Description
These diode-transistor optocouplers use an insulating
layer between a LED and an integrated photodetector to
provide electrical insulation between input and output.
Separate connections for the photodiode bias and out-
put-transistor collector increase the speed up to a hun-
dred times that of a conventional phototransistor coupler
by reducing the base-collector capacitance.
These single channel optocouplers are available in
8-Pin DIP, SO-8 and Widebody package congurations.
The 6N135, HCPL-0500, and HCNW135 are for use in TTL/
CMOS, TTL/LSTTL or wide bandwidth analog applications.
Current transfer ratio (CTR) for these devices is 7% mini-
mum at IF = 16 mA.
The 6N136, HCPL-2502, HCPL-0501, and HCNW136 are
designed for high speed TTL/TTL applications. A standard
16 mA TTL sink current through the input LED will pro-
vide enough output current for 1 TTL load and a 5.6 kΩ
pull-up resistor. CTR for these devices is 19% minimum at
IF = 16 mA.
Functional Diagram
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.
6N135/6, HCNW135/6, HCNW4502/3
HCPL-2502/0452/0453/0500/0501/4502/4503
Single Channel, High Speed Optocouplers
Data Sheet
Features
• 15 kV/µs minimum common mode transient
immunity at VCM = 1500 V (4503/0453)
• High speed: 1 Mb/s
• TTL compatible
• Available in 8-Pin DIP, SO-8, widebody packages
• Open collector output
• Guaranteed performance from temperature:
0°C to 70°C
• Safety approval
UL Recognized – 3750 Vrms for 1 minute (5000 Vrms
for 1 minute for HCNW and Option 020 devices)
per UL1577
CSA Approved
IEC/EN/DIN EN 60747-5-2 Approved
– VIORM = 630 V peak for HCPL-4503#060
– VIORM = 1414 V peak for HCNW devices
• Dual channel version available
(253X/4534/053X/0534)
• MIL-PRF-38534 hermetic version available
(55XX/65XX/4N55)
Applications
• High voltage insulation
• Video signal isolation
• Power transistor isolation in motor drives
• Line receivers
• Feedback element in switched mode power supplies
• High speed logic ground isolation
– TTL/TTL, TTL/CMOS, TTL/LSTTL
• Replaces pulse transformers
• Replaces slow phototransistor isolators
• Analog signal ground isolation
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
7
1
2
3
45
6
8
NC
ANODE
CATHODE
NC
V
CC
V
B
V
O
GND
*
* NOTE: FOR 4502/3, 0452/3,
PIN 7 IS NOT CONNECTED.
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
V
O
LOW
HIGH
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
2
Schematic
Selection Guide
Widebody
Minimum CMR 8-Pin DIP (300 Mil) Small-Outline SO-8 (400 Mil) Hermetic
Current Single Dual Single Dual Single Single and
dV/dt V
CM Transfer Channel Channel Channel Channel Channel Dual Channel
(V/µs) (V) Ratio (%) Package Package* Package Package* Package Packages*
1,000 10 7 6N135 HCPL-2530 HCPL-0500 HCPL-0530 HCNW135
19 6N136 HCPL-2531 HCPL-0501 HCPL-0531 HCNW136
HCPL-4502† HCPL-0452† HCNW4502†
15 HCPL-2502
15,000 1500 19 HCPL-4503† HCPL-4534 HCPL-0453† HCPL-0534 HCNW4503†
1,000 10 9 HCPL-55XX
HCPL-65XX
4N55
*Technical data for these products are on separate Avago publications.
†Pin 7, transistor base, is not connected.
The HCPL-4502, HCPL-0452, and HCNW4502 provide the
electrical and switching performance of the 6N136, HCPL-
0501, and HCNW136 with increased ESD protection.
The HCPL-4503, HCPL-0453, and HCNW4503 are similar to
the HCPL-4502, HCPL-0452, and HCNW4502 optocouplers
but have increased common mode transient immunity of
15 kV/µs minimum at VCM = 1500 V guaranteed.
I
F
SHIELD
HCPL-4503/0453
HCNW4503
8
6
5GND
V
CC
2
3
V
O
I
CC
V
F
I
O
ANODE
CATHODE
+
-
7
V
B
I
B
*
* NOTE: FOR HCPL-4502/-3, HCPL-0452/3,
HCNW4502/3, PIN 7 IS NOT CONNECTED.
3
Ordering Information
6N135, 6N136, HCPL-2502, HCPL-4502 and HCPL-4503, HCPL-0452, HCPL-0453, HCPL-0500, HCPL-0501 are UL Recog-
nized with 3750 Vrms for 1 minute per UL1577.
HCNW135, HCNW136, HCNW4502 and HCNW4503 are UL Recognized with 5000 Vrms for 1 minute per UL1577. All de-
vices above listed are approved under CSA Component Acceptance Notice #5, File CA 88324.
Part number
Option
Package
Surface
Mount
Gull
Wing
Tape
& Reel
UL 5000
Vrms/ 1 Minute
rating
IEC/EN/DIN
EN 60747-5-2 Quantity
RoHS
Compliant
Non RoHS
Compliant
6N135
6N136
HCPL-2502
HCPL-4502
HCPL-4503
-000E No option
300mil
DIP-8
50 per tube
-300E #300 X X 50 per tube
-500E #500 X X X 1000 per reel
-020E #020 X 50 per tube
-320E #320 X X X 50 per tube
-520E #520 X X X X 1000 per reel
-060E #060 X 50 per tube
-360E #360 X X X 50 per tube
-560E #560 X X X X 1000 per reel
HCPL-0452
HCPL-0453
HCPL-0500
HCPL-0501
-000E No option
SO-8
100 per tube
-500E #500 X X X 1500 per reel
-060E #060 X 100 per tube
-560E #560 X X X X 1500 per reel
HCNW135
HCNW136
HCNW4502
HCNW4503
-000E No option 400mil
Widebody
DIP-8
X X 42 per tube
-300E #300 X X X X 42 per tube
-500E #500 X X X X X 750 per reel
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry.
Example 1:
HCPL-4502-560E to order product of 300mil DIP Gull Wing Surface Mount package in Tape and Reel packaging with
IEC/EN/DIN EN 60747-5-2 Safety Approval in RoHS compliant.
Example 2:
HCPL-4502 to order product of 300mil DIP package in tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15th July 2001 and RoHS
compliant option will use ‘-XXXE‘.
4
1.080 ± 0.320
(0.043 ± 0.013) 2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
5¡ TYP. 0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
A XXXXZ
YYWW
DATE CODE
DIMENSIONS IN MILLIMETERS AND (INCHES).
5678
4321
OPTION CODE*
UL
RECOGNITION
UR
TYPE NUMBER
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3.56 ± 0.13
(0.140 ± 0.005)
0.635 ± 0.25
(0.025 ± 0.010) 12¡ NOM.
9.65 ± 0.25
(0.380 ± 0.010)
0.635 ± 0.130
(0.025 ± 0.005)
7.62 ± 0.25
(0.300 ± 0.010)
5
6
7
8
4
3
2
1
9.65 ± 0.25
(0.380 ± 0.010)
6.350 ± 0.25
(0.250 ± 0.010)
1.016 (0.040)
1.27 (0.050)
10.9 (0.430)
2.0 (0.080)
LAND PATTERN RECOMMENDATION
1.080 ± 0.320
(0.043 ± 0.013)
3.56 ± 0.13
(0.140 ± 0.005)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
Package Outline Drawings
8-Pin DIP Package (6N135/6, HCPL-4502/3, HCPL-2502)
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N135/6, HCPL-4502/3)
5
Small Outline SO-8 Package (HCPL-0500/1, HCPL-0452/3)
8-Pin Widebody DIP Package (HCNW135/6, HCNW4502/3)
XXX
YWW
8765
4321
5.994 ± 0.203
(0.236 ± 0.008)
3.937 ± 0.127
(0.155 ± 0.005)
0.406 ± 0.076
(0.016 ± 0.003) 1.270
(0.050)BSC
5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005) 1.524
(0.060)
45¡ X 0.432
(0.017)
0.228 ± 0.025
(0.009 ± 0.001)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0.305
(0.012)MIN.
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
7¡
PIN ONE
0 ~ 7¡
*
*
7.49 (0.295)
1.9 (0.075)
0.64 (0.025)
LAND PATTERN RECOMMENDATION
5
6
7
8
4
3
2
1
11.15 ± 0.15
(0.442 ± 0.006)
1.78 ± 0.15
(0.070 ± 0.006)
5.10
(0.201)MAX.
1.55
(0.061)
MAX.
2.54 (0.100)
TYP.
DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
7¡ TYP.
0.254 + 0.076
- 0.0051
(0.010+ 0.003)
- 0.002)
11.00
(0.433)
9.00 ± 0.15
(0.354 ± 0.006)
MAX.
10.16 (0.400)
TYP.
A
HCNWXXXX
YYWW
DATE CODE
TYPE NUMBER
0.51 (0.021) MIN.
0.40 (0.016)
0.56 (0.022)
3.10 (0.122)
3.90 (0.154)
6
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW135/6, HCNW4502/3)
Solder Reow Temperature Prole
0
TIME (SECONDS)
TEMPERATURE (
°
C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160
°
C
140
°
C
150
°
C
PEAK
TEMP.
245
°
C
PEAK
TEMP.
240
°
C
PEAK
TEMP.
230
°
C
SOLDERING
TIME
200
°
C
PREHEATING TIME
150
°
C, 90 + 30 SEC.
2.5
°
C ± 0.5
°
C/SEC.
3
°
C + 1
°
C/- 0.5
°
C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3
°
C + 1
°
C/- 0.5
°
C/SEC.
REFLOW HEATING RATE 2.5
°
C ± 0.5
°
C/SEC.
1.00 ± 0.15
(0.039 ± 0.006)
7° NOM.
12.30 ± 0.30
(0.484 ± 0.012)
0.75 ± 0.25
(0.030 ± 0.010)
11.00
(0.433)
5
6
7
8
4
3
2
1
11.15 ± 0.15
(0.442 ± 0.006)
9.00 ± 0.15
(0.354 ± 0.006)
1.3
(0.051)
13.56
(0.534)
2.29
(0.09)
LAND PATTERN RECOMMENDATION
1.78 ± 0.15
(0.070 ± 0.006)
4.00
(0.158)MAX.
1.55
(0.061)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254 + 0.076
- 0.0051
(0.010+ 0.003)
- 0.002)
MAX.
Note: Non-halide flux should be used.
7
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5,
File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(HCNW and Option 060 only)
Recommended Pb-Free IR Prole
Insulation and Safety Related Specications
8-Pin DIP Widebody
(300 Mil) SO-8 (400 Mil)
Parameter Symbol Value Value Value Units Conditions
Minimum External L(101) 7.1 4.9 9.6 mm Measured from input terminals
Air Gap (External to output terminals, shortest
Clearance) distance through air.
Minimum External L(102) 7.4 4.8 10.0 mm Measured from input terminals
Tracking (External to output terminals, shortest
Creepage) distance path along body.
Minimum Internal 0.08 0.08 1.0 mm Through insulation distance,
Plastic Gap conductor to conductor, usually
(Internal Clearance) the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Minimum Internal NA NA 4.0 mm Measured from input terminals
Tracking (Internal to output terminals, along
Creepage) internal cavity.
Tracking Resistance CTI 200 200 200 Volts DIN IEC 112/VDE 0303 Part 1
(Comparative
Tracking Index)
Isolation Group IIIa IIIa IIIa Material Group
(DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classication is Class A in accordance with CECC 00802.
217
°
C
RAMP-DOWN
6
°
C/SEC. MAX.
RAMP-UP
3
°
C/SEC. MAX.
150 - 200
°
C
260 +0/-5
°
C
t 25
°
C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5
°
C of ACTUAL
PEAK TEMPERATURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25
°
C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200
°
C, T
smin
= 150
°
C
Note: Non-halide flux should be used.
8
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCPL-4503 OPTION 060 ONLY)
Description Symbol Characteristic Units
Installation classication per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤300 V rms I-IV
for rated mains voltage ≤450 V rms I-III
Climatic Classication 55/100/21
Pollution Degree (DIN VDE 0110/1.89) 2
Maximum Working Insulation Voltage VIORM 630 V peak
Input to Output Test Voltage, Method b*
VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, VPR 1181 V peak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
VIORM x 1.5 = VPR, Type and sample test, VPR 945 V peak
tm = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec) VIOTM 6000 V peak
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 9, Thermal Derating curve.)
Case Temperature TS 175 °C
Input Current IS,INPUT 230 mA
Output Power PS,OUTPUT 600 mW
Insulation Resistance at TS, VIO = 500 V RS ≥109 Ω
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW135/6, HCNW4502/3 ONLY)
Description Symbol Characteristic Units
Installation classication per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤600 V rms I-IV
for rated mains voltage ≤1000 V rms I-III
Climatic Classication 55/85/21
Pollution Degree (DIN VDE 0110/1.89) 2
Maximum Working Insulation Voltage VIORM 1414 V peak
Input to Output Test Voltage, Method b*
VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, VPR 2652 V peak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
VIORM x 1.5 = VPR, Type and sample test, VPR 2121 V peak
tm = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec) VIOTM 8000 V peak
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 9, Thermal Derating curve.)
Case Temperature TS 150 °C
Input Current IS,INPUT 400 mA
Output Power PS,OUTPUT 700 mW
Insulation Resistance at TS, VIO = 500 V RS ≥ 109 Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2, for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in applica-
tion.
9
Absolute Maximum Ratings
Parameter Symbol Device Min. Max. Units Note
Storage Temperature* TS -55 125 °C
Operating Temperature* TA 8-Pin DIP -55 100 °C
SO-8
Widebody -55 85
Average Forward Input Current* IF(AVG) 25 mA 1
Peak Forward Input Current* IF(PEAK) 8-Pin DIP 2
(50% duty cycle, 1 ms pulse width) SO-8 50 mA
(50% duty cycle, 1 ms pulse width) Widebody 40
Peak Transient Input Current* IF(TRANS) 8-Pin DIP 1 A
(≤1 µs pulse width, 300 pps) SO-8
Widebody 0.1
Reverse LED Input Voltage* (Pin 3-2) VR 8-Pin DIP 5 V
SO-8
Widebody 3
Input Power Dissipation* PIN 8-Pin DIP 45 mW 3
SO-8
Widebody 40
Average Output Current* (Pin 6) IO(AVG) 8 mA
Peak Output Current* IO(PEAK) 16 mA
Emitter-Base Reverse Voltage* VEBR 5 V
(Pin 5-7, except 4502/3, 0452/3)
Supply Voltage (Pin 8-5) VCC -0.5 30 V
Output Voltage (Pin 6-5) VO -0.5 20 V
Supply Voltage* (Pin 8-5) VCC -0.5 15 V
Output Voltage* (Pin 6-5) VO -0.5 15 V
Base Current* (Pin 7, except 4502/3, 0452/3) IB 5 mA
Output Power Dissipation* PO 100 mW 4
Lead Solder Temperature*
(Through-Hole Parts Only)
1.6 mm below seating plane, 10 seconds TLS 8-Pin DIP 260 °C
up to seating plane, 10 seconds Widebody 260 °C
Reow Temperature Prole TRP SO-8 and
Option 300
*Data has been registered with JEDEC for the 6N135/6N136.
See Package Outline Drawings
section
10
Electrical Specications (DC)
Over recommended temperature (TA = 0°C to 70°C) unless otherwise specied. See note 13.
Parameter Symbol Device Min. Typ.** Max. Units Test Conditions Fig. Note
Current
Transfer Ratio
CTR* 6N135
HCPL-0500
HCNW135
7 18 50 % TA = 25°C VO = 0.4 V IF = 16 mA,
VCC = 4.5 V
1, 2,
4
5, 11
5 19 VO = 0.5 V
HCPL-2502 15 22 TA = 25°C VO = 0.4 V
15 25 VO = 0.5 V
6N136
HCPL-4502/3
HCPL-0501
HCPL-0452/3
HCNW136
HCNW4502/3
19 24 50 TA = 25°C VO = 0.4 V
15 25 VO = 0.5 V
Logic Low
Output Voltage
VOL 6N135
HCPL-0500
HCNW135
0.1 0.4 V TA = 25°C IO = 1.1 mA IF = 16 mA,
VCC = 4.5 V
0.1 0.5 IO = 0.8 mA
6N136
HCPL-2502
HCPL-4502/3
HCPL-0501
HCPL-0452/3
HCNW136
HCNW4502/3
0.1 0.4 TA = 25°C IO = 3.0 mA
0.1 0.5 IO = 2.4 mA
Logic High
Output Current
IOH* 0.003 0.5 µA TA = 25°C VO = VCC = 5.5 V IF = 0 mA 7
0.01 1 TA = 25°C VO = VCC = 15 V
50 VO = VCC = 15 V
Logic Low
Supply Current
ICCL 50 200 µA IF = 16 mA, VO = Open,
VCC = 15 V
13
Logic High
Supply Current
ICCH* 0.02 1 µA TA = 25°C IF = 16 mA,
VO = Open,
13
2 VCC = 15 V
Input Forward VF*
Voltage
8-Pin DIP 1.5 1.7 V TA = 25°C IF = 16 mA 3
SO-8 1.8
Widebody 1.45 1.68 1.85 TA = 25°C IF = 16 mA
1.35 1.95
Input Reverse
Breakdown
Voltage
BVR* 8-Pin DIP 5 V IR = 10 µA
SO-8
Widebody 3 IR = 100
µA
Temperature
Coecient of
Forward Volt-
age
∆VF/
∆TA
8-Pin DIP -1.6 mV/°C IF = 16 mA
SO-8
Widebody -1.9
Input
Capacitance
CIN 8-Pin DIP 60 pF f = 1 MHz, VF = 0 V
SO-8
Widebody 90
Transistor DC
Current Gain
hFE 8-Pin DIP 150 VO = 5 V, IO = 3 mA
SO-8 130 VO = 0.4 V, IB = 20 µA
Widebody 180 VO = 0.4 V, IB = 20 µA
160 VO = 5 V, IO = 3 mA
*For JEDEC registered parts.
**All typicals at TA = 25°C.
11
Switching Specications (AC)
Over recommended temperature (TA = 0°C to 70°C), VCC = 5 V, IF = 16 mA unless otherwise specied.
Parameter Sym. Device Min. Typ.** Max. Units Test Conditions Fig. Note
Propagation tPHL* 6N135 0.2 1.5 µs TA = 25°C RL = 4.1 kΩ 5, 6, 8, 9
HCPL-0500 2.0 11
HCNW135
6N136 0.2 0.8 TA = 25°C RL = 1.9 kΩ
HCPL-2502
HCPL-4502/3
HCPL-0501
HCPL-0452/3 1.0
HCNW136
HCNW4502/3
Propagation tPLH* 6N135 1.3 1.5 µs TA = 25°C RL = 4.1 kΩ 5, 6, 8, 9
HCPL-0500 2.0 11
HCNW135
6N136 0.6 0.8 TA = 25°C RL = 1.9 kΩ
HCPL-2502
HCPL-4502/3
HCPL-0501
HCPL-0452/3 1.0
HCNW136
HCNW4502/3
Common Mode |CMH| 6N135 1 kV/µs RL = 4.1 kΩ IF = 0 mA, TA = 25°C, 12 7, 8,
HCPL-0500 1 VCM = 10 Vp-p 9
HCNW135 CL = 15 pF
6N136 1 RL = 1.9 kΩ
HCPL-2502 1
HCPL-4502
HCPL-0501
HCPL-0452
HCNW4502
HCPL-4503 15 30 RL = 1.9 kΩ IF = 0 mA, TA = 25°C,
HCPL-0453 VCM = 1500 Vp-p,
HCNW4503 CL = 15 pF
Common Mode |CML| 6N135 1 kV/µs RL = 4.1 kΩ IF = 16 mA, TA = 25°C, 12 7, 8,
HCPL-0500 1 VCM = 10 Vp-p 9
HCNW135 CL = 15 pF
6N136 1 RL = 1.9 kΩ
HCPL-2502 1
HCPL-4502
HCPL-0501
HCPL-0452
HCNW4502
HCPL-4503 15 30 RL = 1.9 kΩ IF = 16 mA, TA = 25°C,
HCPL-0453 V
CM = 1500 Vp-p,
HCNW4503 CL = 15 pF
Bandwidth BW 6N135/6 9 MHz See Test Circuit 8, 10 10
HCPL-2502
HCPL-0500/1
HCNW135/6 11
*For JEDEC registered parts.
**All typicals at TA = 25°C.
Delay Time to
Logic Low at
Output
Delay Time to
Logic High at
Output
Transient Im-
munity at Logic
High Level
Output
Transient Im-
munity at Logic
Low Level
Output
12
Notes:
1. Derate linearly above 70°C free-air temperature at a rate of 0.8 mA/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 0.5 mA/°C (SO-8).
2. Derate linearly above 70°C free-air temperature at a rate of 1.6 mA/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 1.0 mA/°C (SO-8).
3. Derate linearly above 70°C free-air temperature at a rate of 0.9 mW/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 1.1 mW/°C (SO-8).
4. Derate linearly above 70°C free-air temperature at a rate of 2.0 mW/°C (8-Pin DIP).
Derate linearly above 85°C free-air temperature at a rate of 2.3 mW/°C (SO-8).
5. CURRENT TRANSFER RATIO in percent is dened as the ratio of output collector current, IO, to the forward LED input current, IF, times 100.
6. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.
7. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt on the leading edge of the common
mode pulse signal, V
CM, to assure that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a
Logic Low level is the maximum tolerable (negative) dVCM /dt on the trailing edge of the common mode pulse signal, VCM, to assure that the
output will remain in a Logic Low state (i.e., VO < 0.8 V).
8. The 1.9 kΩ load represents 1 TTL unit load of 1.6 mA and the 5.6 kΩ pull-up resistor.
9. The 4.1 kΩ load represents 1 LSTTL unit load of 0.36 mA and 6.1 kΩ pull-up resistor.
10. The frequency at which the ac output voltage is 3 dB below its mid-frequency value.
11. The JEDEC registration for the 6N136 species a minimum CTR of 15%. Avago guarantees a minimum CTR of 19%.
12. See Option 020 data sheet for more information.
13. Use of a 0.1 µf bypass capacitor connected between pins 5 and 8 is recommended.
14. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 V rms for 1 second (leakage
detection current limit, II-O ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation
Related Characteristics Table if applicable.
15. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 second (leakage
detection current limit, II-O ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation
Related Characteristics Table if applicable.
16. This rating is equally validated by an equivalent ac proof test.
Package Characteristics
Over recommended temperature (TA = 0°C to 70°C) unless otherwise specied.
Parameter Sym. Device Min. Typ.* Max. Units Test Conditions Fig. Note
Input-Output VISO 8-Pin DIP 3750 V rms RH < 50%, 6, 14
Momentary SO-8 t = 1 min.,
Withstand TA = 25°C
Voltage**
8-Pin DIP 5000 6, 12,
(Option 020) 15
II-O 8-Pin DIP 1 µA 45% RH, t = 5 s, 6, 16
VI-O = 3 kVdc,
TA = 25°C
Input-Output RI-O 8-Pin DIP 1012 Ω VI-O = 500 Vdc 6
Resistance SO-8
Widebody 1012 1013 TA = 25°C
1011 TA = 100°C
Input-Output CI-O 8-Pin DIP 0.6 pF f = 1 MHz 6
Capacitance SO-8
Widebody 0.5 0.6
*All typicals at TA = 25°C.
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous
voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table (if applicable), your
equipment level safety specication or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage,” publication num-
ber 5963-2203E.
Widebody 5000 6, 15
13
10
5
0
0 10 20
V
O
- OUTPUT VOLTAGE - V
40 mA
35 mA
30 mA
25 mA
20 mA
15 mA
10 mA
I = 5 mA
F
T = 25
°
C
V = 5.0 V
A
CC
I
O
Ð OUTPUT CURRENT - mA
8 PIN DIP, SO-8
12
8
00 10 20
V
O
- OUTPUT VOLTAGE - V
40 mA
35 mA
30 mA
25 mA
20 mA
15 mA
10 mA
I = 5 mA
F
I
O
Ð OUTPUT CURRENT Ð mA
4
16
T = 25
°
C
V = 5.0 V
A
CC
WIDEBODY
NORMALIZED
I = 16 mA
V = 0.4 V
V = 5 V
T = 25
°
C
F
O
CC
A
6N135, HCPL-0500
1.5
1.0
0.5
0.1
0 1 10 100
NORMALIZED CURRENT TRANSFER RATIO
I
F
- INPUT CURRENT - mA
6N136, HCPL-4502/3,
HCPL-2502
HCPL-0501/0452/0453
8 PIN DIP, SO-8
F
O
CC
A
0
0 1 10 100
NORMALIZED CURRENT TRANSFER RATIO
I
F
- INPUT CURRENT - mA
1.5
0.5
1.0
NORMALIZED
I = 16 mA
V = 0.4 V
V = 4.5 V
T = 25
°
C
HCNW135/6,
HCNW4502/3
WIDEBODY
V
F
- FORWARD VOLTAGE - VOLTS
100
10
0.1
0.01
1.1 1.2 1.3 1.4
I
F
- FORWARD CURRENT - mA
1.61.5
1.0
0.001
1000
I
F
V
F
+T = 25
°
C
A
-
8 PIN DIP, SO-8
V
F
- FORWARD VOLTAGE - VOLTS
1000
100
10
1.0
0.1
0.01
0.001
1.2 1.3 1.4 1.5
T = 25
°
C
A
I
F
- FORWARD CURRENT - mA
I
F
V
F
+
-
1.81.71.6
WIDEBODY
Figure 2. Current transfer ratio vs. input current.
Figure 3. Input current vs. forward voltage.
Figure 1. DC and pulsed transfer characteristics.
14
1.1
1.0
0.9
0.8
0.7
0.6
-60 -20 0 80
NORMALIZED CURRENT TRANSFER RATIO
T
A
- TEMPERATURE -
°
C
F
CC
A
6N135, HCPL-0500
6N136, HCPL-4502/3,
HCPL-2502
HCPL-0501, 0452, 0453
8 PIN DIP, SO-8
-40 20 40 60 100
O
NORMALIZED
I = 16 mA
V = 0.4 V
V = 5 V
T = 25
°
C
1.1
1.0
0.9
0.8
0.7
0.6
-60 -20 20 60 100
NORMALIZED CURRENT TRANSFER RATIO
T
A
- TEMPERATURE -
°
C
0.5
80
40
0
-40
0.4
WIDEBODY
HCNW135/6,
HCNW4502/3
F
CC
A
O
NORMALIZED
I = 16 mA
V = 0.4 V
V = 5 V
T = 25
°
C
3.0
2.0
1.0
0.1
4
0.6
0.4
321
0.2
8765 9 10
0.8
R
L
- LOAD RESISTANCE - (k
Ω
)
t
PLH
t
PHL
V = 5.0 V
T = 25
°
C
CC
I = 10 mA
I = 16 mA
F
t
P
- PROPAGATION DELAY - µs
F
A
8 PIN DIP, SO-8
R
L
- LOAD RESISTANCE - (k
Ω
)
t
P
- PROPAGATION DELAY - µs
10.0
6.0
4.0
1.0
0.1 10 40 100
0.6
0.4
4
V = 5.0 V
T = 25
°
C
A
CC
I = 10 mA
I = 16 mA
F
t
21
0.2
PLH
PHL
t
t
WIDEBODY
2000
1500
1000
500
0
-60 -20
t
p
- PROPAGATION DELAY - ns
T
A
- TEMPERATURE -
°
C
8 PIN DIP, SO-8
20 60 100
6N135, HCPL-0500 (R
L
= 4.1 k
Ω
)
6N136, HCPL-0501, HCPL-2502
HCPL-4502/3 (R
L
= 1.9 k
Ω
)
HCPL-0452/3
I
F
= 16 mA, V
CC
= 5.0 V
t
PLH
t
PHL
1000
800
600
400
200
0
-60 -20 0 80
T
A
- TEMPERATURE -
°
C
HCNW135 (R
L
= 4.1 k
Ω
)
HCNW136 (R
L
= 1.9 k
Ω
)
HCNW4502/3
WIDEBODY
-40 20 40 60 100
I
F
= 16 mA, V
CC
= 5.0 V
t
p
- PROPAGATION DELAY - ns
t
PHL
t
PLH
Figure 6. Propagation delay time vs. load resistance.
Figure 5. Propagation delay vs. temperature.
Figure 4. Current transfer ratio vs. temperature.
15
T
A
- TEMPERATURE -
°
C
I = 0
V = V = 5.0 V
CCO
F
-50 -25 0 +25 +50 +75 +100
10
+4
10
-2
10
-1
10
0
10
+1
10
+2
10
+3
I
OH
- LOGIC HIGH OUTPUT CURRENT - nA
-75
8 PIN DIP, SO-8
I
OH
- LOGIC HIGH OUTPUT CURRENT - nA
T
A
- TEMPERATURE -
°
C
-60 -20 0 20 40 100
10
0
10
+1
10
+2
10
+3
-40 8060
I = 0
V = V = 15 V
CCO
F
WIDEBODY
��
I
F
I
O
- SMALL SIGNAL CURRENT TRANSFER RATIO
0
0.10
0.20
0.30
0
I
F
- QUIESCENT INPUT CURRENT - mA
25
164 8 12 20
T
A
= 25
°
C, R
L
= 100
Ω
, V
CC
= 5 V
8 PIN DIP, SO-8
0
0.10
0.30
0 4 8 12 16 25
0.20
0.40
20
0.50
��I
F
I
O
- SMALL SIGNAL CURRENT TRANSFER RATIO
I
F
- QUIESCENT INPUT CURRENT - mA
T
A
= 25
°
C, R
L
= 100 Ω, V
CC
= 5 V
WIDEBODY
OUTPUT POWER - P
S
, INPUT CURRENT - I
S
0
0
T
S
- CASE TEMPERATURE -
°
C
20050
400
12525 75 100 150
600
800
200
100
300
500
700
P
S
(mW)
I
S
(mA)
175
HCPL-4503 OPTION 060
OUTPUT POWER - P
S
, INPUT CURRENT - I
S
0
0
T
S
- CASE TEMPERATURE -
°
C
175
1000
50
400
12525 75 100 150
600
800
200
100
300
500
700
900 P
S
(mW)
I
S
(mA)
HCNW135/6, HCNW4502/3
Figure 9. Thermal derating curve, dependence of safety limiting value with case temperature per IEC/EN/DIN EN 60747-5-2.
Figure 8. Small-signal current transfer ratio vs. quiescent input current.
Figure 7. Logic high output current vs. temperature.
Figure 10. Frequency response.
HCNW135/6
HCNW135/6
V
O
PULSE
GEN.
Z = 50 Ω
t = 5 ns
O
r
I MONITOR
F
I
F
0.1µF
L
R
C
L
= 1.5 µF
R
M
0
t
PHL
t
PLH
O
V
I
F
OL
V
1.5 V
+5 V
1
2
3
4
8
7
6
5
1.5 V
5 V
10% DUTY CYCLE
1/f < 100 µS
*
* PIN 7 UNCONNECTED IN HCPL-4502/3,
HCPL-0452/3, HCNW4502/3
O
V5 V
OL
V
O
V
0 V 10% 90% 90% 10%
SWITCH AT A: I = 0 mA
F
SWITCH AT B: I = 16 mA
F
CM
V
t
r
t
f
7
1
2
3
45
6
8
V
O
0.1 µF
L
R
+5 V
PULSE GEN.
V
CM
+-
V
IF
*
A
B
FF
*PIN 7 UNCONNECTED IN HCPL-4502/3, HCPL-0542/3, HCNW4502/3
Figure 12. Test circuit for transient immunity and typical waveforms.
Figure 11. Switching test circuit.
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Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2008 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0550EN
AV02-0171EN - February 12, 2008