Description
These diode-transistor opto coup lers use an insulating
layer between a LED and an integrated photodetector to
provide elec trical in su lation between input and out put.
Separate connections for the photodiode bias and out-
put-transistor collector increase the speed up to a hun-
dred times that of a conven tional phototransistor coupler
by reduc ing the base-collector capacitance.
These single channel optocoup lers are available in
8-Pin DIP , SO-8 and Widebody package configurations.
The 6N135, HCPL-0500, and HCNW135 are for use in TTL/
CMOS, TTL/LSTTL or wide bandwidth analog applications.
Current transfer ratio (CTR) for these devices is 7% mini-
mum at IF = 16 mA.
The 6N136, HCPL-2502, HCPL-0501, and HCNW136 are
designed for high speed TTL/TTL applications. A standard
16 mA TTL sink current through the input LED will pro-
vide enough output current for 1 TTL load and a 5.6 kΩ
pull-up resistor. CTR for these devices is 19% minimum at
IF = 16 mA.
Functional Diagram
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.
6N135/6, HCNW135/6
HCPL-2502/0500/0501
Single Channel, High Speed Optocouplers
Data Sheet
Features
• High speed: 1 Mb/s
• TTL compatible
• Available in 8-Pin DIP, SO-8, widebody packages
• Open collector output
• Safety approval
UL Recognized – 3750 Vrms for 1 minute (5000 Vrms
for 1 minute for HCNW and Option 020 devices)
per UL1577
CSA Approved
IEC/EN/DIN EN 60747-5-2 Approved
– VIORM = 560 V peak for SO8 devices
– VIORM = 630 V peak for DIP 300mil devices
– VIORM = 1414 V peak for DIP 400mil (widebody)
devices
• Dual channel version available (253X/053X/0534)
Applications
• High voltage insulation
• Video signal isolation
• Line receivers
• Feedback element in switched mode power supplies
• High speed logic ground isolation
– TTL/TTL, TTL/CMOS, TTL/LSTTL
• Replaces pulse transformers
• Replaces slow phototransistor isolators
• Analog signal ground isolation
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
7
1
2
3
45
6
8
NC
ANODE
CATHODE
NC
V
CC
V
B
V
O
GND
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
V
O
LOW
HIGH
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
2
Schematic
Selection Guide
Minimum CMR 8-Pin DIP Small-Outline Widebody
(300 Mil) SO-8 (400 Mil)
Current Single Dual Single Dual Single
dV/dt V
CM Transfer Channel Channel Channel Channel Channel
(V/µs) (V) Ratio (%) Package Package* Package Package* Package
1,000 10 7 6N135 HCPL-2530 HCPL-0500 HCPL-0530 HCNW135
19 6N136 HCPL-2531 HCPL-0501 HCPL-0531 HCNW136
15 HCPL-2502
*Technical data for these products are on separate Avago publications.
I
F
SHIELD
8
6
5GND
V
CC
2
3
V
O
I
CC
V
F
I
O
ANODE
CATHODE
+
-
7
V
B
I
B
3
Ordering Information
6N135, 6N136, HCPL-2502, HCPL-0500, HCPL-0501 are UL Recognized with 3750 Vrms for 1 minute per UL1577.
HCNW135, HCNW136 are UL Recognized with 5000 Vrms for 1 minute per UL1577. All devices above listed are approved
under CSA Component Acceptance Notice #5, File CA 88324.
Part number
Option
Package
Surface
Mount
Gull
Wing
Tape
& Reel
UL 5000
Vrms/ 1
Minute rating
IEC/EN/DIN
EN 60747-
5-2 Quantity
RoHS
Compliant
Non RoHS
Compliant
6N135
6N136
HCPL-2502
-000E No option
300mil
DIP-8
50 per tube
-300E #300 X X 50 per tube
-500E #500 X X X 1000 per reel
-020E #020 X 50 per tube
-320E #320 X X X 50 per tube
-520E #520 X X X X 1000 per reel
-060E #060 X 50 per tube
-360E #360 X X X 50 per tube
-560E #560 X X X X 1000 per reel
HCPL-0500
HCPL-0501
-000E No option
SO-8
100 per tube
-500E #500 X X X 1500 per reel
-060E #060 X 100 per tube
-560E #560 X X X X 1500 per reel
HCNW135
HCNW136
-000E No option 400mil
Widebody
DIP-8
X X 42 per tube
-300E #300 X X X X 42 per tube
-500E #500 X X X X X 750 per reel
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry.
Example 1:
HCPL-2502-560E to order product of 300mil DIP Gull Wing Surface Mount package in Tape and Reel packaging with
IEC/EN/DIN EN 60747-5-2 Safety Approval in RoHS compliant.
Example 2:
HCPL-2502 to order product of 300mil DIP package in tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15th July 2001 and RoHS
compliant option will use ‘-XXXE‘.
4
1.080 ± 0.320
(0.043 ± 0.013) 2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
5
°
TYP. 0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
A XXXXZ
YYWW
DATE CODE
DIMENSIONS IN MILLIMETERS AND (INCHES).
5678
4321
OPTION CODE*
UL
RECOGNITION
UR
TYPE NUMBER
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3.56 ± 0.13
(0.140 ± 0.005)
Package Outline Drawings
8-Pin DIP Package (6N135/6, HCPL-2502)
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N135/6)
0.635 ± 0.25
(0.025 ± 0.010) 12
°
NOM.
9.65 ± 0.25
(0.380 ± 0.010)
0.635 ± 0.130
(0.025 ± 0.005)
7.62 ± 0.25
(0.300 ± 0.010)
5
6
7
8
4
3
2
1
9.65 ± 0.25
(0.380 ± 0.010)
6.350 ± 0.25
(0.250 ± 0.010)
1.016 (0.040)
1.27 (0.050)
10.9 (0.430)
2.0 (0.080)
LAND PATTERN RECOMMENDATION
1.080 ± 0.320
(0.043 ± 0.013)
3.56 ± 0.13
(0.140 ± 0.005)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
5
Small Outline SO-8 Package (HCPL-0500/1)
8-Pin Widebody DIP Package (HCNW135/6)
XXX
YWW
8765
4321
5.994 ± 0.203
(0.236 ± 0.008)
3.937 ± 0.127
(0.155 ± 0.005)
0.406 ± 0.076
(0.016 ± 0.003) 1.270
(0.050)BSC
5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005) 1.524
(0.060)
45° X 0.432
(0.017)
0.228 ± 0.025
(0.009 ± 0.001)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0.305
(0.012)MIN.
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
7°
PIN ONE
0 ~ 7°
*
*
7.49 (0.295)
1.9 (0.075)
0.64 (0.025)
LAND PATTERN RECOMMENDATION
5
6
7
8
4
3
2
1
11.23 ± 0.15
(0.442 ± 0.006)
1.8 ± 0.15
(0.071 ± 0.006)
5.10
(0.201)MAX.
1.55
(0.061)
MAX.
2.54 (0.100)
TYP.
DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
7
TYP.
0.254 + 0.076
- 0.0051
(0.010+ 0.003)
- 0.002)
11.00
(0.433)
9.00 ± 0.15
(0.354 ± 0.006)
MAX.
10.16 (0.400)
TYP.
A
HCNWXXXX
YYWW
DATE CODE
TYPE NUMBER
0.51 (0.021) MIN.
0.40 (0.016)
0.56 (0.022)
3.10 (0.122)
3.90 (0.154)
6
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW135/6)
Solder Reflow Temperature Profile
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160 °C
140 °C
150 °C
PEAK
TEMP.
245 °C
PEAK
TEMP.
240 °CPEAK
TEMP.
230 °C
SOLDERING
TIME
200 °C
PREHEATING TIME
150 °C, 90 + 30 SEC.
2.5 C ± 0.5 °C/SEC.
3 °C + 1 °C/–0.5 °C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
NOTE: NON-HALIDE FLUX SHOULD BE USED.
7
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5,
File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(HCNW and Option 060 only)
Recommended Pb-Free IR Profile
Insulation and Safety Related Specifications
8-Pin DIP Widebody
(300 Mil) SO-8 (400 Mil)
Parameter Symbol Value Value Value Units Conditions
Minimum External L(101) 7.1 4.9 9.6 mm Measured from input terminals
Air Gap (External to output terminals, shortest
Clearance) distance through air.
Minimum External L(102) 7.4 4.8 10.0 mm Measured from input terminals
Tracking (External to output terminals, shortest
Creepage) distance path along body.
Minimum Internal 0.08 0.08 1.0 mm Through insulation distance,
Plastic Gap conductor to conductor, usually
(Internal Clearance) the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Minimum Internal NA NA 4.0 mm Measured from input terminals
Tracking (Internal to output terminals, along
Creepage) internal cavity.
Tracking Resistance CTI 200 200 200 Volts DIN IEC 112/VDE 0303 Part 1
(Comparative
Tracking Index)
Isolation Group IIIa IIIa IIIa Material Group
(DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
217 °C
RAMP-DOWN
6 °C/SEC. MAX.
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
* 260 +0/-5 °C
t 25 °C to PEAK
60 to 150 SEC.
15 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
tp
ts
PREHEAT
60 to 180 SEC.
tL
TL
Tsmax
Tsmin
25
Tp
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 °C, Tsmin = 150 °C
NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR
WIDEBODY 400mils PACKAGE IS 245 °C
8
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (OPTION 060 ONLY)
Characteristic
Description Symbol 8 Pin DIP SO-8 Units
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤300 V rms I-IV I-III
for rated mains voltage ≤450 V rms I-III
Climatic Classification 55/100/21 55/100/21
Pollution Degree (DIN VDE 0110/1.89) 2 2
Maximum Working Insulation Voltage VIORM 630 560 V peak
Input to Output Test Voltage, Method b*
V
IORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, VPR 1181 1050 V peak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM x 1.5 = VPR, Type and sample test, VPR 945 840 V peak
t
m = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec) VIOTM 6000 4000 V peak
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 9, Thermal Derating curve.)
Case Temperature TS 175 175 °C
Input Current IS,INPUT 230 150 mA
Output Power PS,OUTPUT 600 600 mW
Insulation Resistance at TS, VIO = 500 V RS ≥ 109 ≥ 109 Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2, for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW135/6 ONLY)
Description Symbol Characteristic Units
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤600 V rms I-IV
for rated mains voltage ≤1000 V rms I-III
Climatic Classification 55/85/21
Pollution Degree (DIN VDE 0110/1.89) 2
Maximum Working Insulation Voltage VIORM 1414 V peak
Input to Output Test Voltage, Method b*
V
IORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, VPR 2652 V peak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM x 1.5 = VPR, Type and sample test, VPR 2121 V peak
t
m = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec) VIOTM 8000 V peak
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 9, Thermal Derating curve.)
Case Temperature TS 150 °C
Input Current IS,INPUT 400 mA
Output Power PS,OUTPUT 700 mW
Insulation Resistance at TS, VIO = 500 V RS ≥ 109 Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2, for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
9
Absolute Maximum Ratings
Parameter Symbol Device Min. Max. Units Note
Storage Temperature* TS -55 125 °C
Operating Temperature* TA 8-Pin DIP -55 100 °C
SO-8
Widebody -55 85
Average Forward Input Current* IF(AVG) 25 mA 1
Peak Forward Input Current* IF(PEAK) 8-Pin DIP 2
(50% duty cycle, 1 ms pulse width) SO-8 50 mA
(50% duty cycle, 1 ms pulse width) Widebody 40
Peak Transient Input Current* IF(TRANS) 8-Pin DIP 1 A
(≤1 µs pulse width, 300 pps) SO-8
Widebody 0.1
Reverse LED Input Voltage* (Pin 3-2) VR 8-Pin DIP 5 V
SO-8
Widebody 3
Input Power Dissipation* PIN 8-Pin DIP 45 mW 3
SO-8
Widebody 40
Average Output Current* (Pin 6) IO(AVG) 8 mA
Peak Output Current* IO(PEAK) 16 mA
Emitter-Base Reverse Voltage* (Pin 5-7) VEBR 5 V
Supply Voltage (Pin 8-5) VCC -0.5 30 V
Output Voltage (Pin 6-5) VO -0.5 20 V
Supply Voltage* (Pin 8-5) VCC -0.5 15 V
Output Voltage* (Pin 6-5) VO -0.5 15 V
Base Current* (Pin 7) IB 5 mA
Output Power Dissipation* PO 100 mW 4
Lead Solder Temperature*
(Through-Hole Parts Only)
1.6 mm below seating plane, 10 seconds TLS 8-Pin DIP 260 °C
up to seating plane, 10 seconds Widebody 260 °C
Reflow Temperature Profile TRP SO-8 and
Option 300
*Data has been registered with JEDEC for the 6N135/6N136.
See Package Outline Drawings
section
10
Electrical Specifications (DC)
Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified. See note 13.
Parameter Symbol Device Min. Typ.** Max. Units Test Conditions Fig. Note
Current
Transfer Ratio
CTR* 6N135
HCPL-0500
HCNW135
7 18 50 % TA = 25°C VO = 0.4 V IF = 16 mA,
VCC = 4.5 V
1, 2,
4
5, 11
5 19 VO = 0.5 V
HCPL-2502 15 22 TA = 25°C VO = 0.4 V
15 25 VO = 0.5 V
6N136
HCPL-0501
HCNW136
19 24 50 TA = 25°C VO = 0.4 V
15 25 VO = 0.5 V
Logic Low
Output Voltage
VOL 6N135
HCPL-0500
HCNW135
0.1 0.4 V TA = 25°C IO = 1.1 mA IF = 16 mA,
VCC = 4.5 V
0.1 0.5 IO = 0.8 mA
6N136
HCPL-2502
HCPL-0501
HCNW136
0.1 0.4 TA = 25°C IO = 3.0 mA
0.1 0.5 IO = 2.4 mA
Logic High
Output Current
IOH* 0.003 0.5 µA TA = 25°C VO = VCC = 5.5 V IF = 0 mA 7
0.01 1 TA = 25°C VO = VCC = 15 V
50 VO = VCC = 15 V
Logic Low
Supply Current
ICCL 50 200 µA IF = 16 mA, VO = Open,
VCC = 15 V
13
Logic High
Supply Current
ICCH* 0.02 1 µA TA = 25°C IF = 0 mA,
VO = Open,
13
2 VCC = 15 V
Input Forward VF*
Voltage
8-Pin DIP 1.5 1.7 V TA = 25°C IF = 16 mA 3
SO-8 1.8
Widebody 1.45 1.68 1.85 TA = 25°C IF = 16 mA
1.35 1.95
Input Reverse
Breakdown
Voltage
BVR* 8-Pin DIP 5 V IR = 10 µA
SO-8
Widebody 3 IR = 100
µA
Temperature
Coefficient of
Forward Volt-
age
∆VF/
∆TA
8-Pin DIP -1.6 mV/°C IF = 16 mA
SO-8
Widebody -1.9
Input
Capacitance
CIN 8-Pin DIP 60 pF f = 1 MHz, VF = 0 V
SO-8
Widebody 90
Transistor DC
Current Gain
hFE 8-Pin DIP 150 VO = 5 V, IO = 3 mA
SO-8 130 VO = 0.4 V, IB = 20 µA
Widebody 180 VO = 0.4 V, IB = 20 µA
160 VO = 5 V, IO = 3 mA
*For JEDEC registered parts.
**All typicals at TA = 25°C.
11
Switching Specifications (AC)
Over recommended temperature (TA = 0°C to 70°C), VCC = 5 V, IF = 16 mA unless otherwise specified.
Parameter Sym. Device Min. Typ.** Max. Units Test Conditions Fig. Note
Propagation tPHL* 6N135 0.2 1.5 µs TA = 25°C RL = 4.1 kΩ 5, 6, 8, 9
HCPL-0500 2.0 11
HCNW135
6N136 0.2 0.8 TA = 25°C RL = 1.9 kΩ
HCPL-2502
HCPL-0501
HCNW136 1.0
Propagation tPLH* 6N135 1.3 1.5 µs TA = 25°C RL = 4.1 kΩ 5, 6, 8, 9
HCPL-0500 2.0 11
HCNW135
6N136 0.6 0.8 TA = 25°C RL = 1.9 kΩ
HCPL-2502
HCPL-0501
HCNW136 1.0
Common Mode |CMH| 6N135 1 kV/µs RL = 4.1 kΩ I
F = 0 mA, TA = 25°C, 12 7, 8,
HCPL-0500 1 VCM = 10 Vp-p 9
HCNW135 CL = 15 pF
6N136 1 RL = 1.9 kΩ
HCPL-2502 1
HCPL-0501
Common Mode |CML| 6N135 1 kV/µs RL = 4.1 kΩ I
F = 16 mA, TA = 25°C, 12 7, 8,
HCPL-0500 1 VCM = 10 Vp-p 9
HCNW135 CL = 15 pF
6N136 1 RL = 1.9 kΩ
HCPL-2502 1
HCPL-0501
Bandwidth BW 6N135/6 9 MHz See Test Circuit 8, 10 10
HCPL-2502
HCPL-0500/1
HCNW135/6 11
*For JEDEC registered parts.
**All typicals at TA = 25°C.
Delay Time to
Logic Low at
Output
Delay Time to
Logic High at
Output
Transient Im-
munity at Logic
High Level
Output
Transient Im-
munity at Logic
Low Level
Output
12
Notes:
1. Derate linearly above 70°C free-air temperature at a rate of 0.8 mA/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 0.5 mA/°C (SO-8).
2. Derate linearly above 70°C free-air temperature at a rate of 1.6 mA/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 1.0 mA/°C (SO-8).
3. Derate linearly above 70°C free-air temperature at a rate of 0.9 mW/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 1.1 mW/°C (SO-8).
4. Derate linearly above 70°C free-air temperature at a rate of 2.0 mW/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 2.3 mW/°C (SO-8).
5. CURRENT TRANSFER RATIO in percent is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times 100.
6. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.
7. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt on the leading edge of the common
mode pulse signal, V
CM, to assure that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a
Logic Low level is the maximum tolerable (negative) dVCM /dt on the trailing edge of the common mode pulse signal, VCM, to assure that the
output will remain in a Logic Low state (i.e., VO < 0.8 V).
8. The 1.9 kΩ load represents 1 TTL unit load of 1.6 mA and the 5.6 kΩ pull-up resistor.
9. The 4.1 kΩ load represents 1 LSTTL unit load of 0.36 mA and 6.1 kΩ pull-up resistor.
10. The frequency at which the ac output voltage is 3 dB below its mid-frequency value.
11. The JEDEC registration for the 6N136 specifies a minimum CTR of 15%. Avago guarantees a minimum CTR of 19%.
12. See Option 020 data sheet for more information.
13. Use of a 0.1 µf bypass capacitor connected between pins 5 and 8 is recommended.
14. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 V rms for 1 second (leakage
detection current limit, II-O ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation
Related Characteristics Table if applicable.
15. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 second (leakage
detection current limit, II-O ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation
Related Characteristics Table if applicable.
16. This rating is equally validated by an equivalent ac proof test.
Package Characteristics
Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified.
Parameter Sym. Device Min. Typ.* Max. Units Test Conditions Fig. Note
Input-Output VISO 8-Pin DIP 3750 V rms RH < 50%, 6, 14
Momentary SO-8 t = 1 min.,
Withstand TA = 25°C
Voltage**
8-Pin DIP 5000 6, 12,
(Option 020) 15
I
I-O 8-Pin DIP 1 µA 45% RH, t = 5 s, 6, 16
V
I-O = 3 kVdc,
T
A = 25°C
Input-Output RI-O 8-Pin DIP 1012 Ω VI-O = 500 Vdc 6
Resistance SO-8
Widebody 1012 1013 T
A = 25°C
1011 T
A = 100°C
Input-Output CI-O 8-Pin DIP 0.6 pF f = 1 MHz 6
Capacitance SO-8
Widebody 0.5 0.6
*All typicals at TA = 25°C.
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous
voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table (if applicable), your
equipment level safety specification or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage,” publication number
5963-2203E.
Widebody 5000 6, 15
13
10
5
0
010 20
V
O
- OUTPUT VOLTAGE - V
40 mA
35 mA
30 mA
25 mA
20 mA
15 mA
10 mA
I = 5 mA
F
T = 25
C
V = 5.0 V
A
CC
I
O
Ð OUTPUT CURRENT - mA
8 PIN DIP, SO-8
12
8
0010 20
V
O
- OUTPUT VOLTAGE - V
40 mA
35 mA
30 mA
25 mA
20 mA
15 mA
10 mA
I = 5 mA
F
I
O
Ð OUTPUT CURRENT Ð mA
4
16
T = 25
C
V = 5.0 V
A
CC
WIDEBODY
NORMALIZED
I = 16 mA
V = 0.4 V
V = 5 V
T = 25
C
F
O
CC
A
6N135, HCPL-0500
1.5
1.0
0.5
0.1
0 1 10 100
NORMALIZED CURRENT TRANSFER RATIO
I
F
- INPUT CURRENT - mA
6N136, HCPL-2502
HCPL-0501
8 PIN DIP, SO-8
F
O
CC
A
0
0 1 10 100
NORMALIZED CURRENT TRANSFER RATIO
I
F
- INPUT CURRENT - mA
1.5
0.5
1.0
NORMALIZED
I = 16 mA
V = 0.4 V
V = 4.5 V
T = 25
C
HCNW135/6
WIDEBODY
V
F
- FORWARD VOLTAGE - VOLTS
100
10
0.1
0.01
1.1 1.2 1.3 1.4
I
F
- FORWARD CURRENT - mA
1.61.5
1.0
0.001
1000
I
F
V
F
+T = 25
C
A
-
8 PIN DIP, SO-8
V
F
- FORWARD VOLTAGE - VOLTS
1000
100
10
1.0
0.1
0.01
0.001
1.2 1.3 1.4 1.5
T = 25
C
A
I
F
- FORWARD CURRENT - mA
I
F
V
F
+
-
1.81.71.6
WIDEBODY
Figure 2. Current transfer ratio vs. input current.
Figure 3. Input current vs. forward voltage.
Figure 1. DC and pulsed transfer characteristics.
14
Figure 6. Propagation delay time vs. load resistance.
Figure 5. Propagation delay vs. temperature.
Figure 4. Current transfer ratio vs. temperature.
1.1
1.0
0.9
0.8
0.7
0.6
-60 -20 0 80
NORMALIZED CURRENT TRANSFER RATIO
T
A
- TEMPERATURE -
°
C
F
CC
A
6N135, HCPL-0500
6N136, HCPL-2502,
HCPL-0501
8 PIN DIP, SO-8
-40 20 40 60 100
O
NORMALIZED
I = 16 mA
V = 0.4 V
V = 5 V
T = 25
°
C
1.1
1.0
0.9
0.8
0.7
0.6
-60 -20 20 60 100
NORMALIZED CURRENT TRANSFER RATIO
T
A
- TEMPERATURE -
°
C
0.5
80
40
0
-40
0.4
WIDEBODY
HCNW135/6
F
CC
A
O
NORMALIZED
I = 16 mA
V = 0.4 V
V = 5 V
T = 25
°
C
2000
1500
1000
500
0
-60 -20
tp - PROPAGATION DELAY - ns
TA - TEMPERATURE - °C
8 PIN DIP, SO-8
20 60 100
6N135, HCPL-0500 (RL = 4.1 kΩ)
6N136, HCPL-0501, HCPL-2502
IF = 16 mA, VCC = 5.0 V
tPLH tPHL
1000
800
600
400
200
0
-60 -20 0 80
TA - TEMPERATURE - °C
HCNW135 (RL = 4.1 kΩ)
HCNW136 (RL = 1.9 kΩ)
WIDEBODY
-40 20 40 60 100
IF = 16 mA, VCC = 5.0 V
tp - PROPAGATION DELAY - ns
tPHL
tPLH
(RL = 1.9 kΩ)
3.0
2.0
1.0
0.1
4
0.6
0.4
321
0.2
8765 9 10
0.8
R
L
- LOAD RESISTANCE - (k
Ω
)
t
PLH
t
PHL
V = 5.0 V
T = 25
°
C
CC
I = 10 mA
I = 16 mA
F
tP - PROPAGATION DELAY - µs
F
A
8 PIN DIP, SO-8
R
L
-
t
P
- PROPAGATION DELAY - µs
10.0
6.0
4.0
1.0
0.1 10 40 100
0.6
0.4
4
V = 5.0 V
T = 25
°
C
A
CC
I = 10 mA
I = 16 mA
F
t
21
0.2
PLH
PHL
t
t
WIDEBODY
LOAD RESISTANCE - (k
Ω
)
15
T
A
- TEMPERATURE -
C
I = 0
V = V = 5.0 V
CCO
F
-50 -25 0 +25 +50 +75 +100
10
+4
10
-2
10
-1
10
0
10
+1
10
+2
10
+3
I
OH
- LOGIC HIGH OUTPUT CURRENT - nA
-75
8 PIN DIP, SO-8
I
OH
- LOGIC HIGH OUTPUT CURRENT - nA
T
A
- TEMPERATURE -
C
-60 -20 0 20 40 100
10
0
10
+1
10
+2
10
+3
-40 8060
I = 0
V = V = 15 V
CCO
F
WIDEBODY
I
F
I
O
- SMALL SIGNAL CURRENT TRANSFER RATIO
0
0.10
0.20
0.30
0
I
F
- QUIESCENT INPUT CURRENT - mA
25
16
4 8 12 20
T
A
= 25
C, R
L
= 100
, V
CC
= 5 V
8 PIN DIP, SO-8
0
0.10
0.30
0 4 8 12 16 25
0.20
0.40
20
0.50
I
F
I
O
- SMALL SIGNAL CURRENT TRANSFER RATIO
I
F
- QUIESCENT INPUT CURRENT - mA
T
A
= 25
C, R
L
= 100 , V
CC
= 5 V
WIDEBODY
OUTPUT POWER - P
S
, INPUT CURRENT - I
S
0
0
T
S
- CASE TEMPERATURE -
C
175
1000
50
400
12525 75 100 150
600
800
200
100
300
500
700
900 P
S
(mW)
I
S
(mA)
HCNW135/6
OUTPUT POWER - P
S
, INPUT CURRENT - I
S
0
0
T
S
- CASE TEMPERATURE -
C
20050
400
12525 75 100 150 175
600
800
200
100
300
500
700
P
S
(mW)
I
S
(mA) For 8-PIN DIP
I
S
(mA) For S0-8
8-PIN DIP/S0-8
Figure 9. Thermal derating curve, dependence of safety limiting value with case temperature per IEC/EN/DIN EN 60747-5-2.
Figure 8. Small-signal current transfer ratio vs. quiescent input current.
Figure 7. Logic high output current vs. temperature.
16
Figure 10. Frequency response.
HCNW135/6
HCNW135/6
0.1 1.0 10 100
-20
-15
-10
-5
0
+5
T
A
= 25
C
f - FREQUENCY - MHz
NORMALIZED RESPONSE - dB
6N135/6, HCPL-0500/1, HCPL-2502
7
1
2
3
45
6
8
+12 V
0.1 µF
V
FF
47 µF
51
2.1 K
100
1 K
1N4150 22
R
T
Q
1
TRIM FOR
UNITY GAIN
1.2 K
15 K
9.1 K
0.1 µF
100
Q
2
Q
3
470
�
+12 V
0.1 µF
(1 M
12 pF
TEST INPUT)
p-p
TYPICAL LINEARITY = ± 3% AT V = 1 V
TYPICAL SNR = 50dB
TYPICAL R = 375
TYPICAL V dc = 3.8 V
TYPICAL I = 9 mA
IN
T
O
F
123
Q , Q , Q : 2N3904
V
O
6N135/6, HCPL-0500/1, HCPL-2502
V
O
PULSE
GEN.
Z = 50
t = 5 ns
O
r
I MONITOR
F
I
F
0.1µF
L
R
C
L
= 1.5 µF
R
M
0
t
PHL
t
PLH
O
V
I
F
OL
V
1.5 V
+5 V
1
2
3
4
8
7
6
5
1.5 V
5 V
10% DUTY CYCLE
1/f < 100 µS
O
V5 V
OL
V
O
V
0 V 10% 90% 90% 10%
SWITCH AT A: I = 0 mA
F
SWITCH AT B: I = 16 mA
F
CM
V
t
r
t
f
7
1
2
3
45
6
8
V
O
0.1 µF
L
R
+5 V
PULSE GEN.
V
CM
+-
V
IF
A
B
FF
Figure 12. Test circuit for transient immunity and typical waveforms.
Figure 11. Switching test circuit.
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Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes AV01-0550EN
AV02-0171EN - January 29, 2010