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LM135
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LM135A
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LM235
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LM235A
,
LM335
,
LM335A
SNIS160E –MAY 1999–REVISED FEBRUARY 2015
LMx35, LMx35A Precision Temperature Sensors
1 Features 3 Description
The LM135 series are precision, easily-calibrated,
1• Directly Calibrated to the Kelvin Temperature integrated circuit temperature sensors. Operating as
Scale a 2-terminal zener, the LM135 has a breakdown
• 1°C Initial Accuracy Available voltage directly proportional to absolute temperature
• Operates from 400 μA to 5 mA at 10 mV/°K. With less than 1-Ωdynamic impedance,
the device operates over a current range of 400 μA to
• Less than 1-ΩDynamic Impedance 5 mA with virtually no change in performance. When
• Easily Calibrated calibrated at 25°C, the LM135 has typically less than
• Wide Operating Temperature Range 1°C error over a 100°C temperature range. Unlike
other sensors, the LM135 has a linear output.
• 200°C Overrange
• Low Cost Applications for the LM135 include almost any type of
temperature sensing over a −55°C to 150°C
temperature range. The low impedance and linear
2 Applications output make interfacing to readout or control circuitry
• Power Supplies are especially easy.
• Battery Management The LM135 operates over a −55°C to 150°C
• HVAC temperature range while the LM235 operates over a
• Appliances −40°C to 125°C temperature range. The LM335
operates from −40°C to 100°C. The LMx35 devices
are available packaged in hermetic TO transistor
packages while the LM335 is also available in plastic
TO-92 packages.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM135 TO-46 (3) 4.699 mm × 4.699 mm
LM135A
LM235 TO-92 (3) 4.30 mm × 4.30 mm
LM235A
LM335 SOIC (8) 4.90 mm × 3.91 mm
LM335A
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Basic Temperature Sensor Simplified Schematic Calibrated Sensor
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM135
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Table of Contents
1 Features.................................................................. 18 Application and Implementation ........................ 10
8.1 Application Information............................................ 10
2 Applications ........................................................... 18.2 Typical Application.................................................. 10
3 Description............................................................. 18.3 System Examples ................................................... 11
4 Revision History..................................................... 29 Power Supply Recommendations...................... 16
5 Pin Configuration and Functions......................... 310 Layout................................................................... 16
6 Specifications......................................................... 410.1 Layout Guidelines ................................................. 16
6.1 Absolute Maximum Ratings ...................................... 410.2 Layout Example .................................................... 16
6.2 Recommended Operating Conditions....................... 410.3 Waterproofing Sensors ......................................... 17
6.3 Thermal Information.................................................. 410.4 Mounting the Sensor at the End of a Cable.......... 17
6.4 Temperature Accuracy: LM135/LM235,
LM135A/LM235A ....................................................... 411 Device and Documentation Support................. 18
6.5 Temperature Accuracy: LM335, LM335A(1).............. 511.1 Device Support...................................................... 18
6.6 Electrical Characteristics........................................... 511.2 Related Links ........................................................ 18
6.7 Typical Characteristics.............................................. 611.3 Trademarks........................................................... 18
11.4 Electrostatic Discharge Caution............................ 18
7 Detailed Description.............................................. 811.5 Glossary................................................................ 18
7.1 Overview................................................................... 8
7.2 Functional Block Diagram......................................... 812 Mechanical, Packaging, and Orderable
Information........................................................... 18
7.3 Feature Description................................................... 8
7.4 Device Functional Modes.......................................... 9
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (March 2013) to Revision E Page
• Added Pin Configuration and Functions section, Feature Description section, Device Functional Modes,Application
and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
Changes from Revision C (November 2012) to Revision D Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 18
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5 Pin Configuration and Functions
TO-46 (NDV) TO-92 (LP)
3 Pins 3 Pins
Bottom View Bottom View
SOIC (D)
8 Pins
Top View
Pin Functions
PIN I/O DESCRIPTION
NAME TO-46 TO-92 SO8
— — 1
N.C. — — 2 — No Connection
— — 3
– — — 4 O Negative output
ADJ — — 5 I Calibration adjust pin
— — 6
N.C. — No Connection
— — 7
+ — — 8 I Positive input
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)(3)(4)
MIN MAX UNIT
Reverse Current 15 mA
Forward Current 10 mA
8-Pin SOIC Package −65 150 °C
Storage temperature,
Tstg TO / TO-92 Package −60 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Refer to RETS135H for military specifications.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) Soldering process must comply with the Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging.
6.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
Continuous (TMIN ≤TA≤TMAX)−55 150 °C
LM135, LM135A Intermittent (1) 150 200
Continuous (TMIN ≤TA≤TMAX)−40 125 °C
Specified Temperature LM235, LM235A Intermittent (1) 125 150
Continuous (TMIN ≤TA≤TMAX)−40 100 °C
LM335, LM335A Intermittent (1) 100 125
Forward Current 0.4 1 5 mA
(1) Continuous operation at these temperatures for 5,000 hours for LP package may decrease life expectancy of the device.
6.3 Thermal Information LM335 / LM235 / LM135 /
LM335A LM235A LM135A
THERMAL METRIC(1) UNIT
SOIC (D) TO-92 (LP) TO-46 (NDV)
8 PINS 3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 165 202 400 °C/W
RθJC Junction-to-case thermal resistance — 170 —
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.4 Temperature Accuracy: LM135/LM235, LM135A/LM235A(1)
LM135A/LM235A LM135/LM235
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
Operating Output Voltage TC= 25°C, IR= 1 mA 2.97 2.98 2.99 2.95 2.98 3.01 V
Uncalibrated Temperature Error TC= 25°C, IR= 1 mA 0.5 1 1 3 °C
Uncalibrated Temperature Error TMIN ≤TC≤TMAX, IR= 1 1.3 2.7 2 5 °C
mA
Temperature Error with 25°C TMIN ≤TC≤TMAX, IR= 1 0.3 1 0.5 1.5 °C
mA
Calibration Calibrated Error at Extended TC= TMAX (Intermittent) 2 2 °C
Temperature Non-Linearity IR= 1 mA 0.3 0.5 0.3 1 °C
(1) Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered.
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6.5 Temperature Accuracy: LM335, LM335A(1)
LM335A LM335
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
Operating Output Voltage TC= 25°C, IR= 1 mA 2.95 2.98 3.01 2.92 2.98 3.04 V
Uncalibrated Temperature Error TC= 25°C, IR= 1 mA 1 3 2 6 °C
Uncalibrated Temperature Error TMIN ≤TC≤TMAX, IR= 1 2 5 4 9 °C
mA
Temperature Error with 25°C TMIN ≤TC≤TMAX, IR= 1 0.5 1 1 2 °C
mA
Calibration Calibrated Error at Extended TC= TMAX (Intermittent) 2 2 °C
Temperature Non-Linearity IR= 1 mA 0.3 1.5 0.3 1.5 °C
(1) Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered.
6.6 Electrical Characteristics
See (1).LM135/LM235/LM135A/LM LM335/LM335A
235A
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
Operating Output Voltage Change 400 μA≤IR≤5 mA, At 2.5 10 3 14 mV
with Current Constant Temperature
Dynamic Impedance IR= 1 mA 0.5 0.6 Ω
Output Voltage Temperature 10 10 mV/°C
Coefficient
Time Constant Still Air 80 80 sec
100 ft/Min Air 10 10 sec
Stirred Oil 1 1 sec
Time Stability TC= 125°C 0.2 0.2 °C/khr
(1) Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered.
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6.7 Typical Characteristics
Figure 1. Reverse Voltage Change Figure 2. Calibrated Error
Figure 3. Reverse Characteristics Figure 4. Response Time
Figure 5. Dynamic Impedance Figure 6. Noise Voltage
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Typical Characteristics (continued)
Figure 8. Thermal Time Constant
Figure 7. Thermal Resistance Junction To Air
Figure 10. Thermal Response In Stirred Oil Bath
Figure 9. Thermal Response In Still Air
Figure 11. Forward Characteristics
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7 Detailed Description
7.1 Overview
Applications for the LM135 include almost any type of temperature sensing over a −55°C to 150°C temperature
range. The low impedance and linear output make interfacing to readout or control circuitry especially easy.
The LM135 operates over a −55°C to 150°C temperature range while the LM235 operates over a −40°C to
125°C temperature range. The LM335 operates from −40°C to 100°C.
Operating as a 2-terminal zener, the LM135 has a breakdown voltage directly proportional to absolute
temperature at 10 mV/°K. With less than 1-Ωdynamic impedance, the device operates over a current range of
400 μA to 5 mA with virtually no change in performance. When calibrated at 25°C, the LM135 has typically less
than 1°C error over a 100°C temperature range. Unlike other sensors, the LM135 has a linear output.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Temperature Calibration Using ADJ Pin
Included on the LM135 chip is an easy method of calibrating the device for higher accuracies. A pot connected
across the LM135 with the arm tied to the adjustment terminal (as shown in Figure 12) allows a 1-point
calibration of the sensor that corrects for inaccuracy over the full temperature range.
This single point calibration works because the output of the LM135 is proportional to absolute temperature with
the extrapolated output of sensor going to 0-V output at 0 K (−273.15°C). Errors in output voltage versus
temperature are only slope (or scale factor) errors so a slope calibration at one temperature corrects at all
temperatures.
The output of the device (calibrated or uncalibrated) can be expressed as:
where
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Feature Description (continued)
• T is the unknown temperature in degrees Kelvin
• Tois a reference temperature in degrees Kelvin (1)
By calibrating the output to read correctly at one temperature the output at all temperatures is correct. Nominally
the output is calibrated at 10 mV/K.
Calibrate for 2.982V at 25°C
Figure 12. Calibrated Sensor
7.4 Device Functional Modes
The LM135 has two functional modes calibrated and uncalibrated. For optimum accuracy, a one point calibration
is recommended. For more information on calibration, see Temperature Calibration Using ADJ Pin.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
To insure good sensing accuracy, several precautions must be taken. Like any temperature-sensing device, self-
heating can reduce accuracy. The LM135 should be operated at the lowest current suitable for the application.
Sufficient current, of course, must be available to drive both the sensor and the calibration pot at the maximum
operating temperature as well as any external loads.
If the sensor is used in an ambient where the thermal resistance is constant, self-heating errors can be calibrated
out. This is possible if the device is run with a temperature-stable current. Heating will then be proportional to
zener voltage and therefore temperature. This makes the self-heating error proportional to absolute temperature
the same as scale factor errors.
8.2 Typical Application
Figure 13. Basic Temperature Sensor
8.2.1 Design Requirements
Table 1. Design Parameters
PARAMETER EXAMPLE VALUE
Accuracy at 25°C ±1°C
Accuracy from –55 °C to 150 °C ±2.7°C
Forward Current 1 mA
Temperature Slope 10m V/K
8.2.2 Detailed Design Procedure
For optimum accuracy, R1 is picked such that 1 mA flows through the sensor. Additional error can be introduced
by varying load currents or varying supply voltage. The influence of these currents on the minimum and
maximum reverse current flowing through the LM135 should be calculated and be maintained in the range of 0.4
mA to 5 mA. Minimizing the current variation through the LM135 will provide for the best accuracy. The
Operating Output Voltage Change with Current specification can be used to calculate the additional error which
could be up to 1 K maximum from the LM135A, for example.
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8.2.3 Application Curve
Figure 14. Reverse Characteristics
8.3 System Examples
Figure 15. Wide Operating Supply Figure 16. Minimum Temperature Sensing
Wire length for 1°C error due to wire drop
Figure 17. Average Temperature Sensing Figure 18. Isolated Temperature Sensor
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System Examples (continued)
Figure 19. Simple Temperature Controller Figure 20. Simple Temperature Control
Adjust R2 for 2.554V across LM336. Adjust for 2.7315V at output of LM308
Adjust R1 for correct output.
Figure 21. Ground Referred Fahrenheit Figure 22. Centigrade Thermometer
Thermometer
To calibrate adjust R2 for 2.554V across LM336.
Adjust R1 for correct output.
Figure 23. Fahrenheit Thermometer
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System Examples (continued)
8.3.1 Thermocouple Cold Junction Compensation
Compensation for Grounded Thermocouple
Select R3 for proper thermocouple type
Figure 24. Thermocouple Cold Junction Compensation
THERMO-COUPLE R3 (±1%) SEEBECK COEFFICIENT
J 377 Ω52.3 μV/°C
T 308 Ω42.8 μV/°C
K 293 Ω40.8 μV/°C
S 45.8 Ω6.4 μV/°C
Adjustments: Compensates for both sensor and resistor tolerances
1. Short LM329B
2. Adjust R1 for Seebeck Coefficient times ambient temperature (in degrees K) across R3.
3. Short LM335 and adjust R2 for voltage across R3 corresponding to thermocouple type.
J 14.32 mV K 11.17 mV
T 11.79 mV S 1.768 mV
THERMO-COUPLE R3 R4 SEEBECK COEFFICIENT
J 1.05K 385Ω52.3 μV/°C
T 856Ω315Ω42.8 μV/°C
K 816Ω300Ω40.8 μV/°C
S 128Ω46.3Ω6.4 μV/°C
Adjustments:
1. Adjust R1 for the voltage across R3 equal to the Seebeck Coefficient times ambient temperature in degrees Kelvin.
2. Adjust R2 for voltage across R4 corresponding to thermocouple.
J 14.32 mV
T 11.79 mV
K 11.17 mV
S 1.768 mV
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Terminate thermocouple reference junction in close
proximity to LM335.
Adjustments:
1. Apply signal in place of thermocouple and adjust
R3 for a gain of 245.7.
2. Short non-inverting input of LM308A and output of
Select R3 and R4 for thermocouple type LM329B to ground.
3. Adjust R1 so that VOUT = 2.982V @ 25°C.
4. Remove short across LM329B and adjust R2 so
that VOUT = 246 mV @ 25°C.
5. Remove short across thermocouple.
Figure 25. Single Power Supply Cold Junction Figure 26. Centigrade Calibrated Thermocouple
Compensation Thermometer
Figure 27. Differential Temperature Sensor Figure 28. Differential Temperature Sensor
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Adjust D1 to 50 mV greater VZthan D2.
Charge terminates on 5°C temperature rise.
Couple D2 to battery.
Adjust for zero with sensor at 0°C and 10T pot set at
0°C
Adjust for zero output with 10T pot set at 100°C and
sensor at 100°C
Output reads difference between temperature and
dial setting of 10T pot
Figure 29. Fast Charger For Nickel-Cadmium Figure 30. Variable Offset Thermometer
Batteries
*Self heating is used to detect air flow
Figure 31. Ground Referred Centigrade Figure 32. Air Flow Detector
Thermometer
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ADJ
N.C.
N.C.
-
N.C.
VIA to ground plane
VIA to power plane
+ N.C.
N.C.
R1
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9 Power Supply Recommendations
Ensure the LM335 is biased properly with a current ranging 0.4 mA to 5 mA.
10 Layout
10.1 Layout Guidelines
The LM135 is applied easily in the same way as other integrated-circuit temperature sensors. Glue or cement the
device to a surface and the temperature should be within about 0.01°C of the surface temperature.
Efficient temperature transfer assumes that the ambient air temperature is almost the same as the surface
temperature where the LM135 leads are attached. If there is a great difference between the air temperature and
the surface temperature, the actual temperature of the LM135 die would be at an intermediate temperature
between the two temperatures. For example, the TO-92 plastic package, where the copper leads are the
principal thermal path to carry heat into the device, can be greatly affected by airflow. The temperature sensed
by the TO92 package could greatly depend on velocity of the airflow as well.
To lessen the affect of airflow, ensure that the wiring to the LM135 (leads and wires connected to the leads) is
held at the same temperature as the surface temperature that is targeted for measurement. To insure that the
temperature of the LM135 die is not affected by the air temperature, mechanically connect the LM135 leads with
a bead of epoxy to the surface being measured. If air temperature is targeted for measurement ensure that the
PCB surface temperature is close to the air temperature. Keep the LM135 away from offending PCB heat
sources such as power regulators. One method commonly used for thermal isolation is to route a thermal well as
shown in Figure 33 with the smallest possible geometry traces connecting back to rest of the PCB.
10.2 Layout Example
Figure 33. Layout Example
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10.3 Waterproofing Sensors
Meltable inner-core, heat-shrinkable tubing, such as manufactured by Raychem, can be used to make low-cost
waterproof sensors. The LM335 is inserted into the tubing about 0.5 inches from the end and the tubing heated
above the melting point of the core. The unfilled 0.5-inch end melts and provides a seal over the device.
10.4 Mounting the Sensor at the End of a Cable
The main error due to a long wire is caused by the voltage drop across that wire caused by the reverse current
biasing the LM135 on. Table 2 shows the wire AWG and the length of wire that would cause 1°C error.
Figure 34. Cable Connected Temperature Sensor
Table 2. Wire Length for 1°C Error Due to Wire Drop
IR= 1 mA IR= 0.5 mA(1)
AWG FEET FEET
14 4000 8000
16 2500 5000
18 1600 3200
20 1000 2000
22 625 1250
24 400 800
(1) For IR= 0.5 mA, the trim pot must be deleted.
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Device Nomenclature
Operating Output Voltage: The voltage appearing across the positive and negative terminals of the device at
specified conditions of operating temperature and current.
Uncalibrated Temperature Error: The error between the operating output voltage at 10 mV/°K and case
temperature at specified conditions of current and case temperature.
Calibrated Temperature Error: The error between operating output voltage and case temperature at 10 mV/°K
over a temperature range at a specified operating current with the 25°C error adjusted to zero.
11.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 3. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY
LM135 Click here Click here Click here Click here Click here
LM135A Click here Click here Click here Click here Click here
LM235 Click here Click here Click here Click here Click here
LM235A Click here Click here Click here Click here Click here
LM335 Click here Click here Click here Click here Click here
LM335A Click here Click here Click here Click here Click here
11.3 Trademarks
All trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM135AH ACTIVE TO NDV 3 500 Non-RoHS &
Non-Green Call TI Call TI -55 to 150 ( LM135AH, LM135AH
)
LM135AH/NOPB ACTIVE TO NDV 3 500 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 150 ( LM135AH, LM135AH
)
LM135H ACTIVE TO NDV 3 500 Non-RoHS &
Non-Green Call TI Call TI -55 to 150 ( LM135H, LM135H)
LM135H/NOPB ACTIVE TO NDV 3 500 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 150 ( LM135H, LM135H)
LM235AH ACTIVE TO NDV 3 500 Non-RoHS &
Non-Green Call TI Call TI -40 to 125 ( LM235AH, LM235AH
)
LM235AH/NOPB ACTIVE TO NDV 3 500 RoHS & Green Call TI Level-1-NA-UNLIM -40 to 125 ( LM235AH, LM235AH
)
LM235H ACTIVE TO NDV 3 500 Non-RoHS &
Non-Green Call TI Call TI -40 to 125 ( LM235H, LM235H)
LM235H/NOPB ACTIVE TO NDV 3 500 RoHS & Green Call TI Level-1-NA-UNLIM -40 to 125 ( LM235H, LM235H)
LM335A MWC ACTIVE WAFERSALE YS 0 1 TBD Call TI Call TI -40 to 85
LM335AH/NOPB ACTIVE TO NDV 3 1000 RoHS & Green Call TI Level-1-NA-UNLIM -40 to 100 ( LM335AH, LM335AH
)
LM335AM NRND SOIC D 8 95 Non-RoHS
& Green Call TI Call TI -40 to 100 LM335
AM
LM335AM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 100 LM335
AM
LM335AMX NRND SOIC D 8 2500 Non-RoHS
& Green Call TI Call TI -40 to 100 LM335
AM
LM335AMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 100 LM335
AM
LM335AZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 100 LM335
AZ
LM335H ACTIVE TO NDV 3 1000 Non-RoHS &
Non-Green Call TI Call TI -40 to 100 ( LM335H, LM335H)
LM335H/NOPB ACTIVE TO NDV 3 1000 RoHS & Green Call TI Level-1-NA-UNLIM -40 to 100 ( LM335H, LM335H)
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM335M NRND SOIC D 8 95 Non-RoHS
& Green Call TI Call TI -40 to 100 LM335
M
LM335M/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 100 LM335
M
LM335MX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 100 LM335
M
LM335Z/LFT7 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM335
Z
LM335Z/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 100 LM335
Z
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 3
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM335AMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM335AMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM335MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM335AMX SOIC D 8 2500 367.0 367.0 35.0
LM335AMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM335MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
( 2.54)
1.16
0.92
4.95
4.55
0.76 MAX 2.67 MAX
0.64 MAX
UNCONTROLLED
LEAD DIA
3X
12.7 MIN
3X 0.483
0.407
-5.565.32
1.22
0.72
45
TO-CAN - 2.67 mm max heightNDV0003H
TO-46
4219876/A 01/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-46.
1
2
3
SCALE 1.250
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND
0.07 MAX
TYP
( 1.2)
METAL
2X ( 1.2)
METAL
3X ( 0.7) VIA
(R0.05) TYP
(2.54)
(1.27)
TO-CAN - 2.67 mm max heightNDV0003H
TO-46
4219876/A 01/2017
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:12X
2X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
1
2
3
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
www.ti.com
PACKAGE OUTLINE
3X 2.67
2.03
5.21
4.44
5.34
4.32
3X
12.7 MIN
2X 1.27 0.13
3X 0.55
0.38
4.19
3.17
3.43 MIN
3X 0.43
0.35
(2.54)
NOTE 3
2X
2.6 0.2
2X
4 MAX
SEATING
PLANE
6X
0.076 MAX
(0.51) TYP
(1.5) TYP
TO-92 - 5.34 mm max heightLP0003A
TO-92
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
EJECTOR PIN
OPTIONAL
PLANE
SEATING
STRAIGHT LEAD OPTION
321
SCALE 1.200
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL
TO STRAIGHT LEAD OPTION
SCALE 1.200
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND
TYP
(1.07)
(1.5) 2X (1.5)
2X (1.07)
(1.27)
(2.54)
FULL R
TYP
( 1.4)0.05 MAX
ALL AROUND
TYP
(2.6)
(5.2)
(R0.05) TYP
3X ( 0.9) HOLE
2X ( 1.4)
METAL
3X ( 0.85) HOLE
(R0.05) TYP
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
LAND PATTERN EXAMPLE
FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
SOLDER MASK
OPENING
METAL
2X
SOLDER MASK
OPENING
123
LAND PATTERN EXAMPLE
STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
METAL
TYP
SOLDER MASK
OPENING
2X
SOLDER MASK
OPENING
2X
METAL
12 3
www.ti.com
TAPE SPECIFICATIONS
19.0
17.5
13.7
11.7
11.0
8.5
0.5 MIN
TYP-4.33.7
9.75
8.50
TYP
2.9
2.4 6.75
5.95
13.0
12.4
(2.5) TYP
16.5
15.5
32
23
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
FOR FORMED LEAD OPTION PACKAGE
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