TD62308APG/AFG
2011-02-23
1
TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic
TD62308APG,TD62308AFG
4ch Low Input Active High-Current Darlington Sink Driver
The TD62308APG/AFG is a non−inverting transistor array
which is comprised of four NPN darlington output stages and
PNP input stages.
This device is low−level input active driver and is suitable for
operation with 5-V TTL, 5-V CMOS and 5-V Microprocessor
which have sink current output drivers.
Application include relay, hammer, lamp and stepping motor
drivers.
Features
• Output current (single output): 1.5 A (max)
• High sustaining voltage output: 50 V (min)
• Output clamp diodes
• Input compatible with TTL and 5 V CMOS
• Low level active inputs
• Standard supply voltage
• Two VCC terminals VCC1, VCC2 (separated)
• GND and SUB terminal = Heat sink
• Package type-APG: DIP-16 pin
• Package type-AFG: HSOP-16 pin
Pin Assignment (top view)
TD62308APG
TD62308AFG
TD62308APG
TD62308AFG
Weight
DIP16-P-300-2.54A: 1.11 g (typ.)
HSOP16-P-300-1.00: 0.50 g (typ.)
COM
16 15 14 13 12 11 10 9
1 2 3 4 5 678
O4 I4
Heat sink
& GND I3 O3 COM
VCC1 O1 I1 Heat sink
& GND
I2 O2 VCC2
COM
16 15 14 13 12 11 10 9
1 2 3 4 567 8
O4 I4 I3 O3 COM
VCC1 O1 I1 I2 O2 VCC2
Heat sink
& GND
Heat sink
& GND
NC NC
NCNC
TD62308APG/AFG
2011-02-23
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Schematics (each driver)
Note: The input and output parasitic diodes cannot be used as clamp diodes.
Precautions for Using
(1) This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, VCC, COMMON and GND line since IC may be
destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
(2) If a TD62308APG/AFG is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba
recommends that the diodes (pins 9 and 16) be connected to the secondary power supply pin so as to absorb
the counter electromotive force generated by the load. Please adhere to the device’s absolute maximum ratings.
Toshiba recommends that zener diodes be connected between the diodes (pins 9 and 16) and the secondary
power supply pin (as the anode) so as to enable rapid absorption of the counter electromotive force. Again,
please adhere to the device’s absolute maximum ratings.
Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Supply voltage VCC −0.5 to 10 V
Output sustaining voltage VCE (SUS) −0.5 to 50 V
Output current IOUT 1.5 A/ch
Input current IIN −10 mA
Input voltage VIN −0.5 to 30 V
Clamp diode reverse voltage VR 50 V
Clamp diode forward current IF 1.5 A
APG 1.47/2.7
(Note 1)
Power dissipation
AFG
PD
0.9/1.4
(Note 2)
W
Operating temperature Topr −40 to 85 °C
Storage temperature Tstg −55 to 150 °C
Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)
Note 2: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%)
1.1 kΩ
Input
Output
GND
COMMON
600 Ω
2 kΩ
4 k Ω
8.2 k Ω
VCC
TD62308APG/AFG
2011-02-23
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Recommended Operating Conditions (Ta = −40 to 85°C)
Characteristics Symbol Test Condition
Min Typ. Max Unit
Supply voltage VCC ⎯ 4.5 ⎯ 5.5 V
Output sustaining voltage VCE (SUS) ⎯ 0 ⎯ 50 V
DC1 circuit, Ta = 25°C 0 ⎯ 1250
Duty = 10% 0 ⎯ 1250
APG
Duty = 50% 0 ⎯ 700
Duty = 10% 0 ⎯ 1250
Output current
AFG
IOUT
tpw = 25 ms
4 circuits
Ta = 85°C
Tj = 120°C Duty = 50% 0 ⎯ 390
mA/ch
V
IN ⎯ 0 ⎯ 25 V
Output ON VIN (ON) ⎯ 0 ⎯ VCC
−3.6
Input voltage
Output OFF VIN (OFF) ⎯ VCC
−1.0 ⎯ VCC
V
Clamp diode reverse voltage VR ⎯ ⎯ ⎯ 50 V
Clamp diode forward current IF ⎯ ⎯ ⎯ 1.25
A
APG Ta = 85°C (Note 1) ⎯ ⎯ 1.4
Power dissipation
AFG
PD
Ta = 85°C (Note 2) ⎯ ⎯ 0.7
W
Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)
Note 2: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%)
Electrical Characteristics (Ta = 25°C)
Characteristics Symbol
Test
Circuit Test Condition Min Typ. Max Unit
VCE = 50 V, Ta = 25°C ⎯ ⎯ 50
Output leakage current ICEX 1
VCE = 50 V, Ta = 85°C ⎯ ⎯ 100
μA
IOUT = 1.25 A ⎯ ⎯ 1.8
Output saturation voltage VCE (sat) 3
IOUT = 0.7 A ⎯ ⎯ 1.3
V
High level VIH ⎯ ⎯ VCC
−1.6 ⎯ 25
Input voltage
Low level VIL ⎯ ⎯ ⎯ ⎯ VCC
−3.6
V
High level IIH ⎯ ⎯ ⎯ ⎯ 10 μA
Input current
Low level IIL ⎯ ⎯ ⎯ −0.05 −0.36 mA
Clamp diode reverse current IR 4 VR = 50 V, Ta = 25°C ⎯ ⎯ 50 μA
Clamp diode forward voltage VF 5 IF = 1.25 A ⎯ 1.5 2.0 V
Output ON ICC (ON) VCC = 5.5 V, VIN = 0 V ⎯ 8.5 12.5 mA/ch
Supply current
Output OFF ICC (OFF)
2
VCC = 5.5 V, VIN = VCC ⎯ ⎯ 1.0 μA
Turn-ON delay tON 6 CL = 15 pF, VOUT = 50 V,
RL = 40 Ω ⎯ 0.2 ⎯ μs
Turn-OFF delay tOFF 6 CL = 15 pF, VOUT = 35 V,
RL = 40 Ω ⎯ 5.0 ⎯ μs
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Test Circuit
1. ICEX
2. ICC
3. VCE (sat)
4. IR
5. VF
6. tON, tOFF
Note 1: Pulse Width 50 μs, Duty Cycle 10%
Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns
Note 2: CL includes probe and jig capacitance
ICEX
Open
VCE
VCC
IIN
Open
VIN
VCC
ICC
Open
VIL VCE (sat)
IOUT
VCC
Open
IR
VR
VCC
Open
IF
VF
VCC
Input
CL = 15 pF
(Note 2)
(Note 1)
Open VOUT
Output
VIN
Pulse
generator
RL
VCC
10%
50%
tON tOFF
t
f
t
r
VIH
=
5 V
VOH
VOL
Input 50%
90%
50
μ
s
Output 50% 50%
(Note 1)
90%
10%
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Input voltage VIN (V)
VOUT – VIN
Output voltage VOUT (V)
Input voltage VIN (V)
VOUT – VIN
Output voltage VOUT (V)
Output saturation voltage VIN (V)
IOUT – VCE (sat)
Output current IOUT (A)
Ambient temperature Ta (°C)
PD – Ta
Power dissipation PD (W)
Duty cycle (%)
IOUT – Duty cycle
Output current IOUT (mA)
Duty cycle (%)
IOUT – Duty cycle
Output current IOUT (mA)
0
0
Ta = 25°C (typ.)
IOUT = 0.9 A
20
10
4 6
5.0
30
2
VCC = 4.5 V 5.5
0
0
VCC = 5.0 V
IOUT = 0.9 A
20
10
4 6
25
30
2
Ta = −40°C 85
1.5
0
0
Ta = 85°C
(typ.)
VCC = 5 V
VIN = 0 V
1.0
0.5
0.5 1.0 1.5 2.0
25
−40
0
0
TD62308APG
Ta = 25°C
VCC = 5.5 V
n-ch ON
1500
900
300
60 100
600
40
n = 1
1200
20 80
n = 2
n = 3
n = 4
0
0
1500
900
300
60 100
600
40
n = 1
1200
20 80
n = 2 n = 3 n = 4
TD62308APG
Ta = 85°C
VCC = 5.5 V
n-ch ON
(1)
(2)
(3)
(4)
0
0
(1) DIP-16 pin
type-APG on PCB
(50 × 50 × 1.6 mm Cu 50%)
(2) DIP-16 pin type-AP free air
(3) HSOP-16 pin
Type-AFG on PCB
(60 × 30 × 1.6 mm Cu 30%)
(4) HSOP-16 pin free air
3.0
1.8
0.6
120 200
1.2
80
2.4
40 160
TD62308APG/AFG
2011-02-23
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Duty Cycle (%)
IOUT – Duty cycle
Output current IOUT (mA)
Duty Cycle (%)
IOUT – Duty cycle
Output current IOUT (mA)
0
0
1500
900
300
60 100
600
40
n = 1
1200
20 80
n = 2
n = 3
n = 4
TD62308AFG
Ta = 25°C
VCC = 5.5 V
n-ch ON
0
0
1500
900
300
60 100
600
40
1200
20 80
n = 1
n = 2
n = 3
TD62308AFG
Ta = 85°C
VCC = 5.5 V
n-ch ON
n = 4
TD62308APG/AFG
2011-02-23
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Package Dimensions
Weight: 1.11 g (typ.)
TD62308APG/AFG
2011-02-23
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Package Dimensions
Weight: 0.50 g (typ.)
TD62308APG/AFG
2011-02-23
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Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
2. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
TD62308APG/AFG
2011-02-23
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Points to Remember on Handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into
consideration in system design.
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
TD62308APG/AFG
2011-02-23
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injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
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all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
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