GP2S60
1
Sheet No.: D3-A02101FEN
Date Oct. 3. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confi rmation by device specifi cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specifi cation sheets before using any SHARP device.
GP2S60 SMT, Detecting Distance : 0.5mm
Phototransistor Output,
Compact Refl ective
Photointerrupter
■Description
GP2S60 is a compact-package, phototransistor out-
put, refl ective photointerrupter, with emitter and detector
facing the same direction in a molding that provides non-
contact sensing. The compact package series is a result
of unique technology, combing transfer and injection
molding, that also blocks visible light to minimize false
detection.
This photointerrupter can be ordered in different CTR
ranks, and has a thin, leadless (T&R) package, suitable
for refl ow soldering.
■Features
1. Refl ective with Phototransistor Output
2. Highlights :
• Compact Size
• Surface Mount Type (SMT), reflow soldering, with
gullwing leads
• Tape and Reel (T&R) 1 000 pcs per reel
3. Key Parameters :
• Optimal Sensing Distance : 0.7mm
• Package : 4×3×1.7mm
• Visible light cut resin to prevent
4. RoHS directive compliant
■Agency approvals/Compliance
1. Compliant with RoHS directive
■Applications
1. Detection of object presence or motion.
2. Any application, which production is migrating to
100% surface mount components.
3. Example : printer, optical storage
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Sheet No.: D3-A02101FEN
GP2S60
■Internal Connection Diagram
1
2
2
3
3
4
4
1Collector
Emitter
Cathode
Anode
Top view
Detector center
Emitter center
Opaque resin molding portion
Pattern for directional
Distinction (NC)
(0.7)
(0.65)
1.7
1.1
0.4
(0.57)
(0.57)
(0.63)
(0.7)
2.7
3.2
(1.8)
(0.55)
4
3
1
2
Plating area
Top view
■Outline Dimensions (Unit : mm)
Product mass : approx. 0.01g
• Unspecifi ed tolerance : ±0.15mm.
• Dimensions in parenthesis are shown for reference.
• Dimensions on the outline drawing is the maximum value excluding
burr.
• The dimensions shown do not include burr.
Burr's dimension : 0.15mm MAX.
Plating material : Au
Country of origin
Japan
3
Sheet No.: D3-A02101FEN
GP2S60
■Absolute Maximum Ratings
■Electro-optical Characteristics
(Ta=25˚C)
Parameter Symbol Rating Unit
Input
Forward current IF50 mA
Reverse voltage VR6V
Power dissipation PD75 mW
Output
Collector-emitter voltage
VCEO 35 V
Emitter-collector voltage
VECO 6V
Collector current IC20 mA
Collector power dissipation PC75 mW
Total power dissipation Ptot 100 mW
Operating temperature Topr −25 to +85 ˚C
Storage temperature Tstg −40 to +100 ˚C
∗1Soldering temperature Tsol 260 ˚C
∗1 For 5s or less
(Ta=25˚C)
Parameter Symbol Condition MIN. TYP. MAX. Unit
Input Forward voltage VFIF=20mA −1.2 1.4 V
Reverse current IRVR=6V −−
10 μA
Output Collector dark current ICEO VCE=20V −1 100 nA
Transfer
charac-
teristics
∗2 Collector Current ICIF=4mA, VCE=2V 40 85 130 μA
∗3 Leak current ILEAK IF=4mA, VCE=2V −−
500 nA
Response time Rise time trVCE=2V, IC=100μA,
RL=1kΩ, d=1mm
−20 100 μs
Fall time tf−20 100
∗2 The condition and arrangement of the refl ective object are shown below.
The rank splitting of collector current (IC) shall be executed according to the table below.
Rank Collector current, IC [μA]
(IF=4mA, VCE=2V)
A 40 to 80
B 65 to 130
∗3 Without refl ective object.
●Test Condition and Arrangement for Collector Current
d=1mm
glass plate
Aluminum evaporation
4
Sheet No.: D3-A02101FEN
GP2S60
■Model Line-up
Please contact a local SHARP sales representative to see the actial status of the produiction.
Model No. Rank IC(μA) Conditions
GP2S60 A or B 40 to 130 IF=4mA
VCE=2V
Ta=25˚C
GP2S60A A 40 to 80
GP2S60B B 65 to 130
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Sheet No.: D3-A02101FEN
GP2S60
Fig.5 Collector Current vs.
Collector-Emitter Voltage
Fig.6 Relative Collector Current vs.
Ambient Temperature
Fig.3 Forward Current vs. Forward
Voltage
Fig.4 Collector Current vs.
Forward Current
Forward current IF (mA)
100
10
0 0.5 1 1.5 2 2.5 3
Forward voltage VF (V)
Ta=75˚C
50˚C
25˚C
0˚C
−25˚C
10
100
200
300
400
500
600
700
0 5 10 15 20
Forward current IF (mA)
Collector current IC (μA)
VCE=2V
Ta=25C
Collector current IC (μA)
0
100
200
300
400
500
600
0246810
Collector-emitter voltage VCE (V)
IF=15mA
10mA
7mA
4mA
2mA
Ta=25˚C
−25
VCE=2V
IF=4mA
0
20
40
60
80
100
120
025
5075
Relative collector current (%)
Ambient temperature Ta (˚C)
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 Collector Power Dissipation vs.
Ambient Temperature
Power dissipation P (mW)
Ambient temperature Ta (˚C)
0
20
15
40
60
80
75
100
120
Ptot
−25 0 1007550 8525
P,PC
Forward current IF (mA)
0
10
20
30
40
50
60
25 0 1007550 8525
Ambient temperature Ta (˚C)
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Sheet No.: D3-A02101FEN
GP2S60
Fig.7 Collector Dark Current vs.
Ambient Temperature
Fig.8 Response Time vs. Load
Resistance
Fig.9
Test Circuit for Response Time
Fig.10 Relative Collector Current vs.
Distance
Fig.11
Spectral Sensitivity
Collector dark current ICEO (A)
10−10
10−6
10−7
10−8
10−9
0 25 50 75 100
Ambient temperature Ta (˚C)
VCE=20V
10%
Input
Output
Input Output
90%
ts
td
VCC
RD
RL
tf
tr
Reflector
Plate
Response time (μs)
1
10
100
1 000
0.1 1 1 00010 100
Load resistance RL (kΩ)
VCE=2V
IC=100μA
Ta=25˚C
tf
ts
td
tr
Relative sensitivity (%)
0
100
80
60
40
20
600 700 800 900 1 000 1 100 1 200
Wavelength λ (nm)
Ta=25˚C
L
Al evaporation glass
10
20
30
40
50
60
70
80
90
100
1 4.523453.52.51.50.50
VCE=2V
IF=4mA
Ta=25˚C
Relative collector current (%)
Distance between sensor and Aluminum evaporation glass L (mm)
Fig.12
Detecting Position Characteristics (1)
20
40
60
80
100
6420351−3−1−2
Relative collector current (%)
OMS card moving distance (mm)
VCE=2V
IF=4mA
d=1mm
1mm
d
0
OMS test card
Sensor −+
7
Sheet No.: D3-A02101FEN
GP2S60
Fig.13
Detecting Position Characteristics (2)
Sensor
20
40
60
80
100
64203
51−3−1−2
Relative collector current (%)
OMS card moving distance (mm)
VCE=2V
IF=4mA
d=1mm
1mm
d
0
OMS test card
−+
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
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Sheet No.: D3-A02101FEN
GP2S60
■Design Considerations
●Design guide
1) Regarding to prevention of malfunction
To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to
the external light.
2) Distance characteristic
The distance between the photointerrupter and the object to be detected shall be determined the distance
by referencing Fig.10 "Relative collector current vs. distance".
3) For wiring on a mounting PCB
To avoid possibility for short, please do not apply pattern wiring on the back side of the device.
4) Regarding to mounting this product
There is a possibility that the opaque molded resin portion may have a crack by force at mounting etc.
Please use this product after well confi rmation of conditions in your production line.
This product is not designed against irradiation and incorporates non-coherent IRED.
●Degradation
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
●Parts
This product is assembled using the below parts.
• Light detector (qty. : 1)
Category Material Maximum Sensitivity
wavelength (nm)
Sensitivity
wavelength (nm) Response time (μs)
Phototransister Silicon (Si) 930 700 to 1 200 20
• Light emitter (qty. : 1)
Category Material Maximum light emitting
wavelength (nm) I/O Frequency (MHz)
Infrared emitting diode
(non-coherent) Gallium arsenide (GaAs) 950 0.3
• Material
Case PCB Lead frame plating
Epoxy resin
Black polyphenylene sulfi de Glass epoxy resin Au plating
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Sheet No.: D3-A02101FEN
GP2S60
●Recommended pattern
2−0.65
2−1 2−1
(Unit : mm)
area : Please do not apply the pattern wiring to avoid the possibility of short circuit.
2−1.7
2−0.65
2−0.45
Regarding amount of solder, if there is solder leakage in terminal wiring pattern between PCB and housing
main body, the reliability will be deteriorated.
Please check the proper amount of solder in advance not to have solder leakage into terminal wiring pattern
between PCB and housing main body.
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Sheet No.: D3-A02101FEN
GP2S60
■Manufacturing Guidelines
●Storage and management after open
Storage condition
Storage temp.: 5 to 30˚C, Storage humidity : 70%RH or less at regular packaging.
Treatment after opening the moisture-proof package
After opening, you should mount the products while keeping them on the condition of 5 to 25˚C and 70%RH
or less in humidity within 4 days.
After opening the bag once even if the prolonged storage is necessary, you should mount the products within
two weeks.
And when you store the rest of products you should put into a DRY BOX. Otherwise after the rest of products
and silicagel are sealed up again, you should keep them under the condition of 5 to 30˚C and 70%RH or
less in humidity.
Baking before mounting
When the above-mentioned storage method could not be executed, please process the baking treatment
before mounting the products.
However the baking treatment is permitted within one time.
Recommended condition : 125˚C, 16 to 24 hours
∗Do not process the baking treatment with the product wrapped. When the baking treatment processing, you
should move the products to a metallic tray or fi x temporarily the products to substrate.
11
Sheet No.: D3-A02101FEN
GP2S60
●Soldering Method
Refl ow Soldering:
Refl ow soldering should follow the temperature profi le shown below.
Soldering should not exceed the curve of temperature profi le and time.
Please solder within one time.
Other notice
Please take care not to let any external force exert on lead pins.
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
●Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
Do not execute ultrasonic cleaning.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
MAX
240˚C
MAX
160˚C
200˚C
25˚C
1 to 4˚C/s
MAX120s
MAX10s
MAX60s
MAX90s
1 to 4˚C/s
1 to 4˚C/s
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Sheet No.: D3-A02101FEN
GP2S60
●Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specifi c brominated fl ame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
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Sheet No.: D3-A02101FEN
GP2S60
■Package specifi cation
●Tape and Reel package
Package materials
Carrier tape : PS (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Package method
2 000 pcs of products shall be packaged in a reel. One reed with silicagel is endased in aluminum laminated
bag. After sealing up the bag, it encased in one case (5 bags/case).
Carrier tape structure and Dimensions
Reel structure and Dimensions
F
K
E D I
J
B
H
A
C
H
L
G
5˚MAX.
Dimensions List (Unit : mm)
A
8±0.3
B
3.5±0.05
C
1.75±0.1
D
4±0.1
E
2±0.1
G
φ1.55±0.05
H
3.6±0.1
I
0.3±0.05
J
1.25±0.1
K
2.2±0.1
L
φ1.1±0.1
F
4±0.1
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
180
b
9±1
c
60+0.5
−0
d
φ13±0.2
e
φ21±0.8
f
11.4±1
g
2+0.3
−0
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Sheet No.: D3-A02101FEN
GP2S60
Direction of product insertion
[Packing : 2 000pcs/reel]
Storage method
Storage conditions should follow the condition shown below.
Storage temperature : 5 to 30˚C
Storage hunidity : 70%RH or less
Pull-out direction
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Sheet No.: D3-A02101FEN
GP2S60
■Important Notices
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifi cations, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specifi ed in the relevant specifi cation
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Offi ce automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffi c signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative
if there are any questions about the contents of this
publication.
[H146]
