Mechanics Thailand
Co., Ltd. (SEMTHAI)
Wellgrow Industrial Estate, 93 Moo 5T.
Bangsamak, A. Bangpakong, Chachoengsao
24180, Thailand
Tel:+66-38-562-000
Fax:+66-38-562-177~9
Branch Factories
Suzhou Branch Factory
Suchuan #17D Industrial Square, No.428
Xinlong Street, Suzhou Indusrial Park,
Suzhou, China 215000
Tel : +86-512-8716-9898(100)
Fax : +86-512-8716-9896
Binhai Branch Factory
No 80 xiaqing road, TEDA west
District, China
Tel : +86-22-2830-3333(3500)
Fax : +86-22-6686-3333~3628
Hungary Branch Factory
Samsung Electro-Mechanics Hungary
branch, H-2310 Leshegy utca 2-4
Szigetszentmiklos Pest megye, Hungary
Tel:+36-24-551-144
Fax:+36-24-551-104
Sales Offices
The AMERICAS
Samsung Electro-Mechanics America
3333 Michelson Drive Suite 500,
Irvine, CA. 92612, U.S.A
Tel:+1-949-797-8000~8059
Fax:+1-949-797-8060~8062
Sao Paulo Office
04578-910 Av. Das Nações Unidas,
12399, Edificio Landmark, 89B Sao Paulo
SP
Tel:+55-11-3544-5600
Fax:+55-11-3544-5629
San Jose Office
85 W Tasman Drive, San Jose, CA. 95134
U.S.A.
Tel:+1-408-544-5274
Fax:+1-408-544-4967
Chicago Office
1870 West Winchester Blvd. Suite #247
Libertyville IL, 60048 U.S.A
Tel:+1-847-549-9421~4
Fax:+1-847-549-9419
Phoenix Office
4505 E. Chandler Blvd., Suite
#115, Phoenix, AZ 85048 U.S.A.
Tel:+1-480-592-0180
Fax:+1-480-592-0186
R&D center(Atlanta)
6 Concourse Parkway, Suite 900 Atlanta,
GA 30328 U.S.A
Tel : +1-770-542-2220
Fax : +1-770-542-2225
Europe
Samsung Electro-Mechanics GmbH.
Samsung Haus, Am Kronberger Hang 6,
65824 Schwalbach/TS, Germany
Tel:+49-6196-66-7250, 7265, 7254
Fax:+49-6196-66-7744, 7766, 7755
London office
Samsung House 3000, Hillswood Drive
Chertsey Surrey KT16 0PS, U.K.
Tel:+44-1932-45-5480, 5483
Fax:+44-1932-45-5484
Istanbul office
Harman Caddesi, Polat Plaza B-Block
No.4, Kat4 Levent-80640 Istanbul, Turkey
Tel:+90-212-324-0856,8
Fax:+90-212-270-0077
Helsinki office
02601 Lars Sonckin Kaari 14 Espoo
Finland
Tel:+358-9-8531-132
Fax:+358-9-2517-2258
China
Samsung Electro-Mechanics(H.K) Ltd.
8/F., Central Plaza, 18 Harbour Road, Wanc
hai, Hongkong, China
Tel:+852-2862-6340, 6350, 6360
Fax:+852-2862-6362~4
Shenzhen Office
46 F, New World Center, Yitian Road, Futian
District, Shenzhen, China 518026
Tel:+86-755-8608-5581
Fax:+86-755-8608-5566
Shanghai office
Rm. 1211, Shanghai International Trade
Center No.2201 Yan An(W) Rd., Shanghai,
China 200335
Tel:+86-21-6270-4168(Ext.200)
Fax:+86-21-6219-6640
Beijing office
24F, China Merchants Tower, No.118,
Jianguo Rd., Chaoyang District,
Beijing, China 100022
Tel:+86-10-6566-8100(#6600)
Fax:+86-10-6566-8146
Taiwan
Taipei office
9F-1, No.399, Ruey Kuang Road, Neihu
District, Taipei City 114, Taiwan R.O.C
Tel:+886-2-2656-8350
Fax:+886-2-2656-8388
Japan
Samsung Electro-Mechanics Japan
Co., Ltd
Roppongi T-Cube Building, 3-1-1,
Roppongi, Minato-Ku, Tokyo 106-8532,
Japan
Tel:+81-3-6234-2569, 2573, 2405
Fax:+81-3-6234-2568
Osaka Office
6th Fl., Crystal Tower, 1-2-
27, Shiromi, Chuo-ku, Osaka 540-6006,
Japan
Tel:+81-6-6949-3406~9
Fax:+81-6-6949-3047
Southeast Asia
Samsung Electro-Mechanics Private
Limited
3 Church Street Samsung Hub #23-02
Singapore 049483
Tel:+65-6833-3215~31
Fax:+65-6833-3243~4
Bangkok Office
23rd Floor, Lake Rajada Office Complex
193/52 Rachadapisek Road,
Klongtoey, Bangkok 10110 Thailand
Tel:+662-661-8004~5
Fax:+662-661-8006
Penang Office
1-05-3A Menara IJM Land Lebuh Tunku
Kudin 3, 11700 Gelugor, Penang, Malaysia
Tel:+60-4-660-6120,2
Fax:+60-4-660-6123
Manila Office
4027 Block No. 5, Calamba Premiere
International Park, Barangay Batino,
Calamba, Laguna, The Philippines
Tel:+63-49-508-8446
New Delhi Office
A-25, GF, Mohan Co-operative Industrial
Estate, New Delhi-110044, India
Tel:+91-11-49661241
Fax:+91-11-43661299
Hanoi Office
1st floor, Technosoft building, Dich Vong
Hau Cau Giay, Hanoi Vietnam
Tel:+84-4-6673-1200
Fax:+84-16-9259-6656
R&D Center(Bengaluru)
201, World Trade Centre,Rajkumar Rd,
Malleshwaram Bangalore Karnataka India
Tel:+91-80-6726-0888
Fax:+91-80-67260876
Head office & Sales Dept.
206, Cheomdansaneop Road, Yeongtong-
Gu, Suwon City,
Kyeonggi Province 443-743, Korea
Tel: 031-210-5114
Fax: 031-210-6363
Daejeon Plant
581, Myeonghah-ri, Dong-myeon, Yeongi-
gun, Chungnam Province
339-860, Korea
Tel: 041-861-1214
Fax: 041-861-1333
Busan Plant
114, Noksansaneopjung Road, Gangseo-
gu,
Busan 618-270, Korea
Tel: 051-970-7114, 8114
Fax: 051-970-8702
Seoul office
21st Fl, Samsung Seocho-Tower 1320-10,
Seocho 2-dong,Seocho-gu, Seoul 137-
857, Korea
Tel: 02-2255-2840~49
Fax: 02-2-2255-2850
Head Office & Worksites (Korea)
Global Network