TD62308APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62308APG,TD62308AFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62308APG/AFG is a non-inverting transistor array which is comprised of four NPN darlington output stages and PNP input stages. This device is low-level input active driver and is suitable for operation with 5-V TTL, 5-V CMOS and 5-V Microprocessor which have sink current output drivers. Application include relay, hammer, lamp and stepping motor drivers. Features TD62308APG TD62308AFG * Output current (single output): 1.5 A (max) * High sustaining voltage output: 50 V (min) * Output clamp diodes * Input compatible with TTL and 5 V CMOS * Low level active inputs * Standard supply voltage * Two VCC terminals VCC1, VCC2 (separated) * GND and SUB terminal = Heat sink * Package type-APG: DIP-16 pin * Package type-AFG: HSOP-16 pin Weight DIP16-P-300-2.54A: 1.11 g (typ.) HSOP16-P-300-1.00: 0.50 g (typ.) Pin Assignment (top view) TD62308APG Heat sink & GND COM O4 I4 I3 O3 COM 16 15 14 13 12 11 10 9 1 VCC1 2 O1 3 I1 4 5 6 I2 7 O2 8 VCC2 Heat sink & GND TD62308AFG COM O4 I4 NC 16 15 14 13 1 VCC1 2 O1 3 I1 4 NC Heat sink & GND Heat sink & GND NC I3 O3 COM 12 11 10 9 5 NC 6 I2 7 O2 8 VCC2 1 2011-02-23 TD62308APG/AFG Schematics (each driver) 4k 2 k VCC COMMON Output 8.2 k 1.1 k 600 Input GND Note: The input and output parasitic diodes cannot be used as clamp diodes. Precautions for Using (1) This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, VCC, COMMON and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding. (2) If a TD62308APG/AFG is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba recommends that the diodes (pins 9 and 16) be connected to the secondary power supply pin so as to absorb the counter electromotive force generated by the load. Please adhere to the device's absolute maximum ratings. Toshiba recommends that zener diodes be connected between the diodes (pins 9 and 16) and the secondary power supply pin (as the anode) so as to enable rapid absorption of the counter electromotive force. Again, please adhere to the device's absolute maximum ratings. Absolute Maximum Ratings (Ta = 25C) Characteristics Supply voltage Output sustaining voltage Output current Symbol Rating Unit VCC -0.5 to 10 V VCE (SUS) -0.5 to 50 V IOUT 1.5 A/ch Input current IIN -10 mA Input voltage VIN -0.5 to 30 V Clamp diode reverse voltage VR 50 V Clamp diode forward current IF 1.5 A APG Power dissipation PD AFG 1.47/2.7 (Note 1) 0.9/1.4 (Note 2) W Operating temperature Topr -40 to 85 C Storage temperature Tstg -55 to 150 C Note 1: On glass epoxy PCB (50 x 50 x 1.6 mm Cu 50%) Note 2: On glass epoxy PCB (60 x 30 x 1.6 mm Cu 30%) 2 2011-02-23 TD62308APG/AFG Recommended Operating Conditions (Ta = -40 to 85C) Symbol Test Condition Min Typ. Max Unit VCC 4.5 5.5 V VCE (SUS) 0 50 V 0 1250 Characteristics Supply voltage Output sustaining voltage DC1 circuit, Ta = 25C APG Output current AFG Output OFF 1250 4 circuits 700 Ta = 85C Duty = 10% 0 1250 Tj = 120C Duty = 50% 0 390 mA/ch 0 25 VIN (ON) 0 VCC -3.6 VIN (OFF) VCC -1.0 VCC VR 50 V A Clamp diode reverse voltage Clamp diode forward current 1.25 Ta = 85C (Note 1) 1.4 Ta = 85C (Note 2) 0.7 Min Typ. Max VCE = 50 V, Ta = 25C 50 VCE = 50 V, Ta = 85C 100 IOUT = 1.25 A 1.8 IOUT = 0.7 A 1.3 IF APG Power dissipation 0 0 VIN Output ON Input voltage Duty = 10% Duty = 50% tpw = 25 ms IOUT PD AFG V V W Note 1: On glass epoxy PCB (50 x 50 x 1.6 mm Cu 50%) Note 2: On glass epoxy PCB (60 x 30 x 1.6 mm Cu 30%) Electrical Characteristics (Ta = 25C) Symbol Test Circuit ICEX 1 VCE (sat) 3 High level VIH VCC -1.6 25 Low level VIL VCC -3.6 High level IIH 10 A Low level IIL -0.05 -0.36 mA Clamp diode reverse current IR 4 VR = 50 V, Ta = 25C 50 A Clamp diode forward voltage VF 5 IF = 1.25 A 1.5 2.0 V VCC = 5.5 V, VIN = 0 V 8.5 12.5 mA/ch VCC = 5.5 V, VIN = VCC 1.0 A Characteristics Output leakage current Output saturation voltage Test Condition Input voltage Input current Supply current Output ON ICC (ON) Output OFF ICC (OFF) 2 Unit A V V Turn-ON delay tON 6 CL = 15 pF, VOUT = 50 V, RL = 40 0.2 s Turn-OFF delay tOFF 6 CL = 15 pF, VOUT = 35 V, RL = 40 5.0 s 3 2011-02-23 TD62308APG/AFG Test Circuit 1. ICEX 2. ICC VCC 3. VCE (sat) VCC ICEX IIN VCC Open ICC IOUT Open Open VCE VIN 4. IR VIL VCE (sat) 5. VF VCC VCC IR Open VF VR IF Open 6. tON, tOFF Input VCC Open RL Pulse generator (Note 1) Output VIN (Note 1) tf tr VOUT Input 90% 50% 90% 50% 10% VIH = 5 V 10% 50 s CL = 15 pF (Note 2) tOFF tON Output 50% VOH 50% VOL Note 1: Pulse Width 50 s, Duty Cycle 10% Output Impedance 50 , tr 5 ns, tf 10 ns Note 2: CL includes probe and jig capacitance 4 2011-02-23 TD62308APG/AFG VOUT - VIN 30 VOUT - VIN 30 Ta = 25C (typ.) (V) VOUT 20 5.0 VCC = 4.5 V 5.5 Output voltage VOUT Output voltage VCC = 5.0 V IOUT = 0.9 A (V) IOUT = 0.9 A 10 0 0 4 2 Input voltage VIN 20 25 Ta = -40C 10 0 0 6 Input voltage IOUT - VCE (sat) VIN = 0 V (A) 1.0 Power dissipation PD IOUT (W) VCC = 5 V Ta = 85C 0.5 25 -40 1.0 (V) (1) DIP-16 pin type-APG on PCB (50 x 50 x 1.6 mm Cu 50%) (2) DIP-16 pin type-AP free air (3) HSOP-16 pin Type-AFG on PCB (60 x 30 x 1.6 mm Cu 30%) (4) HSOP-16 pin free air (1) 0.5 VIN 6 PD - Ta 3.0 (typ.) Output current 4 2 (V) 1.5 0 0 85 1.5 2.4 1.8 (2) 1.2 (4) 0.6 0 0 2.0 (3) Output saturation voltage VIN (V) 40 80 120 160 Ambient temperature Ta (C) IOUT - Duty cycle IOUT - Duty cycle 1500 1500 (mA) n=3 n=2 IOUT n=4 900 Output current Output current IOUT (mA) n=1 1200 600 TD62308APG 300 Ta = 25C n=4 n=3 n=2 900 600 TD62308APG 300 Ta = 85C VCC = 5.5 V n-ch ON 20 n=1 1200 VCC = 5.5 V 0 0 200 n-ch ON 40 Duty cycle 60 80 0 0 100 (%) 20 40 Duty cycle 5 60 80 100 (%) 2011-02-23 TD62308APG/AFG IOUT - Duty cycle IOUT - Duty cycle 1500 1500 (mA) IOUT n=3 n=4 900 n=2 Output current Output current IOUT (mA) n=1 1200 600 TD62308AFG 300 Ta = 25C 1200 n=2 900 600 n=4 Ta = 85C VCC = 5.5 V n-ch ON 20 n=3 TD62308AFG 300 VCC = 5.5 V 0 0 n=1 n-ch ON 40 Duty Cycle 60 80 0 0 100 (%) 20 40 Duty Cycle 6 60 80 100 (%) 2011-02-23 TD62308APG/AFG Package Dimensions Weight: 1.11 g (typ.) 7 2011-02-23 TD62308APG/AFG Package Dimensions Weight: 0.50 g (typ.) 8 2011-02-23 TD62308APG/AFG Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on Handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. 9 2011-02-23 TD62308APG/AFG Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. About solderability, following conditions were confirmed * Solderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux 10 2011-02-23 TD62308APG/AFG RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. 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