RN4871U-V/RM118 - MICROCHIP TECHNOLOGY

 2016 Microchip Technology Inc. DS50002489A-page 1

RN4870/71

Features

• Fully Qualified Bluetooth® Smart Module

• On-Board Bluetooth 4.2 Low Energy Stack

• ASCII Command Interface API over UART

• Scripting Engine for Hostless Operation

• Compact Form Factor – The RN4870/71 family

comes in four different sizes from 6 mm x 8 mm to

12 mm x 22 mm:

- RN4870: 12 mm x 22 mm

- RN4871: 9 mm x 11.5 mm

- RN4870U: 12 mm x 15 mm

- RN4871U: 6 mm x 8 mm

• Beacon Private Service for Beacon Services

• UART Transparent Service for Serial Data

Applications

• Remote Configuration Over The Air

Operational

• Operating Voltage: 1.9V to 3.6V (3.3V typical)

• Temperature Range: -20°C to +70°C

• Supports UART

• Up to Three Pulse Width Modulation (PWM)

Outputs

RF/Analog Features

• ISM Band 2.402 to 2.480 GHz Operation

• Channels: 0-39

• RX Sensitivity: -90 dBm

• TX Power: 0 dBm

• RSSI Monitor

MAC/Baseband/Higher Layer Features

• Secure AES128 Encryption

• GAP, GATT, SM, L2CAP and Integrated Public

Profiles

• Customer Can Create up to Five Public and Four

Private Services

• Keyboard I/O Authentication

• Software Configurable Role as Peripheral or

Central and Client or Server

Antenna Options

• Ceramic Chip Antenna (RN4870/RN4871)

• External Antenna Connection via RF pad

(RN4870U/RN4871U)

Applications

• Health/Medical Devices

• Sports Activity/Fitness Meters

• Beacon Applications

• Internet of Things (IoT) Sensor Tag

• Remote Control

• Wearable Smart Devices and Accessories

• Smart Energy/Smart Home

• Industrial Control

Description

The RN487x modules, based on Microchip's IS187x

Bluetooth LE ICs, provide a complete solution to

implement Bluetooth 4.2 Low Energy connectivity.

These modules are interfaced via a two- or four-wire

UART interface with Microchip's simple ASCII

command set for easy integration into most

applications. All products in the RN series can be

dynamically configured by the host microcontroller with

a few simple ASCII commands. The RN487x series

also supports on-board scripting to automate basic

operations without a host microcontroller. The RN4870

(12 mm x 22 mm) and RN4871 (9 mm x 11.5 mm)

modules combine Microchip's Bluetooth LE Silicon with

all necessary peripheral components and an on-board

chip antenna to create an easy to use/drop-in solution.

All modules in this series are Bluetooth SIG qualified.

The RN4870 and RN4871 include FCC modular

certification, as well as most other worldwide

government regulatory approvals. For a listing of the

latest certifications, go to www.microchip.com/wireless.

The RN4870U (12 mm x 15 mm) and RN4871U (6 mm

x 8 mm) offer compact, flexible, unshielded options for

designs that are extremely space constrained or need

to remotely locate the antenna.

Bluetooth® 4.2 Low Energy Module

RN4870/71

DS50002489A-page 2  2016 Microchip Technology Inc.

Table of Contents

1.0 Device Overview .......................................................................................................................................................................... 3

2.0 Specifications ............................................................................................................................................................................... 9

3.0 Interface PINs..............................................................................................................................................................................11

4.0 Physical Dimensions And Attributes ........................................................................................................................................... 13

5.0 Application Reference Circuits ................................................................................................................................................... 23

6.0 ASCII Command API.................................................................................................................................................................. 29

7.0 Supported Services .................................................................................................................................................................... 31

8.0 Antenna Characteristics ............................................................................................................................................................. 33

9.0 Timing Characteristics ................................................................................................................................................................ 35

10.0 Regulatory Approval ................................................................................................................................................................... 37

11.0 Ordering Information .................................................................................................................................................................. 43

The Microchip Web Site ....................................................................................................................................................................... 45

Customer Change Notification Service ................................................................................................................................................ 45

Customer Support ................................................................................................................................................................................ 45

Product Identification System............................................................................................................................................................... 46

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Most Current Data Sheet

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You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.

The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).

Errata

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To determine if an errata sheet exists for a particular device, please check with one of the following:

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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are

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Customer Notification System

 2016 Microchip Technology Inc. DS50002489A-page 3

RN4870/71

1.0 DEVICE OVERVIEW

1.1 Overview

The RN4870/71 Bluetooth Low Energy (BLE) modules

integrate Bluetooth 4.2 baseband controller, on-board

Bluetooth stack, digital and analog I/O, and RF power

amplifier into one solution.

Table 1-1 shows the various options for packaging and

features available in the RN4870/71 family. Table 1-2

provides the description of the pin functions for all the

modules in the RN4870/71 family. Figure 1-1 through

Figure 1-4 show the pinout for the different modules.

TABLE 1-1: RN4870/71 FAMILY

Part Number(1) Antenna On-Board Shielding Number of Pins Dimensions

RN4870-V/RM118 Yes Yes 33 12 mm x 22 mm

RN4870U-V/RM118 No No 30 12 mm x 15 mm

RN4871-V/RM118 Yes Yes 16 9 mm x 11.5 mm

RN4871U-V/RM118 No No 17 6 mm x 8 mm

Note 1: The last three digits in P/N indicate firmware version. At the time of publication, the latest firmware version

is 1.18. Ensure to check product webpage for latest part number and firmware version.

TABLE 1-2: PIN DESCRIPTION

RN4870U RN4870 RN4871U RN4871 Name Type Description

— 1 — — GND Power Ground reference

— 2 — — GND Power Ground reference

1 3 12 13 GND Power Ground reference

2 4 11 14 VBAT Power Positive supply input. Range: 1.9V~3.6V

— — 10 — BK_IN Power Buck power supply input

Can be connected to the VBAT pin

Connect to 10 µF low ESR ceramic capacitor

Voltage range: 1.9V to 3.6V

35——P2_2D I/OGPIO

PWM1

Default: Input; pulled-high

4 6 — — VDD_IO Power VDD; power input

Same input pin as VBAT

Can be connected to the VBAT pin

5 7 — — VDD_IO Power VDD; power input

Same input pin as VBAT

Can be connected to the VBAT pin

6 8 — — ULPC_O Power 1.2V ULPC LDO output

Used for diagnostic purposes

Do not connect to any pin or device

For measurement, connect a bypass 1 µF

capacitor to ground

79——P2_3D I/OGPIO

PWM2

Default: Input; pulled-high

8 10 — — BK_O Power 1.55V Buck power supply output for diagnostic

purpose

Do not connect

— — 13 6 P1_6 D I/O

A O/p

GPIO

— — 14 5 P1_7 D I/O

A O/p

GPIO

RN4870/71

DS50002489A-page 4  2016 Microchip Technology Inc.

9 11 15 15 P2_7 D I/O

A I/p

GPIO; default: Input; pulled-high

AD14

Configured as the TX_IND pin by default

10 12 — — P1_1 D I/O

A I/p

GPIO; default: Input; pulled-high

AD9

Configured as the BLEDK_STATUS1_IND pin by

default

11 13 2 3 P1_2 D I/O

A I/p

GPIO; default: Input; pulled-high

AD10

12 14 3 4 P1_3 D I/O GPIO; default: Input; pulled-high

AD11

13 15 8 11 P0_0 D I/O GPIO; default: Input; pulled-high

AD0

Configured as the UART_CTS pin by default

14 16 — — P1_0 D I/O GPIO; default: Input; pulled-high

AD8

Configured as the BLEDK_STATUS2_IND pin by

default

15 17 6 9 P3_6 D I/O GPIO; default: Input; pulled-high

PWM0

Configured as the UART_RTS pin by default

16 18 16 16 P2_0 D I/p System configuration input;

1: Application mode

0: Test mode, for Flash update and EEPROM

settings

Default: Input; pulled-high

17 19 — — P2_4 D I/O GPIO; default: Input; pulled-high

18 20 — — NC — No Connection

19 21 7 10 RST_N D I/p Module Reset; active-low; Internally pulled-high

20 22 5 7 UART_RX D I/p UART Data input

21 23 4 8 UART_TX D O/p UART Data output

22 24 — — P3_1 D I/O GPIO; default: Input; pulled-high

Configured as RSSI_IND pin by default

23 25 — — P3_2 D I/p GPIO; default: Input; pulled-high

Configured as the LINK_DROP pin by default

24 26 — — P3_3 D I/p GPIO; default: Input; pulled-high

Configured as the UART RX Indication pin by

default

25 27 — — P3_4 D I/p GPIO; default: Input; pulled-high

Configured as the PAIRING_KEY pin by default

26 28 — — P3_5 D I/O

A I/p

GPIO; default: Input; pulled-high

LED1; provides indication whether the module is

ON/OFF

27 29 — — P0_7 D I/O GPIO; default: Input; pulled-high

Configured to the LOW_BATTERY_INDICATOR

pin by default

28 30 9 12 P0_2 D I/O AD2

LED0: Provides indication whether the module is

in ON/OFF mode

29 31 17 2 GND Power Ground Reference

— 32 — — GND Power Ground Reference

TABLE 1-2: PIN DESCRIPTION (CONTINUED)

RN4870U RN4870 RN4871U RN4871 Name Type Description

 2016 Microchip Technology Inc. DS50002489A-page 5

RN4870/71

FIGURE 1-1: PIN DIAGRAM - RN4870U

FIGURE 1-2: PIN DIAGRAM - RN4870

30 — 1 1 BT_RF A I/O External Antenna connection (50 ohms)

— 33 — — GND Power Ground Reference

Legend: Pin Type Abbreviations: A = Analog D = Digital I/O = Input/Output I/p = Input O/p = Output

TABLE 1-2: PIN DESCRIPTION (CONTINUED)

RN4870U RN4870 RN4871U RN4871 Name Type Description

TP-2 TP-2 CLDO_O

TP-1 VCC_PA

TP-3 VCC_RF

TP-1

TP-3

GND

VBAT

P2_2

VDD_IO

ULPC_O

P2_3

BK_O

P2_7/TX_IND

P1_1

P1_2

P1_3

P0_0/CTS

P1_0

P3_6/RTS

P2_0/MODE

P2_4

RST_N

P0_2/LED

P0_7

P3_5

P3_4

P3_3

P3_2

P3_1

UART_TX

UART_RX

301BT_RF

30 1

Top View Bottom View

TP-2 TP-2 CLDO_O

TP-1 VCC_PA

TP-3 VCC_RF

TP-1

TP-3

GND

VBAT

P2_2

VDD_IO

ULPC_O

P2_3

BK_O

P2_7/TX_IND

P1_1

P1_2

P1_3

P0_0/CTS

P1_0

P3_6/RTS

P2_0/MODE

P2_4

RST_N

P0_2/LED

P0_7

P3_5

P3_4

P3_3

P3_2

P3_1

UART_TX

UART_RX

133

Top View Bottom View

RN4870/71

DS50002489A-page 6  2016 Microchip Technology Inc.

FIGURE 1-3: PIN DIAGRAM - RN4871U

FIGURE 1-4: PIN DIAGRAM - RN4871

17 17

TP-1

TP-2

TP-3

TP-4

TP-5

VBAT

BK_IN

GND

P1_6

P1_7

P2_7

P2_0

GND

BT_RF

P1_2

P1_3

UART_TX

UART_RX

RST_N

P3_6

P0_2

P0_0

TP-1 CLDO_O

VCC_PA TP-3

VCC_RF TP-2 TP-4 ULPC_O

TP-5 BK_O

Top View Bottom View

CLDO_O TP-5

TP-3 VCC_PA

TP-2 VCC_RF

TP-4 ULPC_O

BK_O TP-1

BT_RF

P1_2

GND

P1_7

P1_3

P2_7

P2_0

14 VBAT

13 GND

P0_212

UART_TX

RST_N

P3_6

P0_0

UART_RX

P1_6

TP-1

TP-2

TP-3

TP-4

TP-5

Top View Bottom View

 2016 Microchip Technology Inc. DS50002489A-page 7

RN4870/71

1.2 Module Configuration

The GPIO pins of the RN4870 and RN4871 modules

can be configured to different functions using the ASCII

command interface. Tab l e 1- 3 shows the various pins

in the RN4870/71 module that are available for

configuration and their default configuration settings.

Table 1-4 provides details on each functions available.

Table 1-5 shows the status of the module as indicated

by the Status 1 and Status 2 indication pins. Table 1-6

shows the details of test pads that are present on the

bottom side of the module, used for diagnostic

purposes during testing. Figure 1-5 shows all the key

elements of the module.

TABLE 1-3: CONFIGURABLE PINS AND DEFAULT FUNCTIONS IN THE RN4870 AND RN4871

Pin Name

Available in

Default Function

RN4870 RN4871

P0_7 x — Low Battery Indication

P1_0 x — Status 2

P1_1 x — Status 1

P2_2 x — None

P2_4 x — None

P3_1 x — RSSI Indication

P3_2 x — Link Drop

P3_3 x — UART RX Indication

P3_4 x — Pairing Key

P3_5 x — None

P1_2 x x None

P1_3 x x None

P1_6 — x UART RX Indication

P1_7 — x None

TABLE 1-4: CONFIGURABLE FUNCTIONS AND DESCRIPTIONS

Function Name Description

Low Battery Indication Pin output goes low when the VDD is below a specified level. To set the threshold

level, change the EEPROM settings.

Status 1 Use this indication pin along with the Status 2 pin to indicate the current status of

the module. Refer to Table 1-5 for details of the status indication.

Status 2 Use this indication pin along with the Status 1 pin to indicate the current status of

the module. Refer to Table 1-5 for details of the status indication.

RSSI Indication Use this indication pin to indicate the quality of the link based on the RSSI level.

If the RSSI level is lower than the specified threshold value, then the RSSI

indication pin goes low. Set the threshold for the RSSI link quality in EEPROM.

Link Drop Use this pin to force the module to drop the current BLE link with a peer device.

Pulling the Link Drop pin low forces the connection to close. The pin needs to be

pulled low for at least 10 ms.

UART RX Indication Use this pin to enable communication with the UART when the module is in Low-

Power mode. When not in Low-Power mode, the module runs on a 16 MHz

clock. If Low-Power mode is enabled on the module by using command SO,1,

the module runs on a 32 kHz clock thus reducing power consumption. However,

in Low-Power mode, the host MCU cannot communicate with the module via the

UART since the UART is not operational. If the user intends to provide data or

commands via UART in the Low-Power mode, then the UART RX INDICATION

pin must be pulled low and the user needs to wait for at least five milliseconds

before sending the data. Pulling the UART RX INDICATION pin low allows the

module to operate the 16 MHz clock and to enable UART.

RN4870/71

DS50002489A-page 8  2016 Microchip Technology Inc.

FIGURE 1-5: BLOCK DIAGRAM OF THE RN4870/71

Pairing Key Use this pin to force the module to enter Standby mode. The pin must be pulled

down for at least 160 ms.

RF Active Indication Use this indication pin to indicate that the module is currently performing an

active transmission and receiving BLE data.

TABLE 1-5: STATUS INDICATION PINS

Status 1 Status 2 State

High High Power On

High Low Standby state

Low Low Connection established

Low High Data session open (Transparent UART)

TABLE 1-6: TEST POINTS ON THE BOTTOM SIDE

RN4870U RN4870 RN4871U RN4871 Symbol Description

TP-1 TP-1 TP-3 TP-3 VCC_PA 1.55V RF PA LDO

TP-2 TP-2 TP-1 TP-5 CLDO_O 1.2V CLDO Output

TP-3 TP-3 TP-2 TP-2 VCC_RF 1.2V RF LDO Output

— — TP-4 TP-4 ULPC_O 1.2V ULPC LDO Output

— — TP-5 TP-1 BK_O 1.55V Buck Reg Output

TABLE 1-4: CONFIGURABLE FUNCTIONS AND DESCRIPTIONS (CONTINUED)

Function Name Description

RN4870/RN4871

 2016 Microchip Technology Inc. DS50002489A-page 9

RN4870/71

2.0 SPECIFICATIONS

Table 2-1 provides the general specifications for the

module. Table 2-2 and Ta ble 2 -3 provide the electrical

characteristics and the current consumption of the

module.

TABLE 2-1: GENERAL SPECIFICATIONS

Specification Description

Standard Compliance Bluetooth 4.2

Frequency Band 2.402 to 2.480 GHz

Modulation Method GFSK

Maximum Data Rate (Transparent UART) 10 kBps (iOS®9)

Antenna Ceramic

Interface UART, AIO, PIO

Operating Range 1.9V to 3.6V

Sensitivity -90 dBm

RF TX Power 0 dBm

Operating Temperature Range -20°C to +70°C

Storage Temperature Range -65°C to +150°C

Operating Relative Humidity Range 10% to 90%

Storage Relative Humidity Range 10% to 90%

Moisture Sensitivity Level 2

TABLE 2-2: ELECTRICAL CHARACTERISTICS

Parameter Min. Typ. Max. Units

Supply Voltage (VDD) 1.9 — 3.6 V

I/O Supply Voltage (VDD_IO = VDD) 1.9 — 3.6 V

I/O Voltage Levels

VIL Input Logic Levels Low VSS — 0.3 VDD V

VIH Input Logic Levels High 0.7 VDD —VDD V

VOL Output Logic Levels Low Vss — 0.2 VDD V

VOH Output Logic Levels High 0.8 VDD —VDD V

Reset

VTH,RES Threshold Voltage — 1.6 — V

Reset Low Duration 63 — — ns

Input and Tri-State Current with

Pull-Up Resistance 34 48 74 k

Pull-Down Resistance 29 47 86 k

Leakage Current -1 — 1 µA

ADC (Analog to Digital Converter)

Full Scale (BAT_IN) 0 3.0 3.6 V

Full Scale (AD0~AD15) 0 — 3.6 V

Conversion Time (ENOB 8-bit) — 131 — µs

Conversion Time (ENOB 10-bit) — 387 — µs

Operating Current — — 500 µA

RN4870/71

DS50002489A-page 10  2016 Microchip Technology Inc.

TABLE 2-3: CURRENT CONSUMPTION

Parameter Min. Typ. Max. Units

Supply Current

TX mode Peak Current at VDD = 3V, TX = 0 dBm, Buck mode — — 13 mA

RX mode Peak Current at VDD = 3V, Buck mode — — 13 mA

Link Static Current — 60 — µA

Standby Current 1.9 — 2.9 µA

Power-Saving 1 — 1.7 µA

Temperature Sensor (PTS)

Temperature Range Detected -20 — +70 °C

Digital Output 1387 — 2448 —

Resolution — 12 — units/deg

Accuracy -3 — +3 °C

Conversion Time (ENOB 10-bit) — 12.35 — ms

Operating Current — — 200 µA

TABLE 2-4: CURRENT CONSUMPTION DURING VARIOUS APPLICATION MODES

Test Mode Test Condition(1) Average Current

Consumption Remarks

Standby mode Advertising Interval: 100 ms 0.23 mA —

Advertising Interval: 500 ms 0.077 mA —

BLE Connected mode

(no data exchange)

Connection Interval: 500 ms 0.08 mA Module set in Transparent UART

mode

Transparent UART

enabled

Data transmission in

progress

Connection Interval: 18.75 ms 3.87 mA TX data throughput: 9.863 kBps

Connection Interval: 40 ms 2.77 mA TX data throughput: 4.676 kBps

Transparent UART

enabled

Data being received

Connection Interval: 18.75 ms 3.06 mA

(write with response)

Throughput: 4.956 kBps

3.9 mA

(write with reliable

Burst Transmit)

Throughput: 9.382 kBps

Connection Interval: 40 ms 2.14 mA

(write with response)

Throughput: 2.494 kBps

(write with response)

3.03 mA

(write with reliable

Burst Transmit)

Throughput: 5.056 kBps

Shutdown mode — 1.44 µA —

Note 1: Test conditions: Input voltage: 3.3V; Test phone: iPhone6 with iOS 9.02 version

 2016 Microchip Technology Inc. DS50002489A-page 11

RN4870/71

3.0 INTERFACE PINS

Figure 3-1 shows the power scheme using a 3.3V

low-dropout regulator to the RN487x and a host MCU.

This scheme ensures that the same voltage is used for

both the module and the MCU.

Figure 3-1 also shows the basic UART connections to

the host MCU.

Figure 3-2 shows the recommended connections for

running the RN4870/71 on coin cell battery.

FIGURE 3-1: POWER SCHEME

System Configurator

Note 1: Ensure VDD_IO and MCU VDD voltages are compatible

2: Control and Indication ports are configurable

3: To implement low-power operation, enable the UART_RX_IND

pin and connect to ground.

Note 1: Ensure VDD_IO and MCU VDD voltages are compatible

2: Control and Indication ports are configurable

3: 10 µF (X5R) and 330 ohm resistor are required for RN487x

4: BK_IN connects to VBAT for RN4871U

5: To implement low-power operation, enable the UART_RX_IND

pin and connect to ground.

RN4870/71/70U

RN4871U

RN4870/71

DS50002489A-page 12  2016 Microchip Technology Inc.

FIGURE 3-2: RN4870/71 COIN CELL POWER SCHEME

The Configuration pins on the RN4870 can also be

configured through Windows®-based User Interface

(UI) Configuration tool, BLEDK3.

RN4870/71

Note 1: Application includes ADC, PWM (RN4870), and

I2C bus interface

2: BK_IN connection is needed only for RN4871U.

3: To implement low-power operation, enable the

UART_RX_IND pin and connect to ground.

 2016 Microchip Technology Inc. DS50002489A-page 13

RN4870/71

4.0 PHYSICAL DIMENSIONS AND

ATTRIBUTES

4.1 RN4870 Module

Figure 4-1 shows the physical dimensions of the

RN4870 module. Figure 4-2 illustrates the recom-

mended PCB layout, and Figure 4-3 shows the recom-

mended mounting details.

Ensure that there is no top copper layer near the test

pin area, indicated by the shaded keep out areas, as

shown in Figure 4-2. When laying out the host PCB, the

areas under the antenna must not contain any top,

inner layer, or bottom copper as shown in Figure 4-3. A

low-impedance ground plane ensures the best radio

performance (best range; lowest noise). Figure 4-3

also shows a minimum ground plane area to the left

and right side of the module for best antenna

performance. The ground plane can be extended

beyond the minimum recommended as required for

host PCB EMC noise reduction. For best range

performance, keep all external metal at least 30 mm

away from the ceramic chip antenna.

FIGURE 4-1: RN4870 MODULE DIMENSIONS

RN4870/71

DS50002489A-page 14  2016 Microchip Technology Inc.

FIGURE 4-2: RN4870 RECOMMENDED PCB FOOTPRINT

FIGURE 4-3: RECOMMENDED MOUNTING DETAILS

 2016 Microchip Technology Inc. DS50002489A-page 15

RN4870/71

4.2 RN4870U Module

Figure 4-4 shows the physical dimensions of the

RN4870U module. Figure 4-5 illustrates the recom-

mended PCB layout, and Figure 4-6 shows the recom-

mended mounting details.

A low-impedance ground plane ensures the best radio

performance (best range; lowest noise). Pin 30

(BT_RF) is a 50 ohm connection that can be connected

to an external antenna such as a PCB trace antenna, a

component (chip) antenna, or through a host PCB 50

ohm micro-strip trace. This trace can be extended to

include passive parts for antenna attenuation padding,

impedance matching, or to provide test posts. It is

recommended that the micro-strip trace to be as short

as possible for minimum loss and best impedance

matching. If the micro-strip trace is longer, a 50 ohm

impedance is recommended.

FIGURE 4-4: RN4870U MODULE DIMENSIONS

RN4870/71

DS50002489A-page 16  2016 Microchip Technology Inc.

FIGURE 4-5: RN4870U RECOMMENDED PCB FOOTPRINT

FIGURE 4-6: RN4870U RECOMMENDED PCB MOUNTING

 2016 Microchip Technology Inc. DS50002489A-page 17

RN4870/71

4.3 RN4871 Module

Figure 4-7 shows the physical dimensions of the

RN4871 module. Figure 4-8 illustrates the recom-

mended PCB layout, and Figure 4-9 shows the recom-

mended mounting details.

Ensure that there is no top copper layer near the test

pin area, indicated by the shaded keep out areas, as

shown in Figure 4-8. When laying out the host PCB, the

areas under the antenna must not contain any top,

inner layer, or bottom copper as shown in Figure 4-9. A

low-impedance ground plane ensures the best radio

performance (best range; lowest noise). Figure 4-9

also shows a space area around antenna section for

best antenna performance. The ground plane can be

extended beyond the minimum recommended as

required for host PCB EMC noise reduction. For best

range performance, keep all external metal at least

30 mm away from the ceramic chip antenna.

FIGURE 4-7: RN4871 MODULE DIMENSIONS

RN4870/71

DS50002489A-page 18  2016 Microchip Technology Inc.

FIGURE 4-8: RN4871 RECOMMENDED PCB FOOTPRINT

FIGURE 4-9: RN4871 RECOMMENDED PCB MOUNTING SUGGESTION

 2016 Microchip Technology Inc. DS50002489A-page 19

RN4870/71

4.4 RN4871U Module

Figure 4-10 shows the physical dimensions of the

RN4871U module. Figure 4-11 illustrates the recom-

mended PCB layout. It is highly recommended to

layout the host PCB as suggested in Figure 4-12.

Figure 4-13 shows the recommended placement for

the module on the host PCB board. For optimal

transmission and reception sensitivity, place the

module at the edge of the board.

A low-impedance ground plane ensures the best radio

performance (best range; lowest noise). Pin 1 (BT_RF)

is a 50 ohm connection that can be connected to an

external antenna such as a PCB trace antenna, a

component (chip) antenna, or through a host PCB

50 ohm micro-strip trace. This trace can be extended to

include passive parts for antenna attenuation padding,

impedance matching, or to provide test posts. It is

recommended that the micro-strip trace to be as short

as possible for minimum loss and best impedance

matching. If the micro-strip trace is longer, a 50 ohm

impedance is recommended.

FIGURE 4-10: RN4871U MODULE DIMENSIONS

Top View Bottom View

Side View

RN4870/71

DS50002489A-page 20  2016 Microchip Technology Inc.

FIGURE 4-11: RN4871U RECOMMENDED PCB FOOTPRINT

FIGURE 4-12: RN4871U RECOMMENDED PCB MOUNTING

 2016 Microchip Technology Inc. DS50002489A-page 21

RN4870/71

FIGURE 4-13: RECOMMENDATIONS FOR THE PLACEMENT OF THE MODULE ON THE HOST

PCB BOARD

4.5 Soldering Recommendations

The RN4870/71 Bluetooth modules are assembled

using standard lead-free reflow profile IPC/JEDEC

J-STD-020.

The module can be soldered to the host PCB using

standard leaded and lead-free solder reflow profiles.

To avoid damaging the module, the following recom-

mendations are given:

• Microchip Technology Application Note, “AN233

Solder Reflow Recommendation” (DS00233)

provides solder reflow recommendations

•Do not exceed peak temperature (TP) of 250°C

• Refer to the solder paste data sheet for specific

reflow profile recommendations

• Use no-clean flux solder paste

•Do not wash as moisture can be trapped under

the shield

• Use only one flow. If the PCB requires multiple

flows, apply the module on the final flow.

Acceptable

Best

Acceptable

Lowest

performance

RN4870/71

DS50002489A-page 22  2016 Microchip Technology Inc.

NOTES:

 2016 Microchip Technology Inc. DS50002489A-page 23

RN4870/71

5.0 APPLICATION REFERENCE

CIRCUITS

5.1 External Configuration and

Programming

The RN4870/71 modules can be configured and firm-

ware programmed using an external configuration and

programming tool. Figure 5-1 shows the mandatory

connections required between the module and the

external programming header. It is recommended to

include these pin connections on the host PCB for

development. For accessing the various configuration

and indication pins, use Ta ble 1 -2 , Tab le 1 - 3, Table 1-4

and Tab l e 1- 5 .

5.2 Reference Circuit

Figure 5-2 through Figure 5-5 show the reference

circuits for various modules under the RN4870/71 fam-

ily. In the circuits, the power input range is 1.9V ~ 3.6V.

A battery reverse protection circuit is recommended in

case a battery power input is used. Note that the

VDD_IO is the same as the power input. In case of a

LED connection, the power input must be greater than

3.0V. For the RN4870U, an RF antenna matching

circuit must also be included as shown in Figure 5-3.

FIGURE 5-1: EXTERNAL PROGRAMMING HEADER CONFIGURATIONS

RN4870/71

1P2_0 P2_0

VBAT

1RXD

1TXD

1GND

RXD

TXD

GND

1 VBAT

RN4870/71

DS50002489A-page 24  2016 Microchip Technology Inc.

FIGURE 5-2: RN4870 REFERENCE CIRCUIT

RN4870

GND

VBAT

P2_2

VDD_IO

ULPC_O

P2_3

BK_O

P2_7/TX_IND

P1_1

P1_2/SCL

P1_3/SDA

P0_0/CTS

P1_0

P3_6/RTS

P2_0/MODE

P2_4

RST

UART_RX 22

UART_TX 23

P3_1 24

P3_2 25

P3_3 26

P3_4 27

P3_5 28

P0_7 29

P0_2 30

GND 31

GND 32

GND 33

RN4

VDD_

LPC

BK_

TX_

IND

SCL

UART

RT_

LD1

GND

330

GND

VCC

UART_TX

UART_RX

P0_2

P0_0

P1_0

P1_1

P1_2

P1_3

P0_7

P2_0

P2_2

P2_3

P2_4

P2_7

P3_1

P3_2

P3_3

P3_4

P3_5

P3_6

4.7k

VCC

P0_7

P3_1

P3_2

P3_3

P3_4

P3_5

STS2301

P0_0

P1_0

P2_0

P2_4

P3_6

P1_1

P1_2

P1_3

P2_3

P2_7

P2_2

Configurable I/O

P2_0 MODE

Low

High

Test Mode

APP Mode

APP

GND

Power Input

Reverse Voltage Protection

Configuration Interface

VCC

UART_TX

UART_RX

UART Interface

LED Option

P0_2

10uF 6.3V X5R

GND

1uF

GND

RST

 2016 Microchip Technology Inc. DS50002489A-page 25

RN4870/71

FIGURE 5-3: RN4870U REFERENCE CIRCUIT

GND

VBAT

P2_2

VDD_IO

ULPC_O

P2_3

BK_O

P2_7/TX_IND

P1_1

P1_2/SCL

P1_3/SDA

P0_0/CTS

P1_0

P3_6/RTS

P2_0/MODE

P2_4

RST

UART_RX 20

UART_TX 21

P3_1 22

P3_2 23

P3_3 24

P3_4 25

P3_5 26

P0_7 27

P0_2 28

GND 29

BT_RF 30

VDD_

LPC

TX_

IND

ART

BT_

RN4870U

LD1

GND

330

GND

VCC

UART_TX

UART_RX

P0_2

P0_0

P1_0

P1_1

P1_2

P1_3

P0_7

P2_0

P2_2

P2_3

P2_4

P2_7

P3_1

P3_2

P3_3

P3_4

P3_5

P3_6

4.7k

VCC

P0_7

P3_1

P3_2

P3_3

P3_4

P3_5

STS2301

P0_0

P1_0

P2_0

P2_4

P3_6

P1_1

P1_2

P1_3

P2_3

P2_7

P2_2

Configurable I/O

P2_0 MODE

Low

High

Test Mode

APP Mode

APP

GND

Power Input

Reverse Voltage Protection

Configuration Interface

VCC

UART_TX

UART_RX

UART Interface

LED Option

P0_2

C3 C4

ANT1

1nH

10uF 6.3V X5R

GND

1uF

GND

Antenna Matching

RST

RN4870/71

DS50002489A-page 26  2016 Microchip Technology Inc.

FIGURE 5-4: RN4871 REFERENCE CIRCUIT

VBAT 14

P2_7 15

P1_6

P1_2 3

P1_3 4

P0_0

P3_6

P2_0 16

RST

UART_RX

UART_TX

P0_2

GND 13

BT_RF 1

P1_7

GND 2

RN4871

LD1

GND

330

GND

VCC

UART_TX

UART_RX

P0_2

P1_2

P1_3

P1_7

P2_7

4.7k

VCC

P0_2

STS2301

P0_0

P2_0

P1_6

P3_6

P1_2

P1_3

P2_7

P2_0

Configurable I/O

P2_0 MODE

Low

High

Test Mode

APP Mode

Mode

PP M

ode

GND

Power Input

Reverse Voltage Protection

Configuration Interface

VCC

UART_TX

UART_RX

UART Interface

LED Option

P0_2

10uF 6.3V X5R

GNDGND

P0_0

P2_0

P3_6

P1_6

P1_7

1uF

GND

RST

 2016 Microchip Technology Inc. DS50002489A-page 27

RN4870/71

FIGURE 5-5: RN4871U REFERENCE CIRCUIT

VBAT

11 BK_I

P2_7

P1_6

13 P1_2 2

P1_3 3

P0_0 8

P3_6 6

P2_0

16 RST 7

UART_RX 5

UART_TX 4

P0_2 9

GND

BT_RF 1

P1_7

GND

12 RN4871U

LD1

GND

330

GND

VCC

UART_TX

UART_RX

P0_2

P1_2

P1_3

P1_7

P2_7

4.7k

VCC

P0_2

STS2301

P0_0

P2_0

P1_6

P3_6

P1_2

P1_3

P2_7

P2_0

Configurable I/O

P2_0 MODE

Low

High

Test Mode

APP Mode

P2_0

Low

Tes

Mode

PP M

ode

GND

Power Input

Reverse Voltage Protection

Configuration Interface

VCC

UART_TX

UART_RX

UART Interface

LED Option

P0_2

10uF 6.3V X5R

GND

P0_0

P2_0 P3_6

P1_6

P1_7

GND

1uF

GND

C3 C4

ANT1

1nH

GND

Antenna Matching

RST

RN4870/71

DS50002489A-page 28  2016 Microchip Technology Inc.

5.3 Power Drop Protection

To prevent any problems that may arise when the

power supply goes below 1.9V, a power-supply drop-

protection circuit is recommended. Essentially, this

circuit consists of a Reset IC which acts as an Open

Drain with a Delay =< 10 ms, and is triggered at 1.8V

power supply. Figure 5-6 shows a recommended

power drop protection circuit.

FIGURE 5-6: POWER DROP PROTECTION CIRCUIT

RN4870/71

VBAT

RST_N

Reset IC

OUT VDD

 2016 Microchip Technology Inc. DS50002489A-page 29

RN4870/71

6.0 ASCII COMMAND API

The RN4870/71 command Application Programming

Interfaces (APIs) are documented in the “RN4870/71

Bluetooth® Low Energy Module User's Guide”

(DS50002466A).

The following are the available command options and

their categories:

• Connection

- Establish connection

- Disconnect

- Bond/Unbond current connection

- Start/Stop scan for other devices

- Add/Delete peer devices to white list

- Read RSSI values

- Stop connection process

•I/O

- Read/Write I2C

- Change settings in the EEPROM

- Configure pin functions

- Configure GPIO mask

- Set/Get GPIO states

- Read and write analog data

-PWM control

• System

- Reboot

- Factory default

- Enter and Exit Command mode

- Enter Low-Power mode

•Scripting

- Enter Script mode

- Declare event handler

- Execute current script

- List current script

- Clear script

- Define user function

•GATT Services

- Create/Delete public services/characteristics

- Read/Write characteristic values

- Set notification for characteristics

• GAP Role

- Central, Peripheral, Observer and

Broadcaster

• Advertising

- Start/Stop

- Set custom advertisement content

- Set scan response content

- Set beacon content

• Private Service

- Create/Delete private services/characteristics

- Read/Write characteristic values

- Set notification for characteristics

• Transparent UART

- Enable/Disable

- Peripheral side configuration

- Central side configuration

• Remote configuration of the module

• Read individual device Information or Profile

settings

RN4870/71

DS50002489A-page 30  2016 Microchip Technology Inc.

NOTES:

 2016 Microchip Technology Inc. DS50002489A-page 31

RN4870/71

7.0 SUPPORTED SERVICES

The RN4870 supports four built-in GATT services:

• Device Information public service

• Airpatch private service, which handles Over The

Air (OTA) updates

• BeaconThings, which handles beacon services

control

• UART Transparent private service, which handles

data streaming function

In addition to the above predefined private services, the

RN4870 provides the ability to create private services.

If the services are supported on both end points of a

Bluetooth Low Energy connection, such as Central and

Peripheral devices, data can be exchanged. For

example, two RN4870 modules can define a custom

(private) service with its own unique characteristics.

Data can be exchanged easily via Command API.

Private services are not registered with the Bluetooth

SIG, and therefore not interoperable with other

Bluetooth Low Energy devices, unless the device

implements the private service. An example of a built-

in private service is the Transparent UART. For an

example on how to create a custom service using the

RN4870, refer to “RN4870/71 Bluetooth® Low Energy

Module User's Guide” (DS50002466A).

RN4870 allows custom defined services up to five

public and four private services. Each custom defined

service allows up to eight custom defined

characteristics. All service definitions are saved in

on-board Non-Volatile Memory (NVM) where the user

must setup the module only once.

RN4870/71

DS50002489A-page 32  2016 Microchip Technology Inc.

NOTES:

 2016 Microchip Technology Inc. DS50002489A-page 33

RN4870/71

8.0 ANTENNA CHARACTERISTICS

The RN4870 and RN4871 modules contain an integral

ceramic chip antenna. Figure 8-1 and Figure 8-2 show

the antenna performance on the modules.

FIGURE 8-1: RN4870 ANTENNA PERFORMANCE

Parameter Values

Frequency 2450 MHz

Max Gain 1.63 dBi

Efficiency 71.55%

Antenna Description Manufacturer Part Number Manufacturer

ANT ANT3216A063R2400A

PIFA 2.4GHz L3 2W1.6 ANT3216A063R2400A Yageo

RN4870/71

DS50002489A-page 34  2016 Microchip Technology Inc.

FIGURE 8-2: RN4871 ANTENNA PERFORMANCE

Parameter Values

Frequency 2442 MHz

Max Gain 0.1 dBi

Efficiency 42.7%

Antenna Description Manufacturer Part Number Manufacturer

ANT AANT3216LL00R2400A

PIFA 2.4GHz L3 2W1.6 ANT3216LL00R2400A Yageo

 2016 Microchip Technology Inc. DS50002489A-page 35

RN4870/71

9.0 TIMING CHARACTERISTICS

Figure 9-1 shows the timing diagram for the RN4870/

71 modules when it is Reset in the Test mode and

Application mode. Figure 9-2 shows the timing diagram

for the module when it is powered on. In Application

mode, when RN4870/71 is ready to talk to MCU after

Reset, the module provides a UART response

indicating that the Reset is complete. For more details,

refer to the “RN4870/71 Bluetooth® Low Energy Mod-

ule User's Guide” (DS50002466A).

FIGURE 9-1: TIMING DIAGRAM OF RN4870/71 UART READY AFTER RESET (IN TEST AND

APPLICATION MODE)

FIGURE 9-2: TIMING DIAGRAM OF RN4870/71 UART WHEN POWERED ON (IN TEST AND

APPLICATION MODE)

Ext

Reset

1mS

P2_0=0

P2_0=1

25mS

Test Mode

Process

Application

Mode

Process

46mS

68mS

UART Ready

for MCU

UART Ready

for MCU

Status pin/UART

Report Command

VBAT

P2_0=0

P2_0=1

25mS

Test Mode

Process

Application

Mode

Process

46mS

68mS

UART Ready

for MCU

UART Ready

for MCU

Status pin/UART

Report Command

RN4870/71

DS50002489A-page 36  2016 Microchip Technology Inc.

Table 9-1 shows the error rate for various UART baud

rates for the RN4870/71 module. The system clock is

running at 16 MHz.

TABLE 9-1: ERROR RATE FOR VARIOUS BAUD RATES ON THE RN4870/71

Set Baud Rate Measured Baud Rate Error

921600 941176 -2.12%

460800 457143 0.79%

307200 307692 -0.16%

230400 231884 -0.64%

115200 115942 -0.64%

57600 57971 -0.64%

38400 38095 0.79%

19200 19048 0.79%

9600 9524 0.79%

 2016 Microchip Technology Inc. DS50002489A-page 37

RN4870/71

10.0 REGULATORY APPROVAL

This section outlines the regulatory information for the

RN4870/71 module for the following countries:

• United States

• Canada

• Europe

• Japan

• Korea

• Taiwan

• Other Regulatory Jurisdictions

10.1 United States

The RN4870/71 module has received Federal Commu-

nications Commission (FCC) CFR47 Telecommunica-

tions, Part 15 Subpart C “Intentional Radiators” single-

modular approval in accordance with Part 15.212 Mod-

ular Transmitter approval. Single-modular transmitter

approval is defined as a complete RF transmission

sub-assembly, designed to be incorporated into

another device, that must demonstrate compliance

with FCC rules and policies independent of any host. A

transmitter with a modular grant can be installed in dif-

ferent end-use products (referred to as a host, host

product, or host device) by the grantee or other equip-

ment manufacturer, then the host product may not

require additional testing or equipment authorization

for the transmitter function provided by that specific

module or limited module device.

A host product itself is required to comply with all other

applicable FCC equipment authorization regulations,

requirements, and equipment functions that are not

associated with the transmitter module portion. For

example, compliance must be demonstrated: to regula-

tions for other transmitter components within a host

product; to requirements for unintentional radiators

(Part 15 Subpart B), such as digital devices, computer

peripherals, radio receivers, etc.; and to additional

authorization requirements for the non-transmitter

functions on the transmitter module (i.e., Verification or

Declaration of Conformity) as appropriate (e.g., Blue-

tooth and Wi-Fi transmitter modules may also contain

digital logic functions).

10.1.1 LABELING AND USER

INFORMATION REQUIREMENTS

The RN4870 module has been labeled with its own

FCC ID number, and if the FCC ID is not visible when

the module is installed inside another device, then the

outside of the finished product into which the module is

installed must also display a label referring to the

enclosed module. This exterior label can use wording

as follows:

For the RN4870 module:

Due to the limited size of the RN4871, the FCC Identi-

fier (FCC ID) is not displayed on the module. Therefore,

the FCC ID must be placed on the outside of the fin-

ished product into which the module is installed must

also display a label referring to the enclosed module.

This exterior label can use wording as follows:

For the RN4871 module:

Contains Transmitter Module

FCC ID: A8TBM70ABCDEFGH

Contains FCC ID: A8TBM70ABCDEFGH

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:

(1) this device may not cause harmful interference,

and (2) this device must accept any interference

received, including interference that may cause

undesired operation.

Contains Transmitter Module

FCC ID: A8TBM71S2

Contains FCC ID: A8TBM71S2

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:

(1) this device may not cause harmful interference,

and (2) this device must accept any interference

received, including interference that may cause

undesired operation.

RN4870/71

DS50002489A-page 38  2016 Microchip Technology Inc.

A user’s manual for the product should include the fol-

lowing statement:

Additional information on labeling and user information

requirements for Part 15 devices can be found in KDB

Publication 784748 available at the FCC Office of Engi-

neering and Technology (OET) Laboratory Division

Knowledge Database (KDB)

http://apps.fcc.gov/oetcf/kdb/index.cfm.

10.1.2 RF EXPOSURE

All transmitters regulated by FCC must comply with RF

exposure requirements. KDB Publication 447498 Gen-

eral RF Exposure Guidance provides guidance in

determining whether proposed or existing transmitting

facilities, operations or devices comply with limits for

human exposure to Radio Frequency (RF) fields

adopted by the Federal Communications Commission

(FCC).

Output power listed is conducted. This grant is valid

only when the module is sold to OEM integrators and

must be installed by the OEM or OEM integrators. This

transmitter is restricted for use with the specific

antenna(s) tested in this application for Certification

and must not be co-located or operating in conjunction

with any other antenna or transmitters within a host

device, except in accordance with FCC multi-transmit-

ter product procedures. This module is approved for

installation into mobile or/and portable host platforms.

10.1.3 HELPFUL WEB SITES

Federal Communications Commission (FCC):

http://www.fcc.gov

FCC Office of Engineering and Technology (OET) Lab-

oratory Division Knowledge Database (KDB):

http://apps.fcc.gov/oetcf/kdb/index.cfm

10.2 Canada

The RN4870/71 module has been certified for use in

Canada under Industry Canada (IC) Radio Standards

Procedure (RSP) RSP-100, Radio Standards

Specification (RSS) RSS-Gen, RSS-210, and RSS-

247. Modular approval permits the installation of a

module in a host device without the need to recertify

the device.

10.2.1 LABELING AND USER

INFORMATION REQUIREMENTS

Labeling Requirements (from RSP-100 - Issue 10,

Section 3): The host device shall be properly labeled to

identify the module within the host device.

Modular Devices (from RSP-100 - Issue 10, Section 7):

The Industry Canada certification label of a module

shall be clearly visible at all times when installed in the

host device, otherwise the host device must be labeled

to display the Industry Canada certification number of

the module, preceded by the words “Contains transmit-

ter module”, or the word “Contains”, or similar wording

expressing the same meaning, as follows:

For the RN4870 module:

Due to the limited size of the RN4871, the Industry

Canada certification number is not displayed on the

module. Therefore, the host device must be labeled to

display the Industry Canada certification number of the

module, preceded by the words “Contains transmitter

module”, or the word “Contains”, or similar wording

expressing the same meaning, as follows:

This equipment has been tested and found to comply

with the limits for a Class B digital device, pursuant to

part 15 of the FCC Rules. These limits are designed

to provide reasonable protection against harmful

interference in a residential installation. This equip-

ment generates, uses and can radiate radio fre-

quency energy, and if not installed and used in

accordance with the instructions, may cause harmful

interference to radio communications. However,

there is no guarantee that interference will not occur

in a particular installation. If this equipment does

cause harmful interference to radio or television

reception, which can be determined by turning the

equipment off and on, the user is encouraged to try to

correct the interference by one or more of the follow-

ing measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment

and receiver.

• Connect the equipment into an outlet on a circuit

different from that to which the receiver is con-

nected.

• Consult the dealer or an experienced radio/TV

technician for help.

Contains transmitter module

IC: 12246A-BM70BLES1F2

Contains transmitter module

IC: 12246A-BM71S2

 2016 Microchip Technology Inc. DS50002489A-page 39

RN4870/71

User Manual Notice for License-Exempt Radio Appara-

tus (from Section 8.4, RSS-Gen, Issue 4, November

2014): User manuals for license-exempt radio appara-

tus shall contain the following or equivalent notice in a

conspicuous location in the user manual or alterna-

tively on the device or both:

10.2.2 RF EXPOSURE

All transmitters regulated by IC must comply with RF

exposure requirements listed in RSS-102 - Radio Fre-

quency (RF) Exposure Compliance of Radiocommuni-

cation Apparatus (All Frequency Bands).

10.2.3 HELPFUL WEB SITES

Industry Canada: http://www.ic.gc.ca/

10.3 Europe

The RN4870/71 module is an R&TTE Directive

assessed radio module that is CE marked and has

been manufactured and tested with the intention of

being integrated into a final product.

The RN4870/71 module has been tested to R&TTE

Directive 1999/5/EC Essential Requirements for Health

and Safety (Article (3.1(a)), Electromagnetic Compati-

bility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and

are summarized in Table 10-1 and Ta b l e 1 0 - 2 Euro-

pean Compliance Testing. A Notified Body Opinion has

also been issued. All test reports are available on the

RN4870/71 product web page at http://www.micro-

chip.com.

The R&TTE Compliance Association provides guid-

ance on modular devices in document Technical

Guidance Note 01 available at

http://www.rtteca.com/html/download_area.htm.

10.3.1 LABELING AND USER

INFORMATION REQUIREMENTS

The label on the final product which contains the

RN4870/71 module must follow CE marking require-

ments. The R&TTE Compliance Association Technical

Guidance Note 01 provides guidance on final product

CE marking.

This device complies with Industry Canada's license-

exempt RSSs. Operation is subject to the following

two conditions:

(1) This device may not cause interference; and

(2) This device must accept any interference, includ-

ing interference that may cause undesired operation

of the device.

Le présent appareil est conforme aux CNR d'Indus-

trie Canada applicables aux appareils radio exempts

de licence. L'exploitation est autorisée aux deux con-

ditions suivantes:

(1) l'appareil ne doit pas produire de brouillage;

(2) l'utilisateur de l'appareil doit accepter tout brouil-

lage radioélectrique subi, même si le brouillage est

susceptible d'en compromettre le fonctionnement.

Note: To maintain conformance to the testing

listed in Table 10-1, the module shall be

installed in accordance with the installa-

tion instructions in this data sheet and

shall not be modified.

When integrating a radio module into a

completed product the integrator

becomes the manufacturer of the final

product and is therefore responsible for

demonstrating compliance of the final

product with the essential requirements of

the R&TTE Directive.

RN4870/71

DS50002489A-page 40  2016 Microchip Technology Inc.

10.3.2 HELPFUL WEB SITES

A document that can be used as a starting point in

understanding the use of Short Range Devices (SRD)

in Europe is the European Radio Communications

Committee (ERC) Recommendation 70-03 E, which

can be downloaded from the European Radio Commu-

nications Office (ERO) at: http://www.ero.dk/.

Additional helpful web sites are:

• Radio and Telecommunications Terminal Equip-

ment (R&TTE):

http://ec.europa.eu/enterprise/rtte/index_en.htm

• European Conference of Postal and Telecommu-

nications Administrations (CEPT):

http://www.cept.org/

• European Telecommunications Standards Insti-

tute (ETSI):

http://www.etsi.org

• European Radio Communications Office (ERO):

http://www.ero.dk/

• The Radio and Telecommunications Terminal

Equipment Compliance Association (R&TTE CA):

http://www.rtteca.com/

TABLE 10-1: EUROPEAN COMPLIANCE TESTING FOR RN4870

TABLE 10-2: EUROPEAN COMPLIANCE TESTING FOR RN4871

Certification Standards Article Laboratory Report Number

Safety EN60950-1:2006/A11:2009/A1:2010/

A12:2011/A2:2013

(3.1(a))

TUV

Rheinland

10051261 003

Health EN 62479:2010 10053580 001

EMC EN 301 489-1 V1.9.2 (3.1(b)) 10051137 002

EN 301 489-17 V2.2.1

Radio EN 300 328 V1.9.1 (3.2) 10053580 001

Notified Body

Opinion

10048935 001

Certification Standards Article Laboratory Report Number

Safety EN60950-1:2006/A11:2009/A1:2010/

A12:2011/A2:2013

(3.1(a))

TUV

Rheinland

10053210 001

Health EN 62479:2010 10053433 001

EMC EN 301 489-1 V1.9.2 (3.1(b)) 10052964 001

EN 301 489-17 V2.2.1

Radio EN 300 328 V1.9.1 (3.2) 10053433 001

Notified Body

Opinion

10048936 001

 2016 Microchip Technology Inc. DS50002489A-page 41

RN4870/71

10.4 Japan

The RN4870/71 module has received type certification

and is labeled with its own technical conformity mark

and certification number as required to conform to the

technical standards regulated by the Ministry of Internal

Affairs and Communications (MIC) of Japan pursuant

to the Radio Act of Japan.

Integration of this module into a final product does not

require additional radio certification provided installa-

tion instructions are followed and no modifications of

the module are allowed. Additional testing may be

required:

• If the host product is subject to electrical appli-

ance safety (for example, powered from an AC

mains), the host product may require Product

Safety Electrical Appliance and Material (PSE)

testing. The integrator should contact their confor-

mance laboratory to determine if this testing is

required.

• There is a voluntary Electromagnetic Compatibil-

ity (EMC) test for the host product administered

by VCCII: http://www.vcci.jp/vcci_e/index.html

10.4.1 LABELING AND USER

INFORMATION REQUIREMENTS

The label on the final product which contains the

RN4870/71 module must follow Japan marking

requirements. The integrator of the module should refer

to the labeling requirements for Japan available at the

Ministry of Internal Affairs and Communications (MIC)

website.

The RN4870 module is labeled with its own technical

conformity mark and certification number. The final

product in which this module is being used must have

a label referring to the type certified module inside:

Due to the limited size of the RN4871, the technical

conformity mark and certification number is not dis-

played on the module. Therefore, the final product in

which this module is being used must have a label

referring to the type certified module inside:

10.4.2 HELPFUL WEB SITES

Ministry of Internal Affairs and Communications (MIC):

http://www.tele.soumu.go.jp/e/index.htm

Association of Radio Industries and Businesses

(ARIB): http://www.arib.or.jp/english/

10.5 Korea

The RN4870/71 module has received certification of

conformity in accordance with the Radio Waves Act.

Integration of this module into a final product does not

require additional radio certification provided installa-

tion instructions are followed and no modifications of

the module are allowed.

10.5.1 LABELING AND USER

INFORMATION REQUIREMENTS

The label on the final product which contains the

RN4870/71 module must follow KC marking require-

ments. The integrator of the module should refer to the

labeling requirements for Korea available on the Korea

Communications Commission (KCC) website.

The RN4870 module is labeled with its own KC mark.

The final product requires the KC mark and certificate

number of the module:

Due to the limited size of the RN4871, the KC mark is

not displayed on the module. Therefore, final product

requires the KC mark and certificate number of the

module:

10.5.2 HELPFUL WEB SITES

Korea Communications Commission (KCC):

http://www.kcc.go.kr.

National Radio Research Agency (RRA):

http://rra.go.kr.

Contains transmitter module with certificate number:

RN4870/71

DS50002489A-page 42  2016 Microchip Technology Inc.

10.6 Taiwan

The RN4870/71 module has received compliance

approval in accordance with the Telecommunications

Act. Customers seeking to use the compliance

approval in their product should contact Microchip

Technology sales or distribution partners to obtain a

Letter of Authority.

Integration of this module into a final product does not

require additional radio certification provided installa-

tion instructions are followed and no modifications of

the module are allowed.

10.6.1 LABELING AND USER

INFORMATION REQUIREMENTS

The RN4870 module is labeled with its own NCC ID

number, and if the NCC ID is not visible when the mod-

ule is installed inside another device, then the outside

of the device must also display a label referring to the

enclosed module. This exterior label can use wording

such as the following:

Due to the limited size of the RN4871, the NCC ID is

not displayed on the module. Therefore, the outside of

the device must also display a label referring to the

enclosed module. This exterior label can use wording

such as the following:

The user's manual should contain below warning (for

RF device) in traditional Chinese:

注意!

依據低功率電波輻射性電機管理辦法

第十二條經型式認證合格之低功率射頻電機，

非經許可，

公司、商號或使用者均不得擅自變更頻率、加大

功率或變更原設計

之特性及功能。

第十四條低功率射頻電機之使用不得影響飛航安

全及干擾合法通信；

經發現有干擾現象時，應立即停用，並改善至無

干擾時方得繼續使用。

前項合法通信，指依電信規定作業之無線電信。

低功率射頻電機須忍受合法通信或工業、科學及

醫療用電波輻射性

電機設備之干擾。

10.6.2 HELPFUL WEB SITES

National Communications Commission (NCC):

http://www.ncc.gov.tw.

10.7 Other Regulatory Jurisdictions

Should other regulatory jurisdiction certification be

required by the customer, or the customer need to

recertify the module for other reasons, a certification

utility is available. For further regulatory Certification

Utility and documentation, contact your local Microchip

Technology sales office.

 2016 Microchip Technology Inc. DS50002489A-page 43

RN4870/71

11.0 ORDERING INFORMATION

Table 11-1 provides ordering information for the RN4870/71 module.

Go to http://www.microchip.com for current pricing and a list of distributors carrying Microchip products.

TABLE 11-1: ORDERING INFORMATION

Part Number Description

RN4870-V/RM118 Bluetooth 4.2 BLE Single mode, Class 2, Surface mount module with antenna

and shield. Size: 12 mm x 22 mm

RN4870U-V/RM118 Bluetooth 4.2 BLE Single mode, Class 2, Surface mount module, external

antenna, no shield. Size: 12 mm x15 mm

RN4871-V/RM118 Bluetooth 4.2 BLE Single mode, Class 2, Surface mount module with antenna

and shield. Size: 9 mm x 11.5 mm

RN4871U-V/RM118 Bluetooth 4.2 BLE Single mode, Class 2, Surface mount module, external

antenna, no shield. Size: 6 mm x 8 mm

RN4870/71

DS50002489A-page 44  2016 Microchip Technology Inc.

APPENDIX A: REVISION HISTORY

Revision A (April 2016)

This is the initial release of this document.

 2016 Microchip Technology Inc. DS50002489A-page 45

RN4870/71

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

•Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

documents, latest software releases and archived

software

•General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

online discussion groups, Microchip consultant

program member listing

•Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,

listing of seminars and events, listings of

Microchip sales offices, distributors and factory

representatives

CUSTOMER CHANGE NOTIFICATION

SERVICE

Microchip’s customer notification service helps keep

customers current on Microchip products. Subscribers

will receive e-mail notification whenever there are

changes, updates, revisions or errata related to a

specified product family or development tool of interest.

To register, access the Microchip web site at

www.microchip.com. Under “Support”, click on

“Customer Change Notification” and follow the

registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance

through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor,

representative or Field Application Engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

Technical support is available through the web site

at: http://microchip.com/support

RN4870/71

DS50002489A-page 46  2016 Microchip Technology Inc.

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office.

Device: RN4870: Ceramic Chip Antenna

RN4870U: External Antenna

RN4871: Ceramic Chip Antenna

RN4871U: External Antenna

Temperature

Range:

V=-20C to +70C (Various)

Package: RM =

Radio Module

Example:

RN4870-V/RM118: Various temperature

Note 1: Tape and Reel identifier only appears in the

catalog part number description. This

identifier is used for ordering purposes and

is not printed on the device package. Check

with your Microchip Sales Office for package

availability with the Tape and Reel option.

PART NO.

Device

Temperature

Range

Package

XXX

Firmware

Revision

Number

 2016 Microchip Technology Inc. DS50002489A-page 47

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate,

dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,

KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,

MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,

RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O

are registered trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

ClockWorks, The Embedded Control Solutions Company,

ETHERSYNCH, Hyper Speed Control, HyperLight Load,

IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,

BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,

dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,

EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip

Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,

motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,

MPLINK, MultiTRAK, NetDetach, Omniscient Code

Generation, PICDEM, PICDEM.net, PICkit, PICtail,

PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,

Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total

Endurance, TSHARC, USBCheck, VariSense, ViewSpan,

WiperLock, Wireless DNA, and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

Silicon Storage Technology is a registered trademark of

Microchip Technology Inc. in other countries.

GestIC is a registered trademarks of Microchip Technology

Germany II GmbH & Co. KG, a subsidiary of Microchip

Technology Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

ISBN: 978-1-5224-0514-6

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

QUALITYMANAGEMENTS

YSTEM

CERTIFIEDBYDNV

== ISO/TS16949==

DS50002489A-page 48  2016 Microchip Technology Inc.

AMERICAS

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

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Web Address:

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ASIA/PACIFIC

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Fax: 82-2-558-5932 or

82-2-558-5934

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Worldwide Sales and Service

07/14/15