FAN48615 Fixed-Output Synchronous TinyBoost) Regulator Description The FAN48615 is a low-power PWM only boost regulator designed to provide a minimum voltage-regulated rail from a standard single-cell Li-Ion battery and advanced battery chemistries. Even below the minimum system battery voltage, the device maintains the output voltage regulation for an output load current of 1000 mA. The combination of built-in power transistors, synchronous rectification, and low supply current suit the FAN48615 for battery-powered applications. The FAN48615 is available in a 9-bump, 0.4 mm pitch, (1.215 x 1.215 mm) Wafer-Level Chip-Scale Package (WLCSP). www.onsemi.com WLCSP9 CASE 567QW MARKING DIAGRAM Features * * * * * * * * * * * 1 Input Voltage Range: 2.7 V to 5.5 V Output Voltage: 5.25 V and 5.4 V 1000 mA Max. Load Capability PWM Only Up to 97% Efficient Forced Pass-Through Operation via EN Pin Internal Synchronous Rectification True Load Disconnect Short-Circuit Protection Three External Components: 2016 (Metric) 0.47 mH Inductor, 0402 Input and 0603 Output Capacitors This is a Pb-Free Device Kx AWLYYWWG G KY / KZ F A WL YY WW G = Specific Device Code = Fab Indicator = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) Applications Class-D Audio Amplifier Boost for Low-Voltage Li-Ion Batteries Smart Phones, Tablets, Portable Devices RF Applications NFC Applications Battery * * * * * + L1 0.47 mH VIN VOUT CIN 10 mF COUT FAN48615 10 mF SW PGND EN AGND SYSTEM LOAD Figure 1. Typical Application ORDERING INFORMATION Part Number VOUT Operating Temperature Package Packing Device Marking FAN48615UC08X 5.25 V -40C to 85C 3000 / Tape & Reel KY FAN48615UC11X 5.40 V 9-Bump, 0.4 mm Pitch, WLCSP Package (c) Semiconductor Components Industries, LLC, 2018 May, 2018 - Rev. 0 1 KZ Publication Order Number: FAN48615/D FAN48615 Block Diagram SW Q2A L1 Q2B VOUT VIN Q1 CIN Q2 COUT Synchronous Rectifier Control PGND EN Modulator Logic & Control AGND Figure 2. IC Block Diagram Table 1. RECOMMENDED COMPONENTS Component Description Vendor Parameter Typical Value Unit L1 20%, 5.3 A, 2016, 1.0 mm Height DFE201610E-R47M TOKO Inductance 470 nH DCR (Series R) 26 mW CIN 20%, 6.3 V, X5R, 0402 (1005) C1005X5R0J106M050BC TDK Capacitance 10 mF COUT 20%, 10 V, X5R, 0603 (1608) C1608X5R1A106K080AC TDK Capacitance 10 mF www.onsemi.com 2 FAN48615 Pin Configuration VOUT VOUT VIN VIN VOUT VOUT A1 A2 A3 A3 A2 A1 SW SW EN EN SW SW B1 B2 B3 B3 B2 B1 PGND PGND AGND AGND PGND PGND C1 C2 C3 C3 C2 C1 Top View (Bumps Down) Bottom View (Bumps Up) Figure 3. Pin Assignment Pin Definitions Table 2. PIN DEFINITIONS Pin # Name A1 VOUT Description Output Voltage. This pin is the output voltage terminal; connect directly to COUT. A2 A3 VIN Input Voltage. Connect to Li-Ion battery input power source and CIN. B1 SW Switching Node. Connect to inductor. B3 EN Enable. When this pin is HIGH, the circuit is enabled. After part is engaged, pin forces part into Forced-Pass-Through Mode when EN pin is pulled LOW. C1 PGND Power Ground. This is the power return for the IC. COUT capacitor should be returned with the shortest path possible to these pins. AGND Analog Ground. This is the signal ground reference for the IC. All voltage levels are measured with respect to this pin - connect to PGND at a single point. B2 C2 C3 www.onsemi.com 3 FAN48615 Table 3. ABSOLUTE MAXIMUM RATINGS Symbol VIN Parameter Voltage on VIN Pin VOUT Voltage on VOUT Pin VSW SW Node VCC Voltage on Other Pins ESD Electrostatic Discharge Protection Level Min Max Unit -0.3 6.0 V 6.0 V 6.0 V DC -0.3 Transient: 10 ns, 3 MHz -1.0 8.0 -0.3 6.0(1) Human Body Model, ANSI/ESDA/ JEDEC JS-001-2012 V kV 2.0 Charged Device Model, JESD22-C101 1.0 TJ Junction Temperature -40 150 C TSTG Storage Temperature -65 150 C 260 C TL Lead Soldering Temperature, 10 Seconds Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Lesser of 6.0 V or VIN + 0.3 V. Table 4. RECOMMENDED OPERATING CONDITIONS Symbol Parameter (2) Min Max 2.7 5.5 Unit VIN Supply Voltage for Boost & Auto Pass Through Operation IOUT Maximum Output Current 1000 V TA Ambient Temperature -40 85 C TJ Junction Temperature -40 125 C mA Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 2. When VIN nears VOUT the part will automatically go into pass through mode, depending on load current. Table 5. THERMAL PROPERTIES Symbol qJA NOTE: Parameter Junction-to-Ambient Thermal Resistance Typical Unit 50 C/W Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 2s2p boards with vias in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature, TJ(max), at a given ambient temperature, TA. www.onsemi.com 4 FAN48615 Table 6. ELECTRICAL CHARACTERISTICS Recommended operating conditions, unless otherwise noted, circuit per Figure 1, VOUT = 5.40 V. Typical, minimum and maximum values are given at VIN = 3.6 V, TA = 25C, -40C and +85C. Symbol Parameter Conditions Min Typ Max Unit Power Supply IQ VIN Quiescent Current VUVLO Under-Voltage Lockout VUVLO_HYS IOUT = 0 mA, EN = 1.8 V, No Switching 95 mA Forced Pass-Through EN = 0 V, VOUT = VIN 3.5 VIN Rising 2.20 V 150 mV Under-Voltage Lockout Hysteresis Inputs VIH Enable HIGH Voltage VIL Enable LOW Voltage 1.05 V 0.4 V +2 % 2.8 MHz Outputs VREG Output Voltage Accuracy DC (3) 2.7 V VIN 4.5 V -2 Switching Frequency IOUT = 300 mA 1.8 EN HIGH to 95% of Regulation IOUT = 150 mA Timing fSW tSS (4) 2.3 440 ms FAULT Restart Timer 20 ms RDS(ON)N N-Channel Boost Switch RDS(ON) 63 mW RDS(ON)P P-Channel Sync. Rectifier RDS(ON) 52 mW tRST (4) Power Stage 3. DC ILOAD from 0 to 1 A. VOUT measured from mid-point of output voltage ripple. Effective capacitance of COUT 2.2 mF. 4. Guaranteed by design and characterization; not tested in production. www.onsemi.com 5 FAN48615 Typical Performance Characteristics Unless otherwise specified; VIN = 3.8 V, VOUT = 5.40 V, TA = 25C, and circuit according to Figure 1. Components: CIN = 10 mF (0402, X5R, 6.3 V, C1005X5R0J106M050BC), COUT = 10 mF (0603, X5R, 10 V, C1608X5R1A106K080AC), L1 = 470 nH (2016, 26 mW, DFE201610E-R47M ). Figure 4. Quiescent Current (Switching) vs. Input Voltage and Temperature Figure 5. Pass-Through Current vs. Input Voltage and Temperature Figure 6. Efficiency vs. Load Current and Input Voltage Figure 7. Efficiency vs. Load Current and Temperature Figure 8. Switching Frequency vs. Load Current and Input Voltage Figure 9. Switching Frequency vs. Load Current and Temperature www.onsemi.com 6 FAN48615 Typical Performance Characteristics Unless otherwise specified; VIN = 3.8 V, VOUT = 5.40 V, TA = 25C, and circuit according to Figure 1. Components: CIN = 10 mF (0402, X5R, 6.3 V, C1005X5R0J106M050BC), COUT = 10 mF (0603, X5R, 10 V, C1608X5R1A106K080AC), L1 = 470 nH (2016, 26 mW, DFE201610E-R47M ). Figure 10. Output Regulation vs. Load Current and Input Voltage Figure 11. Output Regulation vs. Load Current and Temperature Figure 12. Output Ripple vs. Load Current and Input Voltage Figure 13. Output Ripple vs. Load Current and Temperature Figure 14. Load Transient, 3.6 VIN, 100 e 200 mA, 1 ms Edge Figure 15. Line Transient, 50 mA, 3.2 V e 3.9 V, 10 ms Edge www.onsemi.com 7 FAN48615 Typical Performance Characteristics Unless otherwise specified; VIN = 3.8 V, VOUT = 5.40 V, TA = 25C, and circuit according to Figure 1. Components: CIN = 10 mF (0402, X5R, 6.3 V, C1005X5R0J106M050BC), COUT = 10 mF (0603, X5R, 10 V, C1608X5R1A106K080AC), L1 = 470 nH (2016, 26 mW, DFE201610E-R47M ). Figure 16. Startup, 150 mA Load Figure 17. Fault Restart www.onsemi.com 8 FAN48615 CIRCUIT DESCRIPTION Pass-Through Mode FAN48615 is a synchronous PWM Only boost regulator. The regulator's Pass-Through Mode automatically activates when VIN is above the boost regulator's set point. The device allows the user to force the device in Forced Pass-Through Mode through the EN pin. If the EN pin is pulled HIGH, the device starts operating in Boost Mode. Once the EN pin is pulled LOW, the device is forced into Pass-Through Mode. To disable the device, the input supply voltage must be removed. The device cannot startup in Forced Pass-Through Mode (see Figure 18). During startup, keep the EN pulled HIGH for at least 350 ms before pulling it LOW in order to make sure that the device enters Pass- Through Mode reliably. In normal operation, the device automatically transitions from Boost Mode to Pass-Through Mode if VIN goes above the target VOUT. In Pass-Through Mode, the device fully enhances Q2 to provide a very low impedance path from VIN to VOUT. Entry to the Pass-Through Mode is triggered by condition where VIN > VOUT and no switching has occurred during the past 5 ms. To soften the entry into Pass-Through Mode, Q2 is driven as a linear current source for the first 5 ms. Pass-Through Mode exit is triggered when VOUT reaches the target VOUT voltage. During Automatic Pass-Through Mode, the device is short-circuit protected by a voltage comparator tracking the voltage drop from VIN to VOUT; if the drop exceeds 300 mV, a fault is declared. Table 7. OPERATING MODES Mode Description Invoked When: LIN Linear Startup VIN > VOUT SS Boost Soft-Start VIN < VOUT < VOUT(TARGET) BST Boost Operating Mode VOUT = VOUT(TARGET) PT Pass-Through Mode VIN > VOUT(TARGET) or when EN is pulled LOW after initial startup Boost Mode Regulation The FAN48615 uses a current-mode modulator to achieve excellent transient response. Table 8. BOOST STARTUP SEQUENCE Start Mode LIN1 LIN2 SS Entry Exit End Mode VIN > VUVLO, EN = 1 VOUT > VIN - 300 mV SS Timeout LIN2 LIN1 Exit VOUT > VIN - 300 mV SS Timeout FAULT VOUT = VOUT(TARGET) BST Overload Timeout FAULT LIN1 or LIN2 Exit Timeout (ms) 512 1024 64 VIN 0V VEN 0V tSS Boost mode LIN Mode VBOOST When EN is HIGH and VIN > VUVLO, the regulator first attempts to bring VOUT within 300 mV of VIN by using the internal fixed-current source from VIN (Q2). The current is limited to the LIN1 set point. If VOUT reaches VIN-300 mV during LIN1 Mode, the SS Mode is initiated. Otherwise, LIN1 times out after 512 ms and LIN2 Mode is entered. In LIN2 Mode, the current source is incremented. If VOUT fails to reach VIN-300 mV after 1024 ms, a fault condition is declared and the device waits 20 ms to attempt an automatic restart. VOUT VIN 0V Force Pass-Through mode Part Shuts down Figure 18. Pass-Through Profile Current Limit Protection The FAN48615 has valley current limit protection in case of overload situations. The valley current limit will prevent high current from causing damage to the IC and the inductor. The current limit is halved during soft-start. When starting into a fault condition, the input current will be limited by LIN1 and LIN2 current threshold. Soft-Start (SS) Mode Upon the successful completion of LIN Mode (VOUT VIN- 300 mV), the regulator begins switching with boost pulses current limited to 50% of nominal level. During SS Mode, if VOUT fails to reach regulation during the SS ramp sequence for more than 64 ms, a fault is declared. If large COUT is used, the reference is automatically stepped slower to avoid excessive input current draw. Fault State The regulator enters Fault State under any of the following conditions: * VOUT fails to achieve the voltage required to advance from LIN Mode to SS Mode. * VOUT fails to achieve the voltage required to advance from SS Mode to BST Mode. Boost (BST) Mode This is a normal operating mode of the regulator. www.onsemi.com 9 FAN48615 * Boost current limit triggers for 2 ms during BST Mode. * VIN - VOUT > 300 mV; this fault can occur only after successful completion of the soft-start sequence. * VIN < VUVLO Once a fault is triggered, the regulator stops switching and presents a high-impedance path between VIN and VOUT. After waiting 20 ms, an automatic restart is attempted. Over-Temperature The regulator shuts down if the die temperature exceeds 150C and restarts when the IC cools by ~20C. Layout Recommendation The layout recommendations below highlight various top-copper pours by using different colors. To minimize spikes at VOUT, COUT must be placed as close as possible to PGND and VOUT, as shown in Figure 19. For best thermal performance, maximize the pour area for all planes other than SW. The ground pour, especially, should fill all available PCB surface area and be tied to internal layers with a cluster of thermal vias. Figure 19. Recommended Layout Table 9. PRODUCT-SPECIFIC PACKAGE DIMENSIONS The following information applies to the WLCSP package dimensions on the next page. Product D (mm) E (mm) X (mm) Y (mm) FAN48615UC08X 1.215 0.030 1.215 0.030 0.2075 0.2075 All other brand names and product names appearing in this document are registered trademarks or trademarks of their respective holders. www.onsemi.com 10 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP9 1.215x1.215x0.581 CASE 567QW ISSUE O DATE 31 OCT 2016 DOCUMENT NUMBER: STATUS: 98AON13355G ON SEMICONDUCTOR STANDARD NEW STANDARD: (c) Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 - Rev. 0 http://onsemi.com WLCSP9 1.215x1.215x0.581 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON13355G PAGE 2 OF 2 ISSUE O REVISION RELEASED FOR PRODUCTION FROM FAIRCHILD UC009AK TO ON SEMICONDUCTOR. REQ. BY F. ESTRADA. 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